CN218181469U - Computer server heat sink - Google Patents
Computer server heat sink Download PDFInfo
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- CN218181469U CN218181469U CN202222148184.9U CN202222148184U CN218181469U CN 218181469 U CN218181469 U CN 218181469U CN 202222148184 U CN202222148184 U CN 202222148184U CN 218181469 U CN218181469 U CN 218181469U
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Abstract
The utility model belongs to computer server heat dissipation field provides a computer server heat sink, including hollow casing, be equipped with mobile coolant liquid in the hollow casing, hollow casing opening side end is equipped with magnetic force and adsorbs the piece, magnetic force adsorbs the piece and is used for connecting hollow casing and utilizes magnetic force to adsorb on the server shell, be equipped with between the magnetic force adsorption piece and lead the temperature subassembly, it is used for in server shell temperature transfer to hollow casing to lead the temperature subassembly, then utilize the interior mobile coolant liquid of hollow casing to reduce its temperature, because this device is equipped with leads the hollow casing that temperature subassembly and inside were equipped with mobile coolant liquid, lead the temperature subassembly near on the server shell, can be with the leading-in to hollow casing of heat of server shell, then reduce its temperature through the mobile coolant liquid in the hollow casing, the temperature that reduces the server shell has been realized, thereby reduce the server temperature.
Description
Technical Field
The utility model belongs to computer server heat dissipation field especially relates to a computer server heat sink.
Background
A server refers to a computer that manages resources and provides services to users, and is generally classified into a file server, a database server, and an application server. A computer or computer system running the above software is also referred to as a server. Compared with a common PC, the server has higher requirements on stability, safety, performance and the like, so that hardware such as a CPU, a chipset, a memory, a disk system, a network and the like is different from the common PC.
Because current server equipment all can set up the server shell in its outside and protect it in order to guarantee that server internal component does not receive the injury from the external world, also brought certain problem for the heat dissipation of server simultaneously, though current server shell has adopted the better metal material of heat conductivity, nevertheless can effectively protect the server component in order to guarantee the shell, current server shell thickness is thick, leads to the inside temperature of server shell still higher.
SUMMERY OF THE UTILITY MODEL
The utility model provides a computer server heat sink aims at solving current server shell thickness thick, leads to the inside temperature of server shell still higher problem.
The utility model discloses a realize like this, a computer server heat sink, including hollow shell, be equipped with mobile coolant liquid in the hollow shell, hollow shell opening side end is equipped with magnetic force and adsorbs the piece, magnetic force adsorbs the piece and is used for connecting hollow shell and utilize magnetic force to adsorb on the server shell, be equipped with between the magnetic force adsorbs the piece and lead the temperature subassembly, lead the temperature subassembly be used for with server shell temperature transfer extremely in the hollow shell, then utilize mobile coolant liquid reduces its temperature in the hollow shell.
Optionally, hollow shell is including placing the storehouse, connecting circular slot, water-proof tank and coolant flow through-hole, hollow shell is inside to be equipped with the orientation lead temperature subassembly one side open-ended place the storehouse, it is used for holding mobile coolant to place the storehouse, it all is equipped with all to place four end angle positions in storehouse connect the circular slot, it is used for connecting to connect the circular slot magnetic force adsorbs the piece, it is equipped with between the circular slot to connect the water-proof tank, it is equipped with to place storehouse length direction both ends face coolant flow through-hole, coolant flow through-hole is used for being connected the messenger with outside water pump place the coolant flow in the storehouse and get up.
Optionally, lead the warm subassembly including leading warm board, connecting block and first waterproof strip, it is equipped with along length direction both ends to lead warm board the connecting block, the connecting block is used for connecting the magnetic force adsorbs the piece, it is close to lead warm board hollow shell one side is equipped with two along length direction first waterproof strip, first waterproof strip be used for with the capillary groove cooperatees.
Optionally, the heat conducting plate is made of a metal material with high heat conductivity.
