CN2665624Y - Cold-hot dual-purpose electric fan - Google Patents
Cold-hot dual-purpose electric fan Download PDFInfo
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- CN2665624Y CN2665624Y CN 200320108465 CN200320108465U CN2665624Y CN 2665624 Y CN2665624 Y CN 2665624Y CN 200320108465 CN200320108465 CN 200320108465 CN 200320108465 U CN200320108465 U CN 200320108465U CN 2665624 Y CN2665624 Y CN 2665624Y
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- heat exchange
- exchange device
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Abstract
Disclosed is a cooling-heating dual purpose fan, comprising a cooling-heating semiconductor wafer(3), a heat exchange set(4), a radiator set(2),and a fan vane(5).Wherein a heat delivery surface of the semiconductor wafer(3) is in tight connection with the radiator set(2), while a heat absorbing surface is in tight connection with one side of the heat exchange set(4); the fan vane(5) is installed near the heat exchange set(4). Radiator wafers(14) are arranged at the other side of the heat exchange set(4); an air output holes(11) are arranged between the radiator wafers(14); and air vents(10) are arranged around sides of the heat exchange set(4). With the communication of the air vents(10) and the air output holes(11), the air flow can flow into and out of the air output holes(11) from the air vents(10) around sides of the heat exchange set(4). The utility model has the advantages that: as the radiator wafers are arranged and the air output holes are arranged among the radiator wafers, the utility model conducts the heat efficiently and has a simple structure.
Description
Technical field
The utility model belongs to household electrical appliance articles for use field, is specifically related to a kind of cold-hot dual-purpose electric fan.
Background technology
Air-conditioning on the market is to be made of compressor, indoor set etc. now, use air-conditioning, there is the air-conditioning installation personnel of specialty to install to the doorstep, the back is installed just can not moves easily, and in use have power consumption big, cause shortcomings such as IAQ difference because of use indoor circulation air cooling and heating type for a long time.And general household electrical appliance are that the electric fan volume is small and exquisite, power saving, and air flows strong.But its shortcoming is tangible especially: winter is unavailable, and what blow out summer is hot blast.Existing is the advantage that the air cooler of refrigeration filling has been concentrated air-conditioner and electric fan with water.But its shortcoming also is conspicuous: air cooler generally adopts cascade cloth circulation normal-temperature water or ice crystal frozen water, sends cold wind by blower fan by the air channel.When using normal-temperature water, in dry area, the effect of water cooling by evaporation is limited, can only make environment temperature reduce the 3-5 degree; In the humid area, then fundamental presentation does not go out the effect of refrigeration.If adopt the ice crystal frozen water, its cooling effect is better, but because ice cube melts at normal temperatures fast, therefore causes the refrigeration time of short duration, can not long time continuous working.On the other hand, if adopt ice cube refrigeration, also will be specially with making ice cubes such as refrigerators, both inconvenience wasted energy again.
The conductor refrigeration pyrogenicity wafer of comparative maturity is a thermoelectric (al) cooling pyrogenicity of utilizing peltier effect to produce at present.When forward current passed through semiconductor wafer, the one side of wafer can absorb heat, another side meeting distribute heat; When by reversing the current, absorbed a distribute heat of heat originally, and the one side of original distribute heat absorbs heat.Simultaneously, the watt level of cooling and heating type can also be regulated by the size of control electric current.As a publication number is the fan assembly that 2118848 utility model patent discloses a kind of tool ice temperature effect, relate to conditioner, the body that comprises a hollow, body interior central authorities are provided with dividing plate, body is separated into equal cold space and heat space, the central authorities of dividing plate are provided with the respectively refrigeration row heat radiation row contact of hot and cold sky of the hot and cold utmost point of semiconductor cooler interface at cold and hot utmost point interface, in the cold space, have one cold wind sent this external fan; In heat space, the cold air that is provided with ground sucks another fan of heat space and an AC/DC power transformation device, and this utility model has the cooling effect better than conventional fan, very power saving owing to adopted cooling technique of semiconductor.But its complex structure, and heat transfer efficiency is lower.
