CN109819601A - A kind of backlight source pin welding resistance method and backlight - Google Patents
A kind of backlight source pin welding resistance method and backlight Download PDFInfo
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- CN109819601A CN109819601A CN201910116276.9A CN201910116276A CN109819601A CN 109819601 A CN109819601 A CN 109819601A CN 201910116276 A CN201910116276 A CN 201910116276A CN 109819601 A CN109819601 A CN 109819601A
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- source pin
- backlight source
- pad
- pin
- backlight
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Abstract
The present invention relates to a kind of backlight source pin welding resistance method and backlights, this method comprises: changing the layout of device on illuminator, with the distance between pad and the backlight source pin for increasing the device；And/or welding resistance processing is carried out to backlight source pin, the pad to be isolated with backlight source pin.Technical solution provided by the invention, by the layout for changing device on illuminator, and/or, welding resistance processing is carried out to backlight source pin, to increase the distance between the pad of the device and backlight source pin or the pad of the device be isolated with backlight source pin, tin distance is climbed after melting to the tin increased on pad and pin, short circuit problem is avoided to occur.Such mode is easy to operate, is easy to dispose implementation, and versatile, and such structure can be used in the material of similar production technology, and application scenarios are wide, user experience is high.
Description
Technical field
The present invention relates to welding circuit board technical fields, and in particular to a kind of backlight source pin welding resistance method and backlight.
Background technique
Backlight (Back Light) is a kind of light source positioned at the behind liquid crystal display (LCD), its illumination effect will
Directly influence LCD MODULE (LCM) visual effect.
With the development of science and technology, backlight is widely used in the fields such as TV, advertisement cabinet, remote controler.It is led with remote controler
For the backlight in domain, structure is made of illuminator and pin, and after pin needs to weld energization on circuit boards, illuminator is
It can shine.
But during actual welding, since the device bonding pad of illuminator is closer with tin region distance in backlight source pin
(actual test only has 0.5-0.7mm), when tin is heated in backlight source pin, the tin in the device bonding pad of illuminator, which can also be heated, to be melted
Change, scolding tin is laterally expanded by the black anti-dazzling screen on circuit board to be moved, then will lead to short circuit.
Summary of the invention
To be overcome the problems, such as present in the relevant technologies at least to a certain extent, the present invention provides a kind of backlight source pin resistance
Soldering method and backlight, to solve the problems, such as that prior art backlight source pin is easy and the short circuit of the pad of the device on illuminator.
According to a first aspect of the embodiments of the present invention, a kind of backlight source pin welding resistance method is provided, comprising:
Change the layout of device on illuminator, with the distance between pad and the backlight source pin for increasing the device；With/
Or,
Welding resistance processing is carried out to backlight source pin, the pad to be isolated with backlight source pin.
Preferably, the layout for changing device on illuminator, comprising:
Adjustment is laid out to the device in preset range around backlight source pin so that the pad of device adjusted with
The distance between backlight source pin increases.
Preferably, the device in preset range around backlight source pin is laid out adjustment, comprising:
If the pad of the device around backlight source pin in preset range is parallel with the backlight source pin, by the pad
It is adjusted to vertical with backlight source pin；
If the pad of the device around backlight source pin in preset range is vertical with the backlight source pin, but the pad
Spacing distance between backlight source pin is less than preset value, increases the distance between the pad and backlight source pin.
It is preferably, described that welding resistance processing is carried out to backlight source pin, comprising:
In one end that backlight source pin is connect with the illuminator, solder resist material is printed.
Preferably, the printing length of the solder resist material accounts for the one third of the luminous body length.
Preferably, the solder resist material includes: solder mask.
According to a second aspect of the embodiments of the present invention, a kind of backlight is provided, comprising:
Illuminator,
Pin, and the pad interval pre-determined distance of device on the illuminator or is isolated.
Preferably, the pad of the device around the pin in preset range is vertical with the pin, and the pad with
The distance between described pin is greater than or equal to preset value.
Preferably, one end that the pin is connect with the illuminator, is printed with solder resist material.
