TWI661168B - At the same time can provide refrigeration and heat insulation box and its temperature control method - Google Patents

Abstract

An insulation box capable of providing both cooling and heating and heating and heating at the same time; The thermostat includes at least two sub-boxes that can independently open and close the door. At least one surface of the sub-box is made of highly conductive metal, and a semiconductor cooling chip is tightly adhered between the metal surface and the metal surface of the other sub-box. Directly use the heat conduction method to make the two sub-boxes simultaneously perform the functions of cooling and keeping cold and heating and keeping heat; and because the inside and outside of the box are closed, it can improve the insulation performance, and the box can be turned so that the door faces upward, through the temperature control element. With the automatic door opening and closing element, the specified sub-box can reach the specified temperature, and the insulation box can also have functions such as smoldering pot.

Description

Insulation box capable of providing cooling and heating and heating and heating at the same time and temperature control method thereof

This creation is a kind of insulation box with semiconductor refrigeration chip as the core. It further uses the thermal insulation technology to isolate the interference between the cooling surface and the heating surface of the semiconductor, and uses the temperature control element and the automatic door opening and closing element to make the box. Internal temperature control.

Semiconductor refrigeration sheet is also called thermoelectric refrigeration sheet. It is a kind of heat pump. It has the advantage that it can work continuously without any refrigerant, no pollution source, no rotating parts, no rotation effect, and no sliding part is a solid piece. There is no vibration, noise, and long life. It uses the Peltier effect of semiconductor materials. When direct current passes through a couple of two different semiconductor materials connected in series, the two ends of the couple can separately absorb and release heat, and can achieve cooling at the same time. And the purpose of heating; but in the past, most of the semiconductor thermal insulation boxes only used a single function at the same time. When used as a cooling function, the thermal energy is indirectly discharged to the outside of the box through the cooling fins and fans. The heat energy is indirectly absorbed from the outside through the heat sink fins and fans, and then transferred to the inside of the box through the semiconductor chip for heat preservation; meaning that the previous technology only had a single consideration of the heat radiation or heat absorption, so at least half of the energy will be wasted. It will also increase the power consumption of the fan.

A small part of the dual-temperature semiconductor incubator that emphasizes energy saving. Although both the heat absorption and heat dissipation are considered at the same time, the heat sink fins and fans or condensate pipes are added to achieve the purpose of locally controlling heat absorption or heat dissipation, so that the semiconductor refrigeration chip is used in At the same time of cooling, the heat energy absorbed can be converted into Use of heating or hot water; or used for heat preservation, can absorb the heat energy in a designated area to produce cold air or ice water. Because semiconductor refrigeration chips are low-power refrigeration and heating elements, they are used when instantaneous energy is needed. For heating and cooling air conditioners, the effect is very limited, and it is used in the supply of hot water and ice water. Due to the space limitation in the incubator, sufficient warm water cannot be supplied, making the existing dual-temperature semiconductor incubator market accepted. Can't improve.

Because the three transmission methods of thermal energy are the most efficient of conduction methods, the previous method of indirect transmission of thermal energy through fins and fans or condensate pipes will inevitably generate some thermal energy loss, and because the thermal energy is to be discharged through the medium or When it is transferred to the heat insulation inner box, the heat insulation treatment of the inside and outside of the box cannot be performed in this transmission area. When the power cannot be continuously supplied, the heat insulation effect of the entire heat preservation box will be affected. As a result, the use surface of the incubator and the use space in the box are restricted.

The creation is in a heat-insulating box with at least two sub-boxes capable of independently opening and closing the door, semiconductor cooling fins, temperature control elements, and door-opening elements; at least one surface of the sub-box is made of high conductivity It is made of metal, and the semiconductor refrigerating chip is tightly adhered between this metal surface and the metal surface of the other sub-box. The insulation gasket can be placed around the two metal surfaces, and then vacuum-treated or completely filled with insulation material. To avoid mutual interference between cold and heat between the two metal surfaces; the metal surface of one sub-box directly passes the cooling surface of the chip, and absorbs the heat energy in the sub-box in a heat-conducting manner to play the function of cooling and keeping cold, while the other sub-box The metal surface can directly transmit the heat energy into the sub-box through the heating surface of the wafer by heat conduction to play the function of heat preservation and heat preservation, while taking into account the cooling and heating parts of the semiconductor wafer, so that the heat energy is completely waste.

