TW202004107A - At the same time can provide refrigeration and heat insulation box and its temperature control method - Google Patents

Abstract

An insulative box capable of simultaneously providing functions of cooling, cold insulation, and heat preservation; at least two sub-tanks capable of independently opening and closing a door in a heat-insulating box having a heat-insulating layer, and at least one surface of the sub-tank is made of thermal conductivity It is made of high metal, and the semiconductor wafer is tightly adhered to the semiconductor cooling wafer between the metal surface and the metal surface of another sub-tank, and directly uses the heat conduction mode to make the two sub-tanks function at the same time for cooling, cooling, and heating and heat preservation; The inside and outside of the box are sealed, which can improve the heat preservation performance, and can turn the box upside down. Through the temperature control element and the automatic opening and closing of the door element, the specified sub-box can reach the specified temperature, so that the incubator can also be stuffy. Pot and other functions.

Description

Insulation box capable of simultaneously providing refrigeration and cold preservation and heating and thermal preservation and temperature control method

This creation is about a thermal insulation box with a semiconductor refrigeration sheet as the core. It further uses heat insulation technology to isolate the interference between the cooling surface and the heating surface of the semiconductor, and uses a temperature control element and an automatic door opening and closing element to perform the box. Internal temperature control.

The semiconductor cooling plate is also called thermoelectric cooling plate, which is a heat pump. It has the advantages that it does not require any refrigerant, can work continuously, has no pollution source, has no rotating parts, does not produce a turning effect, and has no sliding parts. There is no vibration, noise, and long life. It uses the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, and cooling can be achieved at the same time. For the purpose of heating; however, most of the conventional semiconductor insulation boxes are only used for a single function at the same time. When used as a cold insulation function, the heat energy is directly discharged to the outside of the box through the cooling fins and the fan; when used as a heat preservation function, then Heat energy is indirectly absorbed from the outside of the box through the heat dissipation fins and the fan, and then the heat energy is conducted into the box through the semiconductor chip for heat preservation; meaning that the prior art only has a single part to consider heat release or heat absorption, so at least half of the energy will be wasted It also increases the power consumption of the fan.

A small number of dual-temperature semiconductor incubators that emphasize energy saving, although considering heat absorption and heat release parts at the same time, are all equipped with cooling fins and fans or condensate pipes to achieve local control of heat absorption or heat release, so that semiconductor cooling chips are used in While keeping cold, it can turn the absorbed heat energy into heating or hot water; or while keeping warm, it can absorb the heat energy in the designated area to produce cold air or ice water, because semiconductor cooling chips are small Power cooling and heating components are used in air conditioners that need instant heating and cooling, and the effect is very limited. However, they are used in the supply of hot water and ice water. Due to space restrictions in the incubator, they cannot provide sufficient temperature. Water makes the market acceptance of the existing dual-temperature semiconductor incubator always unable to increase.

Since the three heat energy transmission methods are the most efficient by conduction, the prior art method of indirect transmission of heat energy through cooling fins and fans or condensate pipes will inevitably cause some heat loss, and because the heat energy is discharged through the medium or Transfer to the heat preservation inner box, the heat treatment inside and outside the box cannot be carried out in this transfer area, and the heat preservation effect of the whole heat preservation box will be affected when the power supply cannot be continued; also because the box body has heat dissipation holes, it is not suitable for rotating the box body. The use surface of the heat preservation box and the use space in the box are restricted.

This creation is in a thermal insulation box with a heat insulation layer, at least including two sub-boxes that can independently open and close the door, semiconductor cooling plates, temperature control elements, and door opening and closing elements; at least one side of the sub-box is made of high conductivity It is made of metal, and the semiconductor cooling chip is tightly adhered between the metal surface and the metal surface of the other sub-box. Heat insulation gaskets can be put around the two metal surfaces for vacuum treatment or completely filled with insulation materials In order to avoid the mutual interference between the cold and heat of the two metal surfaces; the metal surface of one sub-box directly absorbs the heat energy in the sub-box through the cooling surface of the chip through the heat conduction, and exerts the function of cooling and cooling, while the other sub-box The metal surface can directly transfer the heat energy to the sub-box through the heating surface of the wafer by thermal conduction to play the role of heating and heat preservation, while taking into account the cooling and heating of the semiconductor wafer, so that the heat energy is completely waste.

