CN217640121U

CN217640121U - Novel integrated intelligent semiconductor refrigeration computer radiator

Info

Publication number: CN217640121U
Application number: CN202220424577.5U
Authority: CN
Inventors: 杜洪文; 朱文忠; 肖顺兴; 斯洪诚; 谢康康; 李韬; 谢林森; 车璇; 李伟夫
Original assignee: Sichuan University of Science and Engineering
Current assignee: Sichuan University of Science and Engineering
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-10-21
Anticipated expiration: 2032-03-01

Abstract

The utility model discloses a novel integral type intelligence semiconductor refrigeration computer radiator, including water-cooling pump head, heat dissipation machine-, the surface of heat dissipation machine-is provided with the water-cooling pump head, the water-cooling pump head includes water pump, fastener, red copper base, pagoda formula joint, water pipe, the heat dissipation machine includes that wind cold water is cold to be arranged, semiconductor refrigeration piece XH-C, heat pipe radiator. The utility model discloses the controllability is high, it is simple and easy to use, low cost, compare oil-cooling, compressor refrigeration, liquid nitrogen, cooling methods such as dry ice, but more have the controllability, can batch production, better be applied to most users, possess noiselessness, no vibration, do not need the refrigerant, small, characteristics such as light in weight, and the reliable operation, the refrigeration speed is extremely fast, easily carry out the controllable regulation of the cold volume of difference in temperature, avoid the problem of comdenstion water, the refrigeration temperature can be less than ambient temperature and even be less than 0 degree, the big difference in temperature refrigeration characteristic that possesses, can better solve the problem of generating heat under the intensive technology of super large integrated circuit.

Description

Novel integrated intelligent semiconductor refrigeration computer radiator

Technical Field

The utility model relates to a temperature control and refrigeration technology field specifically are a novel integral type intelligence semiconductor refrigeration computer radiator.

Background

In life, various environments using computers need to use computer radiators. With the continuous pursuit of human beings on chip computing power, the number of super-large scale integrated circuit transistors is higher and higher, the density of each computing unit is continuously improved, and higher frequency also brings higher working voltage and power consumption to the chip. It is expected that in the coming years we will continue to seek to improve the computing performance of the chip, which means we also need to continuously and continuously overcome the heat dissipation problem of the chip temperature, and the controllability of the existing heat sink is not ideal when in use, and the manufacturing cost is high, so the heat sink needs to be optimized by a structure.

The integrated intelligent semiconductor refrigeration computer radiator in the prior art has the defects that:

1. patent document CN110968171A discloses a computer heat sink, "including a computer heat sink main body and heat dissipation fins arranged on the surface of the computer heat sink main body, wherein the computer heat sink main body is a square column structure, the heat dissipation fins are transversely arranged on two opposite side surfaces of the computer heat sink main body and are integrally formed with the computer heat sink main body, and the other two opposite side surfaces of the computer heat sink main body are provided with embedded grooves for installing fans. The computer radiator of the invention is favorable to heat dissipation, but when the device is used, the device is similar to air cooling and water cooling on the market, and is a familiar heat dissipation mode for everyone, and in fact, the integral water cooling is used at ordinary times, part of the principle still belongs to the category of air cooling, but the heat conducting medium of the radiator is replaced by the automatic circulation principle of evaporation-condensation of a heat pipe, and is conducted by liquid driven by the active circulation of a water pump motor, and finally all heat is transferred to the environment through the rotation of a fan to form forced convection, so that the heat of fins or cold rows is transferred to the environment to help the chip to cool, therefore, the air cooling and water cooling radiators both belong to a passive heat dissipation mode, and because the temperature difference range generated by the high temperature of the chip and the low temperature of the environment determines the traditional radiator as a heat carrier, the temperature of the chip can only be reduced to be close to the environment temperature at most;

2. in order to solve the temperature problem and achieve some extreme targets, most customers continuously try to cool down oil cooling, compressor refrigeration, liquid nitrogen, dry ice and the like, an OCZCRYO-Z series compressor which is used in the retail market can enable the temperature of an evaporator to reach-45 ℃ through phase change refrigeration, and even foreign enthusiasts can reduce the temperature to-196 ℃ through a self-made three-stage compressor system, which is equivalent to the evaporation temperature of the liquid nitrogen. Meanwhile, batch production of the market cannot be formed;

3. in addition, the whole installation process does not usually pass professional safety detection, and the durability has certain defects;

4. a computer player directly pastes the cold surface of the semiconductor refrigeration piece to the surface of a CPU or a GPU and combines with an air-cooled hybrid radiator, but the radiator is easy to cause the problem of condensed water. Because the semiconductor refrigeration piece has the cold and hot end, the cold and hot difference in temperature is great, and the cold junction is lower temperature, and the invariable temperature of cold junction is difficult to control, once the temperature control to the cold junction is made bad and is caused the condensation water condensation and will cause the flooding short circuit to burn out whole mainboard and periphery.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel integral type intelligence semiconductor refrigeration computer radiator to solve the problem that proposes in the above-mentioned background art.

In order to achieve the purpose, the utility model provides the following technical scheme, a novel integrated intelligent semiconductor refrigerating computer radiator comprises a water-cooling pump head and a heat radiator, wherein the water-cooling pump head is arranged on the outer surface of the heat radiator;

the water-cooling pump head comprises a water pump, a buckle, a red copper base, a pagoda type joint and a water pipe.

Preferably, the heat radiator comprises an air-cooling water cooling row, a semiconductor cooling plate XH-C and a heat pipe radiator.

Preferably, the air-cooling water-cooling row comprises an intelligent temperature control module, an intelligent speed-regulating double-row fan and a water-cooling row.

Preferably, the heat pipe radiator comprises a heat pipe, an aluminum radiating fin and an intelligent debugging fan.

Preferably, the intelligent temperature control module comprises a liquid crystal temperature display screen, a temperature adjusting button and an unlocking screen for displaying.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses the controllability is high, uses simply, low cost.

2. The utility model discloses compare oil-cooling, compressor refrigeration, liquid nitrogen, cooling methods such as dry ice more have the controllability, can batch production, better be applied to most users.

3. The utility model discloses possess noiselessness, no vibration, do not need characteristics such as refrigerant, small, light in weight, and the reliable operation, refrigeration speed is extremely fast, easily carries out the controllable regulation of the cold volume of difference in temperature, avoids the problem of comdenstion water.

4. The utility model discloses refrigeration temperature can be less than ambient temperature and be less than 0 degree even, and the big difference in temperature refrigeration characteristic that possesses can better solve the problem of generating heat under the intensive technology of super large integrated circuit.

5. The utility model provides promote the treater performance of ordinary application, but accurate intelligent control, but batch production, the other type overclocking instrument of controllable volume.

Drawings

FIG. 1 is a perspective view of the present invention;

fig. 2 is a schematic sectional view of the water-cooling bar structure of the present invention.

In the figure: 1. water-cooling the pump head; 2-4, a heat radiator; 101. a water pump; 102. a fastener; 103. a red copper base; 104. a pagoda type joint; 105. a water pipe; 2. cold discharging of wind and cold water; 3. a semiconductor refrigerating plate XH-C1212; 4. A heat pipe radiator; 201. an intelligent temperature control module; 202. an intelligent speed-regulating double-row fan; 203. water cooling and draining; 401. comprises a heat pipe; 402. aluminum heat dissipation fins; 403. intelligently debugging the fan; 2011. a liquid crystal temperature display screen; 2012. a temperature adjusting button; 2013. and displaying on an unlocking screen.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

referring to fig. 1 and 2, an embodiment of the present invention provides a novel integrated intelligent semiconductor refrigeration computer radiator, including a water-cooling pump head 1 and a heat dissipation machine 2-4, the water-cooling pump head 1 is disposed on the outer surface of the heat dissipation machine 2-4, a water pump 101 is disposed inside the water-cooling pump head 1, a red copper base 103 is disposed at the bottom of the water-cooling pump head 1, a refrigeration module inside the heat dissipation machine 2-4 is semiconductor refrigeration, an air-cooling water cooling row 2 is disposed on the upper portion of the inner space of the heat dissipation machine 2-4, a semiconductor refrigeration sheet XH-C12123 is connected below the air-cooling water cooling row 2, and a heat pipe radiator 4 is connected to the lower portion of the inner space of the heat dissipation machine 2-4 below the semiconductor refrigeration sheet XH-C12123;

the water-cooling pump head 1 comprises a water pump 101, a fastener 102, a red copper base 103, a pagoda type joint 104 and a water pipe 105, wherein the fastener 102 extended from two ends of the water-cooling pump head 1 can ensure that the red copper base 103 of the water-cooling pump head 1 is stably fixed on a CPU or a GPU after being coated with heat-conducting silicone grease.

