CN105762120A - Infrared tube surface mount packaging structure - Google Patents
Infrared tube surface mount packaging structure Download PDFInfo
- Publication number
- CN105762120A CN105762120A CN201610207602.3A CN201610207602A CN105762120A CN 105762120 A CN105762120 A CN 105762120A CN 201610207602 A CN201610207602 A CN 201610207602A CN 105762120 A CN105762120 A CN 105762120A
- Authority
- CN
- China
- Prior art keywords
- pad
- infrared
- infrared emission
- encapsulation base
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- 238000005538 encapsulation Methods 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 238000013461 design Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract 3
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012946 outsourcing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Curtains And Furnishings For Windows Or Doors (AREA)
Abstract
The invention relates to an infrared tube surface mount packaging structure, which comprises an infrared radiation tube, a packaging base and pads, wherein the lower end of the infrared radiation tube is provided with the packaging base; the packaging base has a cuboid structure; the pads are symmetrically arranged at a left right angle edge and a right right angle edge on the front side surface of the packaging base; the pads are communicated with two supporting feet of the infrared radiation tube; each pad has a cuboid sheet structure; and one end of the pad is bent towards the left side surface or the right side surface of the packaging base, and the bent angle is 90 DEG. The infrared tube surface mount packaging structure has the advantages that the structure is simple; the mounting is convenient; the production cost is low; the circuit design difficulty is greatly reduced; automatic screen production is facilitated; the labor cost of workers is saved; the equipment cost is saved; and the production efficiency of the screen is greatly improved.
Description
Technical field
The present invention relates to elevator light curtain infrared emission Manifold technology field, particularly relate to a kind of infrared tube paster encapsulating structure.
Background technology
Encapsulation is process integrated circuit being assembled into chip final products, briefly, it is simply that integrated circuit die being placed on one piece of substrate playing carrying effect, pin is extracted, then fixing and packaging becomes as a whole.
In elevator light curtain banj technical field, two kinds of methods are had to be installed on circuit boards by infrared tube, the first is to adopt traditional paster infrared emission tube, installed on circuit boards at paster infrared emission tube by flat welded, another kind is to be directly installed in circuit board by two legs of infrared emission tube standard component, complete the assembling of light curtain bar, but above two mounting means has certain limitation.
First in the first mounting means, the power of existing paster infrared emission tube is smaller than 170mW's, so need to increase Power processing circuit in circuit design when installing, this mode of production increases cost, the stability of product is easily affected during paster infrared emission tube work simultaneously, in the second mounting means, have and adopt the infrared emission tube with pin, although the problem that this standard component solves paster infrared emission tube underpower and circuit design, but owing to needing to be inserted directly into time pin infrared emission tube is installed, also need to workman manually weld simultaneously, this mode is unfavorable for automated production, leverage work efficiency, simultaneously need to increase the labor cost of workman and the cost of the equipment of installation.
In order to solve the difficult problem produced in process of production of above two technique, design a kind of novel encapsulating structure and be necessary.
Summary of the invention
The technical problem to be solved is to provide a kind of infrared tube paster encapsulating structure, has simple in construction, easy for installation, production cost is low, greatly reduce the difficulty of circuit design, facilitate light curtain automated production, saved the labor cost of workman and equipment cost, substantially increase the feature such as production efficiency of light curtain.
nullThe technical solution adopted for the present invention to solve the technical problems is: provide a kind of infrared tube paster encapsulating structure，Including infrared emission pipe、Encapsulation base and pad，The lower end of described infrared emission pipe is provided with encapsulation base，Encapsulation base is rectangular structure，About its leading flank, two square edge places have been arranged symmetrically with pad，Pad connects with two legs of infrared emission pipe，Described pad is rectangle laminated structure，Pad one end bends towards encapsulation base left surface or right flank，Bending angle is 90 °，Encapsulation base is primarily used to facilitate and is attached between infrared emission pipe and circuit board，Encapsulation base makes infrared emission pipe connect with pad，Pad is when being connected with circuit board，It is equivalent to infrared emission pipe install on circuit boards，The structure of encapsulation base adopts cuboid to facilitate automation equipment and takes encapsulation，And the connection of product and circuit board it is automatically performed by rational line configurations，Substantially increase production efficiency、Save cost in work.
Supplement as to the one of technical solutions according to the invention, why selecting diameter is 5mm, transmitting power is 120～200mW, when not merely take into account the work of light curtain bar, the work problem of its internal circuit, contemplating the Cost Problems of infrared emission pipe itself, the size also defining infrared emission pipe is primarily used to facilitate the production of automation equipment.
Supplementing as to the one of technical solutions according to the invention, described encapsulation base adopts insulant to make.
