CN200966201Y - High efficient fan-free heat radiation device - Google Patents
High efficient fan-free heat radiation device Download PDFInfo
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- CN200966201Y CN200966201Y CN 200620149182 CN200620149182U CN200966201Y CN 200966201 Y CN200966201 Y CN 200966201Y CN 200620149182 CN200620149182 CN 200620149182 CN 200620149182 U CN200620149182 U CN 200620149182U CN 200966201 Y CN200966201 Y CN 200966201Y
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Abstract
The utility model relates to an effective fan free heat sink which is designed to meet the demands for the temperature stability of industrial heating equipment such as two dimensional displays, computers, large power laser diodes or power supplies. The device can realize a heating dispersion effect without a fan and noise. A heating module comprises a front heat accumulator, a heat accumulating channel, a heat insulation layer, an airflow channel and a rear radiating unit. The arrangement of the insulation layer makes the rear radiating unit be isolated in the airflow channel and the corresponding heat current completely be controlled by the heat accumulating channel. The radiating manner of the heat sink is that after the front heat accumulator finishes a heat accumulation, the heat is discharged by the heat accumulating channel to the rear radiating unit and ultimately discharged by radiating fins positioned on the rear radiating unit. The radiating fins are arranged below the airflow channel with an upper opening and a lower opening, and the gas expands after the heating of the radiating fins and then is formed into a hot airflow to rise and discharge, thereby realizing a heat discharge by making use of the flow of the gas.
Description
Technical field
The utility model relates to the heat abstractor of industrial heat-producing devices such as flat-panel screens, computer, high power laser diode or power supply unit, be specifically related to a kind of high efficiency heat radiator without fan, belong to International Classification of Patents G06F1/20 " cooling means of data processing equipment ", H01L23/34 " cooling device of semiconductor or other solid state device parts, ventilation unit " technical field.
Background technology
Now, industrial heat-producing devices such as flat-panel screens, computer, high power laser diode or power supply unit have improved use power.But when the high-power heat that produces is not suitably got rid of, reduce performance or damage device because of overheated easily.Light emitting module with large-scale LCD is an example, this light-emitting diode is parallel between liquid crystal panel and the reflected bottom plate, along with the panel of flat-panel screens increases gradually, the quantity of light-emitting diode also constantly promotes, the a large amount of heat energy of accumulation under the high power running, the temperature that directly has influence on luminous element itself constantly rises, luminous element brightness meeting changes and the luminosity reduction along with temperature produces colour temperature, therefore in the time of can't effectively conducting to the external world as if heat, will cause the temperature contrast of display panels excessive, have a strong impact on display effect and display performance.
The radiating mode of general display in the prior art, kind is more, and most of radiator fan that uses quickens its thermal convection, from shell body fin shape radiating surface heat release is come out again.The heat dissipation design that therefore different structure is arranged is to satisfy the radiating requirements of backlight module, for example: disclosed content in the patents such as US 2006132699, JP2006222254 and KR2005003751.Yet above-mentioned patent all has the radiator fan high speed rotating and produces the shortcoming of big noise.
Summary of the invention
At above-mentioned deficiency of the prior art, the purpose of this utility model is to provide a kind of flat-panel screens or apparatus such as computer of making, and need not use fan can reach the good device of the smooth and easy heat radiation of air flows---high efficiency heat radiator without fan.
The purpose of this utility model is achieved through the following technical solutions.
A kind of high efficiency heat radiator without fan comprises preceding heat collection body, thermal-arrest passage, heat insulation layer, gas channel and back heat-sink unit body.Back heat-sink unit body comprises back heating panel and fin-shaped fin, and the fin-shaped fin evenly is arranged on the heating panel of back.Gas channel comprises the air-flow air inlet of bottom and the air-flow exhaust outlet on top.The combination of this device is a heat collection body before closely being connected by the flat-panel screens light emitting module, and preceding heat collection body closely connects heat insulation layer, is provided with the thermal-arrest passage in the middle of the bottom of heat insulation layer, and heat insulation layer connects back heat-sink unit body.Back heat-sink unit body places the below of gas channel cavity, and the fin-shaped fin of back heat-sink unit body places in the gas channel of upper and lower gas flow opening, and gas channel is established insulating back panel.This gas channel, the biside plate of the back radiating area that constitutes for the heat insulation layer between preceding heat collection body and the back heat-sink unit body and heat-insulating material and the cavity space of upper and lower opening that backboard forms.Whole device is installed on the pedestal.
