TWI865963B - 熱擴散裝置及具備其之電子機器 - Google Patents

熱擴散裝置及具備其之電子機器 Download PDF

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Publication number
TWI865963B
TWI865963B TW111143365A TW111143365A TWI865963B TW I865963 B TWI865963 B TW I865963B TW 111143365 A TW111143365 A TW 111143365A TW 111143365 A TW111143365 A TW 111143365A TW I865963 B TWI865963 B TW I865963B
Authority
TW
Taiwan
Prior art keywords
heat diffusion
support portion
diffusion device
frame
wall surface
Prior art date
Application number
TW111143365A
Other languages
English (en)
Chinese (zh)
Other versions
TW202328618A (zh
Inventor
沼本竜宏
向井剛
Original Assignee
日商村田製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商村田製作所股份有限公司 filed Critical 日商村田製作所股份有限公司
Publication of TW202328618A publication Critical patent/TW202328618A/zh
Application granted granted Critical
Publication of TWI865963B publication Critical patent/TWI865963B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW111143365A 2021-11-16 2022-11-14 熱擴散裝置及具備其之電子機器 TWI865963B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021186250 2021-11-16
JP2021-186250 2021-11-16

Publications (2)

Publication Number Publication Date
TW202328618A TW202328618A (zh) 2023-07-16
TWI865963B true TWI865963B (zh) 2024-12-11

Family

ID=85939223

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111143365A TWI865963B (zh) 2021-11-16 2022-11-14 熱擴散裝置及具備其之電子機器

Country Status (5)

Country Link
US (1) US20240302105A1 (https=)
JP (1) JP7647922B2 (https=)
CN (2) CN218888890U (https=)
TW (1) TWI865963B (https=)
WO (1) WO2023090265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025079557A1 (ja) * 2023-10-10 2025-04-17 株式会社村田製作所 電子機器
CN117190762A (zh) * 2023-10-24 2023-12-08 深圳市顺熵科技有限公司 吸液芯及其制备方法、均温板
WO2026018633A1 (ja) * 2024-07-16 2026-01-22 株式会社村田製作所 熱拡散デバイス、電子機器及び熱拡散デバイス用のウィック

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002062071A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
TWM336673U (en) * 2008-02-04 2008-07-11 Celsia Technologies Taiwan Inc Vapor chamber and supporting structure thereof
JP2019082264A (ja) * 2017-10-27 2019-05-30 古河電気工業株式会社 ベーパーチャンバ
TWM605285U (zh) * 2020-08-21 2020-12-11 建準電機工業股份有限公司 均溫板結構

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3967697B2 (ja) * 2002-08-21 2007-08-29 三星電子株式会社 平板型熱伝逹装置及びその製造方法
JP6176433B2 (ja) * 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
CN211060713U (zh) * 2017-04-28 2020-07-21 株式会社村田制作所 均热板、散热器件以及电子设备
JP6462771B2 (ja) * 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ
JP7137783B2 (ja) * 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002062071A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
TWM336673U (en) * 2008-02-04 2008-07-11 Celsia Technologies Taiwan Inc Vapor chamber and supporting structure thereof
JP2019082264A (ja) * 2017-10-27 2019-05-30 古河電気工業株式会社 ベーパーチャンバ
TWM605285U (zh) * 2020-08-21 2020-12-11 建準電機工業股份有限公司 均溫板結構

Also Published As

Publication number Publication date
US20240302105A1 (en) 2024-09-12
WO2023090265A1 (ja) 2023-05-25
TW202328618A (zh) 2023-07-16
JP7647922B2 (ja) 2025-03-18
JPWO2023090265A1 (https=) 2023-05-25
CN118251580A (zh) 2024-06-25
CN218888890U (zh) 2023-04-18

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