The insulation box of this creation has no heat dissipation holes because it does not require a cooling fan, and there are no fans or other water-resistant components in the sub-box, so you can increase the other functions of the insulation box by pointing the door up, such as smoldering pot, ice temperature thaw Box, water heater, etc.; as long as the temperature control element is connected to the semiconductor chip, when the designated incubator is set to cooling priority, before the cooling sub-box does not reach the specified temperature, in addition to the semiconductor chip will continue to operate with the highest efficiency, the temperature The control element will drive the door opening and closing element to automatically open the door of the heating sub-box for about 1 cm, so that the excess heat energy of the heating box will be naturally convected out of the body through the door slit, and the user can also directly enter the hot water in the cooling box In order to absorb heat energy, when the specified temperature is reached, the temperature control element will drive the switch door element to automatically close the door of the heating sub-box, and reduce the voltage or turn off the power to enter the standby state of the insulation box; otherwise, when the designated insulation box is When heat is given priority, before the heating sub-box reaches the specified temperature, in addition to the semiconductor chip will continue to operate with the highest efficiency, the temperature control element will drive the door element to automatically open the door of the cooling box for about 1 cm, so as to absorb the outside of the box Heat energy, users can also directly put hot water in the cooling box to provide heat energy. When the specified temperature is reached, the temperature control element will drive the door switch element to automatically close the door of the heating sub-box, and reduce the voltage or turn off the power to enter The incubator is in standby state.

1‧‧‧Insulation box

2‧‧‧Semiconductor cooling chip

3‧‧‧Refrigeration sub-box

4‧‧‧heating sub-box

5~6‧‧‧Sub-box high conductive metal surface

7‧‧‧Box insulation

8~9‧‧‧door opening and closing element

10~11‧‧‧ door

12‧‧‧Sub-box high-conductivity metal surface heat insulation gasket

13‧‧‧Temperature control element

Figure 1 is a perspective of creation

Figure 2 is an exploded view of this creation

Figure 3 is a schematic diagram of the door opening up and closing the door element when the box is used as a smoldering pot, and the door is opened by one centimeter to absorb the heat energy outside the box

As shown in Fig. 2, two sub-boxes 3 and 4 with at least one surface made of high-conductivity metal are placed inside the thermal insulation box body 1, and the metal surface 5 is tightly adhered to the metal surface 6 of the other sub-box The semiconductor refrigeration chip 2 can be covered with a heat insulation gasket 12 around the two metal surfaces, and then be evacuated or completely filled with heat insulation materials to avoid mutual interference between the cold and heat of the two metal surfaces; The metal surface 5 directly passes through the cooling surface of the wafer to absorb the heat energy in the sub-box by heat conduction, thereby exerting the function of cooling and cooling, and the metal surface 6 of the other sub-box 4 can directly pass through the heating surface of the wafer to conduct heat The heat energy is transferred into the sub-box in order to play the role of heating and heat preservation, and at the same time take into account the cooling and heating of the semiconductor wafer, so that the heat energy is not wasted at all.