Preferably, the printing length of the solder resist material accounts for the one third of the luminous body length.
Preferably, the solder resist material includes: solder mask.
The technical solution that the embodiment of the present invention provides can include the following benefits:
By the layout of device on change illuminator, and/or, welding resistance processing is carried out to backlight source pin, it is described to increase
The pad of the device is isolated with backlight source pin for the distance between the pad of device and backlight source pin, to increase
Tin distance is climbed after the tin thawing being welded on disk and pin, short circuit problem is avoided to occur.Such mode is easy to operate, is easy to dispose
Implement, and versatile, such structure can be used in the material of similar production technology, and application scenarios are wide, user experience is high.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is a kind of flow chart of backlight source pin welding resistance method shown according to an exemplary embodiment；
Fig. 2A is the device shown according to an exemplary embodiment having not been changed around backlight source pin in preset range
The structural schematic diagram of pad layout；
Fig. 2 B is the weldering of the device around change backlight source pin shown according to an exemplary embodiment in preset range
The structural schematic diagram of disk layout；
Fig. 2 C is the structural representation shown according to an exemplary embodiment in backlight source pin after printing solder resist material
Figure；
Fig. 2 D is the weldering of the device around change backlight source pin shown according to an exemplary embodiment in preset range
Disk layout, and the structural schematic diagram after solder resist material is printed in backlight source pin.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistented with the present invention.On the contrary, they be only with it is such as appended
The example of device and method being described in detail in claims, some aspects of the invention are consistent.
Fig. 1 is a kind of flow chart of backlight source pin welding resistance method shown according to an exemplary embodiment, such as Fig. 1 institute
Show, this method comprises:
Step S1, change the layout of device on illuminator, to increase between the pad of the device and backlight source pin
Distance；And/or
Step S2, welding resistance processing is carried out to backlight source pin, the pad to be isolated with backlight source pin.
Technical solution provided in this embodiment, by the layout of device on change illuminator, and/or, to backlight source pin
Welding resistance processing is carried out, come the distance between pad and backlight source pin for increasing the device or to the pad and back of the device
Light source pin is isolated, and climbs tin distance after the tin on pad and pin melts to increase, short circuit problem is avoided to occur.This
Kind mode is easy to operate, is easy to dispose implementation, and versatile, and such structure can be used in the material of similar production technology, answers
With scene is wide, user experience is high.
Preferably, the layout for changing device on illuminator, comprising:
Adjustment is laid out to the device in preset range around backlight source pin so that the pad of device adjusted with
The distance between backlight source pin increases.
It is understood that the distance between the pad of device adjusted and backlight source pin increase, greatly reduce
The pad of device and the risk of backlight source pin short circuit, improve the reliability of backlight.
A and Fig. 2 B referring to fig. 2, it is preferable that the device 2 in 1 surrounding preset range of backlight source pin is laid out
Adjustment, comprising:
It, will be described if the pad 3 of the device 2 in 1 surrounding preset range of backlight source pin is parallel with the backlight source pin 1
Pad 3 is adjusted to vertical with backlight source pin 1；
If the pad 3 of the device 2 in 1 surrounding preset range of backlight source pin and the backlight source pin 1 are vertical but described
Spacing distance between pad 3 and backlight source pin 1 is less than preset value, increase between the pad 3 and backlight source pin 1 away from
From.
It should be noted that the preset value is configured according to historical experience value or experimental result.
Fig. 2A shows to be the structural representation for having not been changed the pad layout of the device around backlight source pin in preset range
Figure；Fig. 2 B shows to be the structural schematic diagram for changing the pad layout of the device around backlight source pin in preset range.It compares
It is found that the pad of the device in preset range around backlight source pin is adjusted to hang down with backlight source pin after Fig. 2A and Fig. 2 B
Directly, it is equivalent to and increases the distance between pad and pin, it is possible to reduce the contact area of pad and pin improves backlight
Soldering reliability.
A and Fig. 2 C referring to fig. 2, alternatively, Fig. 2A and Fig. 2 D, it is preferable that it is described that welding resistance processing is carried out to backlight source pin 1,
Include:
In one end that backlight source pin 1 is connect with the illuminator, solder resist material 4 is printed.
It is understood that printing solder resist material greatly drops so that pad of the welding position of pin apart from device becomes remote
The pad of low device and the risk of backlight source pin short circuit, improve the reliability of backlight.
Preferably, the printing length of the solder resist material 4 accounts for the one third of the luminous body length.
It is understood that the printing length of solder resist material accounts for the one third of the luminous body length, resistance can be saved
Wlding material, while also can guarantee welding resistance effect, user experience is good, satisfaction is high.
Preferably, the solder resist material 4 includes: solder mask.
By above-mentioned technical proposal description it is found that it includes three kinds of sides that backlight source pin welding resistance method provided by the invention, which has altogether,
Case:
Scheme one: A and Fig. 2 B referring to fig. 2 changes the layout of device on illuminator, to increase the pad and back of the device
The distance between light source pin；
Scheme two: A and Fig. 2 C referring to fig. 2 prints welding resistance material in one end that backlight source pin is connect with the illuminator
Material；
Scheme three: A and Fig. 2 D referring to fig. 2 changes the layout of device on illuminator, to increase the pad and back of the device
The distance between light source pin, and in one end that backlight source pin is connect with the illuminator, print solder resist material.
Wherein, scheme one needs to redesign PCB route, and change procedure is cumbersome, and because PCB overall dimensions are smaller,
Device adjustable range is smaller, is relatively suitble to the new product change just designed.
The changing mode of scheme two is easy to operate, does not need to be altered device arrangement, the design of PCB route.The program is only
It is to increase solder mask printing zone, production technology equally can achieve the pad and back for increasing device without big adjustment
The effect of distance between light source pin, it is easy to operate, save the cost, versatile.
Scheme three combines the advantage and disadvantage of scheme one and scheme two, and using the backlight after scheme three, soldering reliability is more
By force, short-circuit risks are lower, and user experience is more preferable.
B~Fig. 2 D referring to fig. 2, a kind of backlight shown according to an exemplary embodiment, comprising:
Illuminator,
Pin, and the pad interval pre-determined distance of device on the illuminator or is isolated.
Preferably, the pad of the device around the pin in preset range is vertical with the pin, and the pad with
The distance between described pin is greater than or equal to preset value.
It should be noted that the preset value is configured according to historical experience value or experimental result.
Preferably, one end that the pin is connect with the illuminator, is printed with solder resist material.
It is understood that printing solder resist material greatly drops so that pad of the welding position of pin apart from device becomes remote
The pad of low device and the risk of backlight source pin short circuit, improve the reliability of backlight.
Preferably, the printing length of the solder resist material accounts for the one third of the luminous body length.
It is understood that the printing length of solder resist material accounts for the one third of the luminous body length, resistance can be saved
Wlding material, while also can guarantee welding resistance effect, user experience is good, satisfaction is high.
Preferably, the solder resist material includes: solder mask.
Technical solution provided in this embodiment, by the layout of device on change illuminator, and/or, to backlight source pin
Welding resistance processing is carried out, come the distance between pad and backlight source pin for increasing the device or to the pad and back of the device
Light source pin is isolated, and climbs tin distance after the tin on pad and pin melts to increase, short circuit problem is avoided to occur.This
Kind mode is easy to operate, is easy to dispose implementation, and versatile, and such structure can be used in the material of similar production technology, answers
With scene is wide, user experience is high.
It is understood that same or similar part can mutually refer in the various embodiments described above, in some embodiments
Unspecified content may refer to the same or similar content in other embodiments.
It should be noted that in the description of the present invention, term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indication or suggestion relative importance.In addition, in the description of the present invention, unless otherwise indicated, the meaning of " multiple "
Refer at least two.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discussed suitable
Sequence, including according to related function by it is basic simultaneously in the way of or in the opposite order, Lai Zhihang function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
It should be appreciated that each section of the invention can be realized with hardware, software, firmware or their combination.Above-mentioned
In embodiment, software that multiple steps or method can be executed in memory and by suitable instruction execution system with storage
Or firmware is realized.It, and in another embodiment, can be under well known in the art for example, if realized with hardware
Any one of column technology or their combination are realized: having a logic gates for realizing logic function to data-signal
Discrete logic, with suitable combinational logic gate circuit specific integrated circuit, programmable gate array (PGA), scene
Programmable gate array (FPGA) etc..
Those skilled in the art are understood that realize all or part of step that above-described embodiment method carries
It suddenly is that relevant hardware can be instructed to complete by program, the program can store in a kind of computer-readable storage medium
In matter, which when being executed, includes the steps that one or a combination set of embodiment of the method.
It, can also be in addition, each functional unit in each embodiment of the present invention can integrate in a processing module
It is that each unit physically exists alone, can also be integrated in two or more units in a module.Above-mentioned integrated mould
Block both can take the form of hardware realization, can also be realized in the form of software function module.The integrated module is such as
Fruit is realized and when sold or used as an independent product in the form of software function module, also can store in a computer
In read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material and/or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, specific features, structure, material and/or the feature of description can be any
One or more embodiment or examples in can be combined in any suitable manner.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (11)
1. a kind of backlight source pin welding resistance method characterized by comprising
Change the layout of device on illuminator, with the distance between pad and the backlight source pin for increasing the device；And/or
Welding resistance processing is carried out to backlight source pin, the pad to be isolated with backlight source pin.
2. the method according to claim 1, wherein the layout for changing device on illuminator, comprising:
Adjustment is laid out to the device in preset range around backlight source pin, so that the pad and backlight of device adjusted
The distance between source pin increases.
3. according to the method described in claim 2, it is characterized in that, the device in preset range around backlight source pin
It is laid out adjustment, comprising:
If the pad of the device around backlight source pin in preset range is parallel with the backlight source pin, the pad is adjusted
It is vertical with backlight source pin；
If the pad of the device around backlight source pin in preset range is vertical with the backlight source pin, but the pad and back
Spacing distance between light source pin is less than preset value, increases the distance between the pad and backlight source pin.
4. the method according to claim 1, wherein described carry out welding resistance processing to backlight source pin, comprising:
In one end that backlight source pin is connect with the illuminator, solder resist material is printed.
5. according to the method described in claim 4, it is characterized in that,
The printing length of the solder resist material accounts for the one third of the luminous body length.
6. method according to claim 4 or 5, which is characterized in that
The solder resist material includes: solder mask.
7. a kind of backlight, feature is being, comprising:
Illuminator,
Pin, and the pad interval pre-determined distance of device on the illuminator or is isolated.
8. backlight according to claim 7, which is characterized in that
The pad of device around the pin in preset range is vertical with the pin, and between the pad and the pin
Distance be greater than or equal to preset value.
9. backlight according to claim 7, which is characterized in that
One end that the pin is connect with the illuminator, is printed with solder resist material.
10. backlight according to claim 9, which is characterized in that
The printing length of the solder resist material accounts for the one third of the luminous body length.
11. backlight according to claim 9 or 10, which is characterized in that
The solder resist material includes: solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910116276.9A CN109819601A (en) | 2019-02-15 | 2019-02-15 | A kind of backlight source pin welding resistance method and backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910116276.9A CN109819601A (en) | 2019-02-15 | 2019-02-15 | A kind of backlight source pin welding resistance method and backlight |
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| CN109819601A true CN109819601A (en) | 2019-05-28 |
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| CN201910116276.9A Pending CN109819601A (en) | 2019-02-15 | 2019-02-15 | A kind of backlight source pin welding resistance method and backlight |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112631042A (en) * | 2021-01-20 | 2021-04-09 | 维沃移动通信有限公司 | Electronic device and method of assembling electronic device |
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| US20110008974A1 (en) * | 2009-07-11 | 2011-01-13 | Ioan Alexandru Salomie | Circuit design assemblies |
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Application publication date: 20190528 |