CN219042384U

CN219042384U - Adapter device for communication

Info

Publication number: CN219042384U
Application number: CN202223337108.9U
Authority: CN
Inventors: 尧军; 罗良
Original assignee: Enargy Power Shenzhen Co ltd
Current assignee: Enargy Power Shenzhen Co ltd
Priority date: 2022-12-10
Filing date: 2022-12-10
Publication date: 2023-05-16
Anticipated expiration: 2032-12-10

Abstract

The utility model discloses an adapter device for communication, and relates to the technical field of communication equipment. The heat dissipation aluminum housing comprises a heat dissipation aluminum housing, an adapter circuit board is installed in the heat dissipation aluminum housing, a lower heat conduction plate is attached to the bottom of the adapter circuit board, a lower heat conduction silica gel sheet is arranged between the lower heat conduction plate and the adapter circuit board, an upper heat conduction plate is attached to the top of the adapter circuit board, an upper heat conduction silica gel sheet is arranged between the upper heat conduction plate and the adapter circuit board, and an axial flow fan is installed on the upper heat conduction plate. According to the adapter device for communication, the heat conduction plate is used as a heat diffusion device to wrap the adapter circuit board, high-output and high-density heat can be rapidly and uniformly diffused, heat dissipation treatment on circuit board elements with high temperature in a concentrated mode in a local area is very effective, on the basis of configuration of a fan, heat density can be effectively reduced by matching with the heat dissipation aluminum shell, high-efficiency heat dissipation is supported, and heat cannot be effectively discharged in time due to uneven heat dissipation is avoided.

Description

Adapter device for communication

Technical Field

The utility model relates to the technical field of communication equipment, in particular to an adapter device for communication.

Background

The communication adapter, also called network interface board or network interface card NIC, also called network card, refers to an intelligent circuit for converting parallel data in computer into serial data, and is mainly used for connecting shared resource, and is a necessary component of computer system.

The communication adapter is a network component working in a data link layer, is an interface for connecting a computer and a transmission medium in a local area network, not only can realize physical connection and electric signal matching with the transmission medium of the local area network, but also relates to functions of frame sending and receiving, frame encapsulation and unpacking, medium access control, data encoding and decoding, data caching and the like.

In internet application, the communication adapter often carries a large number of network terminals, and a large number of network terminals can generate a large amount of electric current heat when being integrated together to work, and the existing adapter is only provided with a fan singly, so that the working heat can not be effectively discharged in time, and the normal operation and the use of the adapter are not facilitated.

Disclosure of Invention

The utility model provides an adapter device for communication, which is used for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an adapter device for communication, includes the heat dissipation aluminium shell, install the adapter circuit board in the heat dissipation aluminium shell, the bottom of adapter circuit board is attached and is had down the heat conduction silica gel piece, and is provided with down between heat conduction board and the adapter circuit board, the top of adapter circuit board is attached and is had the heat conduction board, and is provided with the heat conduction silica gel piece between heat conduction board and the adapter circuit board, install axial fan on the heat conduction board, the top joint of heat dissipation aluminium shell has the roof, the rear side of heat dissipation aluminium shell passes through the screw and installs the back shrouding, and the front side of heat dissipation aluminium shell passes through the screw and install preceding shrouding.

Further, an inner bottom of the heat dissipation aluminum shell is provided with an inner threaded column, and the adapter circuit board is fixed in the heat dissipation aluminum shell through the inner threaded column matched with a screw.

Further, the lower heat conduction plate is of an L-shaped structure, and the bottom surface and the side surface of the lower heat conduction plate are attached to the inner wall of the heat dissipation aluminum shell.

Further, the upper heat conduction plate is of an L-shaped structure, and the side face of the upper heat conduction plate is attached to the inner wall of the heat dissipation aluminum shell.

Further, an air inlet hole is formed in the bottom of the heat dissipation aluminum shell, heat dissipation holes are formed in the top plate, and the axial flow fan corresponds to the positions of the heat dissipation holes.

