CN2580507Y - Heat radiation device - Google Patents
Heat radiation device Download PDFInfo
- Publication number
- CN2580507Y CN2580507Y CN 02242351 CN02242351U CN2580507Y CN 2580507 Y CN2580507 Y CN 2580507Y CN 02242351 CN02242351 CN 02242351 CN 02242351 U CN02242351 U CN 02242351U CN 2580507 Y CN2580507 Y CN 2580507Y
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- CN
- China
- Prior art keywords
- heat
- heat radiator
- cooling
- radiator
- liquid coolant
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a heat radiating device, which is helpful to reduce a heat source, such as the temperature of a central processor of a computer. The heat radiating device comprises a first heat radiating fin, a second heat radiating fin, a heat conducting pipe and a cooling element, wherein, the first heat radiating fin is contacted with the heat source. Both ends of the heat conducting pipe are respectively pivoted with the first heat radiating fin and the second heat radiating fin in a rotatable mode, in order to the transmit the heat of the first heat radiating fin to the second heat radiating fin. The cooling element comprises a casing, wherein, the casing is provided with a coolant and a surface. The surface is contacted with the second heat radiating fin, in order to receive the heat of the second heat radiating fin, and the coolant is used for reducing the temperature of the surface.
Description
Technical field
The utility model particularly reduces the temperature of central processing unit in the host computer about a kind of heat abstractor.
Background technology
Many electronic components, for example central processing unit (CPU) can produce many heats in running, and then improves component temperature.Yet temperature is too high, will make element function worsen, and damages other connected electronic components on every side.Therefore, must effectively and apace too much heat be removed, operate normally to guarantee electronic component.
Common heat dissipating method is that additional a slice heat radiator is in electronical elements surface.Further, on heat radiator, install a fan again additional to promote radiating effect.General heat radiator is selected the material of energy quick heat radiating, for example aluminium or copper etc. for use.In addition, heat radiator has many fins usually to increase the surface area of heat radiation.And by contact, the heat of electronic component will be passed to heat radiator, and arround by heat radiator heat being distributed in the air, reduce temperature of electronic component by this.
In addition, common heat dissipating method still has water-cooled heat abstractor.This device comprises a water tank and a cooling medium, and for example water in addition, is guided the water pipe that circulate coolant flows in addition, drives the motor of cooling medium operation etc.The heat abstractor of this class, though respond well, because water pipe need be installed in host computer inside, the doubt that probably has aqueous vapor to leak, and then cause in the main frame electronic component to make moist and damage.
Yet because development of technology, the heat that many electronic components produced also relatively improves now.Therefore, seeking more effective radiating mode is considerable target.
Summary of the invention
A purpose of the present utility model is to reduce the temperature of host computer inside chip, for example the temperature of central processing unit (CPU).
Heat abstractor of the present utility model comprises first heat radiator, second heat radiator, a heat pipe and a cooling element.First heat radiator has first surface and second surface.First surface contacts with thermal source, and the heat of conduction heat sources is to second surface.The two ends of heat pipe rotatably articulate first heat radiator and second heat radiator respectively.Heat pipe is in order to transmit heat to the second heat radiator of first heat radiator.Second heat radiator has the 3rd surface and the 4th surface.The 3rd surface and the 4th surface selectivity ground are smooth surface, have the surface of fin or the surface of undaform.Cooling element comprises a shell.This shell holds a cooling medium, and has a surface.This surface has first side and second side.First side optionally contacts the 3rd surface or the 4th surface, is passed to the 5th surface in order to the heat with second heat radiator.Liquid coolant is in order to promote the 5th surface cooling.
Can be further understood by following detailed Description Of The Invention and appended diagram about advantage of the present utility model and spirit.
Description of drawings
Fig. 1 a is the side schematic view of embodiment one;
Fig. 1 b is the stereographic map of embodiment one;
Fig. 2 a and 2b are application synoptic diagram of the present utility model;
Fig. 3 is the synoptic diagram that embodiment second heat radiator contacts with cooling element;
Fig. 4 a is the cooling element synoptic diagram of embodiment two;
Fig. 4 b is that second heat radiator of embodiment two contacts synoptic diagram with cooling element; With
Fig. 5 is the side schematic view of embodiment three.
Embodiment
The utility model is a kind of heat abstractor, helps to reduce the element that can produce high temperature in the host computer, for example the temperature of central processing unit (CPU).
