CN213814588U

CN213814588U - Automatic external radiator of refrigeration formula notebook computer of dehumidification

Info

Publication number: CN213814588U
Application number: CN202120101261.8U
Authority: CN
Inventors: 尤民民; 潘永和
Original assignee: Hefei Xiaobing Refrigeration Technology Co ltd
Current assignee: Hefei Xiaobing Refrigeration Technology Co ltd
Priority date: 2021-01-15
Filing date: 2021-01-15
Publication date: 2021-07-27
Anticipated expiration: 2031-01-15

Abstract

The utility model discloses an automatic external radiator of refrigeration formula notebook computer of dehumidification, including working of plastics one and working of plastics two, the inside heat-conducting plate that is provided with in upper end of working of plastics one, the upper end laminating of heat-conducting plate is connected with heat conduction silica gel gasket, the lower extreme middle part of heat-conducting plate is provided with the semiconductor refrigeration piece, the lower extreme of semiconductor refrigeration piece is provided with the radiator, the lower extreme of working of plastics two and the below that is located the radiator are provided with the water collector, the upper end of working of plastics two and the side that is close to heat conduction silica gel gasket are provided with a plurality of temperature sensor one, heat conduction silica gel gasket's inside is embedded to have a plurality of temperature sensor two. Has the advantages that: the semiconductor refrigeration technology is adopted for refrigeration and dehumidification, the refrigeration function reduces the temperature of working accessories inside the notebook computer, and the dehumidification function reduces the air humidity entering the notebook computer, so that the performance of the notebook computer is stable in the using process, the operation is faster, and the service life is longer.

Description

Automatic external radiator of refrigeration formula notebook computer of dehumidification

Technical Field

The utility model relates to a notebook computer technical field particularly, relates to an automatic refrigeration formula notebook computer external heat radiator of dehumidification.

Background

Online education and cloud office become market hotspots. The notebook computer is one of the important tools for realizing online education and cloud office due to the advantages of portability, easy carrying, internet surfing at any time and any place and the like. However, the heat dissipation of the notebook computers on the market, especially those used for several years, is not good, and the performance and the service life of the notebook computers are seriously affected by the long-term continuous use. The external radiator of the air-cooled notebook computer on the market only accelerates the heat discharge speed and does not cool the notebook computer by using a cold source. The semiconductor refrigeration technology has the advantages of no refrigerant, no moving part, no noise, quick refrigeration and the like, and can be applied to the large range of the external radiator of the notebook computer.

Chinese patent "notebook computer radiator based on semiconductor heat pump", publication No. CN209728654U, discloses that a fan at the cold end of a semiconductor heat pump adopts a convection mode to radiate heat of a notebook computer. Because the cold junction refrigeration, the temperature on its cold junction refrigeration fin surface is lower than ambient temperature, if external environment humidity is a little bit bigger, will produce the condensation on the refrigeration fin, rethread convection fan blows the vapor on the refrigeration fin to notebook computer. The long-term use of the notebook computer causes short circuit of internal accessories of the notebook computer, and the short circuit results in hardware burning, thereby causing fatal influence on the notebook computer. Chinese patent "semiconductor cooling pad for notebook computer", publication No. CN101980101A, discloses that the semiconductor cooling surface cools the hard disk and CPU area of the notebook computer by direct contact. However, the condensed water at the cold end of the semiconductor refrigeration sheet cannot be directly blown into the notebook computer in the mode, but partial water is evaporated into the notebook computer after long-time use. Condensed dew drops on the upper and lower surfaces of the cold end in the process of using refrigeration, so that inconvenience is caused. This is probably one of the reasons why the external heat sink of the notebook computer with semiconductor refrigeration is not widely popularized in the market.

The ideal working temperature of the notebook computer is 10-35 ℃, and the service life of the accessories can be influenced by too high temperature. The relative humidity is 30% -80%, and too high relative humidity can affect the performance of accessories such as a CPU (central processing unit), a display card and the like and even cause short circuit of some accessories. Therefore, the influence of environmental factors on the service life of a computer is not negligible, and the temperature and humidity environment is ensured to be moderate as much as possible.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem among the correlation technique, the utility model provides an automatic refrigeration formula notebook computer external heat radiator who dehumidifies to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

