CN205726712U - A kind of for reducing the press fit device that SMT DIMM Socket missing solder is bad - Google Patents
A kind of for reducing the press fit device that SMT DIMM Socket missing solder is bad Download PDFInfo
- Publication number
- CN205726712U CN205726712U CN201620644872.6U CN201620644872U CN205726712U CN 205726712 U CN205726712 U CN 205726712U CN 201620644872 U CN201620644872 U CN 201620644872U CN 205726712 U CN205726712 U CN 205726712U
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- upper cover
- cylinder
- lower cover
- plate
- cover plate
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 abstract description 24
- 238000000034 method Methods 0.000 abstract description 12
- 238000012545 processing Methods 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 206010016256 fatigue Diseases 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 208000010392 Bone Fractures Diseases 0.000 description 1
- 206010017076 Fracture Diseases 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
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- Manufacturing Of Electrical Connectors (AREA)
Abstract
nullThe utility model discloses a kind of for reducing the press fit device that SMT DIMM Socket missing solder is bad，Belong to server PCBA and manufacture field，How the technical problems to be solved in the utility model is it can be avoided that because of situation that the heavy missing solder caused because of fatigue of people's manual work is bad when PCBA crosses Reflow Soldering processing procedure,Reduce artificial quantity and turnaround time simultaneously,Reduce cost of goods manufactured and improve product quality and the purpose of product competitiveness，Technical scheme is: its structure includes cylinder one，It is provided with lower cover on cylinder one，The both sides of lower cover are provided with moving track，Gap it is provided with between moving track，Lower cover be provided above mobile force fit plate，Mobile force fit plate is provided above upper cover plate，Upper cover plate is connected by connecting shaft is fixing with mobile force fit plate，Cylinder two it is provided with on upper cover plate；It is provided with accurate optical axis between upper cover plate and lower cover, accurate optical axis is provided with accurate lengthening guide pin bushing.
Description
Technical field
This utility model relates to server PCBA manufacture field, specifically one and is used for reducing SMT DIMM
The press fit device that Socket missing solder is bad.
Background technology
High-end server circuit board fabrication flow process all can be through SMT, Wave solder(wave-soldering) flow process, and at Wave
Due to the spacing increasingly miniaturization of part, pcb board circuit multiple stratification in solder flow process, pcb board is caused to complete Wave
After solder there is a lot of short circuit problems in the pin of part, and this short circuit problem must the most additionally check reparation, wastes big
The human cost of amount.
The memory size used on server is relatively big, so supporting more DIMM Socket, so many quantity
Intensive being placed in together of DIMM Socket, substantial amounts of manpower will necessarily be used to put.Meanwhile, high-end server
On because line layer is more, design limit, cause the direct insertion element of PTH(through hole) DIMM Socket eat stannum and (eat stannum i.e. to weld
Material and stannum form the most seamless weld interface) difficulty, for solving this difficulty, most high-end server all have employed
The design of SMT type DIMM Socket,
Design based on DIMM Socket, its have length big × 141mm, number of pins many * 288pin, harpoon foot inserts
Power is relatively big × 30N, and lifting surface area is narrower × feature of 6.5mm, cause common SMT mounting device to put in place completely, thus
Cause the problem that missing solder occurs in part pin.According to bad main reason is that manually of current DIMM Socket body missing solder
Manual work cannot ensure that DIMM Socket body can the surface of smooth pcb board.
How it can be avoided that cause because of fatigue because people's manual work is heavy when PCBA crosses Reflow Soldering processing procedure (Reflow processing procedure)
The bad situation of missing solder, reduce artificial quantity and turnaround time (cycle time) simultaneously, reduce cost of goods manufactured
And the purpose improving product quality and product competitiveness is to be badly in need of in currently available technology solving the technical problem that.
