CN202655757U - Wave soldering support plate - Google Patents
Wave soldering support plate Download PDFInfo
- Publication number
- CN202655757U CN202655757U CN 201220279947 CN201220279947U CN202655757U CN 202655757 U CN202655757 U CN 202655757U CN 201220279947 CN201220279947 CN 201220279947 CN 201220279947 U CN201220279947 U CN 201220279947U CN 202655757 U CN202655757 U CN 202655757U
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- CN
- China
- Prior art keywords
- support plate
- utility
- model
- wave
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a wave soldering support plate, which comprises an upper support plate and a lower support plate, wherein the upper support plate and the lower support plate are overlapped and fixed, the upper support plate is provided with at least one window used for placing a circuit board, and the surface of the lower support plate below the window is provided with multiple through holes used for installing pins of plugged components. According to the utility model, after the support plate is used, a high-temperature adhesive tape is unnecessary, only the circuit board is directly arranged on the corresponding position of a tool, and then the pins of the plugged components are inserted into the corresponding through holes, after wave soldering is completed, only the circuit board is taken down from the support plate, and the circuit board has no any residue.
Description
Technical field
The utility model relates to the wave-soldering technical field, especially a kind of wave-soldering supporting plate.
Background technology
Wave-soldering refers to the solder (terne metal) with fusing, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to the solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder that is electrically connected between components and parts welding end or pin and the printed board pad.Placing components need to be stained with scolder in order to prevent the non-welding position of wiring board with the placing components plug-in mounting in the circuit board when wave-soldering, usually adopt can not tin sticky at wiring board the position post with high temperature gummed tape, after having crossed wave-soldering, tear off again.So both taken thing, time-consuming again, and at last after high temperature gummed tape is torn off, can leave in the circuit board the residue of high temperature gummed tape, can exert an influence to whole wiring board final mass.
The utility model content
The technical problems to be solved in the utility model is: in order to solve the deficiency of above-mentioned technology, provide a kind of easy to operate, wave-soldering supporting plate of being easy to the protection circuit plate.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of wave-soldering supporting plate, comprise mounting plate and bottom plate, described mounting plate and bottom plate stack are fixing, have the window that at least one is used for placing wiring board on the described mounting plate, have a plurality of through holes for the placing components pin is installed on the bottom plate face of described beneath window.
As preferably, described window has two, and two windows are and column distribution.
The beneficial effects of the utility model are, the utility model is after using this supporting plate, needn't use high temperature gummed tape, only need wiring board is directly placed this frock relevant position, then the pin with placing components is inserted in the respective through hole, after finishing wave-soldering, only need wiring board taken off from supporting plate and get final product, do not have any residually on the wiring board, thereby the utility model is simple to operate, compact conformation, good and cheap do not lose again functional.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the structural representation of wave-soldering supporting plate of the present utility model;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the upward view of Fig. 1.
Among the figure: 1. mounting plate, 11. windows, 2. bottom plate, 21. through holes.
The specific embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, basic structure of the present utility model only is described in a schematic way, so it only show the formation relevant with the utility model.
The structural representation of the specific embodiment of the wave-soldering supporting plate of the present utility model shown in Fig. 1 ~ 3, comprise mounting plate 1 and bottom plate 2, mounting plate 1 and bottom plate 2 are fixed by screw, have the windows 11 that are used for placing wiring board of two and column distribution on the mounting plate 1, have for the through hole 21 that the placing components pin is installed on 2 of the bottom plates of window 11 belows.
When using the utility model to carry out the wave-soldering of electronic devices and components, only need wiring board is directly placed i.e. two windows 11 in this frock relevant position, then placing components is placed respective through hole 21, the pin of placing components is inserted on the wiring board, after finishing wave-soldering, only wiring board need be taken off from supporting plate and get final product, do not have any residual on the wiring board, it is that raw material is made that this supporting plate adopts epoxy resin, supporting plate with respect to the other types of current use, have good and cheap, the characteristics that function is constant.
Take above-mentioned foundation desirable embodiment of the present utility model as enlightenment, by above-mentioned description, the relevant staff can in the scope that does not depart from this utility model technological thought, carry out various change and modification fully.The technical scope of this utility model is not limited to the content on the specification, must determine its technical scope according to the claim scope.
Claims (2)
1. wave-soldering supporting plate, it is characterized in that: comprise mounting plate (1) and bottom plate (2), described mounting plate (1) and bottom plate (2) stack are fixing, have the window (11) that at least one is used for placing wiring board on the described mounting plate (1), have a plurality of through holes (21) for the placing components pin is installed on bottom plate (2) face of described window (11) below.
2. wave-soldering supporting plate as claimed in claim 1, it is characterized in that: described window (11) has two, and two windows (11) are and column distribution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220279947 CN202655757U (en) | 2012-06-14 | 2012-06-14 | Wave soldering support plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220279947 CN202655757U (en) | 2012-06-14 | 2012-06-14 | Wave soldering support plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202655757U true CN202655757U (en) | 2013-01-09 |
Family
ID=47450690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220279947 Expired - Fee Related CN202655757U (en) | 2012-06-14 | 2012-06-14 | Wave soldering support plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202655757U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107592753A (en) * | 2017-08-14 | 2018-01-16 | 信利半导体有限公司 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
-
2012
- 2012-06-14 CN CN 201220279947 patent/CN202655757U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107592753A (en) * | 2017-08-14 | 2018-01-16 | 信利半导体有限公司 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20170614 |