The insulation box of this creation has no cooling holes because it does not need a cooling fan, and there are no components that are afraid of water such as a fan in the sub-box. Therefore, the door of the box can be faced up to add other functions of the insulation box, such as smoldering pot and ice temperature thawing. Boxes, water-proof heating pots, etc .; as long as the temperature control element is connected to the semiconductor chip, when the designated insulation box is set as the cooling priority, the temperature of the semiconductor chip will continue to operate at the highest efficiency before the cooling sub-box reaches the specified temperature. The control element will drive the door opening and closing element to automatically open the door of the heating sub-box for about 1 cm, so that the excess heat energy of the heating box is naturally convected out of the box through the door gap. The user can also directly insert hot water into the cooling box. In order to absorb the heat energy, when the specified temperature is reached, the temperature control element will drive the door opening and closing element to automatically close the door of the heating sub-box and reduce the voltage or turn off the power to enter the standby insulation state of the insulation box; otherwise, when the designated insulation box In the case of thermal priority, before the heating sub-box reaches the specified temperature, in addition to the semiconductor chip will continue to operate at the highest efficiency, the temperature control element will drive the door to open and close The component automatically opens the door of the cooling box for about 1 cm to absorb the heat energy outside the box. The user can also directly insert hot water into the cooling box to provide thermal energy. When the specified temperature is reached, the temperature control element will drive the door element to open and close. The door of the heating sub-box closes automatically, and reduces the voltage or turns off the power, and enters the standby insulation state of the incubator.

1‧‧‧ Insulation Box

2‧‧‧Semiconductor refrigeration chip

3‧‧‧Refrigeration sub-box

4‧‧‧ heating box

5 ~ 6‧‧‧Sub-conductor high conductive metal surface

7‧‧‧Box insulation

8 ~ 9‧‧‧Opening and closing element

10 ~ 11‧‧‧door

12‧‧‧Sub-Box High Conductive Metal Surface Insulation Gasket

13‧‧‧Temperature control element

The first picture is the perspective of this creation

The second picture is an exploded view of this creation

The third picture is a schematic diagram of the door opening up and opening the door one centimeter to absorb the heat energy outside the box when it is used as a smoldering pot.

As shown in FIG. 2, two sub-boxes 3 and 4 made of high-conductivity metal are placed in the heat-insulating box 1, and the metal surface 5 and the other sub-box metal surface 6 are tightly adhered to each other. For the semiconductor refrigeration chip 2, a heat insulation gasket 12 can be placed around the two metal faces, and then vacuum-evacuated or completely filled with heat-insulating material to avoid mutual interference between the cold and heat between the two metal faces. The metal surface 5 directly passes through the cooling surface of the chip, and absorbs the heat energy in the sub-box by heat conduction to play the function of cooling and keeping cold. The metal surface 6 of the other sub-box 4 can directly pass through the heating surface of the chip to conduct heat. The method transfers thermal energy into the sub-box to play the function of heating and keeping heat, while taking into account the cooling and heating parts of the semiconductor wafer, so that the thermal energy is not wasted at all.

Because this design does not require a cooling fan, there can be no cooling holes outside the box, and there are no water-resistant components such as fans in the sub-box. Therefore, you can increase the function of the insulation box by turning the door upward, such as a smoldering pot and an ice temperature thawing box Water-proof heating pot, etc., as shown in Figure 3. As long as the temperature control element 13 is connected to the semiconductor wafer 2, when the designated insulation box 3 is set as the cooling priority, before the refrigeration sub-box reaches the specified temperature, except the semiconductor wafer 2 will start with In addition to continuous operation with the highest efficiency, the temperature control element 13 will drive the door opening and closing element 9 to automatically open the door 11 of the heating sub-box for about 1 cm, so that the excess heat energy of the heating box is naturally convected out of the box through the door gap. The user It is also possible to directly insert ice into the heating box 4 to absorb heat energy. When the specified temperature is reached, the temperature control element 13 will drive the opening and closing element 9 to automatically close the door 11 of the heating sub-box, and reduce the voltage or turn off the power. The incubator is in the standby insulation state; on the contrary, when the incubator 4 is designated as the heating priority, the temperature control is performed except that the semiconductor wafer 2 will continue to operate at the highest efficiency before the heating sub-box reaches the specified temperature. The element 13 will drive the door opening and closing element 8 to automatically open the door 10 of the refrigeration box for about 1 cm in order to absorb the heat energy outside the box. The user can also directly insert hot water into the refrigeration box 3 to provide heat energy. When the specified temperature is reached, The temperature control element 13 will drive the opening and closing element 8 to automatically close the door 10 of the refrigerating sub-box, reduce the voltage or turn off the power, and enter the standby insulation state of the incubator.

Claims (4)

A thermal insulation box capable of providing both cooling and heating functions, including: a thermal insulation box with a thermal insulation layer, at least two sub-boxes capable of independently opening and closing the door, a semiconductor refrigeration sheet, and a temperature control element Door opening and closing elements; characterized in that the entire cabinet is required except for the door but is not limited to a fully-closed type; the sub-box and the cabinet are required but not limited to be filled with heat-insulating material or vacuum; the sub-box is not limited to Left and right or up and down or back and forth, at least one face of each sub-box is a door, and at least one face of each sub-box is made of highly conductive metal, and the metal surface is tightly adhered to the metal surface of the other sub-box At least but not limited to a semiconductor wafer, the metal surface of one sub-box can absorb the heat energy in the sub-box through the cooling surface of the wafer, and the metal surface of the other sub-box can conduct the heat energy into the sub-box through the heating surface of the wafer. Therefore, the two sub-boxes can simultaneously perform the functions of cooling and keeping heat and heating and keeping heat separately. As described in claim 1, a thermal insulation box capable of providing both cooling and heating functions, with a semiconductor wafer with a thickness of less than 1 cm between the metal surfaces of the two sub-boxes. In this case, a thermal insulation gasket can be placed around the two metal surfaces, and then the two metal surfaces can be evacuated or filled with thermal insulation material. A method for making two sub-boxes of a heat-insulating box capable of providing cooling and heating and heat-preserving functions at the same time as described in claim 1 to increase the temperature conduction efficiency of objects in the box, which is to divide the sub-boxes on five sides except the door , Are made of high-conductivity metal and designed to be leak-proof, you can turn the side of the door of the cabinet upside down, so that water can be injected into the sub-box, and use water to increase the temperature conduction between the metal surface of the sub-box and the contents . A method for enabling the sub-boxes of the thermal insulation box described in claim 1 and 3 to provide both cooling and thermal insulation functions to reduce the cooling and increase the heating temperature. A semiconductor chip is connected to a temperature control element. When the box is set as the cooling priority, before the cooling sub-box reaches the specified temperature, in addition to the semiconductor chip will continue to operate at the highest efficiency, the temperature control element will drive the automatic opening and closing element to automatically open the door of the heating sub-box for about 1 cm. In order to transfer the excess heat energy of the heating box out of the box through natural door convection, the user can also put ice cubes in the heating box to absorb the heat energy. When the specified temperature is reached, the temperature control element will drive the door element to open and close. The door of the heating sub-box closes automatically, and the voltage or power is turned off to enter the standby insulation state of the incubator. Conversely, when the designated insulation box is the heating priority, before the heating sub-box does not reach the specified temperature, the semiconductor wafer will In addition to continuous operation at the highest efficiency, the temperature control element will drive the door opening and closing element to automatically open the door of the refrigeration box for about 1 cm in order to absorb the heat energy outside the box. The user can also Hot water is placed in the refrigeration box to provide thermal energy. When the specified temperature is reached, the temperature control element will drive the door opening and closing element to automatically close the door of the refrigeration sub-box, reduce the voltage or turn off the power, and enter the thermal insulation standby thermal insulation state.