an automatic dehumidification refrigeration type notebook computer external radiator comprises a first plastic part and a second plastic part, wherein a heat conducting plate is arranged inside the upper end of the first plastic part, the upper end of the heat conducting plate is connected with a heat conducting silica gel gasket in a laminating manner, a semiconductor refrigeration piece is arranged in the middle of the lower end of the heat conducting plate, a radiator is arranged at the lower end of the semiconductor refrigeration piece, a fan is arranged below the radiator, heat insulation cotton is arranged at the upper end of the radiator, the semiconductor refrigeration piece is inserted into the middle of the heat insulation cotton, the heat insulation cotton is provided with the first plastic part connected with the semiconductor refrigeration piece, an air cavity is formed between the first plastic part and the heat conducting plate, the second plastic part is sleeved outside the first plastic part, a drainage channel is arranged between the two inner ends of the second plastic part and the first plastic part, and a drainage hole is formed in the bottom end of the drainage channel, the lower extreme of working of plastics two just is located the below of radiator is provided with the water collector, the upper end of working of plastics two is provided with groove structure, the upper end of working of plastics two just is close to the side of heat conduction silica gel gasket is provided with a plurality of temperature sensor one, the inside embedded a plurality of temperature sensor two that has of heat conduction silica gel gasket.

Further, the heat-conducting plate and the heat-conducting silica gel gasket are all provided with a plurality of ventilation grids at intervals, and the ventilation grids are provided with humidity sensors.

Furthermore, a plurality of refrigeration fins are arranged at the bottom end of the heat conducting plate, and the refrigeration fins are of a concave-convex structure.

Furthermore, a one-way valve is arranged in the middle of the drainage channel.

Furthermore, the second plastic part is fixedly installed and connected with the heat-conducting silica gel gasket, the heat-conducting plate, the semiconductor refrigeration piece, the radiator and the fan in a screw and buckle mode.

The utility model provides an automatic refrigeration formula notebook computer external heat radiator of dehumidification, beneficial effect is as follows: the utility model discloses an adopt many temperature sensor, humidity transducer technique, accurately, the all ring edge borders of intelligent control notebook computer use, the semiconductor refrigeration is cooled down to notebook computer, can realize really absorbing the heat from the notebook for notebook computer's heat-sinking capability improves, and notebook computer's inside parts operating temperature is effectively ensured, thereby has ensured notebook computer's stable performance, moves faster. The semiconductor refrigeration and dehumidification also reduce the air humidity entering the notebook computer, so that the risk of short circuit and burning of internal accessories of the notebook computer is reduced, and the service life of the notebook computer is greatly prolonged. The design of multisensor scheme, the operating condition of intelligent control regulation semiconductor refrigeration piece, also do benefit to the saving of the energy, adopt the semiconductor refrigeration module of automatic dehumidification, be applied to in notebook computer's external radiator, notebook computer's heat-sinking capability has not only been strengthened greatly, and make the air current that gets into notebook computer dry and cool, the short circuit of the inside electrical part of notebook computer has been avoided, make ageing slower, the life of extension notebook computer, and then adopt semiconductor refrigeration technique to refrigerate and the design of the two-way function of dehumidification, refrigeration function reduces the temperature of the inside work accessory of notebook computer, dehumidification function reduces the air humidity that gets into notebook computer, thereby ensure notebook computer stable performance in the use, the operation is faster, the life-span is longer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an external radiator of an automatic dehumidifying refrigeration type notebook computer according to an embodiment of the present invention;

fig. 2 is a top view of an external radiator of a refrigeration type notebook computer with automatic dehumidification according to an embodiment of the present invention.

In the figure:

1. a heat-conducting silica gel gasket; 101. a ventilation grille; 2. a heat conducting plate; 201. a refrigeration fin; 3. a semiconductor refrigeration sheet; 4. a heat sink; 5. a fan; 6. heat preservation cotton; 7. a first plastic part; 701. a drainage channel; 702. a drain hole; 8. a wind cavity; 9. a second plastic part; 901. a water pan; 902. a groove structure; 10. A one-way valve; 11. a first temperature sensor; 12. a second temperature sensor; 13. a humidity sensor.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides an automatic refrigeration formula notebook computer external heat radiator of dehumidification.