Simultaneously because part PCBA has two-sided PTH element, (i.e. the above and following of pcb board all has plug-in element to deposit
), using the one of common PIP(internal memory encapsulation technology) processing procedure cannot omit wave-soldering process completely, therefore how can expire
It is also one of technical problem of existing that the common PIP of foot makes wave-soldering process.
The patent documentation of Patent No. CN 205291842 U discloses a kind of SMT stokehold casting die machine, and it includes: shell
Body, being placed in the control chamber of shell body bottom, hollow out in the middle of described shell body, is controller, at shell body above hollow part
Middle hollow part is provided with transporting rail and is arranged on the laminating mechanism in the middle part of transporting rail, detent mechanism, lifting body；Location
Mechanism is arranged on the upper end of lifting body, and laminating mechanism hangs and is arranged in the fixed plate of back timber, is positioned at just going up of detent mechanism
Side, the dual-side of carrier is placed on two chains of transporting rail, and chain-driving carrier moves ahead；Blocking mechanism on transporting rail
Block carrier；Lifting body rises, and carrier is positioned by the detent mechanism on top.There is structure complexity, operation not in this technical scheme
Just, high in cost of production shortcoming.
Summary of the invention
Technical assignment of the present utility model is to provide a kind of for reducing the pressing dress that SMT DIMM Socket missing solder is bad
Put, how solve it can be avoided that because the heavy missing solder caused because of fatigue of people's manual work is bad when PCBA crosses Reflow Soldering processing procedure
Situation, reduces artificial quantity and turnaround time simultaneously, reduces cost of goods manufactured and improves product quality and product competition
The problem of the purpose of power.
This utility model solves its technical problem and be the technical scheme is that a kind of for reducing SMT DIMM
The press fit device that Socket missing solder is bad, including cylinder one, cylinder one is provided with lower cover, and the both sides of lower cover are provided with shifting
Dynamic track, is provided with gap between moving track, gap location is used for placing PCBA board, lower cover be provided above mobile pressing
Plate, mobile force fit plate is for pressing to PCBA board components and parts, and mobile force fit plate is provided above upper cover plate, upper cover plate and shifting
Dynamic pressure plywood connects by connecting shaft is fixing, and upper cover plate is provided with cylinder two；Precision it is provided with between upper cover plate and lower cover
Optical axis, accurate optical axis is provided with accurate lengthening guide pin bushing.Wherein, moving track uses moving track commonly used in the prior art.
As preferably, described accurate optical axis is provided with four, and four accurate optical axises are uniformly arranged on upper cover plate and lower cover
Between.
As preferably, the both sides of described moving track are disposed with positioning cylinder, compression cylinder and backgauge cylinder respectively,
Guarantee PCBA board fixation, so convenient to the pressing of electric elements in PCBA board.
More preferably, described upper cover plate, mobile force fit plate and lower cover are arranged in parallel.
It is of the present utility model for reducing the bad press fit device of SMT DIMM Socket missing solder compared to the prior art,
Have the advantages that
1, this utility model can solve the problem that PCBA board when crossing Reflow processing procedure because of the heavy and tired generation of people's manual work
The problem that missing solder is bad, reduces simultaneously and manufactures manpower quantity and turnaround time, reduces cost of goods manufactured and improves product
The purpose of competitiveness；
2, this utility model assists the attachment of SMT DIMM Socket by mobile force fit plate, thus ensures DIMM
Socket body can be fitted the surface of pcb board completely, and the missing solder reducing DIMM Socket body is bad, and this pressing simultaneously fills
Put can paraprofessional personnel's operation, improve working performance and quality；
3, this utility model can vertical press-fit DIMM Socket body, thus by DIMM Socket pressing pcb board
Surface, and guarantee that pressing puts in place and keeps the regular hour, prevent DIMM Socket body from rebounding, reach to realize DIMM
The smooth purpose put in place of Socket body；
, there is workload big in 4, traditional manual work, hands fatiguability and injured, and quality is unstable, and inefficiency etc. is asked
Topic, and this utility model is capable of full-automatic operation, saves the heavy labor of manpower, it is to avoid a large amount of streams of manpower
Dynamic；Improving welding quality simultaneously, reduce the bad problems such as missing solder, side reduces maintenance cost originally.
