CN109631202A - A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner - Google Patents

A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner Download PDF

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Publication number
CN109631202A
CN109631202A CN201811485265.XA CN201811485265A CN109631202A CN 109631202 A CN109631202 A CN 109631202A CN 201811485265 A CN201811485265 A CN 201811485265A CN 109631202 A CN109631202 A CN 109631202A
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heat exchange
heat
unit
exchange unit
semiconductor
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CN201811485265.XA
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姜东岳
赵良
陈贵军
张润琦
肖发文
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Dalian University of Technology
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Dalian University of Technology
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Priority to CN201811485265.XA priority Critical patent/CN109631202A/en
Publication of CN109631202A publication Critical patent/CN109631202A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63—Electronic processing
    • F24F11/65—Electronic processing for selecting an operating mode
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/89—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/30—Arrangement or mounting of heat-exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
    • F24F5/0017—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning using cold storage bodies, e.g. ice
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Fuzzy Systems (AREA)
  • Mathematical Physics (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

Abstract

A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner, belongs to semiconductor air conditioner field.The device includes semiconductor refrigerating unit, heat exchange unit, exhaust fan and power-supply controller of electric.Heating/refrigerating core is divided into the identical upper layer and lower layer of structure, air inlet is constituted between each heat exchanger fin of the first heat exchange unit of lower layer, air outlet is constituted between each heat exchanger fin of the first heat exchange unit of upper layer, exhaust fan is set at air outlet, air is entered by air inlet through backflash, is discharged from air outlet by exhaust fan.The air-conditioning device absorbs the cooling capacity or heat of semiconductor refrigerating unit by heat exchange unit and storage adiabator, when environment needs to freeze, the heat of semiconductor refrigerating unit release is absorbed by storage adiabator, and when environment needs to heat, the cooling capacity of semiconductor refrigerating unit release is absorbed by storage adiabator.Semiconductor refrigerating unit realizes the switching of refrigeration, heating by conversion direct current supply positive and negative electrode.Backflash effectively increases heat exchange area and heat-exchange time, promotes refrigeration or heating efficiency.

