WO2023090265A1 - 熱拡散デバイス - Google Patents

熱拡散デバイス Download PDF

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Publication number
WO2023090265A1
WO2023090265A1 PCT/JP2022/042050 JP2022042050W WO2023090265A1 WO 2023090265 A1 WO2023090265 A1 WO 2023090265A1 JP 2022042050 W JP2022042050 W JP 2022042050W WO 2023090265 A1 WO2023090265 A1 WO 2023090265A1
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WO
WIPO (PCT)
Prior art keywords
wall surface
wick structure
housing
diffusion device
support portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/042050
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
竜宏 沼本
剛 向井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2023561569A priority Critical patent/JP7647922B2/ja
Priority to CN202280074978.5A priority patent/CN118251580A/zh
Publication of WO2023090265A1 publication Critical patent/WO2023090265A1/ja
Priority to US18/663,541 priority patent/US20240302105A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the present invention relates to heat diffusion devices.
  • a vapor chamber has a structure in which a working medium (also called a working fluid) and a wick that transports the working medium by capillary force are sealed inside a housing.
  • the working medium absorbs heat from the heat-generating elements such as electronic parts in the evaporator, evaporates in the vapor chamber, moves in the vapor chamber, is cooled, and returns to the liquid phase. .
  • the working medium that has returned to the liquid phase moves again to the evaporating portion on the heating element side by the capillary force of the wick, and cools the heating element.
  • the vapor chamber can operate independently without external power, and heat can be two-dimensionally diffused at high speed by utilizing the latent heat of vaporization and latent heat of condensation of the working medium.
  • Patent Document 1 discloses a thermal ground plane, which is an example of a vapor chamber.
  • the thermal ground plane described in Patent Document 1 includes a first planar substrate member, a plurality of micropillars arranged on the first planar substrate, and at least some of the micropillars a vapor core disposed on at least one of said first planar substrate, said micropillars and said mesh; and disposed on said first planar substrate.
  • said mesh separating said micropillars from said vapor core, said first planar substrate and said second planar substrate separating said micropillars; Surrounding the mesh and the steam core.
  • a wick is composed of struts such as micropillars and perforated bodies such as mesh.
  • the pillars such as micropillars have a shape such as a quadrangular pillar or a cylindrical shape, and a liquid channel for the working medium is formed between the pillars. Therefore, the wider the distance between the struts, the wider the width of the liquid flow path, and the higher the transmittance.
  • the width of the liquid channel is too wide, the perforated body such as the mesh tends to fall between the pillars, which may cause the position of the perforated body to shift and reduce the stability of the wick. For the above reasons, it is difficult to greatly widen the width of the liquid flow path, so it can be said that there is room for improvement from the viewpoint of improving the characteristics of the vapor chamber.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a heat diffusion device having a wick structure that is structurally stable even if the width of the liquid flow path of the working medium is widened. do.
  • a further object of the present invention is to provide an electronic device comprising the above heat diffusion device.
  • a heat diffusion device of the present invention comprises a housing having a first inner wall surface and a second inner wall surface facing each other in a thickness direction, a working medium enclosed in an internal space of the housing, and the internal space of the housing. a wick structure positioned in the .
  • the wick structure includes a support portion in contact with the first inner wall surface, and a perforated portion made of the same material as the support portion and integrally formed with the support portion.
  • the electronic device of the present invention includes the heat diffusion device of the present invention.
  • thermoelectric device having a wick structure that is structurally stable even when the width of the liquid flow path for the working medium is widened. Furthermore, according to the present invention, it is possible to provide an electronic device comprising the above heat diffusion device.
  • FIG. 1 is a perspective view schematically showing an example of the heat diffusion device of the present invention.
  • FIG. 2 is an example of a cross-sectional view along line II-II of the heat spreading device shown in FIG. 3 is a partially enlarged cross-sectional view schematically showing an example of a wick structure constituting the heat diffusion device shown in FIG. 2.
  • FIG. 4A is an example of a plan view of the wick structure shown in FIG. 3 as viewed from the support portion side.
  • FIG. 4B is another example of a plan view of the wick structure shown in FIG. 3 as seen from the support portion side.
  • FIG. 5 is a partially enlarged sectional view schematically showing a first modification of the wick structure.
  • FIG. 1 is a perspective view schematically showing an example of the heat diffusion device of the present invention.