Utility model has reasonable in design, simple in construction, is prone to the spies such as processing, little, easy to use, the one-object-many-purposes of volume
Point, thus, have good value for applications.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings this utility model is further illustrated.
Accompanying drawing 1 is the structural representation for reducing the bad press fit device of SMT DIMM Socket missing solder；
Accompanying drawing 2 is the structural representation of another angle of accompanying drawing 1.
In figure: 1, cylinder two, 2, upper cover plate, 3, cylinder one, 4, lower cover, 5, accurate optical axis, 6, the accurate guide pin bushing that lengthens, 7,
Moving track, 8, backgauge cylinder, 9, positioning cylinder, 10, PCBA board, 11, DIMM Socket body (dual inline type storage mould
Block socket body), 12, compression cylinder, 13, connecting shaft, 14, mobile force fit plate.
Detailed description of the invention
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
In description of the present utility model, it is to be understood that term " on ", D score, "front", "rear", "left", "right",
The orientation of the instruction such as " vertically " " level ", " top ", " end ", " interior ", " outward " or position relationship be based on orientation shown in the drawings or
Position relationship, is for only for ease of description this utility model and simplifies description.Rather than indicate or imply device or the unit of indication
Part must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that the restriction of the present invention.
It is as shown in figure 1 and 2, of the present utility model for reducing the press fit device that SMT DIMM Socket missing solder is bad,
Its structure includes cylinder 1, installs lower cover 4 on the upside of cylinder 1, and moving track 7, moving track 7 are installed in the both sides of lower cover 4
Between be provided with gap, gap location is used for placing PCBA board 10, lower cover 4 be provided above mobile force fit plate 14, mobile pressure
Plywood 14 is for pressing to PCBA board 10 DIMM Socket body 11, and mobile force fit plate 14 is provided above upper cover plate 2,
Upper cover plate 2 is connected by connecting shaft 13 is fixing with mobile force fit plate 14, upper cover plate 2 is installed cylinder 21, in cylinder 21 driving
Cover plate 2 and the mobile force fit plate 14 that be connected fixing with upper cover plate 2 complete to move up and down, and i.e. complete the pressing to PCBA board；Upper cover
It is provided with accurate optical axis 5 between plate 2 and lower cover 4, accurate optical axis 5 installs precision and lengthens guide pin bushing 6.Accurate optical axis 5 is provided with
Four, four accurate optical axises 5 are uniformly arranged between upper cover plate 2 and lower cover 4.The both sides of moving track 7 are installed the most successively
Positioning cylinder 9, compression cylinder 12 and backgauge cylinder 8, it is ensured that can be by PCBA board 10 fixation and then convenient to PCBA board 10
The pressing of upper DIMM Socket body 11.Upper cover plate 2, mobile force fit plate 14 and lower cover 4 are arranged in parallel.
Specific works process: first, the PCBA board 10 placing DIMM Socket body 11 is transported to by moving track 7
On lower cover 4, by positioning cylinder 9 and backgauge cylinder 8, PCBA board 10 is positioned；Then, compression cylinder 12 action, by PCBA
10 liang of side compressions of plate；Subsequently, cylinder 1 and cylinder 21 action, drive upper cover plate 2 and lower cover 4 to move, upper cover plate 2 simultaneously
Drive mobile force fit plate 14 to move down, constantly reduce the distance between lower cover 4 and upper cover plate 2, until mobile force fit plate 14
DIMM Socket body 11 is pressed in PCBA board 10 and keeps a period of time, prevents DIMM Socket body from rebounding；?
After, cylinder 1 and cylinder 21 reset, and drive lower cover 4, upper cover plate 2 and mobile force fit plate 14 to reset, and backgauge cylinder 8 is multiple
Position, moving track 7 continues conveying PCBA board 10 to subsequent processing.
