CN219068494U - SMD structure convenient to encapsulation - Google Patents

Abstract

The utility model relates to an SMD structure convenient for packaging, which comprises a hardware bonding pad and an SMD device, wherein a placement area for packaging and welding the SMD device is arranged on the hardware bonding pad, a plurality of first pins are uniformly connected to the peripheral outer wall of the SMD device except for the vertex angle, and buffer protection components for buffering and protecting the first pins are arranged on the periphery of the SMD device.

Description

SMD structure convenient to encapsulation

Technical Field

The utility model relates to the technical field of SMD processing, in particular to an SMD structure convenient to package.

Background

The packaging refers to the connection of circuit pins on a silicon chip to an external joint by leads so as to be connected with other devices, the packaging form refers to a shell for mounting a semiconductor integrated circuit chip, the shell not only plays roles in mounting, fixing, sealing, protecting the chip, enhancing electric heating performance and the like, but also realizes the connection of the internal chip and the external circuit by pins, and the packaging is mainly divided into two types of DIP dual in-line package and SMD patch packaging. SMD: it is a surface mount device, which is one of SMT components.

The utility model provides a very according to application number CN201921879928.6 provides a novel SMD packaging device, including epoxy lamp shade, first, U type electric plate, a socket, a support, the copper sheet, the solder paste, the gold thread, the package board, second, the seal gum, chuck and cassette, the package board is installed to SMD main part downside, the package board up end is equipped with the epoxy lamp shade, epoxy lamp shade annular side upside is equipped with first, epoxy lamp shade downside is equipped with the support, LED chip is connected with the gold thread about, gold thread left and right sides is equipped with the copper sheet, the copper sheet up end is equipped with the solder paste, the copper sheet outside is equipped with the socket, the inside U type electric plate that is equipped with of pin, the package board up end is equipped with the chuck, the inside downside of SMD main part is equipped with second, the inside downside of SMD main part is equipped with the seal gum.

The SMD structure is convenient to package and good in matching packaging effect; however, the pins are leakage type, since the buffer protection device is not arranged around, the pins are easy to deform in the transportation and carrying process, so that the damage is caused, the packaging efficiency is affected, the substrate is not provided with a quick positioning component for enabling the SMD to quickly package, the dislocation of the SMD pins and the pins on the substrate is easy to occur, the packaging is inaccurate, and the packaging efficiency is low.

Disclosure of Invention

The present utility model is directed to an SMD structure that is convenient for packaging, so as to solve the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a SMD structure convenient to encapsulation, includes five metals pad and SMD device, be provided with the district of placing that is used for the SMD device to encapsulate the welding on the five metals pad, be located on the five metals pad place the district and all be provided with the messenger around apex angle department the welding positioning assembly that the SMD device carries out quick welding location, the outer wall is connected with a plurality of first pins except that apex angle department evenly distributed arranges all around the SMD device, the SMD device is provided with all around and is used for right the buffering protection subassembly that first pin carries out buffering protection, first recess has been seted up at SMD device top, first recess is the trapezoidal structure setting of top big bottom, the bottom is provided with the mounting groove in the first recess, the mounting groove is inside to be inlayed and is equipped with the LED chip, is located the LED chip is outside be equipped with fluorescent glue in the first recess, fluorescent glue top with SMD device top is at same horizontal plane.

As a preferable scheme of the utility model, the welding positioning assembly comprises four welding positioning plates, the welding positioning plates are arranged in an L-shaped structure, and the bottom of each welding positioning plate is connected with an inserting rod.

As a preferable scheme of the utility model, jacks used for being connected with the inserted link in an inserted manner are respectively arranged at the top corners of the periphery of the placement area on the hardware bonding pad, and the inserted link is detachable.

As the preferable scheme of the utility model, the buffer protection component comprises buffer protection clamping sleeves which are arranged in a C-shaped structure, the number of the buffer protection clamping sleeves is four, the buffer protection clamping sleeves are sequentially clamped on the SMD device outside the first pin, and the buffer protection clamping sleeves are detachable.

As a preferable scheme of the utility model, second pins which are in one-to-one correspondence with the first pins are arranged in the placement area.

As a preferred scheme of the utility model, a printed insulating layer is arranged in the middle of the bottom surface of the SMD device.

Compared with the prior art, the utility model has the beneficial effects that:

aiming at the problems in the background technology, the pin is buffered and protected by externally adding the buffer protection clamping sleeve at the peripheral pins of the SMD device, so that the SMD device with the pins leaking outside is convenient to carry, the pins are prevented from deforming in the transportation and carrying process, damage is caused, and the packaging efficiency is influenced;

the detachable welding positioning assembly is arranged at the top corners of the periphery of the placement area on the hardware bonding pad, so that the SMD device is convenient to weld and position, pin positioning is not needed, the first pins of the periphery of the SMD device are in one-to-one correspondence with the pins in the placement area through the welding positioning assembly, dislocation of packaging is prevented, welding is convenient, and packaging efficiency is high.

Drawings

FIG. 1 is a perspective view of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of the whole SMD device and the welding positioning assembly of the present utility model;

FIG. 3 is a schematic view of an integral weld positioning assembly of the present utility model;

FIG. 4 is a schematic diagram of a buffer protection assembly according to the present utility model;

FIG. 5 is a front view of the present utility model;

fig. 6 is a schematic diagram of an insulation layer printed on the bottom of an SMD device of the present utility model.

In the figure: 1. hardware bonding pads; 2. an SMD device; 3. a placement area; 31. a jack; 4. welding the positioning assembly; 41. welding a positioning plate; 42. a rod; 5. a first pin; 6. a buffer protection assembly; 61. buffering and protecting the clamping sleeve; 21. a first groove; 211. a mounting groove; 212. an LED chip; 213. fluorescent glue; 22. and printing an insulating layer.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-6, the present utility model provides a technical solution: the utility model provides a SMD structure convenient to encapsulation, including five metals pad 1 and SMD device 2, be provided with on the five metals pad 1 and be used for SMD device 2 to carry out encapsulation welded place district 3, place district 3 and be convenient for prevent SMD device 2, conveniently carry out quick encapsulation, be located on the five metals pad 1 place district 3 the apex angle department all around and all be provided with the welding location subassembly 4 that makes SMD device 2 carry out quick welding location, welding location subassembly 4 is including welding location board 41, welding location board 41 is provided with four altogether, welding location board 41 is L font structure setting, every welding location board 41 bottom all is connected with inserted bar 42, be located on the five metals pad 1 place district 3 the apex angle all offer be used for with inserted bar 42 grafting be connected jack 31, inserted bar 42 is detachable, welding location board 41 middle part joint and SMD device 2 apex angle department all around carry out spacingly to SMD device 2 position, the position of the SMD device 2 is prevented from displacement dislocation, the middle part of the welding positioning plate 41 is clamped with the top corners of the periphery of the SMD device 2 in sequence through the inserting rod 42 inserting mode, the inserting rod 42 inserting mode is convenient to replace and disassemble for use, the inserting rod 42 can be directly pulled out of the jack 31 for disassembly after the end of use, the outer walls of the periphery of the SMD device 2 except the top corners are uniformly distributed and connected with a plurality of first pins 5, the first pins 5 can be plane pins without pin positioning, the plane pins are changed into plane pins, the height is reduced, the welding is convenient, the efficiency can be improved, the packaging is convenient in a plurality of modes, the second pins corresponding to the first pins 5 one by one are arranged in the placing area 3, the buffer protection components 6 for buffering the first pins 5 are arranged around the SMD device 2, the buffer protection components 6 comprise buffer protection clamping sleeves 61 which are arranged in a C-shaped structure, buffer protection cutting ferrule 61 is provided with four altogether, buffer protection cutting ferrule 61 joint in proper order and on the outside SMD device 2 of first pin 5, buffer protection cutting ferrule 61 is detachable, it carries to add buffer protection cutting ferrule 61 to the pin outside at the pin department around SMD device 2, be convenient for the SMD device 2 of pin external leakage type carries, prevent that the transportation carries in-process pin from taking place to warp, lead to damaging, influence encapsulation efficiency, first recess 21 has been seted up at SMD device 2 top, first recess 21 is the trapezoidal structure setting of top big bottom little, be provided with mounting groove 211 in the first recess 21, the inside embedding of mounting groove 211 is equipped with LED chip 212, be located the outside first recess 21 of LED chip 212 and be equipped with fluorescent glue 213, fluorescent glue 213 top and SMD device 2 top are in same horizontal plane, SMD device 2 bottom surface middle part is provided with printing insulating layer 22, the apex angle department sets up detachable welding positioning assembly 4 in the top corner all around of placing zone 3 on SMD pad 1 makes things convenient for SMD device 2 to carry out welding positioning, make SMD device 2 all around first pin 5 and place in zone 3 one-to-one, prevent encapsulation dislocation, encapsulation efficiency is high.

The working flow of the utility model is as follows:

when the LED packaging structure is used, the inserted bars 42 at the bottom of the welding positioning plate 41 are sequentially inserted into the insertion holes 31 at the top corners of the periphery of the placement area 3, the SMD device 2 is placed in the periphery of the placement area 3, the detachable welding positioning assembly 4 is arranged at the top corners of the periphery of the placement area 3 on the hardware bonding pad 1, so that the SMD device 2 is convenient for welding positioning, the first pins 5 around the SMD device 2 are in one-to-one correspondence with the pins in the placement area 3, the LED chips 212 are embedded into the mounting grooves 211 in the first grooves 21, fluorescent glue 213 is sealed outside the LED chips 212 in the first grooves 21, the package is finished, the inserted bars 42 are sequentially pulled down, the specific structure is shown in the specification, and other structures of the SMD device 2 package are not repeated in the prior art.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a SMD structure convenient to encapsulation, includes five metals pad (1) and SMD device (2), its characterized in that: be provided with on hardware pad (1) and be used for SMD device (2) to encapsulate welded place district (3), be located on hardware pad (1) place district (3) all be provided with the messenger around apex angle department SMD device (2) carry out quick welding location's welding location subassembly (4), SMD device (2) outer wall all around except apex angle department evenly distributed arranges and is connected with a plurality of first pins (5), SMD device (2) are provided with all around and are used for right first pin (5) carry out buffer protection subassembly (6), first recess (21) have been seted up at SMD device (2) top, first recess (21) are the trapezoidal structure setting of top major bottom, the interior bottom of first recess (21) is provided with mounting groove (211), inside the inlaying of mounting groove (211) is equipped with LED chip (212), is located LED chip (212) outside be equipped with fluorescent glue (213) in first recess (21), fluorescent glue (213) top with SMD device (2) are at same horizontal plane.

2. The SMD convenient to package structure of claim 1, wherein: the welding positioning assembly (4) comprises welding positioning plates (41), the welding positioning plates (41) are four in number, the welding positioning plates (41) are arranged in an L-shaped structure, and inserted bars (42) are connected to the bottoms of the welding positioning plates (41).

3. The SMD convenient to package structure of claim 2, wherein: the top angles at the periphery of the placement area (3) on the hardware bonding pad (1) are provided with jacks (31) which are used for being connected with the inserting rods (42) in an inserting mode, and the inserting rods (42) are detachable.

4. The SMD convenient to package structure of claim 1, wherein: the buffer protection assembly (6) comprises buffer protection cutting sleeves (61), the buffer protection cutting sleeves (61) are arranged in a C-shaped structure, the buffer protection cutting sleeves (61) are four in number, the buffer protection cutting sleeves (61) are sequentially connected with the first pins (5) in a clamping mode on the SMD device (2), and the buffer protection cutting sleeves (61) are detachable.

5. The SMD convenient to package structure of claim 1, wherein: second pins which are in one-to-one correspondence with the first pins (5) are arranged in the placement area (3).

6. The SMD convenient to package structure of claim 1, wherein: the middle part of the bottom surface of the SMD device (2) is provided with a printing insulating layer (22).

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