The heat radiator 2-4 comprises an air-cooling water cooling row 2, a semiconductor refrigerating sheet XH-C12123 and a heat pipe radiator 4, wherein an intelligent speed-regulating double-row fan 202 is arranged above the water cooling row 203, a heat-conducting silicone grease is coated below the water cooling row 203 and is linked with a cooling surface of the semiconductor refrigerating sheet XH-C12123, and a high intelligent temperature control module 201 which has the same length and the same sum of the height of the three components is arranged in front of the water cooling row 203, the intelligent speed-regulating double-row fan 202 and the semiconductor refrigerating sheet XH-C12123.

The heat pipe radiator 4 comprises a heat pipe 401, an aluminum radiating fin 402 and intelligent debugging fans 403, wherein the surface of the red copper base 103 embedded with the heat pipe 401 is connected with the hot surface of a semiconductor refrigerating fin XH-C12123 by coating heat-conducting silicone grease, the heat pipe 401 is extended to be embedded into dozens of aluminum radiating fins 402, two intelligent debugging fans 403 are arranged on two sides of the heat pipe, forced convection is formed by the automatic circulation principle of evaporation-condensation of the heat pipe and the rotation of the fans, the heat of fins or cold rows is transferred to the environment to help the chip cool, and the aluminum radiating fin 402 is also called as fins.

The intelligent temperature control module 201 comprises a liquid crystal temperature display screen 2011, a temperature adjusting button 2012 and an unlocking screen display 2013.

The utility model discloses in, the device's working procedure as follows:

after a user coats CPU or GPU with heat-conducting silica gel, the water-cooling pump head 1 is buckled on the CPU or GPU and is installed on a mainboard through a buckle 102, a power supply is connected and then can be used, heat of the CPU or GPU is rapidly transferred to cold liquid through heat-conducting silica gel and a red copper base 103, the water-cooling pump head 1 transports hot cooling liquid to a water-cooling row 203 through a water pump 101, the water-cooling row 203 transfers part of heat to the environment through an intelligent speed-regulating double-row fan 202, the other part of heat generates enough temperature difference through a semiconductor refrigerating sheet and transfers the heat to the hot surface of the semiconductor sheet, the heat is dissipated through a heat pipe radiator 4 and two intelligent debugging fans, an intelligent temperature control module 201 displays the real-time cooling liquid on a liquid crystal temperature display screen 403 through a temperature sensor in the water-cooling row 203, the temperature control is completed by adjusting the rotating speed of the fans and the working temperature adjusting time period of the semiconductor refrigerating sheet, the user can adjust the temperature of a novel intelligent water-cooling computer system through a temperature key 2012 and an unlocking screen display 2013 according to the real-time temperature of the CPU and the GPU, and the temperature of the computer to control and realize the indirect water-cooling system.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a novel integral type intelligence semiconductor refrigeration computer radiator, includes water-cooling pump head (1), heat dissipation machine (2-4), its characterized in that: the outer surface of the heat radiator (2-4) is provided with a water-cooling pump head (1);

the water-cooling pump head (1) comprises a water pump (101), a buckle (102), a red copper base (103), a pagoda type joint (104) and a water pipe (105).

2. The novel integrated intelligent semiconductor refrigeration computer radiator of claim 1, wherein: the heat radiator (2-4) comprises an air cooling water cooling row (2), a semiconductor cooling plate XH-C1212 (3) and a heat pipe radiator (4).

3. The novel integrated intelligent semiconductor refrigeration computer radiator of claim 2, wherein: the air cooling water cooling row (2) comprises an intelligent temperature control module (201), an intelligent speed regulation double-row fan (202) and a water cooling row (203).

4. The novel integrated intelligent semiconductor refrigeration computer radiator of claim 2, wherein: the heat pipe radiator (4) comprises a heat pipe (401), an aluminum radiating fin (402) and an intelligent debugging fan (403).

5. The novel integrated intelligent semiconductor refrigeration computer radiator of claim 3, wherein: the intelligent temperature control module (201) comprises a liquid crystal temperature display screen (2011), a temperature adjusting key (2012) and an unlocking screen display (2013).