CN107592753A - Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin - Google Patents
Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin Download PDFInfo
- Publication number
- CN107592753A CN107592753A CN201710691872.0A CN201710691872A CN107592753A CN 107592753 A CN107592753 A CN 107592753A CN 201710691872 A CN201710691872 A CN 201710691872A CN 107592753 A CN107592753 A CN 107592753A
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- wiring board
- groove
- bending pin
- pin
- localization tool
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Abstract
The invention discloses a kind of wiring board and the localization tool of bending pin, the surface of the localization tool has one first groove, and the bottom surface of first groove has at least one second groove；First groove is used to placing and positioning the wiring board, and second groove is used to placing and positioning the bending pin, and the weld part of the bending pin is exposed outside second groove and higher than the front of the wiring board.Also disclose a kind of wiring board using the localization tool and bend the welding method and lamp bar preparation method of pin.The localization tool and welding method can effectively positioning line fault plate and relative position and relative angle during bending pin welding, reduce when making lamp bar, the wiring board of lamp bar and the error for bending welding position between pin, soldering angle etc..
Description
Technical field
The present invention relates to field of backlights, more particularly to the localization tool of a kind of wiring board and bending pin, welding method and
Lamp bar preparation method.
Background technology
In the backlight of display module, the position of lamp bar is determined by the internal structure of backlight, and the circuit of lamp bar
The position of the pin outs of plate is then set on the back side according to customer demand mostly, therefore, as shown in figure 1, being carried on the back for side entering type
For light source, if its lamp bar 3 ' using top emitting led 32 ', and will use metal pins if, can only be drawn using bending
Pin 33 '.But bending pin 33 ' does not have PIN caps, when being welded with wiring board 31 ', it is difficult to pass through the internal structure of backlight
Its position is controlled, causes the error for bending welding position, the soldering angle of pin 33 ' etc. larger.
The content of the invention
In order to solve above-mentioned the deficiencies in the prior art, the present invention provide a kind of wiring board and bending pin localization tool,
Welding method and lamp bar preparation method.The localization tool and welding method can effective positioning line fault plates and during bending pin welding
Relative position and relative angle, reduce when making lamp bar, welding position, weldering between the wiring board of lamp bar and bending pin
Connect the error of angle etc..
The technical problems to be solved by the invention are achieved by the following technical programs：
The localization tool of a kind of wiring board and bending pin, including a bearing part, the surface of the bearing part are recessed with one first
Groove, the bottom surface of first groove have at least one second groove；First groove is used to placing and positioning the wiring board,
Second groove is used to placing and positioning the bending pin, and the weld part of the bending pin is exposed described second
Groove is outer and is higher than the front of the wiring board.
Further, in addition at least one first press part, for by the edge of the wiring board and first groove
Mutually press.
Further, in addition at least one second press part, for by the connecting portion and described second of the bending pin
Groove mutually presses.
Further, in addition to the bearing part is arranged on away from the magnetic on first groove and the second groove one side
Part is inhaled, between the magnetic absorption member and first press part, and/or, pass through between the magnetic absorption member and second press part
Magnetic picture adsorbs.
Further, the wiring board is single plate structure or whole board structure.
The welding method of a kind of wiring board and bending pin, comprises the following steps：
Step 1, provide any described localization tool in claim 1-5；
Step 2, by it is described bending pin be placed in the second groove of the bearing part, it is described bending pin weld part be exposed at
Outside second groove；
Step 3, the wiring board is placed in the first groove of the bearing part, the weld part of the bending pin passes through institute
State the front for being higher than the wiring board on wiring board after corresponding welding hole；
Step 4, the weld part of the bending pin and the front of the wiring board welded together.
Further, step A is included between step 3 and step 4：First press part is placed on the wiring board
Upper surface edge on, the edge of the wiring board is mutually pressed with first groove.
Further, step B is included between step 2 and step 3 or between step 3 and step 4：By described second
Press part is placed on the connecting portion of the bending pin, is that the connecting portion of the bending pin is mutually pressed with second groove
Close.
Further, step 5 is also included after step 4：Take out the wiring board from the localization tool, and by institute
The back side of the weld part and the wiring board of stating bending pin welds together.
A kind of preparation method of lamp bar, including the welding method of above-mentioned wiring board and bending pin.
The present invention has the advantages that：The localization tool and welding method are placed and positioned using first groove
The wiring board, the bending pin is placed and positioned using second groove, with the fixation wiring board and bending pin
Between relative position and relative angle, can effectively positioning line fault plate and bending pin welding when relative position and relative angle
Degree, is reduced when making lamp bar, the error of welding position, soldering angle between the wiring board and bending pin of lamp bar etc..
Brief description of the drawings
Fig. 1 is the schematic diagram of existing backlight；
Fig. 2 is the schematic diagram of existing wiring board；
Fig. 3 is the schematic diagram of existing bending pin；
Fig. 4 is the schematic diagram of the supporting body of localization tool provided by the invention；
Fig. 5 is the A-A sectional views of the supporting body shown in Fig. 4；
Schematic diagram when Fig. 6 localization tools provided by the invention work；
B-B sectional views when Fig. 7 is the localization tool work shown in Fig. 6；
Fig. 8 is wiring board provided by the invention and bends the step block diagram of the welding method of pin.
Embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
Embodiment one
A kind of localization tool of wiring board and bending pin, wherein, as shown in Fig. 2 the wiring board 2 is with described for welding
An at least welding hole 23 for pin 3 and some pads 22 for welding electronic component are bent, and the wiring board 2 is in the weldering
The line layer 24 that inside is exposed around hole 23 is connect, the electronic component includes but is not limited to LED, resistance etc.；Such as Fig. 3 institutes
Show, the bending pin 3 includes weld part 31 and connecting portion 32, and the weld part 31 is used for the welding through the wiring board 2
Welded behind hole 23 with exposed line layer 24, the connecting portion 32 is used to be attached with outer member.
As shown in Figures 4 and 5, the localization tool includes a bearing part 11, and the surface of the bearing part 11 is recessed with one first
Groove 111, the bottom surface of first groove 111 have at least one second groove 112；First groove 111 is used to place and determine
The position wiring board 2, second groove 112 is used to placing and positioning the bending pin 3, and makes the bending pin 3
Weld part 31 exposes outer and higher than the wiring board 2 the front in second groove 112.
Both preferably, the size of the first groove 111 and wiring board 2 in length and width is adapted, optimally
Size in length and width is consistent, so that the wiring board 2 can just be placed in first groove 111, but
It is unlikely to be captured between in first groove 111 again；Second groove 112 and bending pin 3 are in length and width
Size is adapted, and optimally both sizes in length and width are consistent, so that the bending pin 3 can just be placed
In second groove 112, but it is unlikely to be captured between in second groove 112.
During actual production, the bending angle between the weld part 31 and connecting portion 32 of the bending pin 3 is not
90 ° be limited in the present embodiment, it bends number and is also not necessarily limited to once.
As shown in Figures 6 and 7, in process of production, first the bending pin 3 is placed in second groove 112, and
The weld part 31 of the bending pin 3 is placed on first groove towards first groove 111, then by the wiring board 2
In 111, the weld part 31 for bending pin 3 exposes in the wiring board 2 after passing through the welding hole 23 on the wiring board 2
Top, then weld carrying out a tin cream 4, by what is exposed around the weld part 31 and the welding hole 23 of the bending pin 3
Line layer 24 welds together.
The wiring board 2 is placed and positioned to the localization tool using first groove 111, utilizes second groove
112 place and position the bending pin 3, relative position and relative angle between the fixation wiring board 2 and bending pin 3
Degree, can effectively positioning line fault plate 2 and bending pin 3 welding when relative position and relative angle, reduce when making lamp bar,
The error of welding position, soldering angle between the wiring board 2 and bending pin 3 of lamp bar etc..
The localization tool also includes at least one first press part 12, for a tin cream 4 welding before, by the wiring board 2
Edge pressed with the phase of the first groove 111, moved with limiting the wiring board 2；The preferred density of first press part 12
Larger material, such as metal etc., to provide larger pressure force.
The localization tool also includes at least one second press part 13, for after the bending pin 3 is placed or in point
Before tin cream 4 welds, the connecting portion 32 of the bending pin 3 is pressed with the phase of the second groove 112, drawn with limiting the bending
Pin 3 moves, and prevents the weld part 31 of the bending pin 3 from gliding, and ensures that the weld part 31 has enough height and institute
The welding hole 23 stated on wiring board 2 is welded；The larger material of the preferred density of second press part 13, such as metal etc.,
To provide larger pressure force.
The localization tool also includes being arranged on the bearing part 11 away from the groove 112 1 of the first groove 111 and second
A magnetic absorption member 14 on face, between the magnetic absorption member 14 and first press part 12, and/or, the magnetic absorption member 14 with it is described
Adsorbed between second press part 13 by magnetic picture.
The wiring board 2 is the single plate structure with complete line, or, the present embodiment as shown in Figure 2, the circuit
Plate 2 is the whole board structure that is formed by multiple layouts of single plate structure 21 with independent complete line, adjacent single plate structure 21 it
Between formed with hollow slots, it is convenient to place second press part 13 to expose the connecting portion 32 of the bending pin 3.
Embodiment two
As shown in figure 8, the welding method of a kind of wiring board and bending pin, comprises the following steps：
Localization tool described in step 1, offer embodiment one；
Step 2, as shown in Figures 4 and 5, the bending pin 3 is placed in the second groove 112 of the bearing part 11, it is described
The weld part 31 of bending pin 3 is exposed at outside second groove 112；
Step 3, the wiring board 2 is placed in the first groove 111 of the bearing part 11, the welding of the bending pin 3
Portion 31 passes through the front for being higher than the wiring board 2 on the wiring board 2 after corresponding welding hole 23；
Step 4, the weld part 31 of the bending pin 3 and the front of the wiring board 2 welded together.
Wherein, as shown in Fig. 2 the wiring board 2 has an at least welding hole 23 He for being used for welding the bending pin 3
For welding some pads 22 of electronic component, and the wiring board 2 exposes the line of inside around the welding hole 23
Road floor 24, the electronic component includes but is not limited to LED, resistance etc.；As shown in figure 3, the bending pin 3 includes weld part 31
With connecting portion 32, the weld part 31 is welded after being used for through the welding hole 23 of the wiring board 2 with exposed line layer 24
Connect, the connecting portion 32 is used to be attached with outer member.In step 4, the bending weld part 31 of pin 3 and described
The line layer 24 exposed on the front of welding hole 23 of wiring board 2 carries out a tin cream 4 and welded.
The wiring board 2 is placed and positioned to the welding method using the first groove 111 of the bearing part 11, using described
The bending pin 3 is placed and positioned to second groove 112 of bearing part 11, between the fixation wiring board 2 and bending pin 3
Relative position and relative angle can effectively positioning line fault plate 2 and bending pin 3 weld when relative position and relative angle,
Reduce when making lamp bar, the error of welding position, soldering angle between the wiring board 2 and bending pin 3 of lamp bar etc..
Include step A between step 3 and step 4：First press part 12 is placed on to the upper table of the wiring board 2
On the edge in face, the edge of the wiring board 2 is set mutually to be pressed with first groove 111.
This step A is moved using the gravity of first press part 12 with limiting the wiring board 2, first press part
The larger material of 12 preferred densities, such as metal etc., to provide larger pressure force.
Include step B between step 2 and step 3 or between step 3 and step 4：By second press part 13
It is placed on the connecting portion 32 of the bending pin 3, is the connecting portion 32 of the bending pin 3 and second groove 112
Mutually press.
This step B is moved using the gravity of second press part 13 with limiting the bending pin 3, and is prevented described
The weld part 31 of bending pin 3 glides, and ensures that the weld part 31 has enough height and the welding hole 23 on the wiring board 2
Welded, the larger material of the preferred density of the second press part 13, such as metal etc., to provide larger pressure force.
Also include step 5 after step 4：The wiring board 2 is taken out from the localization tool, and the bending is drawn
The weld part 31 of pin 3 and the back side of the wiring board 2 weld together, to reinforce between the wiring board 2 and bending pin 3
Bonding strength.
The wiring board 2 is the single plate structure with complete line, or, the present embodiment as shown in Figure 2, the circuit
Plate 2 is the whole board structure that is formed by multiple layouts of single plate structure 21 with independent complete line, adjacent single plate structure 21 it
Between formed with hollow slots, it is convenient to place second press part in stepb to expose the connecting portion 32 of the bending pin 3
13。
Embodiment three
A kind of preparation method of lamp bar, including wiring board and the welding method of bending pin described in embodiment two.
Embodiment described above only expresses embodiments of the present invention, and its description is more specific and detailed, but can not
Therefore the limitation to the scope of the claims of the present invention is interpreted as, as long as the skill obtained using the form of equivalent substitution or equivalent transformation
Art scheme, it all should fall within the scope and spirit of the invention.
Claims (10)
- A kind of 1. localization tool of wiring board and bending pin, it is characterised in that：Including a bearing part, the surface of the bearing part With one first groove, the bottom surface of first groove has at least one second groove；First groove is used to place and determine The position wiring board, second groove are used to placing and positioning the bending pin, and make the weld part of the bending pin Expose outside second groove and higher than the front of the wiring board.
- 2. the localization tool of wiring board according to claim 1 and bending pin, it is characterised in that：Also include at least 1 the One press part, for the edge of the wiring board and first groove mutually to be pressed.
- 3. the localization tool of wiring board according to claim 1 and bending pin, it is characterised in that：Also include at least 1 the Two press parts, for the connecting portion of the bending pin mutually to be pressed with second groove.
- 4. the localization tool of the wiring board and bending pin according to Claims 2 or 3, it is characterised in that：Also include setting In the bearing part away from the magnetic absorption member on first groove and the second groove one side, the magnetic absorption member and the described first pressure Between component, and/or, adsorbed between the magnetic absorption member and second press part by magnetic picture.
- 5. according to any described wiring board in claim 1-3 and bending pin, it is characterised in that：The wiring board is veneer Structure or whole board structure.
- A kind of 6. welding method of wiring board and bending pin, it is characterised in that：Comprise the following steps：Step 1, provide any described localization tool in claim 1-5；Step 2, by it is described bending pin be placed in the second groove of the bearing part, it is described bending pin weld part be exposed at Outside second groove；Step 3, the wiring board is placed in the first groove of the bearing part, the weld part of the bending pin passes through institute State the front for being higher than the wiring board on wiring board after corresponding welding hole；Step 4, the weld part of the bending pin and the front of the wiring board welded together.
- 7. the welding method of wiring board according to claim 6 and bending pin, it is characterised in that：In step 3 and step 4 Between include step A：On the edge for the upper surface that first press part is placed on into the wiring board, make the wiring board Edge mutually presses with first groove.
- 8. the welding method of wiring board according to claim 6 and bending pin, it is characterised in that：In step 2 and step 3 Between or include between step 3 and step 4 step B：Second press part is placed on to the company of the bending pin It is that the connecting portion of the bending pin mutually presses with second groove in socket part.
- 9. according to the welding method of any described wiring board and bending pin in claim 6-8, it is characterised in that：In step Also include step 5 after 4：Take out the wiring board from the localization tool, and by the weld part of the bending pin and institute The back side for stating wiring board welds together.
- A kind of 10. preparation method of lamp bar, it is characterised in that：Including any described wiring board and bending in claim 6-9 The welding method of pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710691872.0A CN107592753A (en) | 2017-08-14 | 2017-08-14 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710691872.0A CN107592753A (en) | 2017-08-14 | 2017-08-14 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107592753A true CN107592753A (en) | 2018-01-16 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710691872.0A Pending CN107592753A (en) | 2017-08-14 | 2017-08-14 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
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| CN (1) | CN107592753A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109819601A (en) * | 2019-02-15 | 2019-05-28 | 格力电器（合肥）有限公司 | A kind of backlight source pin welding resistance method and backlight |
| CN112276458A (en) * | 2020-11-23 | 2021-01-29 | 北京机械设备研究所 | Display panel welding positioning device, production method and display panel positioning welding method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1079432A1 (en) * | 1999-08-26 | 2001-02-28 | Sagem S.A. | Electronic module and method of manufacturing such a module |
| CN202655757U (en) * | 2012-06-14 | 2013-01-09 | 常州金源永利达电子科技有限公司 | Wave soldering support plate |
| CN103317200A (en) * | 2013-06-20 | 2013-09-25 | 上海三思电子工程有限公司 | Welding method and jig for adhering lead on circuit board |
| CN203942713U (en) * | 2014-07-01 | 2014-11-12 | 北京晨晶电子有限公司 | Mounting and positioning device |
| CN204018990U (en) * | 2014-07-17 | 2014-12-17 | 上海斐讯数据通信技术有限公司 | A kind of limit for height guiding tool |
| CN104416255A (en) * | 2013-08-22 | 2015-03-18 | 海洋王（东莞）照明科技有限公司 | Wire holder welding tooling |
| CN204221244U (en) * | 2014-09-03 | 2015-03-25 | 东莞华贝电子科技有限公司 | The manual welding fixture of electronic component |
| CN106180956A (en) * | 2016-08-25 | 2016-12-07 | 南京中电熊猫照明有限公司 | FPC lamp bar Multifunctional reflux tool |
| CN206196159U (en) * | 2016-08-15 | 2017-05-24 | 惠州市海顺电子有限公司 | General support plate of magnetism aluminum alloy |
-
2017
- 2017-08-14 CN CN201710691872.0A patent/CN107592753A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1079432A1 (en) * | 1999-08-26 | 2001-02-28 | Sagem S.A. | Electronic module and method of manufacturing such a module |
| CN202655757U (en) * | 2012-06-14 | 2013-01-09 | 常州金源永利达电子科技有限公司 | Wave soldering support plate |
| CN103317200A (en) * | 2013-06-20 | 2013-09-25 | 上海三思电子工程有限公司 | Welding method and jig for adhering lead on circuit board |
| CN104416255A (en) * | 2013-08-22 | 2015-03-18 | 海洋王（东莞）照明科技有限公司 | Wire holder welding tooling |
| CN203942713U (en) * | 2014-07-01 | 2014-11-12 | 北京晨晶电子有限公司 | Mounting and positioning device |
| CN204018990U (en) * | 2014-07-17 | 2014-12-17 | 上海斐讯数据通信技术有限公司 | A kind of limit for height guiding tool |
| CN204221244U (en) * | 2014-09-03 | 2015-03-25 | 东莞华贝电子科技有限公司 | The manual welding fixture of electronic component |
| CN206196159U (en) * | 2016-08-15 | 2017-05-24 | 惠州市海顺电子有限公司 | General support plate of magnetism aluminum alloy |
| CN106180956A (en) * | 2016-08-25 | 2016-12-07 | 南京中电熊猫照明有限公司 | FPC lamp bar Multifunctional reflux tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109819601A (en) * | 2019-02-15 | 2019-05-28 | 格力电器（合肥）有限公司 | A kind of backlight source pin welding resistance method and backlight |
| CN112276458A (en) * | 2020-11-23 | 2021-01-29 | 北京机械设备研究所 | Display panel welding positioning device, production method and display panel positioning welding method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180116 |
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| RJ01 | Rejection of invention patent application after publication |