CN210532556U - Low-temperature environment dehumidifier based on frosting principle - Google Patents
Low-temperature environment dehumidifier based on frosting principle Download PDFInfo
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- CN210532556U CN210532556U CN201920824193.0U CN201920824193U CN210532556U CN 210532556 U CN210532556 U CN 210532556U CN 201920824193 U CN201920824193 U CN 201920824193U CN 210532556 U CN210532556 U CN 210532556U
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Abstract
The utility model relates to a low temperature environment dehumidifier based on frosting principle, which comprises a first semiconductor refrigeration piece, a second semiconductor refrigeration piece, a first refrigeration control circuit, a second refrigeration control circuit, a main control chip, a driving motor, a motor driving circuit, a rotating shaft, a condensation piece and a heat insulation layer; the number of the condensation sheets is four, two condensation sheets are connected through the heat insulation layer to form a first dehumidification sheet, and the other two condensation sheets are connected through the heat insulation layer to form a second dehumidification sheet; the centers of the first dehumidification sheet and the second dehumidification sheet are in transmission connection with a driving motor through a rotating shaft; the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are arranged between the first dehumidification piece and the second dehumidification piece, and are separated through a heat insulation layer. The power consumption is low, higher waste heat is avoided, the cost is saved, and the dehumidification and defrosting treatment is simultaneously carried out, so that the dehumidification effect is good.
Description
Technical Field
The utility model relates to a dehumidifier technical field, in particular to low temperature environment dehumidifier based on frosting principle.
Background
Dehumidifiers, also known as dehumidifiers, dryers, dehumidifiers, include rotary dehumidifiers and cooling dehumidifiers. The core component of the rotary dehumidifier is a dehumidifying rotary wheel which rotates at 8-18 revolutions per hour and is densely distributed with honeycomb holes, when moist processing air enters a processing area, moisture in the air is adsorbed by the dehumidifying rotary wheel to become dry air, and the dry air is delivered to a place needing drying or provides gas for a production process through a processing fan. The desiccant rotor gradually loses its moisture absorption capacity with the increase of absorbed moisture during the moisture absorption process, and the rotor is regenerated to maintain a constant moisture absorption capacity. The runner which tends to be saturated is slowly transferred into a regeneration area under the drive of the transmission motor for regeneration and reduction, the regeneration air which is heated to 100-14CTC enters the regeneration area in the direction opposite to the processing air, and the moisture in the runner is desorbed and is taken away by the regeneration air and discharged outdoors. The dehumidifying rotating wheel recovers the moisture absorption capability and is transferred into the processing area to adsorb the moisture in the processing air again under the drive of the transmission motor. The rotating wheel rotates continuously, and the dehumidification regeneration process is continuously carried out, so that the dry air with constant humidity is continuously output. The cooling dehumidifier utilizes the air to contain different moisture under different temperatures and energies, the moisture content in the air is reduced along with the reduction of the air temperature, when outdoor air passes through the fresh air surface cooler, the air is cooled by the surface cooling coil, the water vapor in the air is gradually condensed along with the reduction of the temperature and reaches a saturated state, and when the dew point of the air is continuously reduced, the water vapor in the air is changed into condensed water and separated out, so that the absolute moisture content in the air is reduced, and the dehumidification process of the air is realized.
Although the rotary dehumidifier is not provided with a compressor, is half lighter than the traditional dehumidifier and is quieter in operation, the rotary dehumidifier is relatively power-consuming because the water is removed by heating through the heater, the power is about 200W-600W, and the rotary dehumidifier is heated by the heater, can discharge higher waste heat than the traditional dehumidifier and is relatively high in overall cost; the cooling dehumidifier has good dehumidification effect, the temperature is reduced, the cost is low, but the normal use temperature of the cooling dehumidifier is more than 8 ℃, the cooling dehumidifier is used in the environment below 10 ℃, defrosting treatment is needed at one dehumidification end time, so the effect of the dehumidifier is greatly reduced, because in the low-temperature environment, after the cooling dehumidifier works, moisture extracted from air is attached to a condensing sheet of the dehumidifier in a defrosting mode, the moisture is frozen after a long time, the normal circulation of the air on the dehumidifier and the air on the dehumidifier are influenced, at the moment, the dehumidifier enters an electronic defrosting program to defrost firstly, then continue the dehumidification work, and the whole dehumidification effect is reduced.
SUMMERY OF THE UTILITY MODEL
Therefore, the dehumidifier for the low-temperature environment based on the frosting principle needs to be provided, and the problems that the conventional rotary dehumidifier is high in power consumption, high in cost and low in dehumidification effect due to the fact that the cooling dehumidifier needs electronic defrosting are solved.
In order to achieve the above purpose, the inventor provides a low-temperature environment dehumidifier based on the frosting principle, which comprises a first semiconductor refrigeration piece, a second semiconductor refrigeration piece, a first refrigeration control circuit, a second refrigeration control circuit, a main control chip, a driving motor, a motor driving circuit, a rotating shaft, a condensation piece and a heat insulation layer;
the number of the condensation sheets is four, two condensation sheets are connected through the heat insulation layer to form a first dehumidification sheet, and the other two condensation sheets are connected through the heat insulation layer to form a second dehumidification sheet;
the first dehumidification sheet and the second dehumidification sheet are arranged in parallel, and the centers of the first dehumidification sheet and the second dehumidification sheet are in transmission connection with the driving motor through a rotating shaft;
the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are arranged between the first dehumidification piece and the second dehumidification piece and are separated by a heat insulation layer;
the first semiconductor refrigeration piece is connected to the main control chip through a first refrigeration control circuit, and the second semiconductor refrigeration piece is connected to the main control chip through a second refrigeration control circuit;
the motor driving circuit is connected to the main control chip.
Further optimize, still include environment temperature and humidity sensor, environment temperature and humidity sensor connects in main control chip.
The temperature acquisition circuit comprises four thermistors which are respectively arranged on two sides of the first semiconductor refrigeration piece and two sides of the second semiconductor refrigeration piece, and the temperature acquisition circuit is connected to the main control chip.
Further optimize, still include communication circuit, communication circuit connects in main control chip.
Further preferably, the condensation sheet is a metal sheet.
Further preferably, the condensation sheet is semicircular.
Further preferably, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet are semicircular.
Further preferably, the heat insulation layer is made of heat insulation cotton.
Different from the prior art, according to the technical scheme, the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet are arranged between the first dehumidifying sheet and the second dehumidifying sheet, the main control chip respectively adds currents in different directions to the first semiconductor refrigerating sheet and the second semiconductor refrigerating sheet through the first refrigerating control circuit and the second refrigerating control circuit, so that the defrosting area and the frosting area are formed on two sides of the first dehumidifying sheet, the defrosting area and the frosting area are formed on two sides of the second dehumidifying sheet, the first dehumidifying sheet and the second dehumidifying sheet are driven to rotate through the driving motor, the dehumidifying and frosting treatment is simultaneously carried out through the rotation of the defrosting area and the frosting area on the first dehumidifying sheet and the rotation of the frosting area and the frosting area on the second dehumidifying sheet, after the semiconductor refrigerating sheets are connected with the currents, the heat of one side is conducted to the other side, so that the refrigerating side and the heating side are realized, the power consumption is low, and the generation of higher waste heat is avoided, the cost is saved, and the dehumidification and defrosting treatment is simultaneously carried out, so that the dehumidification effect is good.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a low temperature environment dehumidifier based on the frosting principle;
FIG. 2 is a schematic structural diagram of a low-temperature environment dehumidifier based on the frosting principle according to an embodiment;
FIG. 3 is a schematic view of another structure of a low-temperature environment dehumidifier based on the frosting principle according to an embodiment;
FIG. 4 is a schematic diagram of a circuit structure of the main control chip according to an embodiment;
FIG. 5 is a schematic diagram of an electrical circuit configuration of the first refrigeration control circuit according to an embodiment;
FIG. 6 is a schematic diagram of an electrical circuit configuration of the second refrigeration control circuit according to an embodiment;
FIG. 7 is a schematic diagram of a circuit configuration of a motor driving circuit according to an embodiment;
FIG. 8 is a schematic diagram of a circuit structure of an ambient temperature and humidity sensor according to an embodiment of the present invention
FIG. 9 is a schematic diagram of a circuit configuration of the temperature acquisition circuit according to an embodiment;
fig. 10 is a schematic circuit diagram of a communication circuit according to an embodiment.