Description

A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner
Technical field
The present invention relates to a kind of accumulation of heat/cold storage double-flow style semiconductor air conditioners, belong to semiconductor air conditioner field.
Background technique
Hot summer room temperature is higher, has seriously affected the working efficiency and quality of life of people.It is easypro in order to obtain Suitable environment generallys use compressed air conditioner and freezes.However compressed air conditioner volume is larger, building block is more, cost It is higher, portability is poor, these factors limit the application of compressed air conditioner on various occasions.In some office blocks, classroom is learned In raw dormitory or even residential house, air-conditioning equipment is popularized far away.In the same manner, in cold winter, especially southern region of China, Due to a lack of central heating, cause room temperature lower, in the place that compressed air conditioner is not popularized and region, lacks safely and fast Heating mode.Semiconductor air conditioner has low in cost, refrigeration (or heating) speed because being freezed using paltie effect or being heated It spends fast, no-rotary part, attract attention without refrigerant and environmental-friendly feature.However since its coefficient of performance is lower, making While cold (or heating), a large amount of heat (cooling capacity) is also produced, if these heats (or cooling capacity) scatter and disappear indoors, not only not It can be room temperature lowering (or heating), so that room temperature is increased (or reduction), this severely limits the extensive of semiconductor air conditioner Using.In addition, in traditional semiconductor air-conditioning system, since the contact area of air and chill surface (or heating surface) has Limit, which greatly limits air by fast cooling (or heating).
Summary of the invention
In order to overcome problems of the prior art, it is empty that the present invention provides a kind of accumulation of heat/cold storage double-flow semiconductor Device is adjusted, which absorbs the cooling capacity or heat of semiconductor refrigerating unit by heat exchange unit and storage adiabator, in environment When needing to freeze, the heat of semiconductor refrigerating unit release is absorbed and closed by thermal insulation board by storage adiabator, needs to make in environment When hot, the cooling capacity of semiconductor refrigerating unit release is absorbed and closed by thermal insulation board by storage adiabator.
The technical solution adopted by the present invention is that: a kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner, it includes partly leading Body refrigeration unit, heat exchange unit, exhaust fan and power-supply controller of electric, the semiconductor refrigerating unit and the heating of heat exchange unit composition/ Refrigerating core, heating/refrigerating core are divided into the identical upper layer and lower layer of structure, every layer of heating/refrigerating core middle position setting A semiconductor refrigerating is respectively arranged in the heat transfer plate outside of the first opposite heat exchange unit of two heat exchanger fins, two the first heat exchange units Unit, the outside of two semiconductor refrigerating units are respectively arranged second heat exchange unit, the refrigeration side of semiconductor refrigerating unit with The heat-transfer area of first heat exchange unit abuts, and the heating side of semiconductor refrigerating unit and the heat-transfer area of the second heat exchange unit abut；Institute It states to be equipped between two heat exchanger fins of the second heat exchange unit and stores adiabator；After upper layer and lower layer heating/refrigerating core superposition, heating/ It is wrapped up using thermal insulation board on the periphery of refrigerating core；The channel constituted between each heat exchanger fin of the first heat exchange unit of lower layer is air inlet Mouthful, the channel constituted between each heat exchanger fin of the first heat exchange unit of upper layer is air outlet, exhaust fan is set at air outlet, air by Air inlet, which passes into, to be arranged in the subsequent backflash of the first heat exchange unit, is discharged from air outlet by exhaust fan；The semiconductor Refrigeration unit, exhaust fan are electrically connected with the power-supply controller of electric being located on panel.
The cross sectional shape of first heat exchange unit uses the structure of the first comb teeth and the first comb teeth slot.
The cross sectional shape of second heat exchange unit uses the structure of the second comb teeth and the second comb teeth slot.
Heating/refrigerating core top surface, bottom surface, the left side, the right side, the back side and positive two sides are arranged in the thermal insulation board.
The power-supply controller of electric is using the direct current supply positive and negative electrode for converting semiconductor refrigerating unit, to control semiconductor system Cold unit is the conversion of refrigeration or heating.
The beneficial effects of the present invention are: this accumulation of heat/cold storage double-flow style semiconductor air conditioner includes semiconductor refrigerating Unit, heat exchange unit, exhaust fan and power-supply controller of electric.Semiconductor refrigerating unit and heat exchange unit constitute heating/refrigerating core, system Heat/refrigerating core is divided into the identical upper layer and lower layer of structure.The channel constituted between each heat exchanger fin of the first heat exchange unit of lower layer is Air inlet, the channel constituted between each heat exchanger fin of the first heat exchange unit of upper layer are air outlet, and exhaust fan is arranged at air outlet, empty Gas is passed by air inlet to be arranged in the subsequent backflash of the first heat exchange unit, is discharged from air outlet by exhaust fan.The air-conditioning Device absorbs the cooling capacity or heat of semiconductor refrigerating unit, when environment needs to freeze, half by heat exchange unit and storage adiabator The heat of conductor refrigeration unit release is absorbed and closed by thermal insulation board by storage adiabator, when environment needs to heat, semiconductor system The cooling capacity of cold unit release is absorbed and closed by thermal insulation board by storage adiabator.By the direct current supply for converting semiconductor refrigerating unit The switching of refrigeration, heating may be implemented in positive and negative electrode；It is designed by backflash, effectively increases the contact area of air and heat exchanger fin And time of contact, promote refrigeration or heating efficiency.
