CN216561692U - Intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator - Google Patents
Intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator Download PDFInfo
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- CN216561692U CN216561692U CN202123309798.2U CN202123309798U CN216561692U CN 216561692 U CN216561692 U CN 216561692U CN 202123309798 U CN202123309798 U CN 202123309798U CN 216561692 U CN216561692 U CN 216561692U
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Abstract
The utility model discloses an intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator, which comprises a sensing assembly, a refrigeration assembly, a radiator assembly, an intelligent self-adaptive control assembly, a display module and a shell assembly, wherein the sensing assembly is used for sensing the temperature of a CPU; the refrigerating surface of the refrigerating semiconductor is connected with the top plane of the temperature and humidity sensor module, so that the refrigerating surface directly passes through the temperature and humidity sensor module to cool a CPU, heat generated by the heating surface is transmitted to a large-area radiating fin through a heat pipe connected with the base, and air convection is accelerated through a fan arranged on the side face of the radiating fin to radiate the heat; so as to realize the function of actively cooling the CPU; the heat insulation piece is arranged on the connecting surface of the heat dissipation base and the temperature and humidity sensor module, so that the heat dissipation base which is respectively connected with the semiconductor heat conduction surface of the refrigerating piece is prevented from contacting with the temperature and humidity sensor module which is connected with the refrigerating surface, and numerical errors detected by the temperature and humidity sensor module are prevented.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to an intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator.
Background
With the continuous development of society and the continuous pursuit of human for chip computing power, more and more transistors are plugged into a computing chip, the density of each computing unit is continuously improved, and meanwhile, higher frequency also brings higher working voltage and power consumption to the chip. This also means we need to continuously overcome the heat dissipation problem of the chip temperature;
computer CPU, display card are two kinds of wind cooling and water cooling in the market at present, and air cooling radiator is through the fan blast air, and the air flow of acceleration fin reduces the device temperature thereby to the heat exchange of acceleration. The water-cooled radiator is formed by conducting liquid driven by the active circulation of a water pump motor to a main radiator (condenser) for heat dissipation. The air-cooled radiator and the water-cooled radiator both belong to a passive radiating mode, and the temperature difference range generated by the high temperature of a chip and the low temperature of the environment determines that the traditional radiator is used as a heat carrier, and the temperature of the chip can only be reduced to be close to the ambient temperature at most;
the air cooling in the prior art has the following defects:
1. the heat dissipation capacity of the air-cooled radiator is limited, so that great heat fluctuation can occur when the CPU works under high load, the temperature warning range of the CPU is easily exceeded, and the down-frequency operation is caused;
2. the top-level air cooling is huge in size and can block the display card, bend the main board and loosen during transportation.
The disadvantages of water cooling:
1. the low-end product which is good in use is lacked, and the performance of the low-end water-cooling radiator is different from that of a price air-cooling radiator;
2. the risk of weeping, along with the ageing of water-cooling radiator's pipeline, can have the risk of weeping, in case take place to leak night, whole host computer will face and scrap, because the problem of water-cooling liquid evaporation, just also two three years probably for the life-span of an integrative water-cooling. If the water is separated and the colored cold liquid is added, the water way is needed to be cleaned after being disassembled once in months.
Disclosure of Invention
The utility model aims to solve the technical problem of providing an intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator, wherein the bottom plane of a temperature and humidity sensor module is directly connected with the upper surface plane of a CPU, so that the temperature of the sensor module is synchronous with the surface temperature of the CPU, and temperature and humidity data are collected and transmitted to an intelligent main board to carry out self-adaptive control on the working power of a semiconductor refrigeration piece and the rotating speed of a cooling fan, so that the CPU is kept at the optimal working temperature.
The intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator is realized by the following technical scheme: the temperature control device comprises a radiator component, a temperature control component and a shell component;
the temperature control assembly comprises a temperature and humidity sensor module, a refrigeration semiconductor and an intelligent temperature control main board; the radiator component comprises a radiating fin and a heat conducting component which are oppositely connected; the refrigeration semiconductor is attached to the heat conduction assembly, and the temperature and humidity sensor module covers the refrigeration semiconductor and is connected with the heat conduction assembly.
As a preferred technical scheme, the heat conducting component comprises a heat radiating base and more than one group of heat conducting pipes; more than one group of heat conduction pipes are respectively arranged at two ends of the heat dissipation base; more than one group of heat conduction pipes are attached to the radiating fins relatively; the heat conducting surface of the refrigeration semiconductor is connected with the heat dissipation base; the refrigerating surface of the refrigerating semiconductor is connected with the temperature and humidity sensor module.
As the preferred technical scheme, the heat radiation base is provided with a heat insulation piece on the connection surface with the temperature and humidity sensor module.