Further, the top of heat dissipation aluminium shell is equipped with the draw runner, the bottom of roof is equipped with the spout, and through spout and draw runner movable mounting on the heat dissipation aluminium shell.

Compared with the prior art, the utility model provides an adapter device for communication, which comprises the following components

The beneficial effects are that:

according to the adapter device for communication, the heat conduction plate is used as a heat diffusion device to wrap the adapter circuit board, high-output and high-density heat can be rapidly and uniformly diffused, heat dissipation treatment on circuit board elements with high temperature in a concentrated mode in a local area is very effective, on the basis of configuration of a fan, heat density can be effectively reduced by matching with the heat dissipation aluminum shell, high-efficiency heat dissipation is supported, and heat cannot be effectively discharged in time due to uneven heat dissipation is avoided.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a side view of the present utility model;

fig. 3 is a partial schematic view of the present utility model.

In the figure: 1. a heat-dissipating aluminum housing; 2. an adapter circuit board; 3. a lower heat guide plate; 4. a lower heat conducting silica gel piece; 5. an upper heat conduction plate; 6. a heat conducting silica gel piece is arranged on the upper surface; 7. an axial flow fan; 8. a top plate; 9. a rear sealing plate; 10. a front sealing plate; 11. an internal threaded post; 12. an air inlet hole; 13. a heat radiation hole; 14. a slide bar; 15. and a sliding groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the utility model discloses an adapter device for communication, which comprises a heat dissipation aluminum housing 1, wherein an adapter circuit board 2 is installed in the heat dissipation aluminum housing 1, a lower heat conduction silicon sheet 4 is arranged between the lower heat conduction plate 3 and the adapter circuit board 2, an upper heat conduction silicon sheet 5 is attached to the top of the adapter circuit board 2, an upper heat conduction silicon sheet 6 is arranged between the upper heat conduction plate 5 and the adapter circuit board 2, an axial fan 7 is installed on the upper heat conduction plate 5, the heat dissipation aluminum housing 1 is wrapped on the adapter circuit board 2 by using the heat conduction plate as a heat dissipation device, the heat dissipation treatment of circuit board elements with high output and high density can be rapidly and uniformly diffused, the heat dissipation treatment of the circuit board elements with high temperature in a concentrated manner can be very effective, the heat dissipation aluminum housing 1 can be matched on the basis of the configuration of the fan, the heat dissipation density can be effectively reduced, the heat dissipation can be effectively prevented from being discharged in time and time due to the uneven heat dissipation, a top plate 8 is clamped on the top of the aluminum housing 1, and a front screw 10 is installed on the rear side of the heat dissipation housing 1 through an aluminum housing through a rear side of the heat dissipation screw 9.

Specifically, the inner bottom of the heat dissipation aluminum housing 1 is provided with an internal thread column 11, and the adapter circuit board 2 is fixed in the heat dissipation aluminum housing 1 through the internal thread column 11 and a screw.

In this embodiment, the adapter circuit board 2 is fixed in the heat dissipation aluminum housing 1 by the internal thread post 11 and the screw, so as to ensure the stable installation of the circuit board.

Specifically, the lower heat conducting plate 3 has an L-shaped structure, and the bottom surface and the side surface of the lower heat conducting plate 3 are attached to the inner wall of the heat dissipation aluminum housing 1.

In this embodiment, the heat conducting plate, also called as a temperature equalizing plate, a superconductive heat plate, has the same function and working principle as the heat conducting pipe, and the liquid fluid enclosed in the plate-shaped cavity is evaporated and condensed to make it have the characteristic of rapid temperature equalization, so that it has the functions of rapid heat conduction and heat diffusion.

Specifically, the upper heat conducting plate 5 has an L-shaped structure, and the side surface of the upper heat conducting plate 5 is attached to the inner wall of the heat dissipation aluminum housing 1.

In this embodiment, the upper thermal conductive plate 5 has the same function as the lower thermal conductive plate 3, and has the functions of rapid thermal conduction and thermal diffusion.