The first embodiment is as follows:

as shown in fig. 1-2, the external radiator for automatically dehumidifying refrigeration type notebook computer according to the embodiment of the present invention comprises a first plastic part 7 and a second plastic part 9, wherein a heat conducting plate 2 is arranged inside the upper end of the first plastic part 7, a heat conducting silica gel gasket 1 is connected to the upper end of the heat conducting plate 2 in a fitting manner, a semiconductor refrigerating sheet 3 is arranged in the middle of the lower end of the heat conducting plate 2, a radiator 4 is arranged at the lower end of the semiconductor refrigerating sheet 3, a fan 5 is arranged below the radiator 4, heat insulating cotton 6 is arranged at the upper end of the radiator 4, the semiconductor refrigerating sheet 3 penetrates through the middle of the heat insulating cotton 6, the first plastic part 7 connected with the semiconductor refrigerating sheet 3 is arranged on the heat insulating cotton 6, an air cavity 8 is formed between the first plastic part 7 and the heat conducting plate 2, and the second plastic part 9 is sleeved outside the first plastic part 7, a drainage channel 701 is arranged between two ends of the inside of the second plastic piece 9 and the first plastic piece 7, a drainage hole 702 is arranged at the bottom end of the drainage channel 701, a water pan 901 is arranged at the lower end of the second plastic piece 9 and below the radiator 4, a groove structure 902 is arranged at the upper end of the second plastic piece 9, a plurality of first temperature sensors 11 are arranged at the upper end of the second plastic piece 9 and on the side edge close to the heat-conducting silica gel gasket 1, and a plurality of second temperature sensors 12 are embedded in the heat-conducting silica gel gasket 1;

the heat conducting silica gel gasket 1 is attached to the heat conducting plate 2. The heat-conducting silica gel gasket 1 and the heat-conducting plate 2 are provided with spaced ventilation grids 101, and the shapes and the areas of the ventilation grids 101 are set according to the air inlet area requirements of the notebook computer. The heat-conducting silica gel gasket 1 is positioned on the highest surface in the whole module so as to be better attached to the base of the notebook computer. The binding surface of the heat conducting plate 2 and the heat conducting silica gel gasket is a plane, and the reverse surface of the heat conducting plate is a concave-convex surface with a refrigerating fin 201, so that the air flow passing through the ventilation grille and the refrigerating small fins of the heat conducting plate 2 can fully exchange heat, and the temperature and the humidity of the air flow can be reduced. The reverse side of the heat-conducting plate 2 can also be plane. The heat conducting plate 2 is connected with the semiconductor refrigerating plate 3 below through heat conducting silicone grease or heat conducting silicone. The number of the semiconductor refrigerating pieces 3 is not less than one. The hot end of the semiconductor refrigeration piece 3 is connected with a radiator 4 with fins, and the gap thermal resistance between the semiconductor refrigeration piece 3 and the radiator 4 is also reduced by filling heat-conducting silicone grease or heat-conducting silicone rubber. A fan 5 is arranged below the radiator 4, when the semiconductor refrigerating sheet 3 works, heat generated by the hot end of the semiconductor refrigerating sheet is transferred to the radiator 4, and forced convection is carried out through the fan 5 to bring the heat to the environment.

In order to prevent the heat of the radiator 4 from being transferred to the cold-end heat-conducting plate of the semiconductor refrigeration sheet 3, a layer of heat-insulating cotton 6 covers the radiator 4, and plays a role in heat insulation. A plastic piece I7 is arranged above the heat preservation cotton 6, and the plastic piece I7 is used for fixing the semiconductor refrigeration piece 3 without shaking. The first plastic part 7, the heat conducting plate 2 and the heat conducting silica gel gasket 1 form an air cavity 8. When the heat-conducting silica gel gasket 1 is tightly attached to the bottom of the notebook computer, the notebook computer can suck air through the ventilation grid 101 to dissipate heat of the notebook computer due to the ventilation grid 101 arranged on the heat-conducting silica gel gasket. The air cavity 8 is used for providing a pretreatment cavity for sucking air for the notebook computer, and the outside air enters the air cavity 8 and can carry out heat convection with the heat conducting plate to reduce the temperature. In addition, the humidity in the air is dehumidified by the cooling fins 201 on the heat conducting plate 2, and the humidity is also reduced before entering the notebook computer, so that the air is dried. The surface can produce the condensation after the refrigeration fin 201 on the heat-conducting plate 2 dehumidifies the air, just drips to working of plastics 7 when condensation drop is big enough, and one side or the design of multiple sides of working of plastics 7 have the drainage channel 701 of being no less than one, and 7 surface designs of working of plastics have inclination or drainage route to let the condensation water that drips from refrigeration fin 201 flow to drainage channel 701 smoothly. The second outer frame plastic part 9 firmly installs the heat-conducting silica gel gasket 1, the heat-conducting plate 2, the semiconductor refrigeration piece 3, the radiator 4, the fan 5 and the like through screws, buckles and the like. One or more small water receiving trays 901 are designed on the outer frame plastic part two 9, and the water receiving trays 901 can be placed below the radiator 4 and tightly attached to the radiator 4. Or on the path of the air outlet of the radiator. The upper side of the water receiving tray 901 faces the water discharge hole 702 of the water discharge passage 701. The condensation water that falls from the cooling fin 201 drips onto the first plastic member 7, flows into the drainage channel 701 through the drainage path, and then flows into the water pan 901. The condensed water in the water pan 901 is quickly evaporated by the high temperature around the radiator 4 and the forced convection air-out action of the fan 5. In addition, the temperature of the radiator 4 can be reduced by the heat absorbed by the evaporation of the condensed water, and the semiconductor refrigerating sheet 3 is favorable for heat dissipation. The top of the second outer frame plastic part 9 is provided with a circle of groove structure 902, and the highest point of the groove structure 902 is lower than the heat-conducting silica gel gasket 1, so that the heat-conducting silica gel gasket 1 is tightly attached to the bottom of the notebook computer. The design of groove structure 902 has a drain hole 702 that is no less than one, if heat conduction silica gel gasket 1 is not good with the laminating of notebook computer bottom, forms the condensation water pearl on heat conduction silica gel gasket 1 surface or periphery, just in time flows into on the working of plastics 7 through drain hole 702 and gets into water collector 901 and evaporate this moment. In order to prevent the hot air of the fan 5 from being blown into the air cavity 8 through the drainage channel 701 to affect the heat dissipation effect of the notebook computer, a one-way valve 10 may be designed in the drainage channel 701, and condensed water may flow into the water receiving tray 901 but the hot air of the fan 5 may not be blown into the air cavity 8 by using the gravity.