Optionally, the magnetic force adsorbs the piece including leading temperature subassembly spread groove, adsorbing piece spliced pole and the waterproof strip of second, the magnetic force adsorbs the piece and is close to it is equipped with to lead temperature subassembly one end lead temperature subassembly spread groove, the magnetic force adsorbs the piece and is close to hollow shell one side just keeps away from it is equipped with to lead temperature subassembly spread groove opening direction end department adsorb the piece spliced pole, adsorb the piece spliced pole be used for with it cooperatees to connect the circular slot, the magnetic force adsorbs the piece and is close to hollow shell one side periphery is equipped with the waterproof strip of second.
Optionally, the material of absorption piece spliced pole is the rubber material, with the cooperation mode of connecting the circular slot is interference fit.
Optionally, a connector is movably connected in the coolant flow hole.
Optionally, one end of the connector, which is close to the hollow shell, is provided with a connecting end, and a circulation hole is formed inside the connector.
Optionally, the hollow shell further comprises a heat dissipation groove, and the heat dissipation groove is formed in the periphery of the hollow shell except the end face close to one side end face of the heat conduction assembly.
Optionally, the temperature conduction assembly further comprises a temperature conduction extension plate, wherein the temperature conduction extension plate is uniformly arranged on one side, close to the hollow shell, of the temperature conduction plate and is used for increasing the contact area of the temperature conduction plate and the flowing cooling liquid in the hollow shell.
About implementing the utility model discloses a beneficial technological effect does: because the device is provided with the temperature conduction assembly and the hollow shell internally provided with the flowing cooling liquid, the temperature conduction assembly is abutted against the server shell, the heat of the server shell can be guided into the hollow shell, and then the temperature of the server shell is reduced through the flowing cooling liquid in the hollow shell, so that the temperature of the server shell is reduced, and the temperature of the server is reduced.
Drawings
FIG. 1 is a schematic view of the installation of the present device of the present invention;
FIG. 2 is a schematic view of the hollow shell of the present invention;
FIG. 3 is a schematic view of the thermal module of the present invention;
FIG. 4 is a schematic view of the magnetic adsorption block of the present invention;
fig. 5 is a schematic view of the connector of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The utility model provides a computer server heat sink, includes hollow casing 1, is equipped with mobile coolant in the hollow casing 1, and 1 opening side end of hollow casing is equipped with magnetic force and adsorbs piece 3, and magnetic force adsorbs piece 3 and is used for connecting hollow casing 1 and utilizes magnetic force to adsorb on the server shell, is equipped with between the magnetic force adsorbs the piece 3 and leads temperature subassembly 2, leads temperature subassembly 2 and is used for in transmitting server shell temperature to hollow casing 1, then utilizes mobile coolant in the hollow casing 1 to reduce its temperature.
Because current server equipment does not receive the injury from the external world in order to guarantee that server internal component, all can set up the server shell at its outside and protect it, also brought certain problem for the heat dissipation of server simultaneously, though current server shell has adopted the better metal material of heat conductivity, nevertheless can effectively protect the server component in order to guarantee the shell, current server shell thickness is thick, lead to the inside temperature of server shell still higher, so can use a heat sink through reducing server shell temperature to cool down for the server.
According to the embodiment of this application, lead temperature subassembly 2 and adsorb 3 with the help of magnetic force on the server shell through the magnetic force at both ends, then lead temperature subassembly 2 through its outstanding heat conductivility heat transfer on with the server shell to hollow shell 1 in, then the mobile cooling liquid in the hollow shell 1 takes away the heat, has realized through reducing the server shell, reaches the purpose for the server cooling.
In some embodiments, the hollow shell 1 includes a placing bin 101, a connecting circular groove 102, a waterproof groove 103 and a coolant flow through hole 104, the placing bin 101 which is open towards one side of the thermal conduction assembly 2 is arranged inside the hollow shell 1, the placing bin 101 is used for containing flowing coolant, the connecting circular grooves 102 are arranged at four corner positions of the placing bin 101, the connecting circular grooves 102 are used for connecting the magnetic adsorption blocks 3, the waterproof groove 103 is arranged between the connecting circular grooves 102, the coolant flow through holes 104 are arranged at two end faces of the placing bin 101 in the length direction, and the coolant flow through hole 104 is used for being connected with an external water pump to enable the coolant in the placing bin 101 to flow.
In some embodiments, the temperature guiding assembly 2 includes a temperature guiding plate 201, a connecting block 202 and first waterproof strips 203, the connecting block 202 is disposed at two ends of the temperature guiding plate 201 along the length direction, the connecting block 202 is used for connecting the magnetic adsorption block 3, two first waterproof strips 203 are disposed at one side of the temperature guiding plate 201 close to the hollow shell 1 along the length direction, and the first waterproof strips 203 are used for matching with the waterproof grooves 103.
According to the embodiment of the application, the first waterproof strip 203 is beneficial to preventing the cooling liquid from flowing out from the gap between the heat conduction assembly 2 and the hollow shell 1, and the cooling effect is influenced.
In some embodiments, the material of the heat conducting plate 201 is a metal material with high thermal conductivity.
According to the embodiment of the present application, the metal material having high thermal conductivity is advantageous for improving the thermal conductivity of the heat conducting plate 201.
Preferably, silicone grease is applied to the contact surface between the temperature guide plate 201 and the server casing, which is beneficial to improving the thermal conductivity of the temperature guide plate 201.
In some embodiments, the magnetic adsorption block 3 includes a temperature conduction assembly connection groove 301, an adsorption block connection post 302 and a second waterproof strip 303, the magnetic adsorption block 3 is provided with the temperature conduction assembly connection groove 301 near one end of the temperature conduction assembly 2, the magnetic adsorption block 3 is provided with the adsorption block connection post 302 near one side of the hollow shell 1 and far away from the opening direction end of the temperature conduction assembly connection groove 301, the adsorption block connection post 302 is used for being matched with the connection circular groove 102, and the magnetic adsorption block 3 is provided with the second waterproof strip 303 near the periphery of one side of the hollow shell 1.
In some embodiments, the suction block connecting post 302 is made of rubber, and the suction block connecting post is fitted into the connecting circular groove 102 in an interference fit manner.
According to the embodiment of the application, the interference fit stability is high, and the later-stage disassembly is convenient.
In some embodiments, the connector 4 is movably connected within the coolant flow bore 104.
In some embodiments, the connection head 4 is provided with a connection end 401 near one end of the hollow shell 1, and the connection head 4 is provided with a through hole 402 inside.
In some embodiments, the hollow casing 1 further comprises a heat dissipation groove 105, and the heat dissipation groove 105 is disposed on the periphery of the hollow casing 1 except for the end surface close to one side of the thermal conduction assembly 2.
Since the cooling liquid in the hollow casing 1 needs to be recycled by the water pump, but the cooling time of the cooling liquid outside is limited, and the temperature of the cooling liquid itself drops in a limited manner when the server operates at high power, other ways are needed to help the cooling liquid itself to drop in temperature.
According to the embodiment of the present application, the heat dissipation groove 105 is beneficial to enlarging the heat dissipation area of the hollow shell 1, and the cooling of the cooling liquid is rapidly realized.
In some embodiments, the temperature guiding assembly 2 further includes a temperature guiding extension plate 204, and the temperature guiding extension plate 204 is uniformly arranged on one side of the temperature guiding plate 201 close to the hollow casing 1 for increasing a contact area between the temperature guiding plate 201 and the flowing cooling liquid in the hollow casing 1.
Because the contact area of the coolant flowing in the heat conducting plate 201 and the hollow shell 1 is limited, when the temperature of the heat conducting plate 201 is higher, the coolant flowing in the hollow shell 1 can hardly take away the heat of the heat conducting plate 201 with high efficiency, and the cooling effect of the device is influenced.
According to the embodiment of the application, the plurality of temperature-conducting extension plates 204 are arranged behind the temperature-conducting plate 201 to increase the contact area with the cooling liquid flowing in the hollow shell 1, so that the cooling effect of the cooling liquid can be effectively improved.
Preferably, the heat conducting plate 201 and the heat conducting extension plate 204 are made of the same material.
Example one
As shown in fig. 1-5, the device provides a technical scheme, and is a cooling device for a computer server, and the cooling device comprises a hollow shell 1, wherein flowing cooling liquid is arranged in the hollow shell 1, a magnetic adsorption block 3 is arranged at one side end of an opening of the hollow shell 1, the magnetic adsorption block 3 is used for connecting the hollow shell 1 and utilizing magnetic force to adsorb on a server shell, a temperature guide component 2 is arranged between the magnetic adsorption blocks 3, the temperature guide component 2 is used for transmitting the temperature of the server shell to the hollow shell 1, and then the flowing cooling liquid in the hollow shell 1 is utilized to reduce the temperature of the server shell.
The heat conducting plate 201 is made of a metal material having high thermal conductivity.
Magnetic force adsorbs piece 3 including leading temperature subassembly spread groove 301, adsorb piece spliced pole 302 and the waterproof strip of second 303, magnetic force adsorbs piece 3 and is close to lead 2 one end of temperature subassembly and be equipped with and lead temperature subassembly spread groove 301, magnetic force adsorbs piece 3 and is close to hollow casing 1 one side and keeps away from and lead temperature subassembly spread groove 301 opening direction end angle department and be equipped with and adsorb piece spliced pole 302, it is used for and is connected circular slot 102 and cooperatees to adsorb piece spliced pole 302, magnetic force adsorbs piece 3 and is close to the peripheral waterproof strip of second 303 that is equipped with of hollow casing 1 one side.
The material of the adsorption block connecting column 302 is rubber, and the matching mode of the adsorption block connecting column and the connecting circular groove 102 is interference fit.
The connecting head 4 is movably connected in the cooling liquid through hole 104.
One end of the connector 4 close to the hollow shell 1 is provided with a connecting end 401, and a circulation hole 402 is arranged inside the connector 4.
Before using, at first install magnetic force adsorption block 3 to leading 2 both ends of temperature subassembly, then utilize magnetic force adsorption block 3 will lead temperature subassembly 2 and install to 1 open end of hollow shell, then be connected with connector 4 of outside water pump and be connected with hollow shell 1, utilize this device that magnetic force adsorption block 3 will be assembled at last adsorb the position that the server case needs the cooling can.
During the use, open outside water pump and make the coolant liquid flow in hollow shell 1 is inside, the heat that will lead that temperature plate 201 transmission comes utilizes the coolant liquid to take away to the realization reduces server shell temperature, and then reduces server temperature.
Example two
The second embodiment is provided on the basis of the above embodiment because the coolant in the hollow casing 1 needs to be circulated by the water pump, but the cooling time of the coolant outside is limited, and the temperature of the coolant itself drops in a limited manner when the server operates at high power.
The hollow shell 1 further comprises a heat dissipation groove 105, and the heat dissipation groove 105 is formed in the periphery of the hollow shell 1 except the end face close to one side of the temperature conduction assembly 2.
When the cooling device is used, the difference between the present embodiment and the above embodiments is that when the cooling liquid is in the hollow shell 1, the contact area between the hollow shell 1 and the outside is large, which is beneficial to the heat transfer of the cooling liquid when the cooling liquid flows through the hollow shell 1, and the temperature of the cooling liquid is reduced more rapidly.
EXAMPLE III
Because the contact area of the heat conducting plate 201 and the cooling liquid flowing in the hollow shell 1 is limited, when the temperature of the heat conducting plate 201 is high, the cooling liquid flowing in the hollow shell 1 can hardly take away the heat of the heat conducting plate 201 with high efficiency, and the cooling effect of the device is affected, so on the basis of the above embodiment, the device provides a third technical scheme.
The temperature conduction assembly 2 further comprises a temperature conduction extension plate 204, and the temperature conduction extension plate 204 is uniformly arranged on one side of the temperature conduction plate 201 close to the hollow shell 1 and used for increasing the contact area of the temperature conduction plate 201 and the flowing cooling liquid in the hollow shell 1.
When in use, the difference between the present embodiment and the above embodiments is that, because the temperature conducting extension plate 204 is connected with the temperature conducting plate 201 and made of the same material, the temperature conducting extension plate 204 increases the contact area between the temperature conducting plate 201 and the cooling liquid, which is beneficial for the cooling liquid to take away the temperature on the temperature conducting plate 201 quickly, and improves the cooling effect of the device.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a computer server heat sink, includes hollow casing (1), be equipped with mobile coolant liquid in hollow casing (1), its characterized in that, hollow casing (1) opening side end is equipped with magnetic force and adsorbs piece (3), magnetic force adsorbs piece (3) and is used for connecting hollow casing (1) and utilize magnetic force to adsorb on the server shell, be equipped with between magnetic force adsorbs piece (3) and lead temperature subassembly (2), lead temperature subassembly (2) and be used for transmitting server shell temperature extremely in hollow casing (1), then utilize mobile coolant liquid reduces its temperature in hollow casing (1).
2. The computer server cooling device according to claim 1, wherein the hollow shell (1) comprises a placing bin (101), a connecting circular groove (102), a waterproof groove (103) and a cooling liquid flow through hole (104), the placing bin (101) with an opening facing one side of the heat conduction assembly (2) is arranged inside the hollow shell (1), the placing bin (101) is used for containing flowing cooling liquid, the connecting circular groove (102) is arranged at each of four corner positions of the placing bin (101), the connecting circular groove (102) is used for being connected with the magnetic adsorption block (3), the waterproof groove (103) is arranged between the connecting circular grooves (102), the cooling liquid flow through hole (104) is arranged on two end faces of the placing bin (101) in the length direction, and the cooling liquid flow through hole (104) is used for being connected with an external water pump to enable the cooling liquid in the placing bin (101) to flow.
3. The computer server cooling device according to claim 2, wherein the temperature guiding assembly (2) comprises a temperature guiding plate (201), a connecting block (202) and a first waterproof strip (203), the connecting block (202) is arranged at two ends of the temperature guiding plate (201) along the length direction, the connecting block (202) is used for connecting the magnetic adsorption block (3), two first waterproof strips (203) are arranged at one side of the temperature guiding plate (201) close to the hollow shell (1) along the length direction, and the first waterproof strip (203) is used for being matched with the waterproof groove (103).
4. The computer server cooling device according to claim 3, wherein the material of the temperature guide plate (201) is a metal material with high thermal conductivity.
5. The computer server cooling device according to claim 3, wherein the magnetic adsorption block (3) comprises a temperature conduction component connection groove (301), an adsorption block connection column (302) and a second waterproof strip (303), one end of the temperature conduction component (2) close to the magnetic adsorption block (3) is provided with the temperature conduction component connection groove (301), the magnetic adsorption block (3) is close to one side of the hollow shell (1) and is far away from the opening direction end of the temperature conduction component connection groove (301) and is provided with the adsorption block connection column (302), the adsorption block connection column (302) is used for being matched with the connection circular groove (102), and the magnetic adsorption block (3) is close to the periphery of one side of the hollow shell (1) and is provided with the second waterproof strip (303).
6. The computer server cooling device according to claim 5, wherein the material of the adsorption block connection post (302) is rubber, and the connection circular groove (102) is in interference fit with the adsorption block connection post.
7. A computer server cooling device according to claim 2, wherein the cooling liquid flow hole (104) is movably connected with a connector (4).
8. The computer server cooling device according to claim 7, wherein a connecting end (401) is provided at one end of the connecting head (4) close to the hollow shell (1), and a circulation hole (402) is provided inside the connecting head (4).
9. The computer server cooling device according to claim 2, wherein the hollow casing (1) further comprises a heat dissipation groove (105), and the heat dissipation groove (105) is formed in the periphery of the hollow casing (1) except the end face close to one side of the temperature conduction assembly (2).
10. The computer server cooling device according to claim 3, wherein the temperature guiding assembly (2) further comprises a temperature guiding extension plate (204), and the temperature guiding extension plate (204) is uniformly arranged on one side of the temperature guiding plate (201) close to the hollow shell (1) and used for increasing the contact area between the temperature guiding plate (201) and the flowing cooling liquid in the hollow shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222148184.9U CN218181469U (en) | 2022-08-15 | 2022-08-15 | Computer server heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222148184.9U CN218181469U (en) | 2022-08-15 | 2022-08-15 | Computer server heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218181469U true CN218181469U (en) | 2022-12-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222148184.9U Active CN218181469U (en) | 2022-08-15 | 2022-08-15 | Computer server heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218181469U (en) |
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2022
- 2022-08-15 CN CN202222148184.9U patent/CN218181469U/en active Active
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