Detailed description of the invention
Fig. 1 is a kind of structure chart of accumulation of heat/cold storage double-flow style semiconductor air conditioner.
Fig. 2 is the internal structure chart of double-flow style semiconductor air conditioner.
Fig. 3 is the A-A cross-sectional view (air flow figure) in Fig. 2.
Fig. 4 is the schematic diagram of semiconductor refrigerating unit.
Fig. 5 is the structure chart of the first heat exchange unit.
Fig. 6 is the structure chart of the second heat exchange unit.
Fig. 7 is the power controller circuit figure of style semiconductor air conditioner.
In figure: 1, semiconductor refrigerating unit, 1a, heating side, 1b, refrigeration side, the 2, first heat exchange unit, 2a, the first pectination Tooth, 2b, the first comb teeth slot, the 3, second heat exchange unit, 3a, the second comb teeth, 3b, the second comb teeth slot, 4, storage adiabator, 5, air draft Fan, 6, air outlet, 7, air inlet, 8, backflash, 9, thermal insulation board, 10, power-supply controller of electric, DC1, refrigeration mode control route connect Mouthful, DC2, heating mode control line interface.
Specific embodiment
Below in conjunction with the drawings and the specific embodiments, the present invention will be described:
Fig. 1,2,3,4,5 show a kind of structure chart of accumulation of heat/cold storage double-flow style semiconductor air conditioner.This accumulation of heat/storage Cold type double-flow style semiconductor air conditioner includes semiconductor refrigerating unit 1, heat exchange unit, exhaust fan 5 and power-supply controller of electric 10.Half Conductor refrigeration unit 1 and heat exchange unit constitute heating/refrigerating core, and heating/refrigerating core is divided into the identical upper layer and lower layer of structure, The first opposite heat exchange unit 2 of two heat exchanger fins, two the first heat exchange units are arranged in every layer of heating/refrigerating core middle position Each one semiconductor refrigerating unit 1 of setting on the outside of 2 heat transfer plate, the outside of two semiconductor refrigerating units 1 are respectively arranged one the Two heat exchange units 3, refrigeration side 1b(Fig. 4 of semiconductor refrigerating unit 1) it is abutted with the heat-transfer area of the first heat exchange unit 2, semiconductor Heating side 1a(Fig. 4 of refrigeration unit 1) it is abutted with the heat-transfer area of the second heat exchange unit 3, two heat exchanger fins of the second heat exchange unit 3 Between be equipped with store adiabator 4.After upper layer and lower layer heating/refrigerating core superposition, heating/refrigerating core periphery uses thermal insulation board 9 Heating/refrigerating core top surface, bottom surface, the left side, the right side, the back side and positive two sides are arranged in package, thermal insulation board 9.In lower layer The channel constituted between each heat exchanger fin of one heat exchange unit 2 is air inlet 7(Fig. 3,5), each heat exchanger fin of the first heat exchange unit of upper layer 2 Between the channel that constitutes be air outlet 6(Fig. 3,5), exhaust fan 5 is set at air outlet 6, and air passes into setting by air inlet 7 In the subsequent backflash 8 of the first heat exchange unit 2, it is discharged from air outlet 6 by exhaust fan 5.Semiconductor refrigerating unit 1, exhaust fan 5 with Power-supply controller of electric 10 on panel is electrically connected.The cross sectional shape of first heat exchange unit 2 uses the first comb teeth 2a and first The structure of comb teeth slot 2b.
Fig. 6 shows the structure chart of the second heat exchange unit.The cross sectional shape of second heat exchange unit 3 uses the second comb teeth 3a With the structure of the second comb teeth slot 3b.
Fig. 7 shows the power controller circuit figure of style semiconductor air conditioner.Alternating current passes through after full-wave rectification to semiconductor Refrigeration unit 1 supplies direct current, and power-supply controller of electric 10 is using the direct current supply positive and negative electrode for converting semiconductor refrigerating unit 1, to control Semiconductor refrigerating unit 1 processed is the conversion of refrigeration or heating.
Using above-mentioned technical method, after power-supply controller of electric connects DC1, air-conditioning device is in refrigeration mode: controller will AC power source is converted into direct current and is supplied to semiconductor refrigerating unit, and semiconductor refrigerating unit is started to work, inside refrigeration, outside Heating, because the inside of semiconductor refrigerating unit is close to the first heat exchange unit, the temperature of the first heat exchange unit is reduced, and exhaust fan will Air is sucked by air inlet and is flowed through backflash, is back to air outlet discharge, flows through in circuit and cooled down in air；Because partly leading The outside of body refrigeration unit is close to the second heat exchange unit, and the heat generated is conducted by the second heat exchange unit to accumulation of heat material Material, heat-storing material is by heat storage, and under the action of thermal insulation board, the heat being stored into heat-storing material will not be discharged into environment and work as In.
After power-supply controller of electric connects DC2, air-conditioning device is in heating mode: AC power source is converted into direct current by controller It is supplied to semiconductor refrigerating unit, semiconductor refrigerating unit is started to work, inside heating, outside refrigeration, because of semiconductor refrigerating list The inside of member is close to the first heat exchange unit, and the temperature of the first heat exchange unit increases, and exhaust fan is sucked air simultaneously by air inlet Backflash is flowed through, air outlet discharge is back to, flows through in circuit and heated up in air；Because semiconductor refrigerating unit outside with Second heat exchange unit is close to, and the cooling capacity generated is conducted by the second heat exchange unit to heat-storing material, and heat-storing material stores up cooling capacity It deposits, under the action of thermal insulation board, the cooling capacity being stored into heat-storing material will not be discharged into environment.

Claims (5)

1.一种蓄热/蓄冷式双流程半导体空调装置，它包括半导体制冷单元（1）、换热单元、排风扇（5）和电源控制器（10），其特征是：所述半导体制冷单元（1）与换热单元构成制热/制冷机芯，制热/制冷机芯分为结构相同的上下两层，每层制热/制冷机芯的中间位置设置两个换热片相对的第一换热单元（2），两个第一换热单元（2）的传热板外侧各设置一个半导体制冷单元（1），两个半导体制冷单元（1）的外侧各设置一个第二换热单元（3），半导体制冷单元（1）的制冷侧（1b）与第一换热单元（2）的传热面紧靠，半导体制冷单元（1）的制热侧（1a）与第二换热单元（3）的传热面紧靠；所述第二换热单元（3）的两个换热片间设有蓄温材料（4）；在上下两层制热/制冷机芯叠加后，制热/制冷机芯的周边采用隔热板（9）包裹；在下层第一换热单元（2）的各换热片间构成的通道为进风口（7），上层第一换热单元（2）的各换热片间构成的通道为出风口（6），在出风口（6）处设置排风扇（5），空气由进风口（7）进入经过设置在第一换热单元（2）后面的回流槽（8），从出风口（6）由排风扇（5）排出；所述半导体制冷单元（1）、排风扇（5）与位于面板上的电源控制器（10）电连接。1. A heat storage/cold storage type dual-flow semiconductor air conditioner, comprising a semiconductor refrigeration unit (1), a heat exchange unit, an exhaust fan (5) and a power supply controller (10), characterized in that: the semiconductor refrigeration unit ( 1) It forms a heating/cooling core with the heat exchange unit. The heating/cooling core is divided into upper and lower layers with the same structure. The middle position of the heating/cooling core of each layer is set with two opposite heat exchange fins. The heat exchange unit (2) is provided with a semiconductor refrigeration unit (1) on the outside of the heat transfer plates of the two first heat exchange units (2), and a second heat exchange unit is provided on the outside of the two semiconductor refrigeration units (1). (3) The cooling side (1b) of the semiconductor refrigeration unit (1) is in close contact with the heat transfer surface of the first heat exchange unit (2), and the heating side (1a) of the semiconductor refrigeration unit (1) exchanges heat with the second heat exchange unit (2). The heat transfer surfaces of the unit (3) are in close contact; a temperature storage material (4) is arranged between the two heat exchange fins of the second heat exchange unit (3); after the upper and lower heating/refrigeration cores are superimposed, The periphery of the heating/cooling core is wrapped by a heat shield (9); the channel formed between the heat exchange fins of the lower first heat exchange unit (2) is the air inlet (7), and the upper first heat exchange unit ( 2) The channel formed between the heat exchange fins is an air outlet (6), an exhaust fan (5) is arranged at the air outlet (6), and the air enters from the air inlet (7) and passes through the first heat exchange unit (2). The rear recirculation tank (8) is discharged from the air outlet (6) by the exhaust fan (5); the semiconductor refrigeration unit (1) and the exhaust fan (5) are electrically connected to the power supply controller (10) located on the panel. 2.根据权利要求1所述的一种蓄热/蓄冷式双流程半导体空调装置，其特征是：所述第一换热单元（2）的截面形状采用第一梳状齿（2a）和第一梳齿槽（2b）的结构。2. A heat storage/cold storage type dual-flow semiconductor air conditioner according to claim 1, characterized in that: the cross-sectional shape of the first heat exchange unit (2) adopts the first comb-like teeth (2a) and the second The structure of a comb-tooth slot (2b). 3.根据权利要求1所述的一种蓄热/蓄冷式双流程半导体空调装置，其特征是：所述第二换热单元（3）的截面形状采用第二梳状齿（3a）和第二梳齿槽（3b）的结构。3. A heat storage/cold storage type dual-flow semiconductor air conditioner according to claim 1, characterized in that: the cross-sectional shape of the second heat exchange unit (3) adopts the second comb-shaped teeth (3a) and the first The structure of the two comb tooth slots (3b). 4.根据权利要求1所述的一种蓄热/蓄冷式双流程半导体空调装置，其特征是：所述隔热板（9）设置在制热/制冷机芯的顶面、底面、左面、右面、背面和正面两侧。4. A heat storage/cold storage type dual-flow semiconductor air conditioner according to claim 1, wherein the heat insulating plate (9) is arranged on the top, bottom, left, Right, back and front sides. 5.根据权利要求1所述的一种蓄热/蓄冷式双流程半导体空调装置，其特征是：所述电源控制器（10）采用转换半导体制冷单元（1）的直流供电正、负极，来控制半导体制冷单元（1）是制冷还是制热的转换。5 . The thermal storage/cold storage dual-flow semiconductor air conditioner according to claim 1 , wherein the power controller ( 10 ) adopts the DC power supply positive and negative electrodes of the conversion semiconductor refrigeration unit ( 1 ) to Control the switching of whether the semiconductor refrigeration unit (1) is cooling or heating.
CN201811485265.XA 2018-12-06 2018-12-06 A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner Pending CN109631202A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110645689A (en) * 2019-10-23 2020-01-03 珠海格力电器股份有限公司 Heat collecting and utilizing device and method for improving energy utilization rate and semiconductor air conditioner
CN112665048A (en) * 2020-12-24 2021-04-16 珠海格力电器股份有限公司 Cooling device and control method thereof

