CN216561692U - Intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator - Google Patents

Abstract

The utility model discloses an intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator, which comprises a sensing assembly, a refrigeration assembly, a radiator assembly, an intelligent self-adaptive control assembly, a display module and a shell assembly, wherein the sensing assembly is used for sensing the temperature of a CPU; the refrigerating surface of the refrigerating semiconductor is connected with the top plane of the temperature and humidity sensor module, so that the refrigerating surface directly passes through the temperature and humidity sensor module to cool a CPU, heat generated by the heating surface is transmitted to a large-area radiating fin through a heat pipe connected with the base, and air convection is accelerated through a fan arranged on the side face of the radiating fin to radiate the heat; so as to realize the function of actively cooling the CPU; the heat insulation piece is arranged on the connecting surface of the heat dissipation base and the temperature and humidity sensor module, so that the heat dissipation base which is respectively connected with the semiconductor heat conduction surface of the refrigerating piece is prevented from contacting with the temperature and humidity sensor module which is connected with the refrigerating surface, and numerical errors detected by the temperature and humidity sensor module are prevented.

Description

An intelligent self-adaptive temperature-controlled semiconductor refrigeration actively cooling CPU radiator

technical field

The utility model relates to the technical field of radiators, in particular to an intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator.

Background technique

With the continuous development of society and the continuous pursuit of chip computing power by humans, more and more transistors have been inserted into computing chips, and the density of each computing unit has been continuously improved. High operating voltage and power consumption. This also means that we also need to continuously overcome the heat dissipation problem of chip temperature;

Computer CPUs and graphics cards are currently available in two types: air-cooled and water-cooled. The air-cooled radiator uses a fan to blow air to accelerate the air flow of the heat sink, thereby accelerating heat exchange and reducing the temperature of the device. The water-cooled radiator is conducted by the liquid driven by the active circulation of the water pump motor to the main radiator (condenser) for heat dissipation. Both air-cooled and water-cooled radiators belong to the form of "passive" heat dissipation, because the temperature difference between the high temperature of the chip and the low temperature of the environment determines that the traditional radiator, as a "heat carrier", can only control the temperature of the chip at most. reduce to near ambient temperature;

Disadvantages of air cooling in the prior art:

1. The heat dissipation capacity of the air-cooled radiator has an upper limit. When the CPU is under high load, there will be large thermal fluctuations, which may easily exceed the temperature warning range of the CPU, resulting in reduced frequency operation;

2. The top air-cooled body is huge, which may block the graphics card, bend the motherboard, and loosen during transportation.

Disadvantages of water cooling:

1. There is a lack of easy-to-use low-end products, and the performance of low-end water-cooled radiators is not as good as the price of air-cooled radiators;

2. The risk of liquid leakage. With the aging of the pipeline of the water-cooled radiator, there will be a risk of liquid leakage. Once night leakage occurs, the entire host will be scrapped. three years. If the water is split and colored cold liquid is added, then it is almost essential to disassemble and clean the waterway every few months.

SUMMARY OF THE INVENTION

The technical problem to be solved by the utility model is to provide an intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator. The utility model realizes the sensor module module by directly connecting the bottom plane of the temperature and humidity sensor module with the upper surface plane of the CPU. The temperature is synchronized with the surface temperature of the CPU, and the temperature and humidity data are collected and transmitted to the intelligent motherboard to adaptively control the working power of the semiconductor cooling chip and the speed of the cooling fan, so as to keep the CPU at the best working temperature.

The intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator of the utility model is realized by the following technical solutions: comprising a radiator component, a temperature control component and a shell component;

The temperature control component includes a temperature and humidity sensor module, a refrigeration semiconductor, and an intelligent temperature control motherboard; the heat sink component includes relatively connected heat sinks and a heat conduction component; the refrigeration semiconductor is attached to the heat conduction component, and the temperature and humidity sensor module covers the refrigeration semiconductor and is connected to the heat conduction component. components.

As a preferred technical solution, the heat-conducting assembly includes a heat-dissipating base and more than one group of heat-conducting pipes; more than one group of heat-conducting pipes are respectively installed at both ends of the heat-dissipating base; more than one group of heat-conducting pipes are relatively attached to the heat sink; the heat-conducting surface of the refrigeration semiconductor Connect the cooling base; the cooling surface of the cooling semiconductor is connected to the temperature and humidity sensor modules.

As a preferred technical solution, a heat insulating member is provided on the connection surface between the heat dissipation base and the temperature and humidity sensor module.

As a preferred technical solution, the temperature and humidity sensor modules and refrigeration semiconductors are connected to the intelligent temperature control motherboard; a light guide groove is installed on the heat sink; the temperature and humidity sensor modules are arranged in the light guide groove; a connection is installed above the temperature and humidity sensor module The display module of the intelligent temperature control motherboard.

As a preferred technical solution, RGB cooling fans are provided on opposite sides of the heat sink; the housing assembly includes a housing; the heat sink is installed in the housing; The second through hole and the third through slot for fixing the light guide slot.

As a preferred technical solution, the heat dissipation base and more than one group of heat pipes are made of nickel-plated red copper material and nickel-plated material respectively.

The beneficial effects of the present utility model are:

1. Connect the cooling surface of the cooling semiconductor to the top plane of the temperature and humidity sensor module, so that the cooling surface can directly cool the CPU through the temperature and humidity sensor module, and the heat generated by the heating surface is transmitted to the large-area heat sink by the heat pipe connected to the base, and then the heat generated by the heating surface is transmitted to the large-area heat sink through the heat pipe connected to the base. The fan set on the cooling side accelerates air convection to dissipate heat, so as to realize the function of actively cooling the CPU;

2. A heat shield is provided on the connection surface between the heat dissipation base and the temperature and humidity sensor module to prevent the heat dissipation base connected to the semiconductor heat conduction surface of the cooling sheet respectively and the temperature and humidity sensor module connected to the cooling surface from contacting, causing the temperature and humidity sensor module to detect The value of is wrong;

3. The heat dissipation base and the temperature and humidity sensor module connection surface are provided with heat insulation parts to prevent the heat dissipation base connected to the semiconductor heat conduction surface of the refrigeration sheet respectively and the temperature and humidity sensor module connected to the heat dissipation surface from contacting, causing the temperature and humidity sensor module to detect. The value of is wrong;

4. The heat dissipation base and more than one group of heat pipes are made of nickel-plated copper material and nickel-plated material respectively. Both nickel-plated copper material and nickel-plated material have high thermal conductivity;

5. The display module can display the cooling power of the radiator, the temperature of the CPU, the speed of the cooling fan and other information in real time; the shell components can realize the diversion of convective air and the appearance decoration.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic diagram of an intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator of the present invention.

Detailed ways

All features disclosed in this specification, or all disclosed steps in a method or process, may be combined in any way except mutually exclusive features and/or steps.

As shown in Figure 1, an intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator of the present invention includes a radiator assembly, a temperature control assembly and a shell assembly;

The temperature control assembly includes a temperature and humidity sensor module 3, a refrigeration semiconductor 4 and an intelligent temperature control motherboard 12; the heat sink assembly includes a relatively connected heat sink 8 and a heat conduction assembly; the refrigeration semiconductor 4 is attached to the heat conduction assembly, and the temperature and humidity sensor module 3 covers Refrigerate the semiconductor 4 and connect the heat conducting component.

In this embodiment, the heat conduction assembly includes a heat dissipation base 5 and more than one group of heat conduction pipes 7; more than one group of heat conduction pipes 7 are respectively installed on both ends of the heat dissipation base 5; more than one group of heat conduction pipes 7 are relatively attached to the heat sink 8; The heat conduction surface of the cooling semiconductor 4 is connected to the heat dissipation base 5 ; the cooling surface of the cooling semiconductor 4 is connected to the temperature and humidity sensor module 3 .

In this embodiment, a heat insulating member 2 is provided on the connection surface of the heat dissipation base 5 and the temperature and humidity sensor module 3 .

In this embodiment, the temperature and humidity sensor module 3 and the refrigeration semiconductor 4 are both connected to the intelligent temperature control motherboard 12; the heat sink 8 is provided with a light guide groove 11; the temperature and humidity sensor module 3 is arranged in the light guide groove 11; Above the humidity sensor module 3 is installed a display module 13 connected to the intelligent temperature control motherboard 12 .

In this embodiment, RGB cooling fans 9 are provided on opposite sides of the heat sink 8; the housing assembly includes a housing 10; the heat sink 8 is installed in the housing 10; 14 and a second through hole 15 for fixing the heat dissipation base 5 and a third through slot 16 for fixing the light guide groove 11 .

In this embodiment, the heat dissipation base 5 and one or more heat pipes 7 are made of nickel-plated red copper material and nickel-plated material, respectively.

The beneficial effects of the present utility model are:

1. Connect the cooling surface of the cooling semiconductor to the top plane of the temperature and humidity sensor module, so that the cooling surface can directly cool the CPU through the temperature and humidity sensor module, and the heat generated by the heating surface is transmitted to the large-area heat sink by the heat pipe connected to the base, and then the heat generated by the heating surface is transmitted to the large-area heat sink through the heat pipe connected to the base. The fan set on the cooling side accelerates air convection to dissipate heat, so as to realize the function of actively cooling the CPU;

2. A heat shield is provided on the connection surface between the heat dissipation base and the temperature and humidity sensor module to prevent the heat dissipation base connected to the semiconductor heat conduction surface of the cooling sheet respectively and the temperature and humidity sensor module connected to the cooling surface from contacting, causing the temperature and humidity sensor module to detect The value of is wrong;

3. The heat dissipation base and the temperature and humidity sensor module connection surface are provided with heat insulation parts to prevent the heat dissipation base connected to the semiconductor heat conduction surface of the refrigeration sheet respectively and the temperature and humidity sensor module connected to the heat dissipation surface from contacting, causing the temperature and humidity sensor module to detect. The value of is wrong;

4. The heat dissipation base and more than one group of heat pipes are made of nickel-plated copper material and nickel-plated material respectively. Both nickel-plated copper material and nickel-plated material have high thermal conductivity;

5. The display module can display the cooling power of the radiator, the temperature of the CPU, the speed of the cooling fan and other information in real time; the shell components can realize the diversion of convective air and the appearance decoration.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or replacements that are not thought of through creative work should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope defined by the claims.

Claims (6)

1. an intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator, comprising a radiator assembly, a temperature control assembly and a housing assembly; it is characterized in that: The temperature control assembly includes a temperature and humidity sensor module (3), a refrigeration semiconductor (4), and an intelligent temperature control motherboard (12); the heat sink assembly includes a heat sink (8) and a heat conduction assembly that are relatively connected; the refrigeration semiconductor (4) is attached A heat-conducting component, the temperature and humidity sensor module (3) covers the refrigeration semiconductor (4), and is connected to the heat-conducting component. 2. The intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator according to claim 1, characterized in that: the heat-conducting assembly comprises a heat-dissipating base (5) and more than one group of heat-conducting pipes (7); The tubes (7) are respectively installed on both ends of the heat dissipation base (5); more than one group of heat conduction pipes (7) are relatively attached to the heat sink (8); the heat conduction surface of the refrigeration semiconductor (4) is connected to the heat dissipation base (5); the refrigeration semiconductor The cooling surface of (4) is connected to the temperature and humidity sensor module (3). 3. The intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator according to claim 2, characterized in that: the connection surface between the heat dissipation base (5) and the temperature and humidity sensor module (3) is provided with a heat insulating member (2) . 4. The intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator according to claim 1, characterized in that: the temperature and humidity sensor modules (3) and the refrigeration semiconductor (4) are all connected to the intelligent temperature-controlled mainboard (12); A light guide groove (11) is installed on the heat sink (8); the temperature and humidity sensor module (3) is arranged in the light guide groove (11); the temperature and humidity sensor module (3) is installed above the temperature and humidity sensor module (3). 12) of the display module (13). 5. The intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator according to claim 1, characterized in that: both opposite sides of the heat sink (8) are provided with RGB cooling fans (9); the housing assembly comprises a housing (10). ); the heat sink (8) is installed in the housing (10); the surface of the housing (10) is provided with a first through slot (14) for fixing the RGB cooling fan (9) and a second slot (14) for fixing the heat dissipation base (5) A through hole (15) and a third through groove (16) for fixing the light guide groove (11). 6. The intelligent self-adaptive temperature-controlled semiconductor refrigeration active cooling CPU radiator according to claim 1, characterized in that: the heat dissipation base (5) and more than one group of heat conducting pipes (7) adopt nickel-plated red copper material and nickel-plated copper material respectively. Material.

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