Example two:

as shown in fig. 1-2, a plurality of ventilation grids are arranged on the heat conducting plate 2 and the heat conducting silica gel gasket 1 at intervals, and a humidity sensor 13 is arranged on each ventilation grid. The bottom of heat-conducting plate 2 is provided with a plurality of refrigeration fins 201, refrigeration fin 201 is concave-convex surface structure. The middle part of the drainage channel 701 is provided with a one-way valve 10. The second plastic part 9 is fixedly installed and connected with the heat-conducting silica gel gasket 1, the heat-conducting plate 2, the semiconductor refrigeration sheet 3, the radiator 4 and the fan 5 in a screw and buckle mode.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

In practical application, the semiconductor refrigeration sheet 3 transmits cold energy to the connected heat conduction plate 2 and the heat conduction silica gel gasket 1, the temperature of the heat conduction plate 2 and the heat conduction silica gel gasket 1 is reduced, the semiconductor refrigeration sheet 2 is tightly attached to a notebook computer to absorb the bottom heat of the notebook computer, so that the heat dissipation capacity of the notebook computer is greatly improved, the semiconductor refrigeration sheet 3 transmits the cold energy to the connected heat conduction plate 2, the temperature of the refrigeration fins 201 on the heat conduction plate 2 is reduced, the refrigeration fins are subjected to heat exchange with passing air, water vapor in the air is absorbed on the refrigeration fins 201, so that the air humidity entering the bottom of the notebook computer is greatly reduced, the refrigeration fins 201 on the heat conduction plate 2 have a dehumidification effect on the notebook computer, the refrigeration fins 201 on the heat conduction plate 2 absorb water vapor condensation in the air, the condensation water conduction channel and the water receiving tray 901 are designed to automatically collect the condensation water through the water conduction path and automatically evaporate the condensation water, so that the dehumidification effect can be circularly repeated, at the top of the second outer frame plastic part 9, a first temperature sensor 11 with at least one is designed beside the heat-conducting silica gel gasket 1, or a first temperature sensor 11 is placed at the bottom corresponding to the CPU and the hard disk, if the corresponding region is at the position of the heat-conducting silica gel gasket 1, the design is kept away, the first temperature sensor 11 is used for monitoring the temperature at the bottom of the notebook computer, and the second temperature sensor 12 with at least one is embedded in the heat-conducting silica gel gasket 1 and used for controlling the refrigerating working temperature of the semiconductor. Be equipped with one or more humidity transducer 13 in the ventilation grid of heat conduction silica gel gasket 1 for detect and feed back the air humidity who passes through, temperature sensor and humidity transducer all connect on the control panel, and the control panel is connected with the power port, and the work is given semiconductor refrigeration piece to the electricity. According to the first temperature sensor 11, the radar monitoring of the humidity sensor and the second temperature sensor 12, the refrigeration and dehumidification degrees of semiconductor refrigeration are automatically and accurately adjusted, and energy consumption of the semiconductor refrigeration module is saved. The temperature detected by the temperature sensor I11 and the humidity detected by the humidity sensor 13 are direct reactions of external atmospheric environment conditions and the use condition of the notebook computer, so that the temperature and humidity environment for using the notebook computer can be intelligently and accurately improved.