  • FIG. 2 is an example of a cross-sectional view along line II-II of the heat spreading device shown in FIG. 3 is a partially enlarged cross-sectional view schematically showing an example of
  • FIG. 6 is a partially enlarged sectional view schematically showing a second modification of the wick structure.
  • FIG. 7 is a partially enlarged sectional view schematically showing a third modification of the wick structure.
  • FIG. 8 is a plan view schematically showing a fourth modification of the wick structure.
  • 9 is a cross-sectional view schematically showing a first modification of the wick structure shown in FIG. 7.
  • FIG. 10 is a cross-sectional view schematically showing a second modification of the wick structure shown in FIG. 7.
  • FIG. 11 is a cross-sectional view schematically showing a third modification of the wick structure shown in FIG. 7.
  • FIG. 12 is a cross-sectional view schematically showing a fourth modification of the wick structure shown in FIG. 7.
  • FIG. 13 is a cross-sectional view schematically showing a fifth modification of the wick structure shown in FIG. 7.
  • FIG. 14 is a cross-sectional view schematically showing a sixth modification of the wick structure shown in FIG. 7.
  • the heat diffusion device of the present invention will be described below.
  • the present invention is not limited to the following embodiments, and can be appropriately modified and applied without changing the gist of the present invention.
  • a combination of two or more of the individual preferred configurations of the present invention described below is also the present invention.
  • the heat diffusion device of the present invention is characterized in that the supporting portion and the perforated portion that constitute the wick structure are made of the same material and are integrally constructed. As a result, adhesion variations do not occur between the supporting portion and the perforated portion. As a result, the wick structure is structurally stable even if the distance between the support portions forming the liquid flow path of the working medium is widened, so that deterioration of the characteristics of the heat diffusion device can be suppressed. Furthermore, since the supporting portion and the perforated portion are integrated, the strength of the wick structure is also improved.
  • integrally constructed means that there is no interface between the support and the perforated portion, specifically, between the support and the perforated portion It means that the boundary cannot be determined.
  • a wick structure in which a copper pillar as a support portion and a copper mesh as a perforated portion are fixed by diffusion bonding or spot welding, the entire surface between the support portion and the perforated portion is bonded. Since it is difficult to remove the holes, some gaps are formed between the support part and the perforated part. In such a wick structure, since the boundary between the supporting portion and the perforated portion can be determined, it can be said that the supporting portion and the perforated portion are not integrally configured.
  • a vapor chamber will be described below as an example of an embodiment of the heat diffusion device of the present invention.
  • the heat diffusion device of the present invention can also be applied to heat diffusion devices such as heat pipes.
  • terms indicating the relationship between elements e.g., “perpendicular”, “parallel”, “orthogonal”, etc.
  • terms indicating the shape of elements are not expressions that express only strict meanings, but substantially It is an expression that means to include a difference in an equivalent range, for example, a few percent difference.
  • FIG. 1 is a perspective view schematically showing an example of the heat diffusion device of the present invention.
  • FIG. 2 is an example of a cross-sectional view along line II-II of the heat spreading device shown in FIG.
  • a vapor chamber (heat diffusion device) 1 shown in FIG. 1 includes a hollow housing 10 that is hermetically sealed.
  • the housing 10 has a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction Z.
  • the vapor chamber 1 further includes a working medium 20 enclosed in the inner space of the housing 10 and a wick structure 30 arranged in the inner space of the housing 10 .
  • An evaporator that evaporates the enclosed working medium 20 is set in the housing 10 .
  • a heat source HS which is a heating element, is arranged on the outer wall surface of the housing 10 .
  • the heat source HS include electronic components of electronic equipment, such as a central processing unit (CPU).
  • CPU central processing unit
  • a portion of the internal space of the housing 10 that is in the vicinity of the heat source HS and is heated by the heat source HS corresponds to the evaporator.
  • the vapor chamber 1 is preferably planar as a whole. That is, the housing 10 as a whole is preferably planar.
  • the “planar shape” includes a plate shape and a sheet shape, and the dimension in the width direction X (hereinafter referred to as width) and the dimension in the length direction Y (hereinafter referred to as length) are the thickness direction Z Shapes that are considerably large relative to their dimensions (hereinafter referred to as thickness or height), for example shapes whose width and length are 10 times or more, preferably 100 times or more, the thickness.
