CN102699474A - Wave crest welding support plate - Google Patents
Wave crest welding support plate Download PDFInfo
- Publication number
- CN102699474A CN102699474A CN2012101960292A CN201210196029A CN102699474A CN 102699474 A CN102699474 A CN 102699474A CN 2012101960292 A CN2012101960292 A CN 2012101960292A CN 201210196029 A CN201210196029 A CN 201210196029A CN 102699474 A CN102699474 A CN 102699474A
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- China
- Prior art keywords
- support plate
- wave
- wave crest
- window
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a wave crest welding support plate which comprises an upper support plate and a lower support plate. The upper support plate is superposed and fixed with the lower support plate; at least one window for placing a circuit board is arranged in the upper support plate; a plurality of through holes for mounting pins of plug-in components are arranged in the surface of the lower support plate below the window. The wave crest welding support plate has the beneficial effects that after the support plate is used, a high-temperature rubber tape is not required to be used, the circuit board is only required to be directly placed at the corresponding position of a tool, and then, the pins of the plug-in components are inserted into the corresponding through holes; and after wave crest welding is finished, the circuit board is only required to be taken down from the support plate, and no residue can be left on the circuit board.
Description
Technical field
The present invention relates to the wave-soldering technical field, especially a kind of wave-soldering supporting plate.
Background technology
Wave-soldering is meant the solder (terne metal) with fusing; Become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow; Also can be through forming to the solder pot nitrogen injection; Make the printed board that components and parts are housed in advance through solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the printed board pad.Placing components need be stained with scolder in order to prevent the non-welding position of wiring board with the placing components plug-in mounting in the circuit board when wave-soldering, be employed in the position that wiring board can not tin sticky usually and post with high temperature gummed tape, after having crossed wave-soldering, tears off again.So both taken thing, time-consuming again, and at last after high temperature gummed tape is torn off, can leave the residue of high temperature gummed tape in the circuit board, can exert an influence to whole wiring board final mass.
Summary of the invention
The technical problem that the present invention will solve is: in order to solve the deficiency of above-mentioned technology, a kind of easy to operate, wave-soldering supporting plate of being easy to the protection circuit plate is provided.
The technical solution adopted for the present invention to solve the technical problems is: a kind of wave-soldering supporting plate; Comprise mounting plate and bottom plate; Said mounting plate and bottom plate stack are fixing; Have the window that at least one is used to place wiring board on the said mounting plate, have a plurality of through holes that are used to install the placing components pin on the bottom plate face of said beneath window.
As preferably, said window has two, and two windows are and column distribution.
The invention has the beneficial effects as follows that the present invention needn't use high temperature gummed tape after using this supporting plate; Only need wiring board is directly placed this frock relevant position, the pin with placing components is inserted in the respective through hole then, after accomplishing wave-soldering; Only need wiring board taken off from supporting plate and get final product, do not have any residually on the wiring board, thereby the present invention is simple to operate; Compact conformation, good and cheap do not lose again functional.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is the structural representation of wave-soldering supporting plate of the present invention;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the upward view of Fig. 1.
Among the figure: 1. mounting plate, 11. windows, 2. bottom plate, 21. through holes.
The specific embodiment
Combine accompanying drawing that the present invention is done further detailed explanation now.These accompanying drawings are the sketch map of simplification, basic structure of the present invention only is described in a schematic way, so it only show the formation relevant with the present invention.
The structural representation of the specific embodiment of the wave-soldering supporting plate of the present invention shown in Fig. 1 ~ 3; Comprise mounting plate 1 and bottom plate 2; Mounting plate 1 and bottom plate 2 are fixed through screw; Have the windows 11 that are used to place wiring board of two and column distribution on the mounting plate 1, have the through hole 21 that is used to install the placing components pin on 2 of the bottom plates of window 11 belows.
When using the present invention to carry out the wave-soldering of electronic devices and components, only need wiring board is directly placed i.e. two windows 11 in this frock relevant position, then placing components is placed respective through hole 21; The pin of placing components is inserted on the wiring board; After accomplishing wave-soldering, only need take off wiring board and get final product from supporting plate, do not have any residual on the wiring board; It is that raw material is processed that this supporting plate adopts epoxy resin; With respect to the supporting plate of the other types of current use, have good and cheap, the characteristics that function is constant.
With above-mentioned foundation desirable embodiment of the present invention is enlightenment, and through above-mentioned description, the related work personnel can carry out various change and modification fully in the scope that does not depart from this invention technological thought.The technical scope of this invention is not limited to the content on the specification, must confirm its technical scope according to the claim scope.
Claims (2)
1. wave-soldering supporting plate; It is characterized in that: comprise mounting plate (1) and bottom plate (2); Said mounting plate (1) and bottom plate (2) stack are fixing; Have at least one window that is used to place wiring board (11) on the said mounting plate (1), have a plurality of through holes (21) that are used to install the placing components pin on bottom plate (2) face of said window (11) below.
2. wave-soldering supporting plate as claimed in claim 1 is characterized in that: said window (11) has two, and two windows (11) are and column distribution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101960292A CN102699474A (en) | 2012-06-14 | 2012-06-14 | Wave crest welding support plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101960292A CN102699474A (en) | 2012-06-14 | 2012-06-14 | Wave crest welding support plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102699474A true CN102699474A (en) | 2012-10-03 |
Family
ID=46892684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012101960292A Pending CN102699474A (en) | 2012-06-14 | 2012-06-14 | Wave crest welding support plate |
Country Status (1)
Country | Link |
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CN (1) | CN102699474A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103231192A (en) * | 2013-05-14 | 2013-08-07 | 昆山禾旺电子有限公司 | Heat insulation tin soldering jig |
CN105489544A (en) * | 2016-01-12 | 2016-04-13 | 惠州Tcl移动通信有限公司 | Method for re-utilizing rubber-coated integrated circuit and tin implanting clamp required for the method |
-
2012
- 2012-06-14 CN CN2012101960292A patent/CN102699474A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103231192A (en) * | 2013-05-14 | 2013-08-07 | 昆山禾旺电子有限公司 | Heat insulation tin soldering jig |
CN105489544A (en) * | 2016-01-12 | 2016-04-13 | 惠州Tcl移动通信有限公司 | Method for re-utilizing rubber-coated integrated circuit and tin implanting clamp required for the method |
CN105489544B (en) * | 2016-01-12 | 2018-05-29 | 惠州Tcl移动通信有限公司 | The method and its required plant tin fixture that gluing integrated circuit recycles |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121003 |