Summary of the invention
Technical problem to be solved in the utility model is a kind of simple in structure, cold-hot dual-purpose electric fan that heat transfer efficiency is higher.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: a kind of cold-hot dual-purpose electric fan, but the semiconductor wafer that comprises cooling and heating type, the heat exchange device, radiating element, fan blade, the heat delivery surface of wherein said semiconductor wafer closely is connected with radiating element, heat-absorbent surface closely is connected with the one side of heat exchange device, fan blade is installed near the heat exchange device, the another side of described heat exchange device is provided with fin, between described fin, be provided with venthole, side week at described heat exchange device is provided with air vent, described air vent is connected with described venthole, and air-flow can enter from the air vent in described heat exchange device-side week and flow out from described venthole.
The contact-making surface of described semiconductor wafer and radiating element and heat exchange device can be coated with silicone grease.
Described fin can be parallel uniform setting.
Compared with prior art, advantage of the present utility model is to adopt heat sink design, is provided with venthole between the fin, so heat transfer efficiency is higher, and simple in structure.In addition, the contact-making surface of semiconductor wafer and radiating element and heat exchange device is coated with the good silicone grease of heat conductivility, can strengthen the exchange heat effect of semiconductor wafer and radiating element and heat exchange device, parallel uniform setting of fin can make heat radiation evenly, further improves heat transfer efficiency.
Description of drawings
The structural representation (analysing and observe) of Fig. 1 electric fan head of the present utility model.
Fig. 2 is the right view of heat exchange device among Fig. 1.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
As Fig. 1, a kind of cold-hot dual-purpose electric fan shown in Figure 2, but the semiconductor wafer 3 that comprises cooling and heating type, heat exchange device 4, radiating element 2, fan blade 5, the heat delivery surface of wherein said semiconductor wafer 3 closely is connected with radiating element 2, heat-absorbent surface closely is connected with the one side of heat exchange device 4, fan blade 5 is installed near heat exchange device 4, the another side of described heat exchange device 4 is provided with three above fin 14, between described fin 14, be provided with venthole 11, side week at described heat exchange device 4 is provided with air vent 10, described air vent 10 is connected with described venthole 11, and air-flow can enter from the air vent 10 in described 4 side weeks of heat exchange device and flow out from described venthole 11.Shown in the direction of arrow that indicates among Fig. 1.Described semiconductor wafer 3 can be coated with silicone grease with the contact-making surface of radiating element 2 and heat exchange device 4.Described fin 14 can be parallel uniform setting.
When refrigeration, described conductor refrigeration pyrogenicity wafer 3 forwards pass to a certain size direct current, and the one side of described wafer can be felt cold, and another side can generate heat.Because refrigeration face closely links to each other with heat exchange device 4, the heat on the heat exchange device 4 is absorbed rapidly, and the temperature of heat exchange device 4 is reduced rapidly.Simultaneously, fan 5 work, the pressure of negative pressuren zone 12 inside reduces, and air just enters negative pressuren zone 12 by the inlet of the refrigerated air on the heat exchange device 4 10,11.Air is cooled because of with heat exchange device 4 heat exchange taking place by heat exchange device 4 time.Cold air in negative pressuren zone 12 is discharged into the outside by heat exchange air outlet slit 13 in fan 5 is continuously worked.Shown in the direction of arrow that indicates among Fig. 1.
At the heat delivery surface of described wafer 3, because heat delivery surface closely is connected with radiating element 2, heat can be delivered to and make it the temperature rising on the radiating element 2.Forced heat radiation fan on the radiating element 21 work simultaneously blows to radiating element 2 with air outside, to reach the effect that reduces radiating element 2 temperature.
When pyrogenicity, conductor refrigeration pyrogenicity wafer 3 oppositely passes to a certain size direct current, and the one side that described wafer contacts with heat exchange device 4 can be generated heat, and another side can turn cold.Because the pyrogenicity face closely links to each other with heat exchange device 4, heat can be delivered to the temperature of heat exchange device 4 is raise rapidly.Simultaneously, fan 5 work, the pressure of negative pressuren zone 12 inside reduces, and air just enters negative pressuren zone 12 by the inlet of the refrigerated air on the heat exchange device 4 10,11.Air is heated because of with heat exchange device 4 heat exchange taking place by heat exchange device 4 time.Hot gas in negative pressuren zone 12 is discharged into the outside by heat exchange air outlet slit 13 in fan 5 is continuously worked.Shown in the direction of arrow that indicates among Fig. 1.
