CN101226976A - LED device and locating structure thereof - Google Patents
LED device and locating structure thereof Download PDFInfo
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- CN101226976A CN101226976A CNA2007100307683A CN200710030768A CN101226976A CN 101226976 A CN101226976 A CN 101226976A CN A2007100307683 A CNA2007100307683 A CN A2007100307683A CN 200710030768 A CN200710030768 A CN 200710030768A CN 101226976 A CN101226976 A CN 101226976A
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- emitting diode
- light
- light emitting
- substrate
- location structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a locating structure of a light emitting diode device, which comprises a base plate, at least one light emitting diode unit and at least one locating component, wherein the base plate is equipped with a first via hole and a second via hole, the base plate is at least equipped with a circuit unit, a conductive portion and a heat dissipation portion of the light emitting diode unit are mutually separated, and the locating component is equipped with at least an elastic pressing portion, at least a guide contacting portion and at least a fixed unit. The elastic pressing portion and the light emitting diode unit are formed into an electrical contacting, the guide contacting portion and the light emitting diode unit are formed into an electrical conduction through the elastic pressing portion, and the guide contacting portion is electrically contacted and is exposed on the circuit unit which is arranged on a first surface. The locating structure of the light emitting diode device of the invention achieves the fixing between the base plate and a heat dissipation device through the fixed unit of the locating component, when the light emitting diode unit is damaged and needs to be changed, only need to change the light emitting diode unit, thereby being capable of saving cost and being convenient to change.
Description
[technical field]
The present invention relates to a kind of light-emitting diode assembly and location structure thereof.
[background technology]
So-called LED (Light Emitting Diode, Light-Emitting Diode) illuminating module is a kind ofly to be made of semi-conducting material, utilizes the electronics in the semiconductor chip to send photon with combining of electric hole, the light-emitting component of generation different frequency.
Shown in Figure 1 is a kind of common lower powered LED illuminating module 10, because this LED illuminating module power is lower, can only be as indicator light, the backlight of button or LCD screen, the switch indicator light, outdoor demonstration, the mark display lamp, occasions such as replacement for small incandescent lamp bulb, every single light (forward conducting) electric current generally between 5mA～30mA, typical then be 20mA, and directly be weldingly fixed on the FR4 printed circuit board (PCB) (epoxy plate) 20, described LED illuminating module 10 comprises: circular illuminating part of packaged chip 11 (Epoxy Dome Lens) 12 and two conductive regions (Lead Frame) 13 that extended by illuminating part 12,14, wherein, the light that chip 11 is launched penetrates by illuminating part 12, conductive region 13,14 one of them be anodal conductive region, another is the negative pole conductive region, and be respectively equipped with the pin 131 of lengthwise, 141, by scolder 30 with pin 131,141 are weldingly fixed on the FR4 circuit board 20.This LED illuminating module 10 its costs are lower, also are not easy very much generally speaking to damage, even and after damaging, because of its cost is lower, directly change the LED illuminating module together with circuit board.
And present high power type LED mainly is used in flashlight, the advertising signboard of LCD TV backlight source, automotive lighting, high light, the occasions such as photoflash lamp, illumination or general light source of mobile phone.Send into regard to the electric current that has 330mA～1A for every single, " every electricity consumption " increased by ten times, even tens of times, so the caloric value of high-capacity LED is tens of times of low-power LED, can occur along with temperature rises, and the problem that luminous power reduces occur, temperature is linear to the influence of brightness, but the influence to the life-span just is index, be as the criterion to connect surface temperature equally, use below 50 ℃ then that LED has nearly 20,000 hours life-span if remain on always, 75 ℃ then only remain 10,000 hour, 100 ℃ remained 5,000 hours, 125 ℃ surplus 2,000 hour, 150 ℃ remained 1,000 hour.Temperature light became 2 times 100 ℃ from 500, just shortened 1/4 times 5,000 hours useful life into from 20,000 hours, injury greatly, so on can the exploitation of the high encapsulating material of heat resistance, what just show relatively be extremely important.
Figure 2 shows that existing LED illuminating module 10 is weldingly fixed on the schematic diagram on the circuit board 20, shown in Figure 2 have only a LED illuminating module to be weldingly fixed on the circuit board, and in fact have a plurality of LED illuminating module to be weldingly fixed on the circuit board, described LED illuminating module comprises: the crystal 12 of packaged chip 11, one insulating base 13 and be installed in the insulating base 13 and extend the outer a plurality of conductive regions (Lead Frame) 14 of insulating base 13, wherein, crystal 12 is by the plastics of light-permeable, material such as glass or pottery is made, the light that chip 11 is launched shines on the object that needs illumination by crystal 12, crystal 12 is installed with in insulating base 13, and be installed with metal heat-conducting body (Heatsink Slug) 15 in the inside of insulating base 13, conductive region 14 has a plurality of according to actual needs, and distinguish anodal conductive region and negative pole conductive region, this conductive region 14 is weldingly fixed on by scolder 30 on the conducting strip 21 of circuit board 20, so that LED illuminating module 10 is fixed on the circuit board 20.
This LED illuminating module 10 is by the metal heat-conducting body 15 that LED encapsulates the heat that LED gives out to be passed to circuit board 20 via scolder or heat-conducting medium 40, and circuit board is by heat-conducting medium, and the fin 51 that is transmitted to heat radiation module 50 at last dispels the heat.In order to strengthen the heat radiation of LED, the FR4 printed circuit board (PCB) (epoxy plate) in past has not applied and has dealt with, and therefore, circuit board 30 is the printed circuit board (PCB) of tool metallic core, is called aluminum bronze substrate (MCPCB).The heat conduction efficiency of aluminum bronze substrate just is higher than traditional F R4 PCB, reach 1W/m.K～2.2W/m.K, though aluminum bronze substrate MCPCB is than FR4 circuit board excellent in heat dissipation effect, but the dielectric layer of aluminum bronze substrate MCPCB does not have very good pyroconductivity, identical with the FR4 circuit board substantially, 0.3W/m.K only, also the characteristic because of insulating barrier makes its heat conduction be subjected to some restrictions, becomes the conduction bottleneck between radiating block and metal core core.
Because high-power LED can produce more heat transfer, the long-term damage parts that is easy to make the LED illuminating module down of using, the LED illuminating module is directly to be welded on the circuit board of MCPCB at present, as will change the LED illuminating module time, need the connection circuit plate to change together, cause replacement cost higher like this; Though it is better that the heat conduction efficiency of the circuit board of MCPCB is higher than traditional FR4 circuit board, but the dielectric layer of the circuit board of MCPCB does not have very good pyroconductivity, therefore, be necessary to increase a kind of device, make the LED illuminating module need not directly to be welded on the circuit board, be convenient to change, have LED when keeping in repair again concurrently and can dispel the heat preferably by this device.
[summary of the invention]
The object of the present invention is to provide a kind of light emitting diode that is convenient for changing, the location structure of the light-emitting diode assembly that the while align member is simple in structure.
The invention provides a kind of location structure of light-emitting diode assembly, comprise: a substrate, this substrate upper end has a first surface, this substrate is provided with at least one first through hole and runs through this substrate upper/lower terminal, and this substrate is provided with at least one second through hole and runs through upper/lower terminal, and this substrate is laid with a circuit unit at least, and this circuit unit part at least appears on this first surface; At least one light emitting diode, correspondence is installed in above-mentioned first through hole from this substrate upper end respectively; At least one radiator, correspondence are located at the aforesaid substrate below, in order to conduct the heat energy of above-mentioned light emitting diode; And at least one align member, this align member has at least one elasticity pressing part, at least one portion of touching and at least one fixed cell of leading; Wherein, this fixed cell, this fixed cell passes through above-mentioned second through hole from the aforesaid substrate upper end, combine with above-mentioned radiator and fix, and this fixed cell is located these elasticity pressing parts; This elasticity pressing part is positioned at the aforesaid substrate upper end above-mentioned light emitting diode is formed compacting, and at least one elasticity pressing part forms electrical the contact with this light emitting diode; And this leads the portion of touching and sees through above-mentioned elasticity pressing part, electrically conduct and form with above-mentioned light emitting diode, and this lead the portion of touching electrically contact state circuit unit on being revealed on the above-mentioned first surface.
The present invention also provides a kind of light emitting diode, comprising: a pedestal has upper end and the lower end relative with this upper end; One light-emitting component is positioned at the upper end of pedestal; At least two electrically conducting contacts are positioned at the upper end of pedestal to small part; At least one heat-conducting part is revealed in the lower end of pedestal to small part.
The location structure of light-emitting diode assembly of the present invention, realize fixing between substrate and the heat abstractor by the fixed cell of align member, and by the elasticity pressing part realization light emitting diode of align member and the electric connection between the substrate, and need not directly be welded on light emitting diode on the substrate, when light emitting diode needs to change because of damaging, only need to change light emitting diode, and need not to change together substrate and heat abstractor, thereby cost-saved, and be convenient for changing; And the fixed cell and the positive stop spring plate of align member are simple in structure, easily manufactured, help saving cost; And the conductive part and the radiating part of light emitting diode are separated from each other, thereby avoid the conductive part and radiating part mutual interference mutually of light emitting diode.
[description of drawings]
Fig. 1 is that existing LED illuminating module is welded on the schematic diagram on the circuit board;
Fig. 2 is that existing another kind of LED illuminating module is welded on the schematic diagram on the circuit board;
Fig. 3 is the three-dimensional exploded view of the location structure of light-emitting diode assembly of the present invention;
Fig. 4 is the three-dimensional combination figure of the location structure of light-emitting diode assembly shown in Figure 3;
Fig. 5 is the stereogram of light emitting diode shown in Figure 3;
Fig. 6 is the vertical view of the location structure of light-emitting diode assembly shown in Figure 3;
Fig. 7 is that the location structure of light-emitting diode assembly shown in Figure 6 is at A-A direction cutaway view;
Fig. 8 is the three-dimensional exploded view of second embodiment of the location structure of light-emitting diode assembly of the present invention;
Fig. 9 is the three-dimensional combination figure of the location structure of light-emitting diode assembly shown in Figure 8;
Figure 10 is the vertical view of the location structure of light-emitting diode assembly shown in Figure 8;
Figure 11 is that the location structure of light-emitting diode assembly shown in Figure 10 is at A-A direction cutaway view;
Figure 12 is the stereogram of the 3rd embodiment of light emitting diode of the present invention;
Figure 13 is the three-dimensional exploded view of the 4th embodiment of the location structure of light-emitting diode assembly of the present invention;
Figure 14 is the three-dimensional combination figure of the location structure of light-emitting diode assembly shown in Figure 13;
Figure 15 is the vertical view of the location structure of light-emitting diode assembly shown in Figure 14;
Figure 16 is that the location structure of light-emitting diode assembly shown in Figure 15 is at A-A direction cutaway view;
Figure 17 is that the location structure of light-emitting diode assembly shown in Figure 15 is at B-B direction cutaway view.
Figure 18 is the three-dimensional exploded view of the 5th embodiment of the location structure of light-emitting diode assembly of the present invention;
Figure 19 is the stereogram of first align member of the location structure of light-emitting diode assembly shown in Figure 180;
Figure 20 is the stereogram of second align member of the location structure of light-emitting diode assembly shown in Figure 180;
Figure 21 is the three-dimensional combination figure of the location structure of light-emitting diode assembly shown in Figure 180;
Figure 22 is the vertical view of the location structure of light-emitting diode assembly shown in Figure 21;
Figure 23 is that the location structure of light-emitting diode assembly shown in Figure 22 is at B-B direction cutaway view;
Figure 24 is that the location structure of light-emitting diode assembly shown in Figure 22 is at C-C direction cutaway view.
[figure number explanation]
10 substrates
11 first surfaces, 12 first through holes
13 second through holes, 14 circuit units
20 light emitting diodes
21 encapsulating light emitting elements, 22 crystal 2s 2
23 insulating bases, 24,25 electrically conducting contacts
26 heat-conducting parts
30 heat abstractors
31 radiating fins, 32 grooves
33 installing holes
40,50 fixed components
41,51 (first, second) fixed cell 42,52 (first, second) positive stop spring plate
43,53 (first, second) fixed head 44,54 (first, second) pedestal
421,521 (first, second) elasticity pressing part 422,522 (first, second) is led the portion of touching
[concrete Implementation Modes]
The invention will be further described below in conjunction with the drawings and specific embodiments.
Fig. 3 to Fig. 7 is the schematic diagram of first embodiment of the invention, and the location structure of light-emitting diode assembly of the present invention comprises: a substrate 10, a light emitting diode 20, a heat abstractor 30 and four groups of align members 40.
As Fig. 3, described substrate 10 is a heat conductivility aluminum bronze substrate (MCPCB) preferably, these substrate 10 upper ends have a first surface 11, this substrate 10 is provided with one first through hole 12 and runs through this substrate upper/lower terminal, and this substrate is provided with two second through holes 13 and runs through upper/lower terminal, and this substrate 10 is laid with a circuit unit 14 at least, wherein this two second through hole 13 is positioned at the both sides of described first through hole 12, and circuit unit 14 is laid in the inwall of second through hole 13, and local appearing on the first surface 11 of substrate.
See also Fig. 3 and Fig. 5, described light emitting diode 20 correspondences are from the first surface of described substrate 10, and be installed in first through hole 12 of substrate 10, and this light emitting diode 20 passes first through hole 12 of substrate 10, directly contact, help light emitting diode 20 and dispel the heat faster with the heat abstractor 30 that is positioned at substrate 10 belows.
Described light emitting diode 20 comprises: the crystal 22 (as Fig. 7) of encapsulating light emitting element 21, an insulating base 23, at least two electrically conducting contacts 24,25 and at least one heat-conducting parts 26.
Described insulating base 23 has upper end and the lower end relative with this upper end.
Crystal 22 is made by the materials such as plastics, glass or pottery of light-permeable, light-emitting component 21 is as the illuminating part of light emitting diode 20, the light that this light-emitting component 21 is launched shines on the object that needs illumination by crystal 22, crystal 22 is positioned at the upper end of insulating base 23, (also can be and insulating base 23 is roughly rectangular according to the shaped design of LED, insulating base is a rectangle in the present embodiment, also can be hexagon or other shape certainly).
Described heat-conducting part 26 is as the radiating part of light emitting diode 20, and as Fig. 7, this heat-conducting part 26 directly facing to heat abstractor 30, on the direct heat loss through conduction device 30 of heat that helps light emitting diode 20 is sent, helps dispelling the heat faster.
Described heat-conducting part 26 is located in the insulating base 23, these heat-conducting part 26 upper ends are facing to light-emitting component 21, insulating base 23 is extended in the lower end, and be revealed in the lower end of insulating base 23 to this heat-conducting part 26 of small part, by this heat-conducting part 26 with heat delivered that light-emitting component 21 is given out to other object.
Described two electrically conducting contacts 24,25 are used for light emitting diode 20 is electrically connected to substrate 10 (as Fig. 7), and as the conductive part of light emitting diode 20, wherein an electrically conducting contact is anodal electrically conducting contact, another electrically conducting contact is the negative pole electrically conducting contact, described electrically conducting contact 24,25 is positioned at the upper end of insulating base 23, and is recessed to form downwards by the upper end of insulating base 23.
Because electrically conducting contact 24,25 and light-emitting component 21 are positioned at the upper end of insulating base 23, i.e. the conductive part 24,25 of light emitting diode 20 and illuminating part 21 the same side of being positioned at insulating base 23; Be revealed in the lower end of insulating base 23 to small part heat-conducting part 26, that is: heat-conducting part 26 is positioned at the opposite side of insulating base 23 with respect to conductive part 24,25 and illuminating part 21, and heat-conducting part 26 is as the radiating part of light emitting diode 20, thereby the conductive part of light emitting diode 20 (that is: conductive part 24,25 and illuminating part 21) and radiating part (that is: heat-conducting part 26) lay respectively at the relative two ends of insulating base 26, the conductive part and the radiating part of light emitting diode 20 are separated from each other, thereby avoid the conductive part and radiating part mutual interference mutually of light emitting diode 20.
As Fig. 3 and Fig. 7, described heat abstractor 30 correspondences are located at described substrate 10 belows, in order to conduct the heat energy of described light emitting diode 20, this heat abstractor 30 is provided with a plurality of radiating fins 31 and is positioned at two grooves 32 of San Re Sushi sheet 31 upper ends, wherein this groove 32 is corresponding with second through hole 13 of described substrate 10, and this groove 32 runs through the both sides of entire heat dissipation device 30, and the upper end of groove 32 is rectangular, and the lower end is triangular in shape.
As Fig. 3, Fig. 4 and Fig. 6 and Fig. 7, substrate 10 is fixed and be electrically connected to described fixed component 40 with described light emitting diode 20, and this align member 40 is fixed together substrate 10 and heat abstractor 30 simultaneously, make described light emitting diode 20 just in time facing to heat abstractor 30, conduct by heat abstractor 30 with heat with light emitting diode 20.
Each fixed component 40 comprises a fixed cell 41 and a positive stop spring plate 42 that is combined together, and wherein this positive stop spring plate 42 is provided with an elasticity pressing part 421 and leads the portion of touching 422 by one of this elasticity pressing part 421 1 ends extension.
As Fig. 4 and Fig. 7, described elasticity pressing part 421 is bending, this elasticity pressing part 421 is positioned at described substrate 10 upper ends, and to light emitting diode 20 formation compactings, and in fact this elasticity pressing part 421 electrically contacts with described light emitting diode 20 corresponding electrically conducting contacts 24,25 formation.
The described portion of touching 422 that leads is a plate body, and is one-body molded with described elasticity pressing part 421, and this leads the portion of touching 422 and see through described elasticity pressing part 421, and this is led the portion of touching 422 and also forms with described light emitting diode 20 and electrically conduct.Describedly lead the first surface 11 that the portion of touching 422 is positioned at described substrate 10, and this leads the portion of touching 422 and be provided with a location hole 4221, this location hole 4221 is corresponding with second through hole 13 of substrate 10.
The described portion of touching 422 that leads electrically contacts the circuit unit 14 that is revealed in described first surface 11, making this lead the portion of touching 422 electrically contacts with substrate 10 formation, and this leads the portion of touching 422 and described elasticity pressing part 421 is one-body molded, thereby an end and 20 formation of described light emitting diode by this positive stop spring plate 42 electrically conduct, the other end and substrate 10 form and electrically conduct, so by this positive stop spring plate 42 light emitting diode 20 is electrically connected on the substrate 10.
Described fixed cell 41 is actual to be a screw, and from described substrate 10 upper ends by described second through hole 13, combine with described light emitting diode 20 and to fix, and locate described elasticity pressing part 421.
Described fixed cell 41 is made of metal, comprise that one presses plate 411, reach by this and press the cylinders 412 that plate 411 extends downwards, and be provided with a joint portion 413 by these cylinder 412 bottoms, wherein, describedly press the upper end that plate 411 is positioned at cylinder 412, and be formed with the work nest 4111 that is " ten " shape on the surface that presses plate 411, when installing and fixing unit 41, (figure does not show by an operation tool, as screwdriver etc.) be positioned in this work nest 4111, fixed cell 41 being locked in substrate 10 and the heat abstractor 30, and cylinder 412 is formed with screw thread with 413 surfaces, joint portion.
At first, this cylinder 412 passes described location hole 4221 of leading the portion of touching 422 in regular turn, corresponding second through hole 13 of substrate 10 and the groove 32 of heat abstractor 30, and the plate 411 that presses of fixed cell 41 is pressed on and leads the portion of touching 422 tops, to prevent that positive stop spring plate 42 relative fixed unit 41 from sliding, and with an end and 20 crimping of described light emitting diode of described positive stop spring plate 42, the other end is fixed on the substrate 10, and make heat abstractor 30 be fixed on the below of substrate 10, and the joint portion 413 of fixed cell 41 enters described heat abstractor 30, and in the groove 32 of the thread lock of joint portion 413 and this heat abstractor 30, and combine fixing with this heat abstractor 30.
During assembling, at first light emitting diode 20 installings are fixed in first through hole 12 of substrate 10, again heat abstractor 30 correspondences are located at the below of substrate 10, follow an end and light emitting diode 20 crimping with the positive stop spring plate 42 of align member 40, the other end is positioned at the first surface 11 of substrate 10, that is: the electrically conducting contact 24 of elasticity pressing part 421 and described light emitting diode 20,25 form electrically contact, leading the portion of touching 422 contacts with circuit unit 14 formation of substrate 10, at last with the fixed cell 41 of align member 40 in regular turn by described location hole 4221 of leading the portion of touching 422, corresponding second through hole 13 of substrate 10 and the groove 32 of heat abstractor 30, thereby described positive stop spring plate 42 is fixed with substrate 10 with described light emitting diode 20 respectively, make heat abstractor 30 be fixed on the below of substrate 10 simultaneously, assemble the location structure of light-emitting diode assembly with this.
The location structure of light-emitting diode assembly of the present invention, fixed cell 41 by align member 40 is realized fixing between substrate 10 and the heat abstractor 40, and by the positive stop spring plate 42 realization light emitting diodes 20 of align member 40 and the electric connection between the substrate 10, and need not directly be welded on light emitting diode 20 on the substrate, when light emitting diode 20 needs to change because of damaging, only need light emitting diode 20, and need not to change together substrate and heat abstractor, thereby cost-saved, and be convenient for changing; And the fixed cell 41 of align member 40 is simple in structure, easily manufactured with positive stop spring plate 42, helps saving cost.
Fig. 8 to Figure 11 is the schematic diagram of second embodiment of the location structure of light-emitting diode assembly of the present invention, the main distinction of present embodiment and the foregoing description is: at first, the upper end of groove 32 these grooves 32 of heat abstractor 30 is still rectangular, but the lower end is also rectangular, and the opening of the aperture efficiency of the rectangle of lower end upper end rectangle is big; Each fixed component 40 still comprises a fixed cell 41 and a positive stop spring plate 42 that is combined together, wherein positive stop spring plate 42 still is provided with an elasticity pressing part 421 and leads the portion of touching 422 by one of this elasticity pressing part 421 1 ends extension, and elasticity pressing part 421 still electrically contacts with light emitting diode 20 corresponding electrically conducting contacts 24,25 formation.
The described portion of touching 422 that leads is positioned on the first surface 11 of substrate 10, and comprise that first 4222, second portion 4224 reach the connecting portion 4223 between this first part 4222 and second portion 4224, wherein connecting portion 4223 contacts with substrate 10 corresponding circuit units 14, this connecting portion 4223 is arranged with to the centre by first 4222 and second portion 4224 and forms, and offers a location hole 4221 in the centre of connecting portion 4223; The side of first part 4222 is provided with a protuberance 4225, and this protuberance 4225 is punctured by first 4222 and forms, and on the first surface 11 that is pressed on substrate 10, prevents relatively moving between fixed component 40 and the substrate 10.
Described fixed cell 41 is an alignment pin, and be made of plastics, and the surface that its pressure is held up portion 411 does not form work nest, and joint portion 413 is provided with the protruding arm 4131,4132 of two elasticity, protruding arm 4131,4132 correspondences of this elasticity are buckled in the both sides of the groove 32 of described heat abstractor 30, heat abstractor 30 is fixed on the below of substrate 10.
The fit of present embodiment is identical with the fit of above-mentioned first embodiment, at this repeated description not just.
Figure 12 is the schematic diagram of the 3rd embodiment of the location structure of light-emitting diode assembly of the present invention, the main distinction of present embodiment and above-mentioned first embodiment is: the electrically conducting contact 24,25 of light emitting diode 20 is darted at the upper end of insulating base 23, and partially conductive contact site 24,25 extends to the side of insulating base 23, and electrically conducting contact 24,25 also can all be formed on the side of insulating base 23 certainly.Other structure of present embodiment all with above-mentioned first implement identical, at this repeated description not just.
Figure 13 to Figure 17 is the schematic diagram of the 4th embodiment of the location structure of light-emitting diode assembly of the present invention, the present embodiment and above-mentioned second main distinction of implementing are: the side of first part 4222 of positive stop spring plate 42 is not provided with a protuberance, but first part 4222 is extended location divisions 4225 downwards, match with location notch 15 on the substrate 10 in this location division 4225, thereby positive stop spring plate 42 is fixed on the substrate 10, thereby prevents positive stop spring plate 42 relative substrate 10 activities; And fixed cell 41 still is alignment pin, and its center that presses plate 411 offers through hole 4111, and this through hole 4111 can make fixed cell 41 have elasticity preferably, thereby can be fixed on preferably on the substrate 10.Other structure of present embodiment all with above-mentioned second implement identical, at this repeated description not just.
Figure 18 to Figure 24 is the schematic diagram of the 5th embodiment of the location structure of light-emitting diode assembly of the present invention, the main distinction of present embodiment and above-mentioned second embodiment is: described substrate 10 parts appear on the first surface 11 of substrate 10, but are not positioned at the inwall of second through hole 13; Described light emitting diode 20 is equipped with two groups of electrically conducting contacts 24,25, and is provided with a depressed part 27 in the middle of every group of electrically conducting contact 24,25; Described heat abstractor 30 is provided with a groove 32 and an installing hole 33.
As Figure 18 to Figure 20 and Figure 21 to Figure 24, the location structure of each light-emitting diode assembly has two groups of fixed components 40,50, wherein first fixed cell 41 of first group of fixed component 40 with above-mentioned second and the structure of the 4th embodiment basic identical, it all is alignment pin, and second fixed cell 51 of second group of fixed component 50 is basic identical with the structure of above-mentioned first embodiment, also is a screw.
Described first group of fixed component 40 comprises described first fixed cell 41, two first positive stop spring plates 42, one first fixed head 43 and one first pedestal 44, wherein the fixed cell structure among also above-mentioned second embodiment of first fixed cell 41 is identical, also be made of plastics, each first fixed cell 41 is provided with first cylinder 412 extension downwards and is provided with one first joint portion 413, and be provided with the protruding arm 4131 of two first elasticity in first joint portion 413,4132, the protruding arm 4131 of this two first elasticity, 4132 correspondences are buckled in the both sides of the groove 32 of described heat abstractor 30, heat abstractor 30 is fixed on the below of substrate 10.
As Figure 18 and Figure 19 and Figure 21 to Figure 24, described first pedestal 44 is positioned at the upper end of substrate 10, each pedestal 44 comprises one first main part 441 and first fixed part 442 that is extended by this first main part 441, and respectively being provided with one first holddown groove 443 in the both sides of this first main part 441 and first fixed part 442, this first holddown groove 443 runs through first main part 441.Described first main part 441 also is provided with one first assembly hole 444 and one first mounting groove 445, wherein first assembly hole 444 runs through first main part 441, first mounting groove 445 laterally runs through whole first main part 441, and be provided with a plurality of first reference columns 446 in the lower end of first main part 441, by this first reference column 446 first pedestal 44 is kept at a certain distance away with substrate 10.
As Figure 18 and Figure 19 and Figure 21 to Figure 24, described first positive stop spring plate 42 roughly is tabular, each first positive stop spring plate 42 is provided with one first elasticity pressing part 421 and leads the portion of touching 422 by one first of this first elasticity pressing part, 421 1 ends extension, wherein the first elasticity pressing part 421 electrically contacts with the electrically conducting contact 24,25 of light emitting diode 20, and first leads the portion of touching 422 electrically contacts with circuit unit 14 formation of substrate 10.
Described first positive stop spring plate 42 is fastened in described first pedestal, 44 corresponding first holddown grooves 443, and the first elasticity pressing part 421 is positioned at the upper surface of first fixed part 442 of first pedestal 44, and this first fixed part 442 is fixed this first elasticity pressing part 421; This first leads the lower surface that the portion of touching 422 is positioned at first main part 441 of first pedestal 44, with this first positive stop spring plate 42 is fixed on first pedestal 44.
As Figure 18 and Figure 19 and Figure 21 to Figure 25, described first fixed head 43 is made of metal, and be fixed on first pedestal 44, one first plate body 432 that described first fixed head 43 is provided with one first projecting plate 431 and is extended by these first projecting plate, 431 1 ends, on this first plate body 432, be provided with first slotted eye 433, wherein first plate body 432 is installed with and is fixed in first mounting groove 445 of first pedestal 44, this first projecting plate 431 is positioned on first fixed part 442 of first pedestal 44, and this first slotted eye 433 is corresponding with first assembly hole 444 of described first pedestal 44.
First projecting plate 431 of described first fixed head 43 is installed with in the depressed part 27 that is fixed on light emitting diode 20, and first cylinder 412 of first fixed cell 41 passes first slotted eye 433 of first fixed head 43 and first assembly hole 444 of first pedestal 44 in regular turn, so that first fixed head 43 is fixed in first pedestal 44, and by these first fixed head, 43 compacting light emitting diodes 20, to prevent light emitting diode 20 relative substrate 10 activities.
As Figure 18, Figure 20 and Figure 21 to Figure 24, described second group of fixed component 50 one the second fixed cells 51, two second positive stop spring plates 52, one second fixed head 53 and one second pedestal 54, wherein second fixed cell 51 is made of metal, comprise that one second presses to hold up plate 511 and to be positioned at this and second presses and hold up second cylinder 512 of plate 511 lower ends, and this second press hold up plate 511 on offer second work nest 5111, (figure does not show by an operation tool, as screwdriver etc.) be positioned in this second work nest 5111, second fixed cell 51 is locked in substrate 10 and the heat abstractor 30, and second cylinder 512 is positioned in the installing hole 33 of heat abstractor 30, heat abstractor 30 is fixed on the below of substrate 10.
As Figure 18 and Figure 20 and Figure 21 to Figure 24, the structure of described second pedestal 54 is similar to second pedestal 44, also comprise second main part 541, second fixed part 542, second holddown groove 543, second assembly hole 544 and one second mounting groove 545, different is: first mounting groove 445 to the small part of first pedestal 44 is exposed first main part 441, and second mounting groove 545 is positioned at the inside of second trunk portion 541.
As Figure 18 and Figure 15 and Figure 16 to Figure 19, described second positive stop spring plate 52 is identical with first positive stop spring plate, 42 structures, also be provided with one second elasticity pressing part 521 and lead the portion of touching 522 by one second of this second elasticity pressing part, 521 1 ends extension, its assembling mode with the assembling mode of second pedestal 54 and first positive stop spring plate 42 and first pedestal 44 is identical, and second positive stop spring plate 52 is also identical with light emitting diode 20 and substrate 10 electric connection modes, at this repeated description not just.
As Figure 18, Figure 20 and Figure 21 to Figure 24, described second fixed head 53 is identical with first fixed head, 43 structures, also comprise one second projecting plate 531, one second plate body 532 and one first slotted eye 533, the assembling mode of this second fixed head 53 and second pedestal 54 is identical with the assembling mode of first fixed head 43 and first pedestal 44, at this repeated description not just.
Claims (16)
1. the location structure of a light-emitting diode assembly is characterized in that: comprise:
One substrate, this substrate upper end has a first surface, this substrate is provided with at least one first through hole and runs through this substrate upper/lower terminal, and this substrate is provided with at least one second through hole and runs through upper/lower terminal, and this substrate is laid with a circuit unit at least, and this circuit unit part at least appears on this first surface;
At least one light emitting diode, corresponding respectively first surface from this substrate, and be installed in above-mentioned first through hole;
At least one heat abstractor, correspondence are located at described substrate below, in order to conduct the heat energy of described light emitting diode; And
At least one align member, this align member have at least one elasticity pressing part, at least one portion of touching and at least one fixed cell of leading; Wherein,
This fixed cell, this fixed cell be from described substrate upper end, and combine with above-mentioned radiator by described second through hole and to fix, and this fixed cell is located these elasticity pressing parts;
This elasticity pressing part is positioned at described substrate upper end, and forms compacting with described light emitting diode, and at least one elasticity pressing part forms electrical the contact with this light emitting diode; And
This is led the portion of touching and sees through above-mentioned elasticity pressing part, and electrically conducts with described light emitting diode formation, and this leads the electrical circuit unit that is revealed on the described first surface that contacts of the portion of touching.
2. the location structure of light-emitting diode assembly as claimed in claim 1, it is characterized in that: wherein this align member has at least one positive stop spring plate and at least one this fixed cell runs through this positive stop spring plate, and this positive stop spring plate has at least one this elasticity pressing part and is extended with at least one this in this elasticity pressing part one end leads the portion of touching.
3. as the sharp location structure that requires 1 described light-emitting diode assembly, it is characterized in that: described positive stop spring plate also is provided with a location division of fixing base.
4. the location structure of light-emitting diode assembly as claimed in claim 1, it is characterized in that: wherein this fixed cell has at least one cylinder by this second through hole, and this cylinder is provided with a joint portion and enters in this heat abstractor, combines fixing with this heat abstractor.
5. the location structure of light-emitting diode assembly as claimed in claim 4 is characterized in that: wherein this joint portion forms the groove that screw thread correspondence is locked this heat abstractor in this damaged surface.
6. the location structure of light-emitting diode assembly as claimed in claim 4 is characterized in that: wherein this joint portion forms a groove of corresponding this heat abstractor of buckle of the protruding arm of at least two elasticity in this cylinder lower end.
7. the location structure of light-emitting diode assembly as claimed in claim 4 is characterized in that: wherein this cylinder upper end further is provided with one and presses plate and be positioned at these elasticity pressing parts and these and lead and touch the portion top.
8. the location structure of light-emitting diode assembly as claimed in claim 7 is characterized in that: wherein this presses the plate surface and is formed with at least one work nest.
9. the location structure of light-emitting diode assembly as claimed in claim 4, it is characterized in that: wherein this fixed cell further is provided with a pedestal, this pedestal is provided with at least one fixed part and fixes these elasticity pressing parts, and this pedestal is provided with an assembly hole, this cylinder enters this second through hole along this assembly hole, and this cylinder upper end is provided with one and presses plate and be positioned at this pedestal top.