To sum up, with the help of the above technical scheme of the utility model, through adopting many temperature sensor, humidity transducer 13 technique, accurately, the all ring edge borders of intelligent control notebook computer use, semiconductor refrigeration is cooled down the notebook computer, can realize really absorbing the heat from the notebook for notebook computer's heat-sinking capability improves, and notebook computer's inside parts operating temperature is effectively ensured, thereby has ensured notebook computer's stable performance, and the operation is faster. The semiconductor refrigeration and dehumidification also reduce the air humidity entering the notebook computer, so that the risk of short circuit and burning of internal accessories of the notebook computer is reduced, and the service life of the notebook computer is greatly prolonged. The design of multisensor scheme, the operating condition of intelligent control regulation semiconductor refrigeration piece 3, also do benefit to the saving of the energy, adopt the semiconductor refrigeration module of automatic dehumidification, be applied to in notebook computer's external radiator 4, notebook computer's heat-sinking capability has not only been strengthened greatly, and make the air current that gets into notebook computer dry and cool, the short circuit of the inside electrical part of notebook computer has been avoided, make ageing slower, the life of extension notebook computer, and then adopt semiconductor refrigeration technique to refrigerate and the design of dehumidification two-way function, refrigeration function reduces the temperature of the inside work accessory of notebook computer, dehumidification function reduces the air humidity that gets into notebook computer, thereby ensure that notebook computer stable performance in the use, the operation is faster, the life-span is longer.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The external radiator of the automatic dehumidification refrigeration type notebook computer is characterized by comprising a first plastic part (7) and a second plastic part (9), wherein a heat-conducting plate (2) is arranged inside the upper end of the first plastic part (7), a heat-conducting silica gel gasket (1) is attached to the upper end of the heat-conducting plate (2), a semiconductor refrigeration piece (3) is arranged in the middle of the lower end of the heat-conducting plate (2), a radiator (4) is arranged at the lower end of the semiconductor refrigeration piece (3), a fan (5) is arranged below the radiator (4), heat-insulating cotton (6) is arranged at the upper end of the radiator (4), the semiconductor refrigeration piece (3) is inserted into the middle of the heat-insulating cotton (6), the first plastic part (7) connected with the semiconductor refrigeration piece (3) is arranged on the heat-insulating cotton (6), and an air cavity (8) is formed between the first plastic part (7) and the heat-conducting plate (2), the outside cover of working of plastics one (7) is equipped with working of plastics two (9), the inside both ends of working of plastics two (9) with be provided with drainage channel (701) between working of plastics one (7), the bottom of drainage channel (701) is provided with wash port (702), the lower extreme of working of plastics two (9) just is located the below of radiator (4) is provided with water collector (901), the upper end of working of plastics two (9) is provided with groove structure (902), the upper end of working of plastics two (9) just is close to the side of heat conduction silica gel gasket (1) is provided with a plurality of temperature sensor one (11), the inside of heat conduction silica gel gasket (1) is embedded to have a plurality of temperature sensor two (12).

2. The external radiator of the automatic dehumidification refrigeration type notebook computer according to claim 1, wherein a plurality of ventilation grilles (101) are arranged on the heat conducting plate (2) and the heat conducting silica gel gasket (1) at intervals, and a humidity sensor (13) is arranged on the ventilation grilles (101).

3. The external radiator for the automatic dehumidification refrigeration type notebook computer as recited in claim 1, wherein a plurality of refrigeration fins (201) are disposed at the bottom end of said heat conducting plate (2), and said refrigeration fins (201) are of a concave-convex structure.

4. The external radiator for the automatic dehumidification refrigeration type notebook computer according to claim 1, wherein a one-way valve (10) is arranged in the middle of the drainage channel (701).

5. The automatic dehumidification refrigeration type external radiator for the notebook computer according to claim 1, wherein the second plastic part (9) is fixedly installed and connected with the heat-conducting silica gel gasket (1), the heat-conducting plate (2), the semiconductor refrigeration piece (3), the radiator (4) and the fan (5) in a screw and buckle mode.