Beneficial effect
The present invention relates to a kind of infrared tube paster encapsulating structure, encapsulation base is primarily used to facilitate and is attached between infrared emission pipe and circuit board, encapsulation base makes infrared emission pipe connect with pad, pad is when being connected with circuit board, it is equivalent to infrared emission pipe install on circuit boards, the structure of encapsulation base adopts cuboid to facilitate automation equipment and takes encapsulation, and the connection of product and circuit board it is automatically performed by rational line configurations, substantially increase production efficiency, save cost in work, there is simple in construction, easy for installation, production cost is low, greatly reduce the difficulty of circuit design, facilitate light curtain automated production, labor cost and the equipment cost of workman are saved, the features such as the production efficiency substantially increasing light curtain.
Accompanying drawing explanation
Fig. 1 is the front view of the present invention；
Fig. 2 is the top view of the present invention.
Diagram: 1, infrared emission pipe, 2, encapsulation base, 3, pad.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is expanded on further.Should be understood that these embodiments are merely to illustrate the present invention rather than restriction the scope of the present invention.In addition, it is to be understood that after having read the content that the present invention lectures, the present invention can be made various changes or modifications by those skilled in the art, and these equivalent form of values fall within the application appended claims limited range equally.
Embodiments of the present invention relate to a kind of infrared tube paster encapsulating structure, as shown in Fig. 12, including infrared emission pipe 1, encapsulation base 2 and pad 3, the lower end of described infrared emission pipe 1 is provided with encapsulation base 2, encapsulation base 2 is in rectangular structure, about its leading flank, two square edge places have been arranged symmetrically with pad 3, pad 3 connects with two legs of infrared emission pipe 1, described pad 3 is rectangle laminated structure, pad 3 one end bends towards encapsulation base 2 left surface or right flank, and bending angle is 90 °.
The diameter of described infrared emission pipe 1 is 5mm, and transmitting power is 120～200mW.
Described encapsulation base 2 adopts insulant to make.
Embodiment 1
Among production process, first the encapsulation base 2 with pad 3 of the infrared emission pipe 1 of outsourcing with outsourcing is assembled by automated production equipment, after assembling, the horizontal patch red outer tube after all being completed is encapsulated and put in Vibrated baiting dish.
Embodiment 2
Light curtain bar adopts production line balance when producing, each operation completes the assembling of an electronic component, when the encapsulation of horizontal patch red outer tube is welded by needs time, first pass through Vibrated baiting dish horizontal patch red outer tube encapsulation discharging form is defined, avoid the occurrence of horizontal patch red outer tube encapsulation pad 3 position cannot be corresponding with welding position situation occur, afterwards by the horizontal patch red outer tube encapsulation of manipulator clamping post, and be coated with on the end face that encapsulation base 2 arranges pad 3 spread soldering paste by another mechanical hand, the encapsulation of horizontal patch red outer tube can be placed on circuit boards by mechanical hand afterwards, and weld with the 3rd mechanical hand, complete the installation of horizontal patch red outer tube encapsulation.
Claims (3)
1. an infrared tube paster encapsulating structure, including infrared emission pipe (1), encapsulation base (2) and pad (3), it is characterized in that: the lower end of described infrared emission pipe (1) is provided with encapsulation base (2), encapsulation base (2) is in rectangular structure, about its leading flank, two square edge places have been arranged symmetrically with pad (3), pad (3) connects with two legs of infrared emission pipe (1), described pad (3) is rectangle laminated structure, pad (3) one end bends towards encapsulation base (2) left surface or right flank, bending angle is 90 °.
2. a kind of infrared tube paster encapsulating structure according to claim 1, it is characterised in that: the diameter of described infrared emission pipe (1) is 5mm, and transmitting power is 120～200mW.