Fig. 1 a and 1b are side schematic view and the schematic perspective view of embodiment one.Heat abstractor of the present utility model comprises first heat radiator (first heat sink), 10, second heat radiator 20, heat pipe (heat pipe) 25 and cooling element (cooling device) 30.First heat radiator 10 has first surface (surface) 11 and second surface 12.First surface 11 contacts with thermal source 100, and the heat of conduction heat sources 100 is to second surface 12.This first surface 10 is a smooth surface, so could closely contact with thermal source 100.Second surface 12 optionally is one to have the surface of fin, to increase area of dissipation, promotes radiating efficiency.
The two ends of heat pipe 25 rotatably articulate first heat radiator 10 and second heat radiator 20 respectively respectively.Heat pipe 25 is in order to transmit heat to the second heat radiator 20 of first heat radiator 10.Second heat radiator 20 has 21 and 1 the 4th surface 22, one the 3rd surface.The 21 and the 4th surface 22, the 3rd surface optionally is smooth surface, has the surface of fin or the surface of undaform.Cooling element comprises a shell.Hold a cooling medium in this shell 33, and have the side of one the 5th surface 31 in shell 33.This 5th surface 31 has first side 311 and second side 312.First side 311 optionally contacts the 21 or the 4th surface 22, the 3rd surface, is passed to the 5th surface 31 in order to the heat with second heat radiator 20.This 5th surface 31 is the surface of a rubber material optionally, has elasticity and also can be out of shape because of being subjected to external force.33 for holding a liquid coolant 35 in the shell.Liquid coolant 35 is in order to cool off the temperature on the 5th surface 31.
Fig. 2 a and Fig. 2 b are the synoptic diagram that the utility model is applied to host computer 200.Has a perforate 201 on the bottom surface of main frame 200 or the side casing, in order to dispose second heat radiator 20.Outside this second heat radiator 20 optionally is exposed to the 21 or the 4th surface 22, the 3rd surface on demand.Then, second heat radiator 20 connects the 5th surface 31 of above-mentioned cooling element 30, can promote the radiating efficiency of thermal source 100.
Fig. 3 is the synoptic diagram that embodiment one second heat radiator 20 contacts with cooling element 30.Because the 5th surface 31 is a rubber surface, therefore work as second heat dissipation element 20 with second surface 22, i.e. during male and fomale(M﹠F) contact, the 5th surface 31 will be out of shape with the surface configuration of second heat radiator 20.In addition, if, then help the 5th surface 31 to be obedient to second surface 22, to promote contact area between the two in second side, 312 some protrusions 37 of configuration of the 5th table 31.
Fig. 4 a is cooling element 30 synoptic diagram of embodiment two.In the present embodiment, further comprise a cooling tube 39 in the shell 33, liquid coolant 35 comes down to flow in cooling tube 39.In addition, for promoting liquid coolant 35 streams, cooling element 30 is also installed a drive unit 40, and for example motor flows in cooling tube 39 to drive liquid coolant 35.Fig. 4 b is that second heat radiator 20 of embodiment two contacts synoptic diagram with cooling element 30.For promoting the heat sinking benefit of cooling tube 39, the rectangle that the 22 and the 5th surface 31, the 4th surface can be as shown in FIG. is concavo-convex.So, the recess of configurable second side 312 in the 5th surface 31 of cooling tube 39 to increase contact area, is promoted cooling effect.
Though the utility model discloses as above with preferred embodiment, so it is not in order to limiting the utility model, anyly is familiar with present technique field person, in not breaking away from spirit and scope of the present utility model, when doing a little change and retouching.As shown in Figure 5, what present embodiment was different with previous embodiment is to have lacked second heat radiator 20 and heat pipe 25.Yet similarly, the first surface 11 of first heat radiator 10 contacts with thermal source 100, but second surface 12 directly contacts with the 5th surface 31 of cooling element 30.Therefore this creation utility model the protection domain scope definition that ought look accompanying claims be as the criterion.
By the above detailed description of preferred embodiments, be to wish to know more to describe feature of the present utility model and spirit, and be not to come category of the present utility model is limited with the above-mentioned preferred embodiment that is disclosed.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the desire application of the utility model institute of various changes and tool equality.
Claims (11)
1, a kind of heat abstractor, cooling be the interior thermal source of a host computer but, and this host computer comprises a casing, and this casing has a perforate, it is characterized in that, this device comprises:
First heat radiator, this first heat radiator has first surface and second surface, and this first surface contacts with this thermal source, supplies to receive the heat of this thermal source to this second surface;
Second heat radiator, this second fin arrangement on this opening, and comprise the 3rd the surface with the 4th surface;
One heat pipe, the two ends of this heat pipe rotatably articulate this first heat radiator and this second heat radiator respectively, supply to transmit the heat of this first heat radiator to this second heat radiator; And
One cooling element, this cooling element comprises a shell, this shell has one the 5th surface, and hold a cooling medium in interior cloth, the 5th surface selectivity ground contact the 3rd surface and the 4th surface, to the 5th surface, this liquid coolant cooling is the 5th surface but in order to the heat that receives this second heat radiator.