Description of reference numerals:
110. the main control chip 121, the first semiconductor refrigeration piece, 122, the first refrigeration control circuit, 131, the second semiconductor refrigeration piece, 132, the second refrigeration control circuit, 141, the driving motor, 142, the motor driving circuit, 150, the ambient temperature and humidity sensor, 160, the temperature acquisition circuit, 170, the communication circuit, 210, the first dehumidification piece, 220, the second dehumidification piece, 230, the rotation axis, 240, the thermal-protective layer.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 7, the present embodiment provides a dehumidifier for low temperature environment based on frosting principle, which includes a first semiconductor cooling plate 121, a second semiconductor cooling plate 131, a first cooling control circuit 122, a second cooling control circuit 132, a main control chip 110, a driving motor 141, a motor driving circuit 142, a rotating shaft 230, a condensing plate and a heat insulation layer 240; the first semiconductor refrigerating piece 121 and the second semiconductor refrigerating piece 131 are semiconductor refrigerating pieces with the type of TEC 1-12704.
The number of the condensation sheets is four, two condensation sheets are connected through a heat insulation layer 240 to form a first dehumidification sheet 210, and the other two condensation sheets are connected through a heat insulation layer 240 to form a second dehumidification sheet 220;
the first dehumidification sheet 210 and the second dehumidification sheet 220 are arranged in parallel, and the centers of the first dehumidification sheet 210 and the second dehumidification sheet 220 are in transmission connection with the driving motor 141 through a rotating shaft 230;
the first semiconductor chilling plate 121 and the second semiconductor chilling plate 131 are arranged between the first dehumidifying plate 210 and the second dehumidifying plate 220, and the first semiconductor chilling plate 121 and the second semiconductor chilling plate 131 are separated by a heat insulation layer 240;
the first semiconductor refrigeration piece 121 is connected to the main control chip 110 through a first refrigeration control circuit 122, and the second semiconductor refrigeration piece 131 is connected to the main control chip 110 through a second refrigeration control circuit 132;
the motor driving circuit 142 is connected to the main control chip 110. The drive motor 141 is a stepping motor of 28BYJ 48-12.
The first semiconductor refrigeration piece 121 and the second semiconductor refrigeration piece 131 are arranged between the first dehumidification piece 210 and the second dehumidification piece 220 to form a three-layer structure, the upper layer and the lower layer are provided with the first dehumidification piece 210 and the second dehumidification piece 220, the first dehumidification piece 210 and the second dehumidification piece 220 are both composed of two condensation pieces, a heat insulation layer 240 is arranged between the two condensation pieces for heat insulation, temperature transmission is avoided, the centers of the first dehumidification piece 210 and the second dehumidification piece 220 are in transmission connection with the driving motor 141 through a rotating shaft 230, and the driving motor 141 can drive the first dehumidification piece 210 and the second dehumidification piece 220 to rotate through the rotating shaft 230; the middle layer is composed of a first semiconductor chilling plate 121 and a second semiconductor chilling plate 131 which are placed side by side, the first semiconductor chilling plate 121 and the second semiconductor chilling plate 131 are insulated by a heat insulation layer 240, the first semiconductor chilling plate 121 and the second semiconductor chilling plate 131 are fixedly arranged and cannot rotate along with the rotation of a rotating shaft 230, the first semiconductor chilling plate 121 is connected to a main control chip 110 through a first chilling control circuit 122, the second semiconductor chilling plate 131 is connected to the main control chip 110 through a second chilling control circuit 132, when the main control chip 110 adds current to the first semiconductor chilling plate 121 through the first chilling control circuit 122 and adds current to the second semiconductor chilling plate 131 through the second chilling control circuit 132, a heating surface is respectively formed on one surface of the first semiconductor chilling plate 121 and the second semiconductor chilling plate 131, and a chilling surface is formed on the other surface, since the directions of the currents added to the first semiconductor chilling plate 121 and the second semiconductor chilling plate 131 by the main control chip 110 are different, the directions of the heating surface and the chilling surface of the first semiconductor chilling plate 121 are different from the directions of the heating surface and the chilling surface of the second semiconductor chilling plate 131, the heating surface of the first semiconductor chilling plate 121 enables one side of the first dehumidifying plate 210 to form a defrosting area, the chilling surface of the second semiconductor chilling plate 131 enables the other side of the first dehumidifying plate 210 to form a frosting area, the heating surface of the second semiconductor chilling plate 131 enables one side of the second dehumidifying plate 220 to form a defrosting area, and the chilling surface of the first semiconductor chilling plate 121 enables the other side of the second dehumidifying plate 220 to form a frosting area. Moisture in the air condenses and frosts in the frosting area of first dehumidification piece 210 and the frosting area of second dehumidification piece 220, then driving motor 141 drives first dehumidification piece 210 and second dehumidification piece 220 and rotates, make first dehumidification piece 210 and second and the one side of frosting in the dehumidification piece rotate to the defrosting area in, heat the defrosting through the heating surface of first semiconductor refrigeration piece 121 and second semiconductor refrigeration piece 131, make the water that frosts liquefy after being heated and slide down along with the effect of gravity, and fall to the water-collecting box and collect and discharge, realize the dehumidification. The driving motor 141 can be controlled to drive the first dehumidifying sheet 210 and the second dehumidifying sheet 220 to rotate 180 degrees for frosting and defrosting by setting an interval for a period of time, so that continuous frosting and defrosting work is realized, and the humidity in the environment is reduced rapidly. After the semiconductor refrigerating sheet is connected with current, heat on one surface can be transferred to the other surface, so that one surface is refrigerated and the other surface is heated, the power consumption is low, higher waste heat is avoided, the cost is saved, and the dehumidification and defrosting treatment is simultaneously carried out, so that the dehumidification effect is good; and the semiconductor refrigeration piece is cooled through the form of temperature difference formed on two sides, for example, after 12V is electrified stably, the temperature of the refrigeration surface of the semiconductor refrigeration piece is 25 ℃ lower than that of the heating surface, and because the condensation piece of the heating surface frosts in a certain thickness and is lower in temperature, the cooling process of the refrigeration surface is quicker, and frosting and dehumidification can be started quickly.
Referring to fig. 8, in the present embodiment, in order to further save power consumption of the dehumidifier, an environment temperature and humidity sensor 150 is further included, and the environment temperature and humidity sensor 150 is connected to the main control chip 110. The main control chip 110 detects the temperature and humidity of the surrounding environment through the temperature and humidity sensor, when the surrounding humidity is higher than a certain value, the main control chip 110 controls the dehumidifier to start working to dehumidify the surrounding environment, and when the humidity is lower than the certain value, the dehumidifier is controlled to stop working, so that the power consumption of the dehumidifier is saved. The environmental temperature and humidity sensor 150 may be a DHT11 temperature and humidity sensor.
Referring to fig. 9, in the present embodiment, in order to further improve the dehumidification effect, the dehumidification cooling system further includes a temperature acquisition circuit 160, the temperature acquisition circuit 160 includes four thermistors respectively disposed on two sides of the first semiconductor chilling plate 121 and two sides of the second semiconductor chilling plate 131, and the temperature acquisition circuit 160 is connected to the main control chip 110. The two sides of the first semiconductor refrigeration sheet 121 and the two sides of the second semiconductor refrigeration sheet 131 are provided with the thermistors, the temperature values of the two sides of the first semiconductor refrigeration sheet 121 and the two sides of the second semiconductor refrigeration sheet 131 are collected through the thermistors, when the temperature of the frosting area collected by the main control chip 110 is lower than a preset temperature value, the driving motor 141 drives the first dehumidification sheet 210 and the second dehumidification sheet 220 to rotate at 180 ℃, so that the frosting area and the defrosting area on the first dehumidification sheet 210 and the second dehumidification sheet 220 are in a wheel shape, and the phenomenon that the thickness of a frost body on the condensation sheet in the frosting area is too large to influence dehumidification is avoided.
Referring to fig. 10, in the present embodiment, in order to facilitate the control of the dehumidifying work by the worker, a communication circuit 170 is further included, and the communication circuit 170 is connected to the main control chip 110. The staff can communicate with the dehumidifier through the communication circuit 170, and send related instructions to the main control chip 110 through the communication circuit 170, so that the main control chip 110 can start dehumidification or stop dehumidification according to the received instructions; meanwhile, the main control chip 110 can also send the dehumidifying structure to the worker through the communication circuit 170, wherein the communication circuit 170 can adopt an RS485 communication module.
In this embodiment, in order to ensure the frosting and defrosting functions of the condensation sheet, the condensation sheet is a metal sheet. The metal sheet has good heat conduction effect, can be heated or cooled quickly, and the metal sheet is adopted as the condensing sheet, so that the defrosting function of the dehumidifier can be ensured. In other embodiments, the condensation sheet may also be a ceramic sheet, a glass sheet, or the like.
In the present embodiment, the condensation sheet is semicircular to facilitate the rotation of the first dehumidification sheet 210 and the second dehumidification sheet 220. The condensation sheet is semicircular, so that the first dehumidification sheet 210 and the second dehumidification sheet 220 are circular, and the first dehumidification sheet 210 and the second dehumidification sheet 220 can rotate conveniently.
The first semiconductor chilling plate 121 and the second semiconductor chilling plate 131 are both semicircular. The first semiconductor refrigeration piece 121 and the second semiconductor refrigeration piece 131 are semicircular, so that the heat transfer areas of the first semiconductor refrigeration piece 121, the second semiconductor refrigeration piece 131, the first dehumidification piece 210 and the second dehumidification piece 220 are large, and the defrosting function of a defrosting area and the frosting function of a frosting area are increased.
In this embodiment, the heat insulation layer 240 is made of heat insulation cotton. The heat insulation cotton can ensure the heat insulation effect on the first dehumidification sheet 210 and the second dehumidification sheet 220, and avoid the temperature influence between the frosting area and the defrosting area. In other embodiments, other insulating materials, such as fiberglass, aerogel blanket, etc., may be used for the insulating layer 240.
It should be noted that, although the above embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, the changes and modifications of the embodiments described herein, or the equivalent structure or equivalent process changes made by the contents of the specification and the drawings of the present invention, directly or indirectly apply the above technical solutions to other related technical fields, all included in the protection scope of the present invention.
Claims (8)
1. A low-temperature environment dehumidifier based on a frosting principle is characterized by comprising a first semiconductor refrigeration piece, a second semiconductor refrigeration piece, a first refrigeration control circuit, a second refrigeration control circuit, a main control chip, a driving motor, a motor driving circuit, a rotating shaft, a condensation piece and a heat insulation layer;
the number of the condensation sheets is four, two condensation sheets are connected through the heat insulation layer to form a first dehumidification sheet, and the other two condensation sheets are connected through the heat insulation layer to form a second dehumidification sheet;
the first dehumidification sheet and the second dehumidification sheet are arranged in parallel, and the centers of the first dehumidification sheet and the second dehumidification sheet are in transmission connection with the driving motor through a rotating shaft;
the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are arranged between the first dehumidification piece and the second dehumidification piece and are separated by a heat insulation layer;
the first semiconductor refrigeration piece is connected to the main control chip through a first refrigeration control circuit, and the second semiconductor refrigeration piece is connected to the main control chip through a second refrigeration control circuit;
the motor driving circuit is connected to the main control chip.
2. The low-temperature environment dehumidifier based on the frosting principle of claim 1, further comprising an environment temperature and humidity sensor, wherein the environment temperature and humidity sensor is connected to the main control chip.
3. The low-temperature environment dehumidifier based on the frosting principle of claim 1, further comprising a temperature acquisition circuit, wherein the temperature acquisition circuit comprises four thermistors, the four thermistors are respectively arranged on two sides of the first semiconductor refrigeration piece and two sides of the second semiconductor refrigeration piece, and the temperature acquisition circuit is connected to the main control chip.
4. The low-temperature environment dehumidifier based on the frosting principle of claim 1, further comprising a communication circuit, wherein the communication circuit is connected to the main control chip.
5. The low temperature environment dehumidifier according to claim 1, wherein said condensation sheet is a metal sheet.
6. The low temperature environment dehumidifier according to claim 1, wherein said condensation sheet is semicircular.
7. The low-temperature environment dehumidifier according to claim 1, wherein the first semiconductor cooling plate and the second semiconductor cooling plate are semicircular.
8. The low-temperature environment dehumidifier based on the frosting principle of claim 1, wherein the heat-insulating layer is heat-insulating cotton.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920824193.0U CN210532556U (en) | 2019-06-03 | 2019-06-03 | Low-temperature environment dehumidifier based on frosting principle |
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| CN201920824193.0U CN210532556U (en) | 2019-06-03 | 2019-06-03 | Low-temperature environment dehumidifier based on frosting principle |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113867457A (en) * | 2021-10-10 | 2021-12-31 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
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- 2019-06-03 CN CN201920824193.0U patent/CN210532556U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113867457A (en) * | 2021-10-10 | 2021-12-31 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
| CN113867457B (en) * | 2021-10-10 | 2022-06-10 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
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