CN113867457B - Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method - Google Patents
Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method Download PDFInfo
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- CN113867457B CN113867457B CN202111178602.2A CN202111178602A CN113867457B CN 113867457 B CN113867457 B CN 113867457B CN 202111178602 A CN202111178602 A CN 202111178602A CN 113867457 B CN113867457 B CN 113867457B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
Abstract
The invention belongs to the field of intelligent wearing equipment, and discloses a cover body structure for intelligently regulating and controlling temperature and humidity, which comprises a cover body and a controller, wherein a temperature sensor and a humidity sensor are arranged in the cover body, the cover body further comprises a first semiconductor refrigerating sheet and a second semiconductor refrigerating sheet, the cold end of the first semiconductor refrigerating sheet is positioned in the cover body, the hot end of the first semiconductor refrigerating sheet is positioned outside the cover body, the hot end of the second semiconductor refrigerating sheet is positioned in the cover body, the cold end of the second semiconductor refrigerating sheet is positioned outside the cover body, and the hot end of the first semiconductor refrigerating sheet and the cold end of the second semiconductor refrigerating sheet exchange heat through a temperature equalizing plate. This structure adopts two semiconductor refrigeration pieces to carry out work, and according to the work of humiture decision two refrigeration pieces, multiple functions such as realization intensification, cooling, intensification dehumidification, cooling dehumidification are realized. Meanwhile, the invention also discloses a temperature and humidity adjusting method based on the structure.
Description
Technical Field
The invention relates to the field of intelligent wearable equipment, in particular to a cover body structure for intelligently regulating and controlling temperature and humidity and a temperature and humidity regulating and controlling method.
Background
CN202011020096.X discloses a device for solving the problem of overhigh temperature and humidity inside protective clothing, which comprises a heat dissipation block fixedly connected to the side wall of a clothing body, wherein the side wall of the heat dissipation block is provided with a circular groove, the inner wall of the circular groove is rotatably connected with a rotating shaft, the side wall of the rotating shaft is fixedly connected with a plurality of impellers, a heat absorption cavity is formed in the heat dissipation block, and the inner wall of the heat absorption cavity is hermetically and slidably connected with a sliding plug; also provides a method for solving the problem of overhigh temperature and humidity inside the protective clothing, which comprises the following steps; s1, the radiating block is pasted on the side wall of the clothes body through the magic tape. When the temperature is too high in the protective clothing, the heat absorption temperature of the evaporating liquid rises, the sliding plug is pushed to slide on the inner wall of the heat absorption cavity, gas in the heat absorption cavity is extruded into the driving cavity through the air inlet pipe, the sliding plate is pushed to slide, the toothed plate drives the gear to rotate, the impeller is driven to rotate in the forward direction, the heat inside the protective clothing is discharged through the exhaust pipe, the protective clothing is cooled, and the cooling effect is good.
The problem that this scheme exists is, carries out temperature humidity control through adopting outer formula mode of arranging, and it has just lost sealed basic principle itself.
CN202010232408.7 discloses a temperature and humidity control system in protective clothing, which relates to the field of protective medical instruments and comprises an air distribution device, an air driving device and a dehumidifying device, wherein the air distribution device is used for drawing and exhausting air flow in the protective clothing and is connected with the dehumidifying device through a first circulating pipe and a second circulating pipe; the dehumidifying device is used for condensing water vapor in the air flow and sending the dried air flow back to the air distribution device; the air driving device is used for enabling the air flow to flow between the air distribution device and the dehumidifying device. The dehumidifying device with the semiconductor refrigerating sheet can remove moisture in the protective clothing and the goggles, so that the moisture is prevented from affecting the operation of medical workers, and the comfort level of the medical workers during working is improved.
According to the scheme, the semiconductor refrigerating sheet is adopted for dehumidification, but in the protection equipment, the power supply cannot be carried too large, meanwhile, the refrigerating efficiency of the semiconductor refrigerating sheet is low, and the endurance time is short.
CN202010291110.3 discloses a similar solution to CN202010232408.7, which uses semiconductor refrigeration sheets for dehumidification. The structure is complicated, and the power consumption is larger.
Therefore, the technical problem solved by the scheme is as follows: the temperature and humidity adjustment can be carried out on the long-term endurance of application scenes similar to protective clothing under the condition that the structure is concise and the energy-saving performance is simultaneously met.
Disclosure of Invention
The invention aims to provide a cover body structure for intelligently regulating and controlling temperature and humidity, which adopts two semiconductor refrigerating sheets to work, determines the working states of the two refrigerating sheets according to the temperature and humidity, and realizes multiple functions of temperature rise, temperature reduction, temperature rise dehumidification, temperature reduction dehumidification and the like. Meanwhile, the invention also discloses a temperature and humidity adjusting method based on the structure.
In order to achieve the purpose, the invention provides the following technical scheme: a cover body structure for intelligently regulating and controlling temperature and humidity comprises a cover body, wherein a temperature sensor and a humidity sensor are arranged in the cover body and connected with a built-in or external controller, the structure further comprises a first semiconductor refrigerating sheet and a second semiconductor refrigerating sheet, the cold end of the first semiconductor refrigerating sheet is positioned in the cover body, the hot end of the first semiconductor refrigerating sheet is positioned outside the cover body, the hot end of the second semiconductor refrigerating sheet is positioned in the cover body, the cold end of the second semiconductor refrigerating sheet is positioned outside the cover body, and the hot end of the first semiconductor refrigerating sheet and the cold end of the second semiconductor refrigerating sheet exchange heat through a temperature equalizing plate or a heat conducting pipe;
the cold end of the first semiconductor is provided with a first fluid cavity, the hot end of the second semiconductor is provided with a second fluid cavity, and the first fluid cavity and the second fluid cavity are communicated; a first forced convection device for enabling the airflow to flow from the first fluid cavity to the second fluid cavity is arranged in the first fluid cavity or the second fluid cavity;
the controller is electrically connected with the temperature sensor, the humidity sensor, the first semiconductor refrigerating piece and the second semiconductor refrigerating piece.
In the cover body structure for intelligently regulating and controlling the temperature and the humidity, a radiator and second forced convection equipment are arranged on the outer side of the temperature equalizing plate or the heat conducting pipe.
In the cover body structure for intelligently regulating and controlling the temperature and the humidity, the first fluid cavity extends from bottom to top, and the upper part of the first fluid cavity is connected with the inlet of the second fluid cavity; the bottom of the first fluid cavity is connected with a liquid collector or a liquid discharge pipe; the liquid discharge pipe extends to the outside of the cover body.
In the cover body structure for intelligently regulating and controlling temperature and humidity, the first fluid cavity and the second fluid cavity are internally provided with fins extending from bottom to top.
In the cover body structure for intelligently regulating and controlling temperature and humidity, the air inlet of the first fluid cavity is positioned at the lower part of the first fluid cavity.
In the above-mentioned cover body structure of intelligent control humiture, the cover body outside is connected with the power that the detachable is used for controller, temperature sensor, humidity transducer, first semiconductor refrigeration piece and the power supply of second semiconductor refrigeration piece power supply.
In the cover body structure for intelligently regulating and controlling the temperature and the humidity, the cover body is one of protective clothing, tents and space suits.
Meanwhile, the invention also discloses a temperature and humidity control method of the cover body structure, which comprises the following steps:
step 1: acquiring the temperature and the humidity in the cover body through a temperature sensor and a humidity sensor;
step 2: if the temperature is within a first preset temperature range, the first semiconductor refrigerating sheet works, and the second semiconductor refrigerating sheet does not work;
if the temperature is within a second preset temperature range, the second semiconductor refrigerating sheet is reversely connected, and the two semiconductor refrigerating sheets refrigerate on one surface in the cover body at the same time;
the first preset temperature range is smaller than the second preset temperature range;
and 3, step 3: if the humidity exceeds a preset value, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet work; the temperature is adjusted by adjusting the power difference of the two refrigerating sheets, so that the temperature of the air flow at the outlet of the second fluid cavity is in a preset value range;
and 4, step 4: if the temperature is in a third preset temperature range and the humidity does not exceed a preset value, the first semiconductor refrigerating sheet does not work and the second semiconductor refrigerating sheet works;
if the temperature is within the fourth preset temperature range, the first semiconductor refrigerating sheet is reversely connected, and the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet simultaneously heat one surface in the cover body;
the third preset temperature range is smaller than the first preset temperature range, and the fourth preset temperature range is smaller than the third preset temperature range;
in steps 2 and 4, the second forced convection equipment works; in step 3, the second forced convection apparatus is operated intermittently as required to control the temperature.
Compared with the prior art, the invention has the beneficial effects that:
the invention adopts the combination of the first semiconductor refrigeration piece and the second semiconductor refrigeration piece, under the condition of exceeding the humidity, the working states of the two refrigeration pieces can be flexibly configured, namely, when the humidity exceeds the standard and the temperature is too high, the first semiconductor refrigeration piece works, when the temperature does not exceed the standard but the humidity exceeds the standard, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece both work, at the moment, the temperature equalizing plate plays a key role, the temperature equalizing plate guides the heat of the hot end of the first refrigeration piece to the cold end of the second semiconductor refrigeration piece, and as is well known, the power consumption can be obviously influenced by the temperature difference between the temperature of the hot end and the temperature of the cold end, so the dehumidification power consumption can be obviously reduced under the condition, and the endurance time of temperature and humidity regulation is improved.
The scheme has simple structure and lasting endurance.
Drawings
FIG. 1 is a front view of embodiment 1 of the present invention;
FIG. 2 is an enlarged view in partial section of embodiment 1 of the present invention;
FIG. 3 is a control block diagram of embodiment 1 of the present invention;
fig. 4 is a control schematic diagram of embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-4, a cover structure for intelligently regulating and controlling temperature and humidity comprises a cover 1, wherein a temperature sensor 2, a humidity sensor 3 and a controller 4 are arranged in the cover 1, the controller 4 can also be arranged outside the cover, and the cover structure further comprises a first semiconductor refrigeration piece 5 and a second semiconductor refrigeration piece 6, the cold end of the first semiconductor refrigeration sheet 5 is positioned in the cover body 1, the hot end of the first semiconductor refrigeration sheet is positioned outside the cover body 1, the hot end of the second semiconductor refrigeration sheet 6 is positioned in the cover body 1, the cold end of the second semiconductor refrigeration sheet is positioned outside the cover body 1, the hot end of the first semiconductor chilling plate 5 and the cold end of the second semiconductor chilling plate 6 exchange heat through a temperature-equalizing plate 7 (the temperature-equalizing plate 7 has been described in a large amount in the applicant's prior application, such as the temperature-equalizing plate 7 recorded in ZL202011446569.2, which contains a plurality of chambers, each of which has a capillary structure and is filled with a superconducting phase-change material);
it should be noted that two windows need to be formed in the cover body 1 in advance, and the first semiconductor chilling plate 5 and the second semiconductor chilling plate 6 are fixed on the windows and sealed.
The cold end of the first semiconductor is connected with a first fluid cavity 8, the hot end of the second semiconductor is connected with a second fluid cavity 9, and the first fluid cavity 8 is communicated with the second fluid cavity 9; a first forced convection device 10 for enabling the airflow to flow from the first fluid cavity 8 to the second fluid cavity 9 is arranged in the first fluid cavity 8 or the second fluid cavity 9;
the controller 4 is electrically connected with the temperature sensor 2, the humidity sensor 3, the first semiconductor refrigeration piece 5, the second semiconductor refrigeration piece 6 and the first forced convection device 10.
The working process is as follows:
step 1: acquiring the temperature and the humidity in the cover body through a temperature sensor and a humidity sensor;
step 2: if the temperature is within a first preset temperature range, the first semiconductor refrigerating sheet works, and the second semiconductor refrigerating sheet does not work; namely, the cold end of the first semiconductor refrigerating sheet refrigerates and the hot end heats; this case can be referred to as D in fig. 4;
if the temperature is in the second preset temperature range, the second semiconductor refrigerating sheet is reversely connected, and the two semiconductor refrigerating sheets refrigerate on one surface in the cover body at the same time, which can refer to C in fig. 4; the reverse connection refers to that the current direction of the second semiconductor refrigerating sheet is adjusted reversely, so that the original positive electrode is changed into the negative electrode, the original negative electrode is changed into the positive electrode, under the condition, the hot end of the second semiconductor refrigerating sheet refrigerates, and the cold end heats;
the first preset temperature range is smaller than the second preset temperature range;
and step 3: if the humidity exceeds the preset value, the temperature is below the second preset temperature range and above the fourth preset temperature range, the first semiconductor chilling plate and the second semiconductor chilling plate both work, refer to B in fig. 4; the temperature is adjusted by adjusting the power difference of the two refrigerating sheets, so that the temperature of the air flow at the outlet of the second fluid cavity is in a preset value range;
in this case, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are both used for heating at the hot end and cooling at the cold end; the heat of the hot end of the first semiconductor refrigerating sheet is led into the cold end of the second semiconductor refrigerating sheet, so that the refrigerating and heating efficiencies of the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet are obviously improved;
if the humidity exceeds the preset value and the temperature is within the second preset temperature range, referring to C in FIG. 4, performing step 2, and after the temperature is controlled to be within the first preset temperature range, performing step 3, referring to B in FIG. 4;
if the humidity exceeds the preset value and the temperature is within the fourth preset temperature range, referring to a in fig. 4, performing step 4, and if the temperature is controlled to be within the third preset temperature range, referring to B in fig. 4, performing step 3;
and 4, step 4: if the temperature is in a third preset temperature range and the humidity does not exceed a preset value, the first semiconductor refrigerating sheet does not work and the second semiconductor refrigerating sheet works; refer to F in fig. 4;
if the temperature is within the fourth preset temperature range, the first semiconductor refrigerating sheet is reversely connected, and the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet simultaneously heat one surface in the cover body; refer to a in fig. 4;
in fig. 4, E represents that the first semiconductor chilling plate and the second semiconductor chilling plate do not work, and the whole device is in a stop state;
the third preset temperature range is smaller than the first preset temperature range, and the fourth preset temperature range is smaller than the third preset temperature range;
in steps 2 and 4, the second forced convection equipment works; in step 3, the second forced convection apparatus is operated intermittently as required to control the temperature.
For example, the first preset temperature range is 35-40 ℃, and the second preset temperature range is above 40 ℃; the third preset temperature range is 20-30 ℃, and the fourth preset temperature range is below 20 ℃;
the first to fourth preset temperature ranges can be flexibly set according to actual conditions. For example, the first preset temperature range is 40-45 ℃, and the second preset temperature range is above 45 ℃; the third preset temperature range is 15-30 ℃, and the fourth preset temperature range is below 15 ℃;
preferably, a second forced convection device 11 is arranged outside the temperature equalizing plate 7. The second forced convection apparatus 11 is required to be operated in both step 2 and step 4, and is not operated in step 3 or intermittently operated as required. The second forced convection apparatus 11 needs to be electrically connected with the controller 4.
The first forced convection device 10 and the second forced convection device 11 are fans, the second forced convection device 11 is attached to the temperature equalizing plate 7 by heat conducting glue, and the temperature equalizing plate 7 and the second forced convection device 11 are provided with heat sinks 15, which are preferably fin type heat sinks, and other types of heat sinks are not excluded.
Preferably, the first fluid chamber 8 extends from bottom to top, and the upper part of the first fluid chamber 8 is connected with the inlet of the second fluid chamber 9; the bottom of the first fluid chamber 8 is connected with a liquid collector 14 or a liquid discharge pipe; the liquid discharge pipe extends out of the cover body 1, fins 12 extending from bottom to top are arranged in the first fluid cavity 8 and the second fluid cavity 9, and the air inlet of the first fluid cavity 8 is positioned at the lower part of the first fluid cavity 8.
In view of the fact that many protective garments are disposable, it is preferred to use a liquid collector, such as a pouch. Liquid drain tubes may be considered for multiple use wearable devices. The fins 12 are primarily used to increase the condensation and heating area and to direct the condensate to a liquid collector or liquid drain.
In this embodiment, the cover body 1 is connected with a detachable power supply 13 for supplying power to the controller 4, the temperature sensor 2, the humidity sensor 3, the first semiconductor refrigeration piece 5 and the second semiconductor refrigeration piece 6 on the outer side, and the cover body 1 is one of a protective clothing, a tent and an aerospace clothing.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. A temperature and humidity control method of a cover body structure for intelligently controlling temperature and humidity relates to a cover body and a controller, wherein a temperature sensor and a humidity sensor are arranged in the cover body, and the temperature and humidity control method is characterized by further comprising a first semiconductor refrigeration piece and a second semiconductor refrigeration piece, wherein the cold end of the first semiconductor refrigeration piece is positioned in the cover body, the hot end of the first semiconductor refrigeration piece is positioned outside the cover body, the hot end of the second semiconductor refrigeration piece is positioned in the cover body, the cold end of the second semiconductor refrigeration piece is positioned outside the cover body, and the hot end of the first semiconductor refrigeration piece and the cold end of the second semiconductor refrigeration piece exchange heat through a temperature equalizing plate or a heat conducting pipe;
the cold end of the first semiconductor is provided with a first fluid cavity, the hot end of the second semiconductor is provided with a second fluid cavity, and the first fluid cavity and the second fluid cavity are communicated; a first forced convection device for enabling the airflow to flow from the first fluid cavity to the second fluid cavity is arranged in the first fluid cavity or the second fluid cavity;
the controller is electrically connected with the temperature sensor, the humidity sensor, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet;
the temperature and humidity control method of the cover body structure comprises the following steps:
step 1: acquiring the temperature and the humidity in the cover body through a temperature sensor and a humidity sensor;
step 2: if the temperature is within a first preset temperature range, the first semiconductor refrigerating sheet works, and the second semiconductor refrigerating sheet does not work;
if the temperature is in a second preset temperature range, the second semiconductor refrigerating sheet is reversely connected, and the two semiconductor refrigerating sheets refrigerate on one surface in the cover body at the same time;
the first preset temperature range is smaller than the second preset temperature range;
and step 3: if the humidity exceeds a preset value, the temperature is below a second preset temperature range and above a fourth preset temperature range, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet work; the temperature is adjusted by adjusting the power difference of the two refrigerating sheets, so that the temperature of the air flow at the outlet of the second fluid cavity is in a preset value range;
if the humidity exceeds the preset value and the temperature is within the second preset temperature range, performing step 2, and performing step 3 when the temperature is controlled to be within the first preset temperature range;
if the humidity exceeds the preset value and the temperature is within the fourth preset temperature range, performing step 4, and when the temperature is controlled to be within the third preset temperature range, performing step 3;
and 4, step 4: if the temperature is in a third preset temperature range and the humidity does not exceed a preset value, the first semiconductor refrigerating sheet does not work and the second semiconductor refrigerating sheet works;
if the temperature is within the fourth preset temperature range, the first semiconductor refrigerating sheet is reversely connected, and the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet simultaneously heat one surface in the cover body;
the third preset temperature range is smaller than the first preset temperature range, and the fourth preset temperature range is smaller than the third preset temperature range;
in steps 2 and 4, the second forced convection equipment works; in step 3, the second forced convection apparatus is operated intermittently as required to control the temperature.
2. The temperature and humidity control method of the cover body structure for intelligently controlling temperature and humidity according to claim 1, wherein a cooling fin and a second forced convection device are arranged outside the temperature equalizing plate.
3. The temperature and humidity control method of the cover structure for intelligently controlling temperature and humidity according to claim 1, wherein the first fluid chamber extends from bottom to top, and an upper portion of the first fluid chamber is connected to an inlet of the second fluid chamber; the bottom of the first fluid cavity is connected with a liquid collector or a liquid discharge pipe; the liquid discharge pipe extends to the outside of the cover body.
4. The temperature and humidity regulating method of the cover structure for intelligently regulating temperature and humidity according to claim 3, wherein fins extending from bottom to top are arranged in the first fluid cavity and the second fluid cavity.
5. The temperature and humidity control method of the cover structure for intelligently controlling temperature and humidity according to claim 3, wherein the air inlet of the first fluid chamber is located at the lower portion of the first fluid chamber.
6. The temperature and humidity control method of the cover structure for intelligently controlling temperature and humidity according to claim 1, wherein a detachable power supply for supplying power to the controller, the temperature sensor, the humidity sensor, the first semiconductor refrigeration piece and the second semiconductor refrigeration piece is connected to an outer side of the cover.
7. The method for regulating temperature and humidity of a cover body structure according to claim 1, wherein the cover body is one of a protective clothing, a tent, and an aerospace wear.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111178602.2A CN113867457B (en) | 2021-10-10 | 2021-10-10 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
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| CN202111178602.2A CN113867457B (en) | 2021-10-10 | 2021-10-10 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401507A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
| CN102738718A (en) * | 2012-06-29 | 2012-10-17 | 西北工业大学 | Cooling type dehumidifier for electric cabinet |
| CN205265052U (en) * | 2015-12-03 | 2016-05-25 | 国网冀北电力有限公司秦皇岛供电公司 | Semiconductor dehumidifier |
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
| CN208318348U (en) * | 2018-01-12 | 2019-01-04 | 成都医学院 | A kind of comfort type operating coat |
| CN208387517U (en) * | 2018-07-02 | 2019-01-18 | 周口师范学院 | A kind of wheat pollination incubator |
| CN209672704U (en) * | 2019-03-19 | 2019-11-22 | 佛山市飞成金属制品有限公司 | A kind of food fresh-keeping device |
| GB201917331D0 (en) * | 2019-11-28 | 2020-01-15 | Prevayl Ltd | Semiconductor package, article and method |
| CN210532556U (en) * | 2019-06-03 | 2020-05-15 | 福州亿得隆电气技术有限公司 | Low-temperature environment dehumidifier based on frosting principle |
| CN112566466A (en) * | 2020-12-11 | 2021-03-26 | 佛山市飞成金属制品有限公司 | Machining method of heat dissipation structure |
| CN112652969A (en) * | 2020-12-23 | 2021-04-13 | 常州长创力智能科技有限公司 | Miniature intelligent dehumidifying device and control method thereof |
| CN213814588U (en) * | 2021-01-15 | 2021-07-27 | 合肥小冰制冷科技有限公司 | Automatic external radiator of refrigeration formula notebook computer of dehumidification |
| CN113243584A (en) * | 2020-02-12 | 2021-08-13 | 武汉益永康医疗科技有限公司 | Temperature and humidity control system in protective clothing |
| CN214547340U (en) * | 2021-02-03 | 2021-11-02 | 新疆大学 | Detachable semiconductor refrigeration air conditioner device of medical protective clothing |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6489793B2 (en) * | 1996-10-21 | 2002-12-03 | Delta Design, Inc. | Temperature control of electronic devices using power following feedback |
| JP2002083756A (en) * | 2000-09-06 | 2002-03-22 | Canon Inc | Apparatus for adjusting substrate temperature |
-
2021
- 2021-10-10 CN CN202111178602.2A patent/CN113867457B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401507A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
| CN102738718A (en) * | 2012-06-29 | 2012-10-17 | 西北工业大学 | Cooling type dehumidifier for electric cabinet |
| CN205265052U (en) * | 2015-12-03 | 2016-05-25 | 国网冀北电力有限公司秦皇岛供电公司 | Semiconductor dehumidifier |
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
| CN208318348U (en) * | 2018-01-12 | 2019-01-04 | 成都医学院 | A kind of comfort type operating coat |
| CN208387517U (en) * | 2018-07-02 | 2019-01-18 | 周口师范学院 | A kind of wheat pollination incubator |
| CN209672704U (en) * | 2019-03-19 | 2019-11-22 | 佛山市飞成金属制品有限公司 | A kind of food fresh-keeping device |
| CN210532556U (en) * | 2019-06-03 | 2020-05-15 | 福州亿得隆电气技术有限公司 | Low-temperature environment dehumidifier based on frosting principle |
| GB201917331D0 (en) * | 2019-11-28 | 2020-01-15 | Prevayl Ltd | Semiconductor package, article and method |
| CN113243584A (en) * | 2020-02-12 | 2021-08-13 | 武汉益永康医疗科技有限公司 | Temperature and humidity control system in protective clothing |
| CN112566466A (en) * | 2020-12-11 | 2021-03-26 | 佛山市飞成金属制品有限公司 | Machining method of heat dissipation structure |
| CN112652969A (en) * | 2020-12-23 | 2021-04-13 | 常州长创力智能科技有限公司 | Miniature intelligent dehumidifying device and control method thereof |
| CN213814588U (en) * | 2021-01-15 | 2021-07-27 | 合肥小冰制冷科技有限公司 | Automatic external radiator of refrigeration formula notebook computer of dehumidification |
| CN214547340U (en) * | 2021-02-03 | 2021-11-02 | 新疆大学 | Detachable semiconductor refrigeration air conditioner device of medical protective clothing |
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|---|---|
| CN113867457A (en) | 2021-12-31 |
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