  • the size of the vapor chamber 1, that is, the size of the housing 10 is not particularly limited.
  • the width and length of the vapor chamber 1 can be appropriately set according to the application.
  • the width and length of the vapor chamber 1 are, for example, 5 mm or more and 500 mm or less, 20 mm or more and 300 mm or less, or 50 mm or more and 200 mm or less.
  • the width and length of the vapor chamber 1 may be the same or different.
  • the housing 10 is preferably composed of a first sheet 11 and a second sheet 12 that face each other and whose outer edges are joined.
  • the materials that constitute the first sheet 11 and the second sheet 12 should have properties suitable for use as a vapor chamber, such as thermal conductivity, strength, and the like. , flexibility, flexibility, etc., and is not particularly limited.
  • the material that constitutes the first sheet 11 and the second sheet 12 is preferably a metal, such as copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing them as a main component. Copper is particularly preferable. is.
  • the materials forming the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.
  • the housing 10 is composed of the first sheet 11 and the second sheet 12
  • the first sheet 11 and the second sheet 12 are joined together at their outer edge portions.
  • the method of such bonding is not particularly limited, but for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding or resin sealing can be used, which is preferable. can use laser welding, resistance welding or brazing.
  • the thicknesses of the first sheet 11 and the second sheet 12 are not particularly limited, but each is preferably 10 ⁇ m or more and 200 ⁇ m or less, more preferably 30 ⁇ m or more and 100 ⁇ m or less, still more preferably 40 ⁇ m or more and 60 ⁇ m or less.
  • the thicknesses of the first sheet 11 and the second sheet 12 may be the same or different. Further, the thickness of each sheet of the first sheet 11 and the second sheet 12 may be the same over the entire area, or may be thin in part.
  • first sheet 11 and the second sheet 12 are not particularly limited.
  • first sheet 11 and the second sheet 12 may each have a shape in which the outer edges are thicker than the portions other than the outer edges.
  • the thickness of the entire vapor chamber 1 is not particularly limited, it is preferably 50 ⁇ m or more and 500 ⁇ m or less.
  • the planar shape of the housing 10 when viewed from the thickness direction Z is not particularly limited, and examples thereof include polygonal shapes such as triangles and rectangles, circular shapes, elliptical shapes, and shapes combining these shapes. Further, the planar shape of the housing 10 may be L-shaped, C-shaped (U-shaped), step-shaped, or the like. Moreover, the housing 10 may have a through hole. The planar shape of the housing 10 may be a shape according to the use of the vapor chamber, the shape of the location where the vapor chamber is installed, and other parts existing nearby.
  • the working medium 20 is not particularly limited as long as it can cause a gas-liquid phase change in the environment inside the housing 10.
  • water, alcohols, CFC alternatives, etc. can be used.
  • working medium 20 is an aqueous compound, preferably water.
  • the wick structure 30 has a capillary structure that can move the working medium 20 by capillary force.
  • the capillary structure of the wick structure 30 may be a known structure used in conventional vapor chambers.
  • the size and shape of the wick structure 30 are not particularly limited.
  • the wick structure 30 may be arranged in the entire internal space of the housing 10 , or the wick structure 30 may not be arranged in a part of the internal space of the housing 10 .
  • FIG. 3 is a partially enlarged sectional view schematically showing an example of a wick structure constituting the heat diffusion device shown in FIG.
  • the wick structure 30 includes a support portion 31 in contact with the first inner wall surface 11a, and a perforated portion made of the same material as the support portion 31 and integrated with the support portion 31. 32 and
  • the materials that form the support portion 31 and the perforated portion 32 are not particularly limited, but examples include resins, metals, ceramics, or mixtures and laminates thereof.
  • FIG. 4A is an example of a plan view of the wick structure shown in FIG. 3 as viewed from the support part side.
  • FIG. 4B is another example of a plan view of the wick structure shown in FIG. 3 as seen from the support portion side.
  • the support portion 31 includes a plurality of columnar members.
  • columnar means a shape in which the ratio of the length of the long side of the bottom surface is less than five times the length of the short side of the bottom surface.
  • the shape of the columnar member is not particularly limited, examples thereof include a cylindrical shape, a prismatic shape, a truncated cone shape, and a truncated pyramid shape.
  • the cross-sectional shape of the support portion 31 perpendicular to the height direction is rectangular, and in the example shown in FIG. 4B, the cross-sectional shape of the support portion 31 perpendicular to the height direction is circular.
  • the columnar member should be relatively taller than its surroundings. Therefore, the columnar member includes, in addition to the portion protruding from the first inner wall surface 11a, a portion relatively high due to the depression formed in the first inner wall surface 11a.
  • the perforated portion 32 for example, a metal porous film, a sintered body, a porous body, or the like formed by etching or metal working is used.
  • the sintered body that is the material of the porous portion 32 may be composed of, for example, a porous sintered body such as a metal porous sintered body or a ceramic porous sintered body, preferably a porous sintered body of copper or nickel. It is composed of a sintered body.
  • the porous body that is the material of the perforated portion 32 may be composed of, for example, a metal porous body, a ceramic porous body, a resin porous body, or the like.
  • the wick structure 30 in which the supporting portion 31 and the perforated portion 32 are integrally formed can be produced, for example, by an etching technique, a printing technique using multi-layer coating, or other multi-layer techniques.
  • the support portion 31 may be integrated with the housing 10, or may be formed by etching the first inner wall surface 11a of the housing 10, for example.
  • the support portion 31 preferably has a tapered shape in which the width narrows from the perforated portion 32 toward the first inner wall surface 11a. As a result, it is possible to widen the flow path between the support portions 31 on the housing 10 side while suppressing the perforated portion 32 from falling between the support portions 31 . As a result, the transmittance is increased and the maximum heat transfer rate is increased.
  • the arrangement of the support parts 31 is not particularly limited, they are preferably arranged evenly in a predetermined area, more preferably evenly over the entire area, for example, so that the center-to-center distance (pitch) of the support parts 31 is constant.
  • the center-to-center distance (the length indicated by P31 in FIG. 4A or 4B) of the support portion 31 is, for example, 60 ⁇ m or more and 800 ⁇ m or less.
  • the width of the support portion 31 (the length indicated by W31 in FIG. 4A or 4B) is, for example, 20 ⁇ m or more and 500 ⁇ m or less.
  • the height of the support portion 31 (the length indicated by T31 in FIG. 3) is, for example, 10 ⁇ m or more and 100 ⁇ m or less.
  • the arrangement of the holes 32a of the perforated portion 32 is not particularly limited, it is preferable that the holes 32a of the perforated portion 32 are arranged evenly in a predetermined region, more preferably evenly over the entire area. are arranged so that
  • the center-to-center distance of the holes 32a of the perforated portion 32 (the length indicated by P32 in FIG. 4A or 4B) is, for example, 3 ⁇ m or more and 150 ⁇ m or less.
  • the diameter of the holes 32a of the perforated portion 32 (the length indicated by ⁇ 32 in FIG. 4A or 4B) is, for example, 1 ⁇ m or more and 100 ⁇ m or less.
  • the thickness of the perforated portion 32 (the length indicated by T32 in FIG. 3) is, for example, 5 ⁇ m or more and 50 ⁇ m or less.
  • FIG. 5 is a partially enlarged sectional view schematically showing a first modification of the wick structure.
  • holes 32a of the perforated portion 32 may exist in a region overlapping with the support portion 31.
  • FIG. 6 is a partially enlarged sectional view schematically showing a second modification of the wick structure.
  • the support portion 31 and the perforated portion 32 are made of porous material. By forming not only the porous portion 32 but also the support portion 31 from a porous material, the capillary force of the wick structure 30B can be improved.
  • porous body constituting the support portion 31 and the porous portion 32 for example, a porous sintered body such as a metal porous sintered body or a ceramic porous sintered body, a metal porous body, a ceramic porous body, A porous body such as a resin porous body can be used.
  • the wick structure 30B composed of a porous material can be produced, for example, by a multi-layer printing technique using metal paste or ceramic paste.
  • the metal or ceramic content in the paste for forming the support portion 31 may be the same as the metal or ceramic content in the paste for forming the perforated portion 32. It may be less than the metal or ceramic content in the paste for forming it, or it may be more than the metal or ceramic content in the paste for forming the perforated portion 32 .
  • the support portion 31 The density can be greater than the density of the perforated portion 32 . As a result, the strength of the support portion 31 can be increased.
  • FIG. 7 is a partially enlarged sectional view schematically showing a third modification of the wick structure.
  • a support portion 31 is formed in the recessed portion by bending and recessing a portion of the metal foil by press working or the like. Since the steam space is formed in the recessed portion of the support portion 31, the thermal conductivity is improved.
  • a through hole may be formed in a recessed portion when a part of the metal foil is bent.
  • the holes 32a of the perforated portion 32 can be formed, for example, by punching the metal foil forming the wick structure 30 by pressing. In that case, the press work for forming the support portion 31 and the press work for forming the holes 32a of the perforated portion 32 may be performed collectively.
  • the thickness of the metal foil is constant before performing press working or the like.
  • the metal foil may become thin at the bent portion. From the above, in the wick structure 30 ⁇ /b>C, it is preferable that the thickness of the support portion 31 is the same as the thickness of the perforated portion 32 or smaller than the thickness of the perforated portion 32 .
  • FIG. 8 is a plan view schematically showing a fourth modification of the wick structure. Note that FIG. 8 is a plan view of the wick structure viewed from the support portion side.
  • the support portion 31 includes a plurality of rail-shaped members.
  • rail-like means a shape in which the ratio of the length of the long side of the bottom surface is five times or more the length of the short side of the bottom surface.
  • the cross-sectional shape perpendicular to the extending direction of the rail-shaped member is not particularly limited, but examples thereof include polygonal shapes such as quadrangles, semicircular shapes, semielliptical shapes, and shapes in which these are combined.
  • the rail-shaped member should be relatively taller than its surroundings. Therefore, the rail-shaped member includes not only the portion protruding from the first inner wall surface 11a, but also the relatively high portion due to the grooves formed in the first inner wall surface 11a.
  • a pillar 40 may be arranged in the internal space of the housing 10 so as to contact the second inner wall surface 12a. It is possible to support the housing 10 and the wick structure 30 by arranging the struts 40 in the internal space of the housing 10 .
  • the material forming the pillars 40 is not particularly limited, but examples thereof include resins, metals, ceramics, mixtures thereof, laminates, and the like.
  • the support 40 may be integrated with the housing 10, or may be formed by etching the second inner wall surface 12a of the housing 10, for example.
  • the shape of the support 40 is not particularly limited as long as it can support the housing 10 and the wick structure 30, but the shape of the cross section of the support 40 perpendicular to the height direction may be, for example, a polygon such as a rectangle, or a circle. , oval, etc.
  • the height of the struts 40 may be the same or different in one vapor chamber.
  • the width of the support 40 is not particularly limited as long as it provides strength capable of suppressing deformation of the housing 10. is, for example, 100 ⁇ m or more and 2000 ⁇ m or less, preferably 300 ⁇ m or more and 1000 ⁇ m or less.
  • the equivalent circle diameter of the strut 40 By increasing the equivalent circle diameter of the strut 40, the deformation of the housing 10 can be further suppressed.
  • the equivalent circle diameter of the strut 40 it is possible to ensure a wider space for the vapor of the working medium 20 to move.
  • the arrangement of the struts 40 is not particularly limited, they are preferably arranged evenly in a predetermined area, more preferably evenly over the entire area, for example, so that the distance between the struts 40 is constant. By arranging the struts 40 evenly, it is possible to ensure uniform strength throughout the vapor chamber 1 .
  • the heat diffusion device of the present invention is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention regarding the configuration, manufacturing conditions, etc. of the heat diffusion device.
  • the periphery of the hole of the perforated portion may be provided with a convex portion that approaches the first inner wall surface or the second inner wall surface of the housing in the thickness direction.
  • the convex portion may be provided only on a part of the periphery of the hole of the perforated portion, but is preferably provided on the entire periphery of the hole of the perforated portion.
  • the hole provided on the periphery with a protrusion that approaches the first inner wall surface and the protrusion on the periphery that approaches the second inner wall surface are provided.
  • a hole may be mixed with a hole, and a hole with a convex portion provided on the peripheral edge and a hole without a convex portion provided on the peripheral edge may be mixed.
  • the convex portion When a convex portion approaching the first inner wall surface is provided on the periphery of the hole of the perforated portion, the convex portion may have a lid portion that narrows the opening of the convex portion at the end on the first inner wall surface side. good.
  • the protrusion when a protrusion approaching the second inner wall surface is provided on the periphery of the hole of the perforated portion, the protrusion has a lid portion that narrows the opening of the protrusion at the end