At the huyashi-chuuka (cold chinese-style noodles) of conductor refrigeration pyrogenicity wafer 3, because the heat delivery surface of described wafer closely is connected with radiating element 2, can absorb the heat on the radiating element 2, make it temperature and reduce.Forced heat radiation fan on the radiating element 21 work simultaneously blows to radiating element 2 with air outside, to reach the effect of rising radiating element 2 temperature.
(3) effect of adjusting cooling and heating type.If change size by conductor refrigeration pyrogenicity wafer 3 direct current electric currents, can control the watt level of described conductor refrigeration pyrogenicity wafer cooling and heating type very easily, in fact be exactly to reach the effect of regulating cooling and heating type.
Power 150W to 250W of the present utility model also can increase conductor refrigeration pyrogenicity wafer as required to increase its cooling and heating type power.The utility model is when work, and the cold air that is discharged is the same with the common air-conditioning effect with the temperature of hot gas, and power consumption is much smaller.
1, as shown in Figure 1, be useful on the semiconductor wafer 3 of cooling and heating type in the electric fan of the present utility model, semiconductor wafer 3 is connected with heat exchange device 4, radiating element 2 respectively.Heat exchange device 4 is connected with fan 5.
2,, note during installation the semiconductor wafer 3 and the contact-making surface of radiating element 2 and heat exchange device 4 are coated the good silicone grease of heat conductivility in order to strengthen the exchange heat effect of semiconductor wafer 3 and radiating element 2 and heat exchange device 4.
3, in order to reduce the weight of complete machine, and consider the effect of heat exchange, radiating element 2 and heat exchange device 4 use aluminum alloy materials to make, and increase the surface area of radiating element 2 and heat exchange device 4 as far as possible.
4, pass to forward current for semiconductor wafer 3, its one side that contacts with heat exchange device 4 begins the heat around a large amount of the absorption, and the temperature around making descends, and the temperature of the device of heat exchange simultaneously 4 also sharply descends.This moment, fan 5 was started working, pressure in the negative pressuren zone 12 between fan 5 and the heat exchange device 4 is reduced, so will be by the air of refrigeration by the inlet of the refrigerated air in the heat exchange device 4 10,11, before entering negative pressuren zone 12, carry out heat exchange with heat exchange device 4, enter negative pressuren zone 12 after being cooled, pass through water conservancy diversion fan blade 6 endlessly to outside drain by fan 5 again, to reach the purpose that reduces indoor temperature.What heat exchange this moment air outlet slit 13 was discharged is cold air.
5, semiconductor wafer 3 is when work, and its hot side can produce a large amount of heat energy, and this heat energy and radiating element 2 carry out heat exchange, make radiating element 2 heating.Meanwhile, the forced heat radiation fan 1 that is installed on the radiating element 2 is started working, and air outside is circulated from the direction of heat radiation air intake 7 to heat radiation air outlet slit 8 and 9, and the heat on the radiating element 2 is taken away to reach the purpose of forced heat radiation.
6, change the sense of current of semiconductor wafer 3, its one side that contacts with heat exchange device 4 meeting pyrogenicity, the one side that contacts with radiating element 2 simultaneously can refrigeration.During fan 5 work, atmospheric pressure in the negative pressuren zone 12 between fan 5 and heat exchange device 4 reduces, so will be by the air of pyrogenicity by the inlet of the refrigerated air in the heat exchange device 4 10,11, and before entering negative pressuren zone 12, carry out heat exchange with heat exchange device 4, enter negative pressuren zone 12 after being heated, pass through water conservancy diversion fan blade 6 endlessly to outside drain by fan 5 again.To reach the purpose of rising indoor temperature.What heat exchange this moment air outlet slit 13 was discharged is hot gas.At the huyashi-chuuka (cold chinese-style noodles) of semiconductor wafer 3, because the heat delivery surface of described wafer closely is connected with radiating element, can absorb the heat on the radiating element, make it temperature and reduce.Forced heat radiation fan work on the radiating element blows to radiating element with air outside, to reach the effect of rising radiating element temperature simultaneously.