Acceptance criteria of the present utility model:
(1), items for acceptance comprises:
(1), the inspection of press equipment rail levelness, the i.e. detection of moving track levelness；
(2), ESD(electrostatic impedor) measurement confirm；
(3), pressure head check and accept & base check and accept, i.e. move force fit plate, upper cover plate and lower cover flatness detection；
(2), checked and accepted after, enter mobile force fit plate stroke adjustment, the stroke energy of mobile force fit plate should be ensured
Enough meet DIMM Socket body and enter in edge PTH hole, ensure that pressure can not be the most greatly and too fast again, cause DIMM Socket
The damage of body；
(3) the Strain gage, completing board (PCBA board) checks and accepts, it is ensured that what mobile force fit plate was applied on board should
Power meets stress requirement, it is to avoid cause board solder joint to have the risk of fracture；
(4), board is automatically migrated on press equipment predetermined trading halt position by moving track, and passes through pressure
Tight cylinder fixes board；
(5), after board fixes, cylinder two drives upper cover plate to press, by DIMM Socket body under starting automatically
It is pressed in edge PTH hole, and the lasting regular hour carries out Stress Release for DIMM, thus ensure that DIMM Socket body can
Smooth pcb board surface and not rebounding；
(6), PCBA board removal press equipment and enter reflow complete welding.After having welded, microscope and X-need to be used
Ray equipment checks outward appearance and the welding effect of part.
By detailed description of the invention above, described those skilled in the art can readily realize this utility model.But
It is to should be appreciated that this utility model is not limited to above-mentioned detailed description of the invention.On the basis of disclosed embodiment, described
Those skilled in the art can the different technical characteristic of combination in any, thus realize different technical schemes.
Claims (4)
1. one kind is used for reducing the press fit device that SMT DIMM Socket missing solder is bad, it is characterised in that: include cylinder one, gas
Being provided with lower cover on cylinder one, the both sides of lower cover are provided with moving track, are provided with gap between moving track, lower cover
Being provided above mobile force fit plate, mobile force fit plate is provided above upper cover plate, and upper cover plate passes through connecting shaft with mobile force fit plate
Fixing connection, upper cover plate is provided with cylinder two；It is provided with accurate optical axis between upper cover plate and lower cover, accurate optical axis is arranged
There is accurate lengthening guide pin bushing.
Press fit device the most according to claim 1, it is characterised in that: described accurate optical axis is provided with four, four precisions
Optical axis is uniformly arranged between upper cover plate and lower cover.
Press fit device the most according to claim 1 and 2, it is characterised in that: the both sides of described moving track set the most successively
It is equipped with positioning cylinder, compression cylinder and backgauge cylinder.
Press fit device the most according to claim 3, it is characterised in that: described upper cover plate, mobile force fit plate and lower cover phase
It is arranged in parallel mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620644872.6U CN205726712U (en) | 2016-06-27 | 2016-06-27 | A kind of for reducing the press fit device that SMT DIMM Socket missing solder is bad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620644872.6U CN205726712U (en) | 2016-06-27 | 2016-06-27 | A kind of for reducing the press fit device that SMT DIMM Socket missing solder is bad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205726712U true CN205726712U (en) | 2016-11-23 |
Family
ID=57317533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620644872.6U Expired - Fee Related CN205726712U (en) | 2016-06-27 | 2016-06-27 | A kind of for reducing the press fit device that SMT DIMM Socket missing solder is bad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205726712U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114488589A (en) * | 2022-03-06 | 2022-05-13 | 新谱（广州）电子有限公司 | Automatic assembly line for assembling ultra-large liquid crystal module |
-
2016
- 2016-06-27 CN CN201620644872.6U patent/CN205726712U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114488589A (en) * | 2022-03-06 | 2022-05-13 | 新谱（广州）电子有限公司 | Automatic assembly line for assembling ultra-large liquid crystal module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20170627 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |