CN216014181U - Network science and technology proxy server convenient to heat dissipation - Google Patents
Network science and technology proxy server convenient to heat dissipation Download PDFInfo
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- CN216014181U CN216014181U CN202121484010.9U CN202121484010U CN216014181U CN 216014181 U CN216014181 U CN 216014181U CN 202121484010 U CN202121484010 U CN 202121484010U CN 216014181 U CN216014181 U CN 216014181U
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Abstract
The utility model discloses a network science and technology proxy server convenient for heat dissipation, which comprises a shell, wherein heat dissipation holes are formed in the upper side and the lower side of the shell, heat dissipation parts are formed in the left side and the right side of the shell, a second heat conduction plate is arranged inside the heat dissipation parts, a semiconductor refrigeration sheet is connected to one side of the second heat conduction plate, a heat conduction column is connected to the other side of the second heat conduction plate, the heat conduction column penetrates through the shell, a first heat conduction plate is connected to the inside of the shell, a spring is sleeved on the column body of the heat conduction column, a server body is clamped between the first heat conduction plates on the two sides, an air inlet is formed in the lower part of the heat dissipation part, and a fan is arranged on the upper part of the heat dissipation part. In the utility model, the heat of the server body can be dissipated through natural ventilation, and can be directly led out to the heat dissipation part through the heat conduction mechanism, and further cooled under the action of the fan and the semiconductor refrigeration sheet, so that the purpose of heat dissipation of the server is realized, and the stability of heat dissipation can be ensured.
Description
Technical Field
The utility model relates to the field of daily necessities, in particular to a network technology proxy server convenient for heat dissipation.
Background
A server is one of computers that runs faster, is more heavily loaded, and is more expensive than a regular computer. The server provides calculation or application services for other clients (such as terminals like PC, smart phone, ATM and the like and even large equipment like train systems and the like) in the network.
In order to ensure that the server can work stably for a long time, the heat dissipation performance of the server is required to be guaranteed, the general heat dissipation mode is wind cooling and water cooling, the heat of the server cannot be timely led out by the conventional server structure, and the heat dissipation efficiency of the server cannot be guaranteed even if the heat dissipation structure is arranged, so that the server structure convenient for heat dissipation is designed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problems that the common heat dissipation mode is wind cooling and water cooling, the existing server structure cannot ensure that the heat of a server can be led out in time, and the heat dissipation efficiency of the server cannot be ensured even if the heat dissipation structure is arranged, so that the server structure convenient for heat dissipation is designed.
In order to solve the technical problems, the utility model adopts a technical scheme that: the utility model provides a network science and technology proxy server convenient to heat dissipation, which comprises an outer shell, the upper and lower both sides of shell all are provided with the louvre, the left and right sides of shell all is provided with the radiating part, the inside of radiating part is provided with the second heat-conducting plate, one side of second heat-conducting plate is connected with the semiconductor refrigeration piece, the opposite side of second heat-conducting plate is connected with the heat conduction post, the heat conduction post runs through the internally connected with first heat-conducting plate to the shell, the spring has been put to the cover on the shaft of heat conduction post, both sides the server body has been pressed from both sides between the first heat-conducting plate, the lower part of radiating part is provided with the air intake, the upper portion of radiating part is provided with the fan.
Preferably, the radiating holes are arranged on the upper side and the lower side of the shell at equal intervals, and dust screens are arranged in the holes of the radiating holes.
Preferably, the casing is oppositely arranged at the middle position between the heat dissipation parts at the two sides, and the surface of the bottom surface of the heat dissipation part is lower than the surface of the bottom surface of the casing.
Preferably, one side of the second heat conducting plate is provided with an embedded groove, the semiconductor refrigeration piece is correspondingly connected in the embedded groove, the cold surface of the semiconductor refrigeration piece is attached to the inner wall of the embedded groove, and a heat insulation belt is arranged on the side surface of the second heat conducting plate, corresponding to the outer side of the semiconductor refrigeration piece.
Preferably, the first heat-conducting plate, the heat-conducting column and the second heat-conducting plate are of an integral structure, and the heat-conducting column is arranged between the first heat-conducting plate and the second heat-conducting plate in a plurality.
Preferably, the springs are oppositely arranged in the shell, and the springs are arranged in a plurality corresponding to the heat conduction columns.
Preferably, the air inlets are arranged on the side surfaces of the bottom of the heat dissipation part, the air inlets on the heat dissipation parts on the two sides are oppositely arranged, and a dust filter screen is arranged in the holes of the air inlets.
Preferably, the fan is disposed on the top of the heat dissipating portion, and the fan penetrates to the outside of the heat dissipating portion.
The utility model has the following beneficial effects:
1. according to the utility model, after the server body is arranged in the shell, the heat of the server body can be dissipated through natural ventilation and can be directly led out to the heat dissipation part through the heat conduction mechanism, the server can be further cooled under the action of the fan and the semiconductor refrigerating sheet, the purpose of heat dissipation of the server is achieved, and the stability of heat dissipation can be ensured;
2. according to the utility model, the heat dissipation mechanisms on the two sides in the shell can be clamped oppositely under the action of the spring, so that the arrangement operation of the server bodies with different widths can be realized, and the application range is wider.
Drawings
FIG. 1 is a front sectional view of the present invention;
FIG. 2 is a top view of a thermally conductive structure of the present invention;
fig. 3 is an enlarged view of a portion a in fig. 1.
In the figure: 1. a housing; 2. a heat dissipating section; 3. a server body; 4. a first heat-conducting plate; 5. a heat-conducting column; 6. a second heat-conducting plate; 7. a semiconductor refrigeration sheet; 8. a spring; 9. heat dissipation holes; 10. an air inlet; 11. a fan; 12. embedding a groove; 13. a heat insulating belt.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.
Referring to fig. 1-3, a network science and technology proxy server convenient for heat dissipation comprises a housing 1, heat dissipation holes 9 are formed in the upper and lower sides of the housing 1 to ensure natural heat dissipation, heat dissipation parts 2 are formed in the left and right sides of the housing 1 to provide a connection space for a heat dissipation mechanism at the edge side, a second heat conduction plate 6 is arranged inside the heat dissipation part 2, a semiconductor refrigeration sheet 7 is connected to one side of the second heat conduction plate 6 to provide corresponding refrigeration operation, a heat conduction column 5 is connected to the other side of the second heat conduction plate 6, the heat conduction column 5 penetrates into the housing 1 and is connected with a first heat conduction plate 4 to realize corresponding heat conduction, a spring 8 is sleeved on the column body of the heat conduction column 5 to provide the moving force of the whole heat conduction mechanism, a server body 3 is clamped between the first heat conduction plates 4 at the two sides to realize the installation of the server, an air inlet 10 is formed in the lower part of the heat dissipation part 2, an air inlet position is provided, a fan 11 is arranged on the upper part of the heat dissipation part 2, and air circulation is realized through the fan 11.
The radiating holes 9 are equidistantly arranged on the upper side and the lower side of the shell 1, a dustproof net is arranged in the holes of the radiating holes 9 to ensure the natural radiating rate and prevent dust from entering the interior of the shell to influence a server, the shell 1 is relatively arranged at the middle position between the radiating parts 2 on the two sides, the bottom surface of the radiating part 2 is lower than that of the shell 1 to provide a premise for the arrangement of an air inlet 10, one side of the second heat conducting plate 6 is provided with an embedded groove 12 to provide an embedded position of the semiconductor refrigerating sheet 7, the semiconductor refrigerating sheet 7 is correspondingly connected in the embedded groove 12, the cold surface of the semiconductor refrigerating sheet 7 is attached to the inner wall of the embedded groove 12 to ensure that the low temperature after refrigeration is conducted into the shell, the side surface of the second heat conducting plate 6 is provided with a heat insulating belt 13 corresponding to the outer side of the semiconductor refrigerating sheet 7 to prevent the hot surface from influencing the internal temperature of the shell 1, the first heat conducting plate 4, the heat conducting columns 5 and the second heat conducting plate 6 are of an integral structure, a plurality of heat conducting columns 5 are arranged between the first heat conducting plate 4 and the second heat conducting plate 6 to ensure the heat conducting rate per se, the springs 8 are oppositely arranged in the shell 1, and the springs 8 are arranged in a plurality corresponding to the plurality of heat-conducting columns 5, so as to ensure that the first heat-conducting plate 4 is fully attached to the server body 3, and ensures the stability of the clamping of the server body 3, the air inlet 10 is arranged on the side surface of the bottom of the heat dissipation part 2, the air inlets 10 on the heat dissipation parts 2 at two sides are oppositely arranged, and the downthehole dust screen that is provided with of air intake 10, after fan 11 opens, not only can the suction outside air, can also directly suction shell 1 inside air, the inside heat dissipation rate of shell 1 with higher speed, fan 11 sets up the top at heat dissipation portion 2, and fan 11 link up to the outside of heat dissipation portion 2, guarantees corresponding circulation of air.
When the server body 3 is arranged in the shell 1, heat of the server body 3 can be directly led out to the heat dissipation part 2 through the heat conduction mechanism besides being dissipated through natural ventilation when the server body is used, the server body can be further cooled under the action of the fan 11 and the semiconductor refrigeration sheet 7, the purpose of heat dissipation of the server body 3 is achieved, the stability of heat dissipation can be guaranteed, the heat dissipation mechanisms on the two sides in the shell 1 can be clamped in a mutual mode under the action of the springs 8, accordingly, arrangement operation of the server bodies 3 with different widths can be achieved, and the application range is wide.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The utility model provides a network science and technology proxy server convenient to heat dissipation, includes shell (1), its characterized in that: the upper and lower both sides of shell (1) all are provided with louvre (9), the left and right sides of shell (1) all is provided with radiating part (2), the inside of radiating part (2) is provided with second heat-conducting plate (6), one side of second heat-conducting plate (6) is connected with semiconductor refrigeration piece (7), the opposite side of second heat-conducting plate (6) is connected with heat conduction post (5), heat conduction post (5) run through to the internal connection of shell (1) have first heat-conducting plate (4), spring (8) have been put to the cover on the shaft of heat conduction post (5), both sides server body (3) have been put to the clamp between first heat-conducting plate (4), the lower part of radiating part (2) is provided with air intake (10), the upper portion of radiating part (2) is provided with fan (11).
2. The network technology proxy server convenient for heat dissipation of claim 1, wherein: the heat dissipation holes (9) are arranged on the upper side and the lower side of the shell (1) at equal intervals, and dust screens are arranged in the holes of the heat dissipation holes (9).
3. The network technology proxy server convenient for heat dissipation of claim 1, wherein: the shell (1) is oppositely arranged at the middle position between the heat dissipation parts (2) on the two sides, and the surface of the bottom surface of the heat dissipation part (2) is lower than the surface of the bottom surface of the shell (1).
4. The network technology proxy server convenient for heat dissipation of claim 1, wherein: one side of second heat-conducting plate (6) is provided with inlay groove (12), semiconductor refrigeration piece (7) correspond the inside of connecting in inlay groove (12), and the cold face of semiconductor refrigeration piece (7) and the laminating of the inner wall of inlay groove (12), the outside that the side surface of second heat-conducting plate (6) corresponds semiconductor refrigeration piece (7) is provided with thermal-insulated area (13).
5. The network technology proxy server convenient for heat dissipation of claim 1, wherein: the heat-conducting plate is characterized in that the first heat-conducting plate (4), the heat-conducting columns (5) and the second heat-conducting plate (6) are of an integral structure, and the heat-conducting columns (5) are arranged between the first heat-conducting plate (4) and the second heat-conducting plate (6) in a plurality.
6. The network technology proxy server convenient for heat dissipation of claim 1, wherein: the spring (8) is arranged in the shell (1) relatively, and the spring (8) is provided with a plurality of heat conducting columns (5).
7. The network technology proxy server convenient for heat dissipation of claim 1, wherein: the air inlets (10) are arranged on the side surfaces of the bottoms of the heat dissipation parts (2), the air inlets (10) on the heat dissipation parts (2) on two sides are oppositely arranged, and dust filter nets are arranged in holes of the air inlets (10).
8. The network technology proxy server convenient for heat dissipation of claim 1, wherein: the fan (11) is arranged on the top of the heat dissipation part (2), and the fan (11) penetrates through the heat dissipation part (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121484010.9U CN216014181U (en) | 2021-07-01 | 2021-07-01 | Network science and technology proxy server convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121484010.9U CN216014181U (en) | 2021-07-01 | 2021-07-01 | Network science and technology proxy server convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216014181U true CN216014181U (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121484010.9U Active CN216014181U (en) | 2021-07-01 | 2021-07-01 | Network science and technology proxy server convenient to heat dissipation |
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| CN (1) | CN216014181U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114759634A (en) * | 2022-04-26 | 2022-07-15 | 天长市森林电器科技有限公司 | Electric vehicle charger suitable for high temperature environment |
-
2021
- 2021-07-01 CN CN202121484010.9U patent/CN216014181U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114759634A (en) * | 2022-04-26 | 2022-07-15 | 天长市森林电器科技有限公司 | Electric vehicle charger suitable for high temperature environment |
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