CN201584409U - Structure of bearing seat for light emitting diode (LED) chips - Google Patents
Structure of bearing seat for light emitting diode (LED) chips Download PDFInfo
- Publication number
- CN201584409U CN201584409U CN 200920133766 CN200920133766U CN201584409U CN 201584409 U CN201584409 U CN 201584409U CN 200920133766 CN200920133766 CN 200920133766 CN 200920133766 U CN200920133766 U CN 200920133766U CN 201584409 U CN201584409 U CN 201584409U
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- CN
- China
- Prior art keywords
- light
- emitting diode
- backlight unit
- diode chip
- load bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
A structure of a bearing seat for light emitting diode (LED) chips comprises at least one conductive pin and a base; the conductive pin is coupled with an LED chip; the base is used for bearing the LED chip and combined with the conductive pin; one end of the conductive pin is connected with the LED chip, and the other end thereof is exposed out of the base; the base comprises a heat conducting piece and an insulation base; the insulation base covers a part of the heat conducting piece in such a manner that the heat conducting piece penetrates the base from the lower part of the base toward the upper part thereof; the heat conducting piece above the base is in contact with the LED chip; an accommodating groove for accommodating an electronic component is formed on the surface of the base; and the electronic component, which adopts a drive chip or a protective circuit, is coupled with the LED chip.
Description
[technical field]
This creation system refers to a kind of light-emitting diode chip for backlight unit load bearing base structure of avoiding the shading phenomenon especially about a kind of light-emitting diode chip for backlight unit load bearing base structure.
[background technology]
Light-emitting diode (Light Emitting Diode, LED) have long such as the life-span, volume is little, high shock resistance, low-heat produce and advantage such as low power consumption, has therefore extensively been applied to indicating device or light source in family expenses and the various device.In recent years, light-emitting diode is towards multicolour and high brightness development, so its application has expanded large-scale outdoor signboard, traffic sign and association area to.Future, light-emitting diode even may hold its power saving under the arm and advantage that environment-friendly function has concurrently becomes the main flow of lighting source.
It should be noted that light-emitting diode Chang Yinzhu is multifactor and damage, and then cause light-emitting diodes tube short circuit or open circuit.For instance, when super-high-current is flowed through light-emitting diode, may cause the light-emitting diodes tube short circuit.When excessive voltage is flowed through light-emitting diode, may cause light-emitting diode to open circuit.
Therefore, known techniques proposes the design of protective circuit.First end of protective circuit and second end system are respectively coupled to first end and second end of light-emitting diode chip for backlight unit, and the conducting voltage of protective circuit is greater than the conducting voltage of light-emitting diode chip for backlight unit.Under the protective circuit situation in parallel, can effectively reduce light-emitting diode chip for backlight unit carrying excessive voltage and the risk of damaging with light-emitting diode chip for backlight unit.
Yet,, will influence the light extraction efficiency of light-emitting diode if light-emitting diode chip for backlight unit and protective circuit are encapsulated in same plane routing.See also Fig. 1, it is in the known techniques, the package structure for LED schematic diagram.As shown in the figure, package structure for LED comprises an encapsulating housing 40 and lead frame 30.Light-emitting diode chip for backlight unit system is arranged at the surface of encapsulating housing 40, and is electrically connected at one of two lead frames 30 end respectively.Protective circuit 50 also is arranged at the surface of encapsulating housing 40, and is electrically connected at two lead frames 30 respectively.So, protective circuit 50 promptly couples light-emitting diode chip for backlight unit and forms parallel connection.
Such encapsulating structure makes protective circuit 50 can cause shading and indirectly produces and reduces brightness and influence harmful effect such as light type.So as shown in Figure 2, another improvement design by the surface that is arranged at encapsulating housing 40, in changing into is embedded in protective circuit 50 within the encapsulating housing 40 '.Though so avoided the problem of shading, caused cost of manufacture to increase in addition and the puzzlement of yield reduction.
[summary of the invention]
Because in the package structure for LED of known techniques; the electronic building brick that light-emitting diode chip for backlight unit couples for example is chip for driving and protective circuit; can cause the problem of shading; this creation system provides a kind of light-emitting diode chip for backlight unit load bearing base structure; owing to offer a storage tank on the base-plates surface of light-emitting diode chip for backlight unit load bearing seat; it is cheap not only to be easy to cost of manufacture, but more the holding electronic assembly makes electronic building brick not be arranged at same plane with light-emitting diode chip for backlight unit, exempts the problem of shading by this.