2, heat abstractor as claimed in claim 1 is characterized in that, this shell further comprises a cooling tube, flows in this cooling tube for this liquid coolant.
3, heat abstractor as claimed in claim 2 is characterized in that, this cooling element further comprises a drive unit, flows in this cooling tube for driving this liquid coolant.
4, heat abstractor as claimed in claim 1, it is characterized in that, the 5th surface further comprises first side and second side, this first side is in order to optionally to contact the 3rd surface and the 4th surface, this second side has a protrusion, in order to increase the contact area of the 5th surface and this two heat radiator.
5, heat abstractor as claimed in claim 1 is characterized in that, the 5th surface comprises a rubber surface.
6, heat abstractor as claimed in claim 1 is characterized in that, this liquid coolant comprises cold coal.
7, heat abstractor as claimed in claim 1 is characterized in that, this thermal source comprises a central processing unit.
8, a kind of heat abstractor, cooling be the interior central processing unit of a host computer but, and this host computer comprises a casing, and this casing has a perforate, it is characterized in that, this device comprises:
First heat radiator, this first heat radiator has first surface and second surface, this first surface contacts with this central processing unit, in order to the heat that receives this central processing unit to this second surface;
Second heat radiator, this second fin arrangement on this opening, and comprise the 3rd the surface with the 4th surface;
One heat pipe, the two ends of this heat pipe articulate this first heat radiator and this second heat radiator in rotatable mode respectively, supply to transmit the heat of this first heat radiator to this second heat radiator;
One cooling element, this cooling element comprises a shell, this shell has a cooling tube and the 5th surface, this cooling tube holds a liquid coolant and flows in this cooling tube, the 5th surface selectivity ground contact the 3rd surface and the 4th surface, to the 5th surface, this liquid coolant cooling is the 5th surface but in order to the heat that receives this second heat radiator; And
One drive unit flows in this cooling tube for driving this liquid coolant.
9, heat abstractor as claimed in claim 8, it is characterized in that, the 5th surface further comprises first side and second side, this first side is in order to optionally to contact the 3rd surface and the 4th surface, this second side has a protrusion, in order to increase the contact area of the 5th surface and this two heat radiator.
10, heat abstractor as claimed in claim 8 is characterized in that, the 5th surface comprises a rubber surface.
11, heat abstractor as claimed in claim 8 is characterized in that, this liquid coolant comprises cold coal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02242351 CN2580507Y (en) | 2002-08-02 | 2002-08-02 | Heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02242351 CN2580507Y (en) | 2002-08-02 | 2002-08-02 | Heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2580507Y true CN2580507Y (en) | 2003-10-15 |
Family
ID=33714937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02242351 Expired - Lifetime CN2580507Y (en) | 2002-08-02 | 2002-08-02 | Heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2580507Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7701708B2 (en) | 2007-02-08 | 2010-04-20 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation assembly |
| CN104684353A (en) * | 2013-11-29 | 2015-06-03 | Abb公司 | Electric apparatus |
| JP2017204491A (en) * | 2016-05-09 | 2017-11-16 | 富士通株式会社 | Heat radiator and rework device |
| CN107426953A (en) * | 2017-09-06 | 2017-12-01 | 昆山昌禾精密电子有限公司 | A kind of metab for being easy to radiating |
-
2002
- 2002-08-02 CN CN 02242351 patent/CN2580507Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7701708B2 (en) | 2007-02-08 | 2010-04-20 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation assembly |
| CN101242732B (en) * | 2007-02-08 | 2011-01-05 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator combination |
| CN104684353A (en) * | 2013-11-29 | 2015-06-03 | Abb公司 | Electric apparatus |
| CN104684353B (en) * | 2013-11-29 | 2017-07-21 | Abb公司 | Electrical equipment |
| JP2017204491A (en) * | 2016-05-09 | 2017-11-16 | 富士通株式会社 | Heat radiator and rework device |
| CN107426953A (en) * | 2017-09-06 | 2017-12-01 | 昆山昌禾精密电子有限公司 | A kind of metab for being easy to radiating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120802 Granted publication date: 20031015 |