CN220041848U - Chip heat abstractor of semiconductor refrigeration piece joint heat pipe - Google Patents
Chip heat abstractor of semiconductor refrigeration piece joint heat pipe Download PDFInfo
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- CN220041848U CN220041848U CN202320667824.9U CN202320667824U CN220041848U CN 220041848 U CN220041848 U CN 220041848U CN 202320667824 U CN202320667824 U CN 202320667824U CN 220041848 U CN220041848 U CN 220041848U
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- heat
- fixedly connected
- chip
- main board
- heat dissipation
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000005057 refrigeration Methods 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000002791 soaking Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 230000007246 mechanism Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of chip heat dissipation, and provides a chip heat dissipation device with a semiconductor refrigeration sheet combined with a heat pipe, which comprises a main board component, wherein a heat exchange component is fixedly connected to the middle part of the upper surface of the main board component, the heat exchange component comprises a vapor chamber and a heat pipe heat exchanger, one end of the heat pipe heat exchanger is fixedly connected with a fin radiator, and the middle part of one end of the upper surface of the main board component is fixedly connected with a supporting component; the support assembly comprises a support box and support posts, the support posts are fixedly connected to four corners of the bottom surface of the support box, and heat dissipation holes are uniformly formed in the bottom surface of the support box. The heat exchange assembly and the support assembly are arranged, so that the problem that the existing chip heat dissipation device generally dissipates heat in a mode that the driving mechanism drives the fan blades to rotate, and the heat dissipation efficiency is low is solved; and the bottom of the chip is clung to the main board in the existing chip heat dissipation device of the semiconductor refrigeration sheet combined heat pipe, so that the bottom heat dissipation effect of the chip is poor, and the problem of poor overall heat dissipation performance is caused.
Description
Technical Field
The utility model relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation device with a semiconductor refrigeration sheet combined with a heat pipe.
Background
The chip in the present electronic equipment is an indispensable device, and the device can generate larger heat when in use, if the device does not actively dissipate heat, the device can cause the temperature to be too high and the performance to be reduced, and even burn the chip, so the present electronic equipment is generally provided with a heat dissipation device which is specially used for dissipating heat and cooling the chip in a device so as to actively dissipate heat of the chip and control the temperature of the chip within a certain range. The electronic chip heat dissipating device disclosed in the prior art comprises a cooling plate, a soaking plate, a thermoelectric cooling plate, a second soaking plate, a heat pipe heat exchanger, a fan and a heat pipe, wherein the cooling plate is clung to one surface of a chip far away from a base, the soaking plate is clung to the thermoelectric cooling plate, the second soaking plate is far away from the thermoelectric cooling plate, the second soaking plate is communicated with the soaking plate through the heat pipe heat exchanger, the heat radiator is fixed on the surface of the second soaking plate, and the fan is used for dissipating heat of the second soaking plate; the device can utilize thermoelectric cooling piece to cool the chip surface, transfers the heat from thermoelectric cooling piece to the radiator in time through the heat pipe heat exchanger and takes away by the fan, and the whole heat dissipation process does not need liquid cooling, can realize better radiating effect.
However, the following drawbacks still exist in practical use: the bottom of chip is hugged closely with the mainboard to lead to the bottom radiating effect of chip relatively poor, lead to whole heat dispersion relatively poor, have certain limitation in use.
In view of this, the present utility model provides a chip heat dissipation device with a semiconductor refrigeration sheet combined with a heat pipe.
Disclosure of Invention
The utility model provides a chip heat dissipation device with a semiconductor refrigeration sheet combined with a heat pipe, which solves the problems that the bottom of a chip is clung to a main board, so that the bottom heat dissipation effect of the chip is poor, the integral heat dissipation performance is poor and certain limitation exists in use of the traditional chip heat dissipation device through a heat exchange assembly and a support assembly.
The technical scheme of the utility model is as follows:
the utility model provides a chip heat abstractor of semiconductor refrigeration piece joint heat pipe, includes, mainboard subassembly, middle part fixedly connected with heat transfer subassembly on the mainboard subassembly upper surface, and heat transfer subassembly includes vapor chamber and heat pipe heat exchanger, and heat pipe heat exchanger one end fixedly connected with fin radiator, and mainboard subassembly upper surface one end middle part fixedly connected with supporting component.
Preferably, the supporting component comprises a supporting box and a strut, the strut is fixedly connected to four corners of the bottom surface of the supporting box, and the bottom surface of the supporting box is uniformly provided with heat dissipation holes; the heat dissipation holes are arranged, so that the heat dissipation of the chip body is facilitated.
Preferably, the two ends of the upper surface of the supporting box are fixedly connected with U-shaped clamping pieces, and the four corners of the upper surface of the supporting box are provided with second screw holes, and the number of the second screw holes is four; the U-shaped clamping piece is convenient for fixing the chip body structurally.
Preferably, the upper end of the supporting box is connected with a chip body in a clamping way, and the upper surface of the chip body is connected with a refrigerating sheet body in a clamping way; the cooling fin body is arranged, so that heat dissipation to the chip body is facilitated.
Preferably, the surfaces of the two side ends of the soaking plate are fixedly connected with an L-shaped piece, the lower part of the outer side surface of the L-shaped piece is fixedly connected with a second fixing piece, and the middle part of the upper surface of the second fixing piece is provided with a second fixing hole; the second fixing piece and the second fixing hole are arranged, so that the soaking plate is convenient to fix structurally.
Preferably, the main board assembly comprises a main board body and a supporting rod, the supporting rod is fixedly connected to one end of the upper surface of the main board body, a first screw hole is formed in the middle of one end of the upper surface of the main board body, first fixing pieces are fixedly connected to the lower parts of the end surfaces of the two sides of the main board body, and first fixing holes are formed in the middle of the upper surface of the first fixing pieces in a penetrating mode; by the first stationary blade and the first fixed orifices that set up, be convenient for carry out structural fixing to the mainboard body.
Preferably, the middle part of one end of the upper surface of the main board component is fixedly connected with a heat dissipation component, the heat dissipation component comprises a motor and fan blades, and the fan blades are uniformly and fixedly connected to the end part of the peripheral surface of an output shaft of the motor; the motor is used for driving the fan blades to rotate.
Preferably, the lower part of the peripheral surface of the motor is fixedly connected with a mounting plate, and the edge of the upper surface of the mounting plate is uniformly provided with mounting holes; the mounting plate and the mounting hole are arranged, so that the motor is convenient to fix structurally.
The working principle and the beneficial effects of the utility model are as follows:
1. the heat exchange assembly is arranged, so that the heat exchange assembly has the advantage of being convenient for improving the heat dissipation efficiency of the chip, and the problem that the conventional chip heat dissipation device is limited in use because the fan blade is driven by the driving mechanism to rotate for heat dissipation is solved;
2. the support component is arranged, so that the heat dissipation device has the advantage of being convenient for the bottom of the chip to dissipate heat, and solves the problems that the bottom of the chip is clung to the main board when the conventional chip heat dissipation device with the semiconductor refrigerating sheet combined with the heat pipe is used, so that the bottom of the chip is poor in heat dissipation effect, the whole heat dissipation performance is poor, and certain limitation exists in use.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
Fig. 1 is a schematic diagram of the overall structure of a chip heat dissipating device with a semiconductor cooling fin combined with a heat pipe according to the present utility model;
fig. 2 is a schematic diagram of a main board assembly of a chip heat dissipating device with a semiconductor cooling fin and a heat pipe according to the present utility model;
fig. 3 is a schematic diagram of a heat exchange assembly of a chip heat dissipating device with a semiconductor refrigeration sheet and a heat pipe according to the present utility model;
fig. 4 is a schematic structural diagram of a supporting component of a chip heat dissipating device with a semiconductor cooling fin and a heat pipe according to the present utility model.
In the figure: 100. a main board assembly; 110. a main board body; 111. a first screw hole; 120. a support rod; 130. a first fixing piece; 131. a first fixing hole; 200. a support assembly; 210. a support box; 211. a second screw hole; 212. a heat radiation hole; 220. a support post; 230. a U-shaped clamping piece; 300. a heat dissipation assembly; 310. a motor; 320. a mounting piece; 321. a mounting hole; 330. fan blades; 400. a heat exchange assembly; 410. a soaking plate; 420. an L-shaped member; 430. a second fixing piece; 431. a second fixing hole; 440. a heat pipe heat exchanger; 450. a fin radiator; 500. a chip body; 600. a refrigerating sheet body.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, an embodiment of the utility model provides a chip heat dissipating device with a semiconductor refrigeration sheet combined with a heat pipe, which comprises a main board assembly 100, wherein a heat exchanging assembly 400 is fixedly connected to the middle part of the upper surface of the main board assembly 100, the heat exchanging assembly 400 comprises a vapor chamber 410 and a heat pipe heat exchanger 440, one end of the heat pipe heat exchanger 440 is fixedly connected with a fin radiator 450, and the middle part of one end of the upper surface of the main board assembly 100 is fixedly connected with a supporting assembly 200.
Specifically, the support assembly 200 includes a support box 210 and a support column 220, wherein the support column 220 is fixedly connected to four corners of the bottom surface of the support box 210, and the bottom surface of the support box 210 is uniformly provided with heat dissipation holes 212; the two ends of the upper surface of the supporting box 210 are fixedly connected with U-shaped clamping pieces 230, the upper end of the supporting box 210 is connected with a chip body 500 in a clamping manner, and the upper surface of the chip body 500 is connected with a refrigerating sheet body 600 in a clamping manner.
In order to realize stable support of the support box 210, the support assembly 200 uses four support posts 220 to support, and the four corners of the upper surface of the support box 210 are provided with the second screw holes 211, that is, the number of the second screw holes 211 is four.
The heat dissipation mode of this device is: the heat soaking plate 410 transfers the heat converted from the refrigerating sheet body 600 to the fin radiator 450 through the heat pipe exchanger 440, and then rapidly dissipates the heat through the fin radiator 450, and the chip body 500 is supported on the support box 210 in the support assembly 200, and the heat dissipation holes 212 on the bottom surface of the support box 210 are arranged, so that the bottom surface of the chip body 500 is conveniently dissipated.
It should be noted that, the chip heat dissipation device of the present utility model is mainly applicable to electronic devices with large internal space, such as industrial control devices, because the chip needs to be arranged overhead through the supporting box; the method is not suitable for electronic equipment such as computers, notebook computers, tablet computers and the like with high requirements on the compactness of the internal space.
In some embodiments, the heat dissipating device may further be fixedly connected with an L-shaped member 420 on two side end surfaces of the soaking plate 410, and a second fixing piece 430 is fixedly connected to a lower portion of an outer side surface of the L-shaped member 420, and a second fixing hole 431 is provided in a middle portion of an upper surface of the second fixing piece 430.
The main board assembly 100 comprises a main board body 110 and a supporting rod 120, the supporting rod 120 is fixedly connected to one end of the upper surface of the main board body 110, a first screw hole 111 is formed in the middle of one end of the upper surface of the main board body 110, first fixing pieces 130 are fixedly connected to the lower portions of the two side end surfaces of the main board body 110, and first fixing holes 131 are formed in the middle of the upper surface of the first fixing pieces 130 in a penetrating mode.
Meanwhile, the heat dissipation assembly 300 may be fastened to the middle of one end of the upper surface of the main board assembly 100, and the heat dissipation assembly 300 includes a motor 310 and fan blades 330, the fan blades 330 are uniformly and fixedly connected to the end of the peripheral surface of the output shaft of the motor 310, and the lower part of the peripheral surface of the motor 310 is fixedly connected with a mounting plate 320, and the edge of the upper surface of the mounting plate 320 is uniformly provided with a mounting hole 321.
In use, the fan blade 330 is driven to rotate by the rotation of the motor 310, so that the bottom of the chip body 500 can be cooled through the cooling hole 212.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (6)
1. The chip heat dissipation device with the semiconductor refrigeration sheet combined with the heat pipe is characterized by comprising a main board assembly (100), wherein a heat exchange assembly (400) is fixedly connected to the middle part of the upper surface of the main board assembly (100), the heat exchange assembly (400) comprises a vapor chamber (410) and a heat pipe heat exchanger (440), one end of the heat pipe heat exchanger (440) is fixedly connected with a fin radiator (450), and the middle part of one end of the upper surface of the main board assembly (100) is fixedly connected with a supporting assembly (200);
the support assembly (200) comprises a support box (210) and a support column (220), the support column (220) is fixedly connected to four corners of the bottom surface of the support box (210), heat dissipation holes (212) are uniformly formed in the bottom surface of the support box (210), U-shaped clamping pieces (230) are fixedly connected to two ends of the upper surface of the support box (210), a chip body (500) is connected to the upper end of the support box (210) in a clamping mode, and a refrigerating sheet body (600) is connected to the upper surface of the chip body (500) in a clamping mode.
2. The heat sink of the semiconductor refrigeration sheet combined heat pipe according to claim 1, wherein the four corners of the upper surface of the supporting case (210) are provided with second screw holes (211), and the number of the second screw holes (211) is four.
3. The heat sink of claim 1, wherein the soaking plate (410) is fixedly connected with an L-shaped member (420) at two side end surfaces thereof, a second fixing piece (430) is fixedly connected to a lower portion of an outer side surface of the L-shaped member (420), and a second fixing hole (431) is formed in a middle portion of an upper surface of the second fixing piece (430).
4. The chip heat dissipation device of a semiconductor refrigeration sheet combined heat pipe according to claim 1, wherein the main board assembly (100) comprises a main board body (110) and a supporting rod (120), the supporting rod (120) is fixedly connected to one end of the upper surface of the main board body (110), a first screw hole (111) is formed in the middle of one end of the upper surface of the main board body (110), first fixing pieces (130) are fixedly connected to the lower portions of the two side end surfaces of the main board body (110), and first fixing holes (131) are formed in the middle of the upper surface of the first fixing pieces (130).
5. The chip heat dissipating device of a semiconductor refrigeration fin combined heat pipe according to claim 1, wherein a heat dissipating component (300) is fixedly connected to a middle part of one end of an upper surface of the main board component (100), and the heat dissipating component (300) comprises a motor (310) and fan blades (330), and the fan blades (330) are uniformly and fixedly connected to end parts of a peripheral surface of an output shaft of the motor (310).
6. The heat sink of claim 5, wherein the lower part of the peripheral surface of the motor (310) is fixedly connected with a mounting plate (320), and the edge of the upper surface of the mounting plate (320) is uniformly provided with mounting holes (321).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320667824.9U CN220041848U (en) | 2023-03-30 | 2023-03-30 | Chip heat abstractor of semiconductor refrigeration piece joint heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320667824.9U CN220041848U (en) | 2023-03-30 | 2023-03-30 | Chip heat abstractor of semiconductor refrigeration piece joint heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220041848U true CN220041848U (en) | 2023-11-17 |
Family
ID=88724766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320667824.9U Active CN220041848U (en) | 2023-03-30 | 2023-03-30 | Chip heat abstractor of semiconductor refrigeration piece joint heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220041848U (en) |
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2023
- 2023-03-30 CN CN202320667824.9U patent/CN220041848U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20231211 Address after: 223800, 1st Floor, Building 4B, Beidou Electronic Information Industry Park, Suqian High tech Industrial Development Zone, Suqian City, Jiangsu Province Patentee after: Suqian Qisling Intelligent Technology Co.,Ltd. Address before: 223800, Third Floor, Factory Building 1 #, Longyun, Industrial Park, Longhe Town, Sucheng District, Suqian City, Jiangsu Province Patentee before: Jiangsu Qixiling Electronic Technology Co.,Ltd. |