As the preferred technical scheme, the temperature and humidity sensor module and the refrigeration semiconductor are connected with the intelligent temperature control mainboard; the heat dissipation sheet is provided with a light guide groove; the temperature and humidity sensor module is arranged in the light guide groove; and a display module connected with the intelligent temperature control main board is installed above the temperature sensor module and the humidity sensor module.
As a preferred technical scheme, RGB heat dissipation fans are arranged on two opposite sides of the heat dissipation fin; the housing assembly includes a housing; the radiating fins are arranged in the shell; the surface of the shell is provided with a first through groove for fixing the RGB heat dissipation fan, a second through hole for fixing the heat dissipation base and a third through groove for fixing the light guide groove.
As a preferred technical scheme, the heat dissipation base and the more than one group of heat conduction pipes are respectively made of nickel-plated red copper materials and nickel-plated materials.
The utility model has the beneficial effects that:
1. the refrigeration surface of the refrigeration semiconductor is connected with the top plane of the temperature and humidity sensor module, so that the refrigeration surface directly cools the CPU through the temperature and humidity sensor module, heat generated by the heating surface is transmitted to a large-area radiating fin through a heat pipe connected with the base, and air convection is accelerated through a fan arranged on the radiating side surface to radiate the heat, so that the function of actively cooling the CPU is realized;
2. the heat insulation piece is arranged on the connecting surface of the heat dissipation base and the temperature and humidity sensor module, so that the heat dissipation base which is respectively connected with the semiconductor heat conducting surface of the refrigerating sheet is prevented from contacting with the temperature and humidity sensor module which is connected with the refrigerating surface, and the numerical value detected by the temperature and humidity sensor module is prevented from being wrong;
3. the heat insulation piece is arranged on the connecting surface of the heat dissipation base and the temperature and humidity sensor module, so that the heat dissipation base which is respectively connected with the semiconductor heat conducting surface of the refrigerating sheet is prevented from contacting with the temperature and humidity sensor module which is connected with the heat dissipation surface, and the numerical value detected by the temperature and humidity sensor module is prevented from being wrong;
4. the heat dissipation base and the more than one group of heat conduction pipes are respectively made of nickel-plated red copper materials and nickel-plated materials, and the nickel-plated red copper materials and the nickel-plated materials have high-efficiency heat conductivity;
5. the display module can display information such as the refrigeration power of the radiator, the temperature of the CPU, the rotating speed of the cooling fan and the like in real time; the shell component can realize the diversion of convection air and the decoration effect of appearance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of an intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator according to the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
As shown in fig. 1, the intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator of the present invention includes a radiator assembly, a temperature control assembly and a housing assembly;
the temperature control assembly comprises a temperature and humidity sensor module 3, a refrigeration semiconductor 4 and an intelligent temperature control main board 12; the radiator assembly comprises a radiating fin 8 and a heat conducting assembly which are oppositely connected; the refrigeration semiconductor 4 is attached to the heat conducting component, and the temperature and humidity sensor module 3 covers the refrigeration semiconductor 4 and is connected with the heat conducting component.
In this embodiment, the heat conducting assembly includes a heat dissipation base 5 and more than one set of heat conducting pipes 7; more than one group of heat conduction pipes 7 are respectively arranged at two ends of the heat dissipation base 5; more than one group of heat conduction pipes 7 are oppositely attached to the radiating fins 8; the heat conducting surface of the refrigeration semiconductor 4 is connected with a heat dissipation base 5; the refrigerating surface of the refrigerating semiconductor 4 is connected with the temperature and humidity sensor module 3.
In this embodiment, the heat-insulating member 2 is disposed on the connection surface between the heat-dissipating base 5 and the temperature/humidity sensor module 3.
In the embodiment, the temperature and humidity sensor module 3 and the refrigeration semiconductor 4 are both connected with the intelligent temperature control mainboard 12; the radiating fins 8 are provided with light guide grooves 11; the temperature and humidity sensor module 3 is arranged in the light guide groove 11; and a display module 13 connected with an intelligent temperature control main board 12 is installed above the temperature and humidity sensor module 3.
In this embodiment, the RGB heat dissipation fans 9 are disposed on two opposite sides of the heat dissipation plate 8; the housing assembly comprises a housing 10; the heat sink 8 is mounted in the housing 10; the surface of the casing 10 is provided with a first through groove 14 for fixing the RGB heat dissipation fan 9, a second through hole 15 for fixing the heat dissipation base 5, and a third through groove 16 for fixing the light guide groove 11.
In this embodiment, the heat dissipation base 5 and the heat conduction pipes 7 are made of nickel-plated red copper material and nickel-plated material, respectively.