The light-emitting diode chip for backlight unit load bearing base structure of this creation comprises an at least one conductive connecting pin and a pedestal.Conductive connecting pin system couples light-emitting diode chip for backlight unit, and pedestal system is in order to the carrying light-emitting diode chip for backlight unit, and wherein, pedestal is incorporated into conductive connecting pin, and conductive connecting pin to be different from the other end that connects this light-emitting diode chip for backlight unit be to be exposed to pedestal.
Pedestal more comprises the light beam of a reflector structure to concentrate light-emitting diode chip for backlight unit to be sent.Light-emitting diode chip for backlight unit system is arranged in this reflector structure.
Pedestal more comprises a conducting strip and an insulating base, and wherein insulating base coats partly conducting strip, makes conducting strip penetrating to the top from the pedestal below, the conducting strip system contact light-emitting diode chip for backlight unit of described top.
A storage tank is offered with the holding electronic assembly in arbitrary surface of pedestal.Wherein electronic building brick is coupled to light-emitting diode chip for backlight unit, is chip for driving and one of them person of protective circuit.
In known techniques, electronic building brick causes the problem of light-emitting diode shading, offer a storage tank on the base-plates surface of the diode chip for backlight unit load bearing base structure of this creation, but the holding electronic assembly makes electronic building brick not be arranged at same plane with light-emitting diode chip for backlight unit, exempts the problem of shading by this.Simultaneously, the design of storage tank is easy to make, yield height and cost is low.
[description of drawings]
Fig. 1 is the profile of the package structure for LED of this creation known techniques;
Fig. 2 is the profile of the package structure for LED of this creation known techniques;
Fig. 3 is this perspective view of creating light-emitting diode chip for backlight unit load bearing base structure among first embodiment;
Fig. 4 and Fig. 4 A are this perspective exploded view of creating light-emitting diode chip for backlight unit load bearing base structure among first embodiment;
Fig. 5 is this generalized section of creating light-emitting diode chip for backlight unit load bearing base structure among first embodiment;
Fig. 6 is this perspective view of creating light-emitting diode chip for backlight unit load bearing base structure among second embodiment; And
Fig. 7 is this generalized section of creating light-emitting diode chip for backlight unit load bearing base structure among second embodiment.
[embodiment]
Because the light-emitting diode chip for backlight unit load bearing base structure that this creation provided can be widely used in and makes various lead frames, its combination execution mode is too numerous to enumerate especially, so give unnecessary details no longer one by one at this, only enumerates one of them preferable embodiment and is specified.
The light-emitting diode chip for backlight unit load bearing base structure of this creation; system is applicable to the lead frame of a light-emitting diode; light-emitting diode chip for backlight unit couples at least one electronic building brick and for example is chip for driving or protective circuit, and is welded on the load bearing base structure of this creation, with luminous being applied after energising.
See also Fig. 3, it is among first embodiment of this creation preferred embodiment, the perspective view of light-emitting diode chip for backlight unit load bearing base structure.The load bearing base structure 1 of this creation comprises at least one conductive connecting pin 3, and a pedestal 4.These conductive connecting pin 3 cordings have six in present embodiment.
Conductive connecting pin 3 is in order to coupling light-emitting diode chip for backlight unit 20 (being drawn on Fig. 5), and pedestal 4 is in order to carrying light-emitting diode chip for backlight unit 20.Wherein, pedestal 4 is incorporated into these conductive connecting pins 3.The two ends of conductive connecting pin 3 are exposed to pedestal 4; Wherein an end is in order to connect light-emitting diode chip for backlight unit 20, and an other end can be for being connected to a printed circuit board (PCB) (figure does not show), to increase the convenience of load bearing base structure 1 assembling.
More offer a storage tank 5 on the surface of pedestal 4 with holding electronic assembly 50.Storage tank 5 can be opened in arbitrary surface of pedestal 4, comprises being different from one side of carrying light-emitting diode chip for backlight unit 20.Thus, can avoid electronic building brick 50, and cause problems such as brightness reduction that shading produces and the influence of light type because be packaged in same plane with light-emitting diode chip for backlight unit 20.
Pedestal 4 comprises an insulating base 41, a reflector structure 42 and a conducting strip 43.Insulating base 41 can be made of plastifying material, and reflector structure 42 is made of metal (for example being aluminium or silver); Reflector structure 42 can be made of plastifying material in addition, and can spend a metallic reflector on reflector structure 42.In the present embodiment, storage tank 5 is the surface that is opened in insulating base 41 in the reflector structure 42.
Conducting strip 43 is made of heat-conducting, and it can be the good metal of radiating efficiency, metallic composite, perhaps ceramic material.In addition, also can be metal, as iron or copper with good conductor.Conducting strip 43 is generally commaterial with conductive connecting pin 3 and constitutes, and is referred to as lead frame.Insulating base 41 coats the conducting strip 43 of part, makes conducting strip 43 penetrating to the top from pedestal 41 belows of insulating.Light-emitting diode chip for backlight unit 20 is a thermal contact conductance sheet 43, and can be with the heat production loss to outside by conducting strip 43 this kind permeable structures.
Further the detailed structure of this creation of narration sees also Fig. 4 and Fig. 4 A, and it is the perspective exploded view of this creation light-emitting diode chip for backlight unit load bearing base structure 1.
As shown in Figure 4, insulating base 41 can be made by integral forming method with reflector structure 42.Light-emitting diode chip for backlight unit 20 (being drawn on Fig. 5) is arranged at the surface of insulating base 41 in the reflector structure 42.
Shown in Fig. 4 A, conductive connecting pin 3 has draw-in groove 31, and conducting strip 43 has draw-in groove 432, and is fixed in insulating base 41 in the engaging mode.In the present embodiment, storage tank 5 is opened on the conducting strip 43, makes conducting strip 43 form a concave face 431.This concave face 431 is the groove bottom that is exposed to this storage tank 5, can be considered the part of storage tank 5.So, when electronic building brick 50 is arranged at the bottom surface of storage tank 5, can see through conducting strip 43 heat radiations.
Fig. 5 is the generalized section that shows this creation light-emitting diode chip for backlight unit load bearing base structure, also is the A-A sectional drawing of Fig. 3.As shown in the figure, this light-emitting diode chip for backlight unit 20 is to see through two lead-in wires 60 to couple conductive connecting pin 3.Electronic building brick 50 can be chip for driving or protective circuit, and wherein, the conducting voltage of this protective circuit system is greater than the conducting voltage of this light-emitting diode chip for backlight unit 20.Electronic building brick 50 is arranged in the storage tank 5.
See also Fig. 6, it is among second embodiment of this creation preferred embodiment, the perspective view of light-emitting diode chip for backlight unit load bearing base structure.In the present embodiment, as shown in the figure, insulating base 41 is in conjunction with conductive connecting pin 3 and conducting strip 43, and storage tank 5 is the back side that is opened in insulating base 41, that is insulating base 41 is with respect to the surface of 20 of carrying light-emitting diode chip for backlight unit.The scope of offering of storage tank 5 also contains to conducting strip 43, and forms concave face 431 on conducting strip 43.Wherein concave face 431 is the groove bottom that is exposed to storage tank 5, and can be considered the part of storage tank 5.
Then see also Fig. 7, it is among second embodiment of this creation preferred embodiment, the generalized section of light-emitting diode chip for backlight unit load bearing base structure.As shown in the figure, this light-emitting diode chip for backlight unit 20 is to see through two lead-in wires 60 to couple conductive connecting pin 3.Electronic building brick 50 is to be arranged at the storage tank 5 that is opened in insulating base 41 back sides, and in ensuing processing procedure, with the insulating material location that is covered to complete.
Subsidiary one carries ground, and in above-mentioned two embodiment, light-emitting diode chip for backlight unit load bearing base structure 1 has six conductive connecting pins 3, so can couple for three light-emitting diode chip for backlight unit 20.Wherein, these light-emitting diode chip for backlight unit 20 are the light that sends different wavelength, that is different color light, as ruddiness, blue light, gold-tinted, see through the effect that this three light-emitting diode chip for backlight unit 20 can present mixed light.
In known techniques, electronic building brick 50 causes the problem of light-emitting diode shading, pedestal 4 surfaces of the light-emitting diode chip for backlight unit load bearing base structure 1 of this creation are owing to offer a storage tank 5, but holding electronic assembly 50 and make electronic building brick 50 not be arranged at same plane with light-emitting diode chip for backlight unit 20 is exempted the problem of shading by this.Simultaneously, the design of storage tank 5 is easy to make, yield height and cost is low.
By above-mentioned this creation embodiment as can be known, this creates the value on the true tool industry.Only above embodiment explanation only is the preferred embodiment explanation of this creation, has in the affiliated such as technical field to know that usually the knowledgeable is when doing other all improvement and variation according to the foregoing description explanation of this creation.Yet all improvement and variation that these are done according to this creation embodiment are in creation spirit that still belongs to this creation and the claim that defines.
[primary clustering symbol description]
1 bearing seat of light-emitting diode chip structure, 20 light-emitting diode chip for backlight unit
30 lead frames, 40 encapsulating housings, 50 electronic building bricks
60 lead-in wires, 3 conductive connecting pins, 4 pedestals
5 storage tanks, 31 draw-in grooves, 41 insulating bases
42 reflector structures, 43 conducting strips, 431 concave faces
432 draw-in grooves.
Claims (13)
1. light-emitting diode chip for backlight unit load bearing base structure is in order to carrying at least one light-emitting diode chip for backlight unit, and this light-emitting diode chip for backlight unit system couples at least one electronic building brick, it is characterized in that this light-emitting diode chip for backlight unit load bearing base structure comprises:
At least one conductive connecting pin is in order to couple this light-emitting diode chip for backlight unit; And
One pedestal is to be incorporated into this conductive connecting pin, and this pedestal is in order to carry this light-emitting diode chip for backlight unit, and the surface system of this pedestal offers a storage tank, and wherein this electronic building brick system is placed in this storage tank.
2. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this electronic building brick is a chip for driving.
3. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this electronic building brick is a protective circuit.
4. as the light-emitting diode chip for backlight unit load bearing base structure as described in the claim 3, it is characterized in that the conducting voltage of the conducting voltage system of this protective circuit greater than this light-emitting diode chip for backlight unit.
5. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this pedestal more comprises a reflector structure, and this light-emitting diode chip for backlight unit system is arranged in this reflector structure.
6. as the light-emitting diode chip for backlight unit load bearing base structure as described in the claim 5, it is characterized in that this storage tank is opened in the bottom surface of this reflector inside configuration.
7. light-emitting diode chip for backlight unit load bearing base structure according to claim 1, it is characterized in that this pedestal more comprises a conducting strip and an insulating base, this insulating base coats this conducting strip of part, make this conducting strip penetrating to the top, conducting strip system this light-emitting diode chip for backlight unit of contact of described top from this pedestal below.
8. as the light-emitting diode chip for backlight unit load bearing base structure as described in the claim 7, it is characterized in that this storage tank system is opened in this conducting strip.
9. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this storage tank is opened in this pedestal, and is different from one side of this light-emitting diode chip for backlight unit of carrying.
10. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this conductive connecting pin is different from the other end system that connects this light-emitting diode chip for backlight unit and is exposed to this pedestal.
11. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this light-emitting diode chip for backlight unit system electrically connects this conductive connecting pin with at least one lead-in wire.
12. light-emitting diode chip for backlight unit load bearing base structure according to claim 1 is characterized in that this conductive connecting pin cording has six, this light-emitting diode chip for backlight unit cording has three, and each light-emitting diode chip for backlight unit system couples with two conductive connecting pins.
13., it is characterized in that these light-emitting diode chip for backlight unit systems send the light of different wavelength as the light-emitting diode chip for backlight unit load bearing base structure as described in the claim 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920133766 CN201584409U (en) | 2009-07-08 | 2009-07-08 | Structure of bearing seat for light emitting diode (LED) chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920133766 CN201584409U (en) | 2009-07-08 | 2009-07-08 | Structure of bearing seat for light emitting diode (LED) chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201584409U true CN201584409U (en) | 2010-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920133766 Expired - Fee Related CN201584409U (en) | 2009-07-08 | 2009-07-08 | Structure of bearing seat for light emitting diode (LED) chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201584409U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723325A (en) * | 2012-06-08 | 2012-10-10 | 深圳市聚智德科技有限公司 | LED (Light-Emitting Diode) light-emitting element |
| CN105762120A (en) * | 2016-04-01 | 2016-07-13 | 宁波赛福特电子有限公司 | Infrared tube surface mount packaging structure |
| CN109037173A (en) * | 2018-07-31 | 2018-12-18 | 上海源微电子科技有限公司 | A kind of paster type encapsulation structure of LED linear driving chip |
-
2009
- 2009-07-08 CN CN 200920133766 patent/CN201584409U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723325A (en) * | 2012-06-08 | 2012-10-10 | 深圳市聚智德科技有限公司 | LED (Light-Emitting Diode) light-emitting element |
| CN105762120A (en) * | 2016-04-01 | 2016-07-13 | 宁波赛福特电子有限公司 | Infrared tube surface mount packaging structure |
| CN109037173A (en) * | 2018-07-31 | 2018-12-18 | 上海源微电子科技有限公司 | A kind of paster type encapsulation structure of LED linear driving chip |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YIWANG GROUP Free format text: FORMER OWNER: ADVANCED CONNECTEK INC. Effective date: 20121008 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20121008 Address after: British Vilgin Patentee after: Yiwang Group Address before: 518118 bamboo East Road, Da Industry Street, Shenzhen great industry zone, Guangdong Patentee before: Lianzhan Science & Technology (Shenzhen) Co., Ltd. |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100915 Termination date: 20130708 |