Claims (3)
1, a kind of cold-hot dual-purpose electric fan, but the semiconductor wafer that comprises cooling and heating type, the heat exchange device, radiating element, fan blade, the heat delivery surface of wherein said semiconductor wafer closely is connected with radiating element, heat-absorbent surface closely is connected with the one side of heat exchange device, fan blade is installed near the heat exchange device, it is characterized in that: the another side of described heat exchange device is provided with fin, between described fin, be provided with venthole, side week at described heat exchange device is provided with air vent, described air vent is connected with described venthole, and air-flow can enter from the air vent in described heat exchange device-side week and flow out from described venthole.
2, a kind of cold-hot dual-purpose electric fan as claimed in claim 1 is characterized in that: the contact-making surface of described semiconductor wafer and radiating element and heat exchange device is coated with silicone grease.
3, a kind of cold-hot dual-purpose electric fan as claimed in claim 1 is characterized in that: described fin is parallel uniform setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320108465 CN2665624Y (en) | 2003-11-28 | 2003-11-28 | Cold-hot dual-purpose electric fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320108465 CN2665624Y (en) | 2003-11-28 | 2003-11-28 | Cold-hot dual-purpose electric fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2665624Y true CN2665624Y (en) | 2004-12-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320108465 Expired - Fee Related CN2665624Y (en) | 2003-11-28 | 2003-11-28 | Cold-hot dual-purpose electric fan |
Country Status (1)
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|---|---|
| CN (1) | CN2665624Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102217909A (en) * | 2010-04-15 | 2011-10-19 | 河南鸿昌电子有限公司 | Cooling and warming closestool cover gasket |
| CN102269454A (en) * | 2010-06-01 | 2011-12-07 | 武汉市天下春商贸有限公司 | Refrigerating and heating fan |
| TWI386606B (en) * | 2009-07-22 | 2013-02-21 | Univ Taipei Chengshih Science | Carried air-condition system |
| CN105042739A (en) * | 2015-07-03 | 2015-11-11 | 华中科技大学 | Multifunctional thermoelectric air conditioner fan |
| CN106723773A (en) * | 2017-01-10 | 2017-05-31 | 陈思韵 | A kind of parasols based on semiconductor chilling plate |
| CN107560047A (en) * | 2017-10-19 | 2018-01-09 | 广东雷子克热电工程技术有限公司 | Semiconductor air conditioner |
| CN111765564A (en) * | 2020-06-22 | 2020-10-13 | 郁海荣 | Cold air electric fan |
| WO2020252680A1 (en) * | 2019-06-19 | 2020-12-24 | 林世轩 | Cooling module having airflow channels, and air conditioner device having same |
-
2003
- 2003-11-28 CN CN 200320108465 patent/CN2665624Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI386606B (en) * | 2009-07-22 | 2013-02-21 | Univ Taipei Chengshih Science | Carried air-condition system |
| CN102217909A (en) * | 2010-04-15 | 2011-10-19 | 河南鸿昌电子有限公司 | Cooling and warming closestool cover gasket |
| CN102269454A (en) * | 2010-06-01 | 2011-12-07 | 武汉市天下春商贸有限公司 | Refrigerating and heating fan |
| CN105042739A (en) * | 2015-07-03 | 2015-11-11 | 华中科技大学 | Multifunctional thermoelectric air conditioner fan |
| CN106723773A (en) * | 2017-01-10 | 2017-05-31 | 陈思韵 | A kind of parasols based on semiconductor chilling plate |
| CN107560047A (en) * | 2017-10-19 | 2018-01-09 | 广东雷子克热电工程技术有限公司 | Semiconductor air conditioner |
| WO2020252680A1 (en) * | 2019-06-19 | 2020-12-24 | 林世轩 | Cooling module having airflow channels, and air conditioner device having same |
| CN111765564A (en) * | 2020-06-22 | 2020-10-13 | 郁海荣 | Cold air electric fan |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |