TWI284188B - An air conditioner with a semiconductor - Google Patents

An air conditioner with a semiconductor Download PDF

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Publication number
TWI284188B
TWI284188B TW94124008A TW94124008A TWI284188B TW I284188 B TWI284188 B TW I284188B TW 94124008 A TW94124008 A TW 94124008A TW 94124008 A TW94124008 A TW 94124008A TW I284188 B TWI284188 B TW I284188B
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TW
Taiwan
Prior art keywords
cold
cooling
heat
cycle device
semiconductor
Prior art date
Application number
TW94124008A
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Chinese (zh)
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TW200702608A (en
Inventor
Chuan-Sheng Chen
Original Assignee
Chuan-Sheng Chen
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Filing date
Publication date
Application filed by Chuan-Sheng Chen filed Critical Chuan-Sheng Chen
Priority to TW94124008A priority Critical patent/TWI284188B/en
Priority to JP2005318579A priority patent/JP2007024484A/en
Priority to AU2005229707A priority patent/AU2005229707B2/en
Priority to MYPI20055227A priority patent/MY138850A/en
Priority to KR1020050107268A priority patent/KR20070009365A/en
Publication of TW200702608A publication Critical patent/TW200702608A/en
Application granted granted Critical
Publication of TWI284188B publication Critical patent/TWI284188B/en

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Abstract

The invention is about an air conditioner with a semiconductor, especially for an air conditioner that applies a specialized semiconductor, called TCC (thermoelectric cooling chip) and the principle of the cooling cycle device. It mainly comprises TCC, a cooling cycle device, heat dissipation cycling equipment, and thermal controller. The cooling effect is produced through process of TCC first, and then transmitted through a cooling induction plate and a cooling cycle device to the cooling fins for storage. A designated temperature can be set with a button on thermal controller through either manual or remote control. The cooling energy stored in the cooling fins can be transmitted through a fan. The heat generated by TCC can be dissipated through the heat dissipation cycling equipment. This semiconductor cooling or heating device can be applied in air conditioner or freezers, and is able to achieve the designated cooling degree without using a compressor. Therefore the product becomes compact, lightweight, electricity-saving and more convenient to be installed while generating less noise and pollution.

Description

1284188 九、發明說明: 【發明所屬之技術領域】 本發明是有關一種半導體冷暖電器,尤指一種運用高科 技產品半導體,亦即熱電致冷晶片(Thermoelectric Cooling Chip),結合冷循環器原理製作而成之冷暖電器,無需使 用依靠傳統之壓縮機,即可達到所設定之冷度5以供適當 室溫之使用需要,符合環境保護與節約能源等需求,又具 有節省空間與安裝方便等等優點。 • 【先前技術】 習知冷暖氣機及電冰箱等冷暖電器,均係使用冷媒與壓 縮機來達成冷氣之使用功能,但由於壓縮機之體積笨重, 搬動與安裝均甚費力,且會產生噪音,耗電量又高,更會 影響生活環境之品質,而且為配合其會滴水與有噪音等考 量,習用冷氣機之裝設處所更受限制,於是如何製造出省 電且搬動與安裝均可方便與省力之冷暖電器產品,乃成為 本發明研發之主要目標。 【發明内容】 本發明之主要目的係為滿足冷暖電器可營造舒適之溫度 與環境,且可達到省電又符合現代生活與環保的需求,而 提供一種運用半導體冷暖電器,其主要係於熱電致冷晶片 (Thermoelectric Cooling Chip)之兩面分別結合有散熱循環 設備及冷循環器;該散熱循環設備及冷循環器係分別由 冷、熱導板裝配冷水管、散熱管及鰭片;並對著該散熱循 1284188 環設備裝設有風扇等所構成,其係由熱電致冷晶片的處理 產生冷,透過冷循環器將冷儲存於鰭片中,而以溫控器使 用介面所設之恆溫與升降溫控制按鍵來控制設定所需之溫 度,然後再透過風扇予以輸出,而熱電致冷晶片所產生之 熱,則由散熱循環設備予以冷卻,如此可使冷暖電器之冷 度在短時間内達到所需求之使用程度,而由於無需使用習 用之壓縮機,可簡化冷暖電器之整體結構,使之變得輕薄 而且容易安裝,使用方便而且省電,更不會產生噪音與環 境污染,其構造為前所未見,為一具有產業上利用價值之 發明。 【實施方式】 本發明之構造運用及其功效特點,依據附圖所示,更詳 細說明如下: 如第一、二、三圖所示,本發明運用半導體冷暖電器主 要構件包含有:電源開關1、熱電致冷晶片(Thermoelectric Cooling Chip)2、冷循環器3、散熱循環設備4、溫控器5, 其冷循環器3及散熱循環設備4係分別固設於熱電致冷晶 片2之冷產生面與熱產生面,該冷循環器3、散熱循環設 備4係分別由冷、熱導板31、41裝設冷水管32與散熱管 42、鰭片33、43,並對著該散熱循環設備4裝設有風扇44 等所構成。其係由熱電致冷晶片2的處理產生冷度,透過 冷導板31經由冷循環器3無障礙地傳輸,到鰭片33將該 冷度加以儲存,而熱電致冷晶片2所產生之熱,則由散熱 ⑤ 6 1284188 體所製成之冷暖電器,只要操作恆溫按鍵設定所需要之溫 度,即能隨心所欲穩定室内之溫度,以達到所需冷房或暖 房效果。 綜上所述,本發明運用半導體冷暖電器,係一種將高科 技產品與日常生活中之電氣產品相結合的發明,其係以熱 電致冷晶片的處理產生冷,加上冷循環器無無障礙的輸出 與傳導等作用,及鰭片的散熱原理等結合於冷暖電器,使 該電氣產品不需要使用壓縮機,亦可不需要使用冷媒,即 • 可獲得所需要之冷度,其不僅不會危害地球臭氧層造成公 害,不會製造噪音影響環境安寧,又可使電氣產品之體積 便得輕薄而容易搬運與安裝,更可節省60%〜80%之用電 量,其構造前所未見,係屬技術思想之創新,不僅具有新 穎性及進步性,且能增進使用效果,理當具有實用價值合 於發明專利要件。 【圖式簡單說明】 第一圖為本發明方塊圖; W 第二圖為本發明構造示意圖; 第三圖為本發明立體示意圖。 【主要元件符號說明】 1 -電源開關 2 -熱電致冷晶片 3 -冷循環器 4 -散熱循壞設備 5 -溫控為 81284188 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor heating and cooling appliance, in particular to a high-tech semiconductor, that is, a thermoelectric cooling chip, which is fabricated in combination with a cold cycler principle. Into the heating and cooling appliances, without the need to rely on the traditional compressor, you can achieve the set coldness 5 for the appropriate room temperature needs, in line with environmental protection and energy conservation requirements, but also save space and easy installation and so on . • [Prior Art] Conventional heating and cooling appliances such as air conditioners and refrigerators use refrigerant and compressor to achieve the function of air-conditioning. However, due to the bulky size of the compressor, it is very laborious to move and install. Noise, high power consumption, will affect the quality of the living environment, and in order to meet the dripping and noise considerations, the installation of air-conditioners is more restricted, so how to create power-saving and moving and installation The heating and cooling electrical products which are convenient and labor-saving are the main objectives of the research and development of the present invention. SUMMARY OF THE INVENTION The main object of the present invention is to meet the needs of a warm and cold electrical appliance to create a comfortable temperature and environment, and to achieve power saving and meet the needs of modern life and environmental protection, and to provide a semiconductor heating and cooling appliance, which is mainly used in thermoelectricity. The two sides of the Thermoelectric Cooling Chip are respectively combined with a heat-dissipating cycle device and a cold circulator; the heat-dissipating cycle device and the cold circulator are respectively equipped with cold water pipes, heat pipes and fins by cold and heat guide plates; The heat-dissipating 1284188 ring device is equipped with a fan, etc., which is cooled by the treatment of the thermoelectrically cooled wafer, and is cold-stored in the fin through the cold cycler, and is thermostated and lifted by the temperature controller using the interface. The temperature control button controls the temperature required for setting, and then outputs it through the fan, and the heat generated by the thermoelectrically cooled wafer is cooled by the heat-dissipating cycle device, so that the coldness of the heating and cooling device can be achieved in a short time. The degree of use of the demand, and because it does not require the use of a conventional compressor, the overall structure of the heating and cooling appliance can be simplified, making it light and thin And easy to install, easy to use and power, but does not produce noise and environmental pollution, which is unprecedented configured as having a value of the industrial use of the invention. [Embodiment] The structural application and its functional characteristics of the present invention are described in more detail below according to the drawings. As shown in the first, second and third figures, the main components of the semiconductor cooling and heating appliance of the present invention include: a power switch 1 , Thermoelectric Cooling Chip 2, Cold Circulator 3, Heat Dissipation Cycle Device 4, Temperature Controller 5, Cold Circulator 3 and Heat Dissipation Cycle Device 4 are respectively fixed to the cold generated of the thermoelectric cooling chip 2 The surface and the heat generating surface, the cold circulating device 3 and the heat-dissipating circulating device 4 are respectively provided with cold water pipes 32 and heat-dissipating pipes 42, fins 33 and 43 by the cold and heat guiding plates 31 and 41, and the heat-dissipating cycle device is attached thereto. 4 is equipped with a fan 44 and the like. It is cooled by the treatment of the thermoelectrically cooled wafer 2, transmitted unobstructed through the cold runner 3 through the cold guide plate 3, and stored to the fins 33 to store the coldness, and the heat generated by the thermoelectrically cooled wafer 2 The cooling and heating appliance made of the heat sink 5 6 1284188 can stabilize the temperature of the room as long as the temperature required by the thermostat button is set to achieve the desired cold room or greenhouse effect. In summary, the present invention utilizes a semiconductor heating and cooling appliance, which is an invention combining a high-tech product with an electrical product in daily life, which is cooled by the treatment of a thermoelectrically cooled wafer, and the cold circulator is not barrier-free. The function of output and conduction, and the heat dissipation principle of the fins are combined with the heating and cooling appliances, so that the electrical product does not need to use a compressor, and does not need to use a refrigerant, that is, the required coldness can be obtained, which not only does not harm The earth's ozone layer causes pollution, does not create noise, affects the environment, and makes the volume of electrical products light and easy to handle and install. It can save 60%~80% of electricity consumption. Its structure has never been seen before. It is an innovation of technical ideas, which not only has novelty and progress, but also enhances the use effect. It is reasonable to have practical value in combination with invention patents. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a block diagram of the present invention; the second drawing is a schematic view of the structure of the present invention; [Main component symbol description] 1 - Power switch 2 - Thermoelectric cooling chip 3 - Cold cycler 4 - Heat dissipation device 5 - Temperature control is 8

Claims (1)

1284188 十、申請專利範圍: 1. 一種運用半導體冷暖電器,其裝設於冷暖電器體内之基 本構件包含有··熱電致冷晶片(Thermoelectric Cooling Chip)、冷循環器、散熱循環設備及溫控器,其係將冷循 環器及散熱循環設備分別固設於熱電致冷晶片之冷產面 與熱產生面,該冷循環器及散熱循環設備係分別由冷、 熱導板裝配冷水管、散熱管、鰭片及風扇所構成,其係 由熱電致冷晶片之處理而產生冷,透過冷導板經由冷循 • 環器傳輸到鰭片將冷儲存,而以溫控器使用介面之控制 按键,恆溫按鍵與升降溫按鍵,利用手動或遙控方式, 設定所需的恆溫或升降溫,然後再透過風扇將鰭片所儲 存之冷能吹送輸出,其熱電致冷晶片所產生之熱係由散 熱循環設備予以冷卻排除為其特徵者。 2. 依申請專利範圍第1項所述之運用半導體冷暖電器,其 中係以一個或以上之熱電致冷晶片裝配一個冷循環器及 一個散熱循環設備為一組作為基本構件,以便按照所需 • 冷能量大小,使用一組或多組基本構件組裝而成為一體 冷暖電器者。 ⑤1284188 X. Patent application scope: 1. A semiconductor heating and cooling appliance, the basic components installed in the body of the heating and cooling electrical appliance include: Thermoelectric Cooling Chip, cold circulator, heat cycle equipment and temperature control The cold circulator and the heat-dissipating cycle device are respectively fixed on the cold-production surface and the heat-generating surface of the thermoelectric cooling chip, and the cold circulator and the heat-dissipating cycle device are respectively assembled with a cold water pipe by a cold and heat guide plate, and heat dissipation. The tube, the fin and the fan are formed by the treatment of the thermoelectrically cooled wafer to generate cold, and are transmitted through the cold guide through the cold loop to the fin for cold storage, and the control button of the interface is controlled by the thermostat. The thermostatic button and the temperature-raising button are used to set the required constant temperature or temperature by manual or remote control, and then the cold energy stored in the fin is blown and output through the fan, and the heat generated by the thermoelectrically cooled wafer is dissipated. The circulation equipment is cooled and excluded as its characteristic. 2. The use of semiconductor heating and cooling appliances according to the scope of claim 1 of the patent application, wherein one or more thermoelectric cooling chips are assembled with a cold cycler and a heat-dissipating cycle device as a basic component, as needed; The amount of cold energy, assembled using one or more sets of basic components to become a one-piece heating and cooling appliance. 5
TW94124008A 2005-07-15 2005-07-15 An air conditioner with a semiconductor TWI284188B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW94124008A TWI284188B (en) 2005-07-15 2005-07-15 An air conditioner with a semiconductor
JP2005318579A JP2007024484A (en) 2005-07-15 2005-11-01 Application of electric appliance for cooling and heating semiconductor
AU2005229707A AU2005229707B2 (en) 2005-07-15 2005-11-04 Cold/heat conditioning device with thermoelectric cooling chip
MYPI20055227A MY138850A (en) 2005-07-15 2005-11-08 Cold/heat conditioning device with thermoelectric cooling chip
KR1020050107268A KR20070009365A (en) 2005-07-15 2005-11-10 Cold/heat conditioning device with thermo-electric cooling chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94124008A TWI284188B (en) 2005-07-15 2005-07-15 An air conditioner with a semiconductor

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TW200702608A TW200702608A (en) 2007-01-16
TWI284188B true TWI284188B (en) 2007-07-21

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TW94124008A TWI284188B (en) 2005-07-15 2005-07-15 An air conditioner with a semiconductor

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JP (1) JP2007024484A (en)
AU (1) AU2005229707B2 (en)
MY (1) MY138850A (en)
TW (1) TWI284188B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109915965A (en) * 2017-12-13 2019-06-21 林世轩 With the cooling fan mechanism of refrigerating chip
US11841166B2 (en) * 2017-12-14 2023-12-12 Siu Tai Chau Semiconductor refrigeration and heating air conditioner
CN108507013A (en) * 2018-02-11 2018-09-07 青岛海尔空调器有限总公司 A kind of fresh air conditioner indoor unit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757530A (en) * 1972-04-12 1973-09-11 Control Data Corp Cooling system for data processing apparatus
US6351951B1 (en) * 1998-03-30 2002-03-05 Chen Guo Thermoelectric cooling device using heat pipe for conducting and radiating
EP1197699A3 (en) * 2000-09-20 2003-05-21 Tokai Rubber Industries, Ltd. Hydrogen fuel hose
KR100455924B1 (en) * 2002-01-31 2004-11-06 삼성전자주식회사 Cooling and Heating Apparatus Utlizing Thermoelectric Module

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TW200702608A (en) 2007-01-16
AU2005229707A1 (en) 2007-02-01
AU2005229707B2 (en) 2010-07-15
MY138850A (en) 2009-08-28
JP2007024484A (en) 2007-02-01

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