The utility model has the beneficial effects that:
1. the refrigeration surface of the refrigeration semiconductor is connected with the top plane of the temperature and humidity sensor module, so that the refrigeration surface directly cools the CPU through the temperature and humidity sensor module, heat generated by the heating surface is transmitted to a large-area radiating fin through a heat pipe connected with the base, and air convection is accelerated through a fan arranged on the radiating side surface to radiate the heat, so that the function of actively cooling the CPU is realized;
2. the heat insulation piece is arranged on the connecting surface of the heat dissipation base and the temperature and humidity sensor module, so that the heat dissipation base which is respectively connected with the semiconductor heat conducting surface of the refrigerating sheet is prevented from contacting with the temperature and humidity sensor module which is connected with the refrigerating surface, and the numerical value detected by the temperature and humidity sensor module is prevented from being wrong;
3. the heat insulation piece is arranged on the connecting surface of the heat dissipation base and the temperature and humidity sensor module, so that the heat dissipation base which is respectively connected with the semiconductor heat conducting surface of the refrigerating sheet is prevented from contacting with the temperature and humidity sensor module which is connected with the heat dissipation surface, and the numerical value detected by the temperature and humidity sensor module is prevented from being wrong;
4. the heat dissipation base and the more than one group of heat conduction pipes are respectively made of nickel-plated red copper materials and nickel-plated materials, and the nickel-plated red copper materials and the nickel-plated materials have high-efficiency heat conductivity;
5. the display module can display information such as the refrigeration power of the radiator, the temperature of the CPU, the rotating speed of the cooling fan and the like in real time; the shell component can realize the diversion of convection air and the decoration effect of appearance.
The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (6)
1. An intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator comprises a radiator component, a temperature control component and a shell component; the method is characterized in that:
the temperature control assembly comprises a temperature and humidity sensor module (3), a refrigeration semiconductor (4) and an intelligent temperature control main board (12); the radiator assembly comprises oppositely connected radiating fins (8) and a heat conducting assembly; refrigeration semiconductor (4) laminating heat-conducting component, temperature, humidity transducer module (3) cover refrigeration semiconductor (4) to connect heat-conducting component.
2. The intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator of claim 1, wherein: the heat conducting component comprises a heat radiating base (5) and more than one group of heat conducting pipes (7); more than one group of heat conduction pipes (7) are respectively arranged at two ends of the heat dissipation base (5); more than one group of heat conduction pipes (7) are oppositely attached to the radiating fins (8); the heat conducting surface of the refrigeration semiconductor (4) is connected with a heat dissipation base (5); the refrigerating surface of the refrigerating semiconductor (4) is connected with the temperature and humidity sensor module (3).
3. The intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator according to claim 2, characterized in that: the heat radiation base (5) and the temperature and humidity sensor module (3) are connected with a face provided with a heat insulation piece (2).
4. The intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator of claim 1, wherein: the temperature and humidity sensor module (3) and the refrigeration semiconductor (4) are both connected with an intelligent temperature control mainboard (12); the radiating fins (8) are provided with light guide grooves (11); the temperature and humidity sensor module (3) is arranged in the light guide groove (11); a display module (13) connected with an intelligent temperature control main board (12) is installed above the temperature and humidity sensor module (3).
5. The intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator of claim 1, wherein: RGB heat dissipation fans (9) are arranged on two opposite sides of the heat dissipation fin (8); the housing assembly comprises a housing (10); the radiating fins (8) are arranged in the shell (10); the surface of the shell (10) is provided with a first through groove (14) for fixing the RGB heat dissipation fan (9), a second through hole (15) for fixing the heat dissipation base (5) and a third through groove (16) for fixing the light guide groove (11).
6. The intelligent adaptive temperature control semiconductor refrigeration active cooling CPU radiator of claim 1, wherein: the heat dissipation base (5) and the heat conduction pipes (7) are respectively made of nickel-plated red copper materials and nickel-plated materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123309798.2U CN216561692U (en) | 2021-12-27 | 2021-12-27 | Intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator |
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| CN202123309798.2U CN216561692U (en) | 2021-12-27 | 2021-12-27 | Intelligent self-adaptive temperature control semiconductor refrigeration active cooling CPU radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117724591A (en) * | 2023-12-26 | 2024-03-19 | 东莞市冰点智能科技有限公司 | Novel CPU liquid cooling radiator of semiconductor refrigerating system |
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2021
- 2021-12-27 CN CN202123309798.2U patent/CN216561692U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117724591A (en) * | 2023-12-26 | 2024-03-19 | 东莞市冰点智能科技有限公司 | Novel CPU liquid cooling radiator of semiconductor refrigerating system |
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