3. a kind of infrared tube paster encapsulating structure according to claim 1, it is characterised in that: described encapsulation base (2) adopts insulant to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610207602.3A CN105762120A (en) | 2016-04-01 | 2016-04-01 | Infrared tube surface mount packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610207602.3A CN105762120A (en) | 2016-04-01 | 2016-04-01 | Infrared tube surface mount packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105762120A true CN105762120A (en) | 2016-07-13 |
Family
ID=56333530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610207602.3A Pending CN105762120A (en) | 2016-04-01 | 2016-04-01 | Infrared tube surface mount packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105762120A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170838A (en) * | 2017-05-26 | 2017-09-15 | 深圳成光兴光电技术股份有限公司 | A kind of patch type infrared reception device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134414A (en) * | 2002-10-04 | 2004-04-30 | Ultrastar Ltd | Package structure of surface mount light emitting diode and method for manufacturing the same |
| JP2005223209A (en) * | 2004-02-06 | 2005-08-18 | Mitsubishi Electric Corp | Vacuum package sensor element, wafer level vacuum package, and manufacturing method thereof |
| CN201038137Y (en) * | 2007-01-26 | 2008-03-19 | 北京鸿合盛视数字媒体技术有限公司 | Infrared tube, tube holder and infrared tube module device |
| CN101226976A (en) * | 2007-10-09 | 2008-07-23 | 番禺得意精密电子工业有限公司 | LED device and locating structure thereof |
| CN101431132A (en) * | 2007-11-07 | 2009-05-13 | 光宝科技股份有限公司 | Luminous diode |
| US20090289269A1 (en) * | 2008-05-26 | 2009-11-26 | Soshchin Naum | Packaging structure of light emitting diode |
| CN201584409U (en) * | 2009-07-08 | 2010-09-15 | 连展科技（深圳）有限公司 | Structure of bearing seat for light emitting diode (LED) chips |
| US8525305B1 (en) * | 2010-06-29 | 2013-09-03 | Eoplex Limited | Lead carrier with print-formed package components |
| CN205609500U (en) * | 2016-04-01 | 2016-09-28 | 宁波赛福特电子有限公司 | Infrared tub of paster packaging structure |
-
2016
- 2016-04-01 CN CN201610207602.3A patent/CN105762120A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134414A (en) * | 2002-10-04 | 2004-04-30 | Ultrastar Ltd | Package structure of surface mount light emitting diode and method for manufacturing the same |
| JP2005223209A (en) * | 2004-02-06 | 2005-08-18 | Mitsubishi Electric Corp | Vacuum package sensor element, wafer level vacuum package, and manufacturing method thereof |
| CN201038137Y (en) * | 2007-01-26 | 2008-03-19 | 北京鸿合盛视数字媒体技术有限公司 | Infrared tube, tube holder and infrared tube module device |
| CN101226976A (en) * | 2007-10-09 | 2008-07-23 | 番禺得意精密电子工业有限公司 | LED device and locating structure thereof |
| CN101431132A (en) * | 2007-11-07 | 2009-05-13 | 光宝科技股份有限公司 | Luminous diode |
| US20090289269A1 (en) * | 2008-05-26 | 2009-11-26 | Soshchin Naum | Packaging structure of light emitting diode |
| CN201584409U (en) * | 2009-07-08 | 2010-09-15 | 连展科技（深圳）有限公司 | Structure of bearing seat for light emitting diode (LED) chips |
| US8525305B1 (en) * | 2010-06-29 | 2013-09-03 | Eoplex Limited | Lead carrier with print-formed package components |
| CN205609500U (en) * | 2016-04-01 | 2016-09-28 | 宁波赛福特电子有限公司 | Infrared tub of paster packaging structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107170838A (en) * | 2017-05-26 | 2017-09-15 | 深圳成光兴光电技术股份有限公司 | A kind of patch type infrared reception device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102883552B (en) | LGA and BGA Rework Technics | |
| CN105762120A (en) | Infrared tube surface mount packaging structure | |
| CN105762254A (en) | Vertical surface mount infrared tube packaging structure | |
| CN205609500U (en) | Infrared tub of paster packaging structure | |
| CN205609564U (en) | Infrared tube packaging structure of vertical paster | |
| CN204470756U (en) | Through-hole reflow positioning fixture | |
| CN204257624U (en) | A kind of novel B GA device | |
| CN204119670U (en) | A kind of PLCC encapsulates mobile phone camera | |
| CN204736144U (en) | LED lamp pearl picture peg anchor clamps spare | |
| CN204992008U (en) | A component for power adapter | |
| CN204558206U (en) | A kind of electronic component assembling box | |
| CN203277366U (en) | J-shaped surface-mounted pin circuit module | |
| CN107592753A (en) | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin | |
| CN203103286U (en) | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor | |
| CN101859749A (en) | Function conversion template welding structure of ball grid array device and preparation method thereof | |
| CN203797583U (en) | Surface mounting type piranha LED lamp | |
| CN203942698U (en) | Based on the PCB encapsulating structure of the miniature SMT components and parts of lightweight | |
| CN202310293U (en) | Lead of camera module circuit | |
| CN105845584B (en) | A kind of semiconductor diode framework quick assembling technique and its aid | |
| CN203871317U (en) | Structure of bridge rectifier | |
| CN204045558U (en) | Array of semiconductor devices formula reviewing packaging mechanism | |
| CN213303774U (en) | SMD coating type electronic component | |
| CN202084536U (en) | Novel lead frame riveting structure | |
| CN202111073U (en) | High-low bonding wire structure of integrated circuit | |
| CN202190459U (en) | Paster element pad layout structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |
|
| RJ01 | Rejection of invention patent application after publication |