Preceding heat collection body and back segment heat-sink unit body intermediate gaps all use insulation material layer to fill up except that the thermal-arrest passage.The back heat-sink unit body two sides and the back side also are made up of adiabatic backboard, its purpose is terminated in the gas channel of upper and lower opening back segment heat-sink unit body, so leading portion heat collection body and the mutual hot-fluid of back segment heat-sink unit body are fully via thermal-arrest heat conduction that passage is controlled.
Being applied to the situation of computer heat radiation, is to extend thermal-collecting tube by the central processing unit that is located on the circuit substrate, and the end in addition of thermal-collecting tube is connected with preceding heat collection body, and remaining setting and connected mode are the same.
The heat-sink unit body is made by high-thermal conductive metal material or metal fever pipe, and its shape can be plate body or tubular body.
The thermal-arrest passage can be made by semiconductor cooler, diamond layer, diamond coated metal or metal.The size of thermal-arrest passage can high-volume be adjusted according to actual hot type.
The dividing plate that heat insulation layer is made up of heat-insulating material is made, the centre of heat collection body and back heating panel before placing.
The fin-shaped fin of fin-shaped fin on the back heat-sink unit body for being arranged in parallel up and down.
Back heat-sink unit body, the back heating panel of its composition and fin-shaped fin can be made with aluminium or copper product.The area of back heating panel can be adjusted according to heat extraction demand difference.
Design of the present utility model can be eliminated the noise that is produced by fan, guarantees the flat-panel screens heat abstractor of radiating efficiency simultaneously.The utility model can discharge unnecessary heat not using under fan, the noiseless hungry situation, avoids precision equipment to reduce performance or damage because of overheated.
Description of drawings
Fig. 1 is the decomposition assembling schematic diagram of the utility model heat abstractor;
Fig. 2 is the transverse cross-sectional view of flat-panel screens heat abstractor.
Fig. 3 is the transverse cross-sectional view of computer radiating apparatus.
Fig. 4 is the top plan view of heat abstractor.
Among the figure: 11-flat-panel screens light emitting module, 12-central processing unit, 13-circuit substrate, 14-pedestal; Thermal-arrest heat pipe before the heat collection body before the 21-, 22-, 3-heat insulation layer, the adiabatic backboard of 31-gas channel, 4-thermal-arrest passage, 5, back heat-sink unit body, heating panel behind the 51-, 52-fin-shaped fin, 6-upper and lower opening gas channel, 61-air-flow air inlet, 62-air-flow exhaust outlet.
Embodiment
Embodiment 1: the utility model structure applications is in the situation of LCD heat radiation.
Heat radiation with the luminous backlight module 11 of flat-panel screens is an example, and structure of the present invention can not used under the fan condition, and backlight module 11 is worked under the state of stable temperature.
Referring to Fig. 1, Fig. 2 and Fig. 4, this heat abstractor is located at the rear of a liquid crystal panel backlight module 11, and radiating module comprises leading portion heat collection body 21, heat insulation layer 3, thermal-arrest passage 4, gas channel 6, back heating panel 51 and fin-shaped fin 52.
Concrete radiating mode: liquid crystal display backlight module 11 back sides and leading portion heat collection body 21 usefulness thermal greases are fitted fixing.On the another side of preceding heat collection body 21,, on the other end of thermal-arrest passage 4, be fixed in back heating panel 51 with the thermal grease applying with the front end face of thermal grease applying thermal-arrest passage 4.Leading portion heat collection body 21 is middle with back segment heat-sink unit body 5, all uses heat insulation layer 3 to fill up except that thermal-arrest passage 4 and separates.In addition, the two sides of back heat-sink unit body and the back side also are made up of adiabatic backboard 31, its objective is back heat-sink unit body is isolated in the heat insulation gas channel 6 of upper and lower opening, and its hot-fluid only passes through via 4 controls of thermal-arrest passage.This thermal-arrest passage 4 uses the heat of semiconductor cooler attraction leading portion heat collection body 21, thereby preceding heat collection body 21 can be discharged into heat back segment heating panel 51 and fin-shaped fin 52 fast.