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Publication number Priority date Publication date Assignee Title
CN2054882U (en) * 1989-06-20 1990-03-21 施巨英 Semiconductor-cooling/heating fan
CN101298925A (en) * 2008-06-05 2008-11-05 湖南大学 Method and device for heating by heat electric heating pump phase-change thermal storage
US20100005730A1 (en) * 2008-07-11 2010-01-14 Kuo Liang Weng Building energy storage and conversion apparatus
CN102997353A (en) * 2012-09-24 2013-03-27 陈志明 Solar electronic air conditioner and manufacture method thereof
JP5714154B1 (en) * 2014-04-14 2015-05-07 日本デジタルソフト株式会社 Building wall, floor or ceiling structure
CN205481472U (en) * 2015-12-30 2016-08-17 合肥华凌股份有限公司 Air -conditioning fan
CN205690582U (en) * 2016-06-21 2016-11-16 丁文凯 Semiconductor air conditioner is fanned
CN107270451A (en) * 2017-07-10 2017-10-20 湖南大学 A kind of air ventilating fan that function is reclaimed with electrostatic precipitation and thermoelectricity

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2054882U (en) * 1989-06-20 1990-03-21 施巨英 Semiconductor-cooling/heating fan
CN101298925A (en) * 2008-06-05 2008-11-05 湖南大学 Method and device for heating by heat electric heating pump phase-change thermal storage
US20100005730A1 (en) * 2008-07-11 2010-01-14 Kuo Liang Weng Building energy storage and conversion apparatus
CN102997353A (en) * 2012-09-24 2013-03-27 陈志明 Solar electronic air conditioner and manufacture method thereof
JP5714154B1 (en) * 2014-04-14 2015-05-07 日本デジタルソフト株式会社 Building wall, floor or ceiling structure
CN205481472U (en) * 2015-12-30 2016-08-17 合肥华凌股份有限公司 Air -conditioning fan
CN205690582U (en) * 2016-06-21 2016-11-16 丁文凯 Semiconductor air conditioner is fanned
CN107270451A (en) * 2017-07-10 2017-10-20 湖南大学 A kind of air ventilating fan that function is reclaimed with electrostatic precipitation and thermoelectricity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110645689A (en) * 2019-10-23 2020-01-03 珠海格力电器股份有限公司 Heat collecting and utilizing device and method for improving energy utilization rate and semiconductor air conditioner
CN112665048A (en) * 2020-12-24 2021-04-16 珠海格力电器股份有限公司 Cooling device and control method thereof

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Application publication date: 20190416