Because no cooling fan is needed for this creation, there is no need for cooling holes outside the box, and there are no fans or other water-resistant components in the sub-box, so the door can be turned up to increase the function of the insulation box, such as smoldering pot, ice temperature thaw box , Water heater, etc., as shown in Figure 3; as long as the temperature control element 13 is connected to the semiconductor wafer 2, when the designated heat preservation box 3 is set to the cooling priority, before the cooling sub-box does not reach the specified temperature, except the semiconductor wafer 2 will In addition to continuous operation with the highest efficiency, the temperature control element 13 will drive the switch door element 9 to automatically open the door 11 of the heating sub-box for about 1 cm, so that the excess heat energy of the heating box will be naturally convected out of the box body through the door gap, the user It is also possible to directly insert ice cubes in the heating box 4 to absorb heat energy. When the specified temperature is reached, the temperature control element 13 will drive the door element 9 to automatically close the door 11 of the heating sub-box, and reduce the voltage or turn off the power to enter The thermal insulation box is in the standby thermal insulation state; conversely, when the thermal insulation box 4 is designated as the heating priority, before the heating sub-box reaches the specified temperature, in addition to the semiconductor chip 2 will continue to operate with the highest efficiency, the temperature control element 13 will drive the switch door The element 8 automatically opens the door 10 of the refrigeration box for about 1 cm in order to absorb the heat energy outside the box. The user can also directly insert hot water into the refrigeration box 3 to provide heat energy. When the specified temperature is reached, the temperature control element 13 will drive The door opening and closing element 8 automatically closes the door 10 of the cooling sub-box, reduces the voltage or turns off the power, and enters the standby state of the heat preservation box.

1‧‧‧Insulation box

2‧‧‧Semiconductor cooling chip

3‧‧‧Refrigeration sub-box

4‧‧‧heating sub-box

5~6‧‧‧High conductive metal surface of the sub-box

7‧‧‧Box insulation

8~9‧‧‧door opening and closing element

10~11‧‧‧ door

Claims (4)

An insulation box capable of simultaneously providing functions of cooling, cooling and heating, including: an insulation box with a heat insulation layer, at least two sub-boxes capable of opening and closing the door independently, a semiconductor cooling chip, and a temperature control element 1. Door opening and closing element; its feature is that the whole box is required except for the door but not limited to a fully enclosed type. It is required but not limited to be filled with thermal insulation material or vacuum between the sub box and the box. The sub box is not limited to Left-right or up-down or back-and-forth arrangement, at least one face of each sub-box is a door, and at least one face of each sub-box is made of highly conductive metal, which is tightly adhered to the metal face of the other sub-box At least but not limited to a semiconductor wafer, so that the metal surface of one sub-box can absorb the heat energy in the sub-box via the cooling surface of the wafer, and the metal surface of the other sub-box can conduct the heat energy into the sub-box via the heating surface of the wafer, Therefore, the two sub-boxes can simultaneously play the functions of cooling, cooling and heating. As described in claim 1, the metal surfaces of the two sub-boxes are only separated by a thickness of less than 1 cm, which will absorb and dissipate heat from each other and produce a cancellation situation. It can be placed around the two metal surfaces. After the heat insulation gasket, vacuum treatment or fill the heat insulation material between the two metal surfaces. A method for increasing the temperature conduction efficiency of the two sub-boxes of claim 1 by making the five surfaces of the sub-box except the door all made of high-conductivity metal and designed to be sealed and watertight. Turn the door face of the box upwards, so that the sub-box can be filled with water, and use water to increase the temperature conduction between the metal surface of the sub-box and the contents. A method for reducing the cooling and increasing the heating temperature of the sub-box described in item 1, 3 is to connect the semiconductor chip to the temperature control element. When the designated heat preservation box is set to the cooling priority, the cooling sub-box does not reach the specified temperature In the past, in addition to the semiconductor chip will continue to operate with the highest efficiency, the temperature control element will drive the automatic opening and closing element to automatically open the door of the heating sub-box for about 1 cm, so that the excess heat energy of the heating box can be naturally convected out through the door slit Outside the box, the user can also put ice cubes in the heating box to absorb the heat energy. When the specified temperature is reached, the temperature control element will drive the door switch element to automatically close the door of the heating sub-box, and reduce the voltage or turn off the power , Enter the standby insulation state of the insulation box; conversely, when the designated insulation box is the heating priority, before the heating sub-box reaches the specified temperature, in addition to the semiconductor chip will continue to operate with the highest efficiency, the temperature control element will drive the switch door element The door of the cooling box is automatically opened for about 1 cm to absorb the heat energy outside the box. The user can also put hot water in the cooling box to provide heat energy. When the specified temperature is reached, the temperature control element will drive the door element The door of the heat sub-box is automatically closed, and the voltage is reduced or the power is turned off, and the standby state of the heat preservation box is entered.

Images