Specifically, an air inlet hole 12 is formed in the bottom of the heat dissipation aluminum housing 1, a heat dissipation hole 13 is formed in the top plate 8, and the axial flow fan 7 corresponds to the heat dissipation hole 13.

In this embodiment, the air intake hole 12 is used for introducing fresh air, and the heat dissipation hole 13 is used for discharging heat.

Specifically, the top of the heat dissipation aluminum housing 1 is provided with a slide bar 14, the bottom of the top plate 8 is provided with a slide groove 15, and the heat dissipation aluminum housing 1 is movably mounted through the slide groove 15 and the slide bar 14.

In this embodiment, the top plate 8 is movably mounted on the heat dissipation aluminum housing 1 through the chute 15 and the slide bar 14, so as to facilitate assembly therebetween.

When the heat dissipation device is used, the heat conduction plate is used as a heat diffusion device to wrap the adapter circuit board 2, high-output high-density heat can be rapidly and uniformly diffused, the heat dissipation treatment of circuit board elements with high temperature in a concentrated mode in a local area is very effective, on the basis of configuring a fan, the heat dissipation aluminum shell 1 is matched, the heat density can be effectively reduced, high-efficiency heat dissipation is supported, and the problem that heat cannot be effectively discharged in time due to uneven heat dissipation is avoided.

In summary, the adapter device for communication uses the heat conduction plate as the heat diffusion device to wrap the adapter circuit board 2, so as to rapidly and uniformly diffuse the heat with high output and high density, and is very effective in the heat dissipation treatment of the circuit board components with high temperature in concentrated areas, and on the basis of configuring the fan, the heat density can be effectively reduced by matching with the heat dissipation aluminum housing 1, and the efficient heat dissipation is supported, so that the heat cannot be effectively discharged in time due to uneven heat dissipation is avoided.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An adapter device for communication, comprising a heat-dissipating aluminum housing (1), characterized in that: install adapter circuit board (2) in heat dissipation aluminium shell (1), the bottom of adapter circuit board (2) is attached and is had thermal conductivity board (3) down, and is provided with down heat conduction silica gel piece (4) between thermal conductivity board (3) and adapter circuit board (2), thermal conductivity board (5) have been attached to the top of adapter circuit board (2), and be provided with heat conduction silica gel piece (6) between last thermal conductivity board (5) and adapter circuit board (2), install axial fan (7) on last thermal conductivity board (5), the top joint of heat dissipation aluminium shell (1) has roof (8), back shrouding (9) are installed through the screw to the rear side of heat dissipation aluminium shell (1), and front shrouding (10) are installed through the screw to the front side of heat dissipation aluminium shell (1).

2. A communication adapter device according to claim 1, characterized in that: the inner bottom of the heat dissipation aluminum shell (1) is provided with an internal thread column (11), and the adapter circuit board (2) is fixed in the heat dissipation aluminum shell (1) through the internal thread column (11) matched with a screw.

3. A communication adapter device according to claim 1, characterized in that: the lower heat conduction plate (3) is of an L-shaped structure, and the bottom surface and the side surface of the lower heat conduction plate (3) are attached to the inner wall of the heat dissipation aluminum shell (1).

4. A communication adapter device according to claim 1, characterized in that: the upper heat conducting plate (5) is of an L-shaped structure, and the side face of the upper heat conducting plate (5) is attached to the inner wall of the heat dissipation aluminum shell (1).

5. A communication adapter device according to claim 1, characterized in that: the bottom of the heat dissipation aluminum shell (1) is provided with an air inlet hole (12), the top plate (8) is provided with a heat dissipation hole (13), and the axial flow fan (7) corresponds to the heat dissipation hole (13).

6. A communication adapter device according to claim 1, characterized in that: the top of heat dissipation aluminum housing (1) is equipped with draw runner (14), the bottom of roof (8) is equipped with spout (15), and through spout (15) and draw runner (14) movable mounting on heat dissipation aluminum housing (1).