10. the location structure of light-emitting diode assembly as claimed in claim 9, it is characterized in that: wherein this fixed cell further is provided with a fixed head, and this fixed head one end is fixed described luminous two machine pipe units, and the other end is fixed in the described pedestal.
11. the location structure of light-emitting diode assembly as claimed in claim 1, it is characterized in that: wherein this light-emitting diode assembly upper end forms at least one electrically conducting contact, and at least one this elasticity pressing part is suppressed this electrically conducting contact in this light emitting diode.
12. the location structure of light-emitting diode assembly as claimed in claim 11 is characterized in that: wherein this electrically conducting contact extends to the side of this light emitting diode.
13. the location structure of light-emitting diode assembly as claimed in claim 1, it is characterized in that: wherein the side surface of this light-emitting diode assembly forms at least one electrically conducting contact, and at least one this elasticity pressing part is suppressed this electrically conducting contact in this light emitting diode.
14. a light emitting diode is characterized in that, comprising:
One pedestal has upper end and the lower end relative with this upper end;
One light-emitting component is positioned at the upper end of pedestal;
At least two electrically conducting contacts are positioned at the upper end of pedestal to small part;
At least one heat-conducting part is revealed in the lower end of pedestal to small part.
15. light emitting diode as claimed in claim 14 is characterized in that: the side that wherein is positioned at this pedestal to this electrically conducting contact of small part.
16. light emitting diode as claimed in claim 15 is characterized in that: wherein be provided with a location structure, this light-emitting diode assembly is fixed on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100307683A CN101226976B (en) | 2007-10-09 | 2007-10-09 | LED device and locating structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100307683A CN101226976B (en) | 2007-10-09 | 2007-10-09 | LED device and locating structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101226976A true CN101226976A (en) | 2008-07-23 |
| CN101226976B CN101226976B (en) | 2012-01-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100307683A Expired - Fee Related CN101226976B (en) | 2007-10-09 | 2007-10-09 | LED device and locating structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101226976B (en) |
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| CN102110761A (en) * | 2009-11-10 | 2011-06-29 | 日本航空电子工业株式会社 | Connector |
| TWI385335B (en) * | 2008-09-19 | 2013-02-11 | Foxconn Tech Co Ltd | Method for assembling an led assembly |
| CN102955342A (en) * | 2011-08-09 | 2013-03-06 | 精工爱普生株式会社 | Light source device and projector |
| TWI392824B (en) * | 2008-09-19 | 2013-04-11 | Foxconn Tech Co Ltd | Led assembly |
| CN103133923A (en) * | 2011-11-21 | 2013-06-05 | 隆达电子股份有限公司 | Assembled lamp strip structure |
| CN105338737A (en) * | 2014-07-18 | 2016-02-17 | 南昌欧菲光电技术有限公司 | Circuit board assembly and mobile phone camera module |
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| US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
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| CN200956373Y (en) * | 2006-09-06 | 2007-10-03 | 戴芸 | Light-emitting diode radiating structure |
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| TWI392824B (en) * | 2008-09-19 | 2013-04-11 | Foxconn Tech Co Ltd | Led assembly |
| TWI385335B (en) * | 2008-09-19 | 2013-02-11 | Foxconn Tech Co Ltd | Method for assembling an led assembly |
| CN102110761A (en) * | 2009-11-10 | 2011-06-29 | 日本航空电子工业株式会社 | Connector |
| US9323139B2 (en) | 2011-08-09 | 2016-04-26 | Seiko Epson Corporation | Light source device and projector |
| CN102955342A (en) * | 2011-08-09 | 2013-03-06 | 精工爱普生株式会社 | Light source device and projector |
| CN103133923A (en) * | 2011-11-21 | 2013-06-05 | 隆达电子股份有限公司 | Assembled lamp strip structure |
| CN105338737A (en) * | 2014-07-18 | 2016-02-17 | 南昌欧菲光电技术有限公司 | Circuit board assembly and mobile phone camera module |
| CN105338737B (en) * | 2014-07-18 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Circuit board assemblies and mobile phone camera mould group |
| CN105762120A (en) * | 2016-04-01 | 2016-07-13 | 宁波赛福特电子有限公司 | Infrared tube surface mount packaging structure |
| CN109427953A (en) * | 2017-08-30 | 2019-03-05 | 欣兴电子股份有限公司 | Heat dissipation substrate structure, manufacturing method, packaging structure and packaging method |
| CN109427953B (en) * | 2017-08-30 | 2020-05-19 | 欣兴电子股份有限公司 | Heat dissipation substrate structure, manufacturing method, packaging structure and packaging method |
| CN111466159A (en) * | 2017-12-08 | 2020-07-28 | 海拉有限双合股份公司 | Method for producing a circuit board/heat sink arrangement and arrangement for this purpose comprising a circuit board and a heat sink |
| CN111466159B (en) * | 2017-12-08 | 2023-07-25 | 海拉有限双合股份公司 | Method for producing a printed circuit board and heat sink structure, and structure for this purpose comprising printed circuit board and heat sink |
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