The heat of above-mentioned discharging improves the temperature of back heating panel 51 and fin-shaped fin 52.Because of fin-shaped fin 52 places below in the upper and lower opening gas channel 6, gas expands through fin 52 heating backs, forms the thermal current fast rise, by open top 62 discharges.Produce certain vacuum degree simultaneously, attract the bottom cold air by in air inlet 61 admission passages.Cold air adds hot driving again via the fin 52 that is arranged in parallel up and down, and the gas Automatic Cycle is flowed, thereby has reached the purpose of discharging heat.
Embodiment 2: structure applications of the present invention is in the situation of computer cpu heat radiation.
The present invention is not using under the fan condition, and central processing unit is worked under the state of stable temperature.Referring to Fig. 3, heat abstractor includes: preceding thermal-arrest heat pipe 22, heat insulation layer 3, thermal-arrest passage 4, gas channel 6, back heating panel 51 and fin-shaped fin 52.
The step of heat radiation is as follows: the heating back side of central processing unit 12 and preceding thermal-arrest heat pipe 22 usefulness thermal greases are fitted fixing, on the other end of preceding thermal-arrest heat pipe 22,, on the other end of thermal-arrest passage 4, be fixed in back heating panel 51 with the thermal grease applying with the front end face of thermal grease applying thermal-arrest passage 4.Before the back segment heat-sink unit body, except that thermal-arrest passage 4, all use heat insulation layer 3 to separate.In addition, before the cell cube of back heat radiation, its two sides and the back side also are made up of adiabatic backboard 31, its objective is back heat-sink unit body is isolated in the heat insulation gas channel 6 of upper and lower opening.Hot-fluid is only via 4 controls of thermal-arrest passage, and this thermal-arrest passage 4 uses semiconductor cooler to absorb the heat of preceding thermal-arrest heat pipe 22.Thereby the heat of preceding thermal-arrest heat pipe 22 can be discharged into back heating panel 51 and fin-shaped fin 52, the temperature of heating panel 51 and fin-shaped fin 52 raising after making fast.Because radiating fin 52 places the interior below of upper and lower opening gas channel 6, gas expands after the heating of fin-shaped fin 52, forms the thermal current fast rise, is discharged by the opening 62 at top.Simultaneously, produce certain vacuum degree, attract the bottom cold air to be entered in the gas channel 6 by air inlet 61, cold air adds hot driving again via the fin 52 that is arranged in parallel up and down, so the mobile order ground of getting rid of heat that reaches of gas Automatic Cycle.
The brief summary of radiator structure of the present utility model and radiating mode is as follows: heaters such as flat-panel screens or computer engage with thermal grease with preceding heat collection body and fix, and are fixed in thermal-arrest passage front end face with the thermal grease joint on the another side of preceding heat collection body.The back heating panel is fixed in the thermal grease joint in other end at the thermal-arrest passage, and the heat of preceding heat collection body is discharged into back heating panel and fin by the thermal-arrest passage, and heat makes the temperature raising of back heating panel and contact fin.Because of this radiating fin has placed below in the upper and lower opening gas channel, the gas bulging of splashing after fin-shaped fin heating becomes thermal current to rise to be discharged by the top exhaust port, attract the bottom cold air to enter simultaneously, reach the mobile voluntarily order ground of getting rid of heat of gas by air inlet.
Claims (8)
1. high efficiency heat radiator without fan is characterized in that: it comprises preceding heat collection body (21), thermal-arrest passage (4), heat insulation layer (3), gas channel (6) and back heat-sink unit body (5); Back heat-sink unit body (5) comprises back heating panel (51) and fin-shaped fin (52), and fin-shaped fin (52) evenly is arranged on the back heating panel (51); Gas channel (6) comprises the air-flow air inlet (61) of bottom and the air-flow exhaust outlet (62) on top;
The combination of this device is a heat collection body (21) before closely being connected by flat-panel screens light emitting module (11), preceding heat collection body (21) closely connects heat insulation layer (3), be provided with thermal-arrest passage (4) in the middle of the bottom of heat insulation layer (3), heat insulation layer (3) connects back heat-sink unit body (5), space between preceding heat collection body (21) and the back heat-sink unit body (5), except that thermal-arrest passage (4), all fill up by insulation material layer;
Back heat-sink unit body (5) places the below of gas channel (6) cavity, and the fin-shaped fin (52) of back heat-sink unit body (5) places upper and lower air-flow to open in the gas channel (6) of (62,61), and gas channel (6) is established adiabatic backboard (31);
Whole device is installed on the pedestal (14).
2. high efficiency heat radiator without fan according to claim 1, it is characterized in that: when this heat abstractor is applied to the heat radiation of computer, be to extend thermal-collecting tube (22) by the central processing unit (12) that is located on the circuit substrate (13), the end in addition of thermal-collecting tube (22) is connected with preceding heat collection body (21), and other setting and connected mode are with claim 1.
3. high efficiency heat radiator without fan according to claim 1, it is characterized in that: described back heat-sink unit body (5) is made by high-thermal conductive metal material or metal fever pipe, its shape can be plate body or tubular body, and the two sides of back heat-sink unit body (5) and the back side are made up of adiabatic backboard (31).
4. high efficiency heat radiator without fan according to claim 1, it is characterized in that: described thermal-arrest passage (4) can be made by semiconductor cooler, diamond layer, diamond coated metal or metal, and the size of thermal-arrest passage (4) can high-volume be adjusted according to actual hot type.
5. high efficiency heat radiator without fan according to claim 1 is characterized in that: the dividing plate that described heat insulation layer (3) is made up of heat-insulating material is made, and places the centre of preceding heat collection body (21) and back heating panel (51).
6. high efficiency heat radiator without fan according to claim 1, it is characterized in that: described gas channel (6), the biside plate of the back radiating area that constitutes for the heat insulation layer (3) between preceding heat collection body (21) and back heat-sink unit body (5) and heat-insulating material and the cavity space of upper and lower opening that backboard forms.
7. high efficiency heat radiator without fan according to claim 1 is characterized in that: the fin-shaped fin of the fin-shaped fin (52) on the described back heat-sink unit body (5) for being arranged in parallel up and down.
8. high efficiency heat radiator without fan according to claim 1, it is characterized in that: described back segment heat-sink unit body (5), the back heating panel (51) of its composition is made with available aluminium of fin-shaped fin (52) or copper product, and the area of back heating panel (51) can be adjusted according to heat extraction demand difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620149182 CN200966201Y (en) | 2006-10-30 | 2006-10-30 | High efficient fan-free heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620149182 CN200966201Y (en) | 2006-10-30 | 2006-10-30 | High efficient fan-free heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200966201Y true CN200966201Y (en) | 2007-10-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620149182 Expired - Fee Related CN200966201Y (en) | 2006-10-30 | 2006-10-30 | High efficient fan-free heat radiation device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470219A (en) * | 2015-12-05 | 2016-04-06 | 重庆元创自动化设备有限公司 | Protection-type heat dissipation device |
| WO2017143587A1 (en) * | 2016-02-26 | 2017-08-31 | 华为技术有限公司 | Optical assembly packaging structure, optical assembly, optical module and related devices and systems |
| CN107305292A (en) * | 2016-04-20 | 2017-10-31 | 佳能株式会社 | Head mounted display and grasping device |
| CN111124090A (en) * | 2020-01-19 | 2020-05-08 | 湖南玖泓节能科技有限公司 | Heat dissipation system for passive heat dissipation of computer |
-
2006
- 2006-10-30 CN CN 200620149182 patent/CN200966201Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470219A (en) * | 2015-12-05 | 2016-04-06 | 重庆元创自动化设备有限公司 | Protection-type heat dissipation device |
| WO2017143587A1 (en) * | 2016-02-26 | 2017-08-31 | 华为技术有限公司 | Optical assembly packaging structure, optical assembly, optical module and related devices and systems |
| US10644481B2 (en) | 2016-02-26 | 2020-05-05 | Huawei Technologies Co., Ltd. | Optical component packaging structure, optical component, optical module, and related apparatus and system |
| CN107305292A (en) * | 2016-04-20 | 2017-10-31 | 佳能株式会社 | Head mounted display and grasping device |
| US10477730B2 (en) | 2016-04-20 | 2019-11-12 | Canon Kabushiki Kaisha | Head-mounted display and gripping apparatus |
| CN111124090A (en) * | 2020-01-19 | 2020-05-08 | 湖南玖泓节能科技有限公司 | Heat dissipation system for passive heat dissipation of computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Youzhen Document name: Notification to Pay the Fees |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071024 Termination date: 20091130 |