CN218888890U - 热扩散设备以及电子设备 - Google Patents

热扩散设备以及电子设备 Download PDF

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Publication number
CN218888890U
CN218888890U CN202222310468.3U CN202222310468U CN218888890U CN 218888890 U CN218888890 U CN 218888890U CN 202222310468 U CN202222310468 U CN 202222310468U CN 218888890 U CN218888890 U CN 218888890U
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CN
China
Prior art keywords
thermal diffusion
support portion
diffusion device
core structure
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202222310468.3U
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English (en)
Chinese (zh)
Inventor
沼本龙宏
向井刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
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Publication of CN218888890U publication Critical patent/CN218888890U/zh
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202222310468.3U 2021-11-16 2022-08-31 热扩散设备以及电子设备 Active CN218888890U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021186250 2021-11-16
JP2021-186250 2021-11-16

Publications (1)

Publication Number Publication Date
CN218888890U true CN218888890U (zh) 2023-04-18

Family

ID=85939223

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202222310468.3U Active CN218888890U (zh) 2021-11-16 2022-08-31 热扩散设备以及电子设备
CN202280074978.5A Pending CN118251580A (zh) 2021-11-16 2022-11-11 热扩散器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202280074978.5A Pending CN118251580A (zh) 2021-11-16 2022-11-11 热扩散器件

Country Status (5)

Country Link
US (1) US20240302105A1 (https=)
JP (1) JP7647922B2 (https=)
CN (2) CN218888890U (https=)
TW (1) TWI865963B (https=)
WO (1) WO2023090265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025079557A1 (ja) * 2023-10-10 2025-04-17 株式会社村田製作所 電子機器
CN117190762A (zh) * 2023-10-24 2023-12-08 深圳市顺熵科技有限公司 吸液芯及其制备方法、均温板
WO2026018633A1 (ja) * 2024-07-16 2026-01-22 株式会社村田製作所 熱拡散デバイス、電子機器及び熱拡散デバイス用のウィック

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002062071A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP3967697B2 (ja) * 2002-08-21 2007-08-29 三星電子株式会社 平板型熱伝逹装置及びその製造方法
TWM336673U (en) * 2008-02-04 2008-07-11 Celsia Technologies Taiwan Inc Vapor chamber and supporting structure thereof
JP6176433B2 (ja) * 2013-01-10 2017-08-09 株式会社Welcon ベーパチャンバ
CN211060713U (zh) * 2017-04-28 2020-07-21 株式会社村田制作所 均热板、散热器件以及电子设备
JP6462771B2 (ja) * 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ
JP7137783B2 (ja) * 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
JP2019082264A (ja) * 2017-10-27 2019-05-30 古河電気工業株式会社 ベーパーチャンバ
TWM605285U (zh) * 2020-08-21 2020-12-11 建準電機工業股份有限公司 均溫板結構

Also Published As

Publication number Publication date
US20240302105A1 (en) 2024-09-12
WO2023090265A1 (ja) 2023-05-25
TW202328618A (zh) 2023-07-16
JP7647922B2 (ja) 2025-03-18
JPWO2023090265A1 (https=) 2023-05-25
CN118251580A (zh) 2024-06-25
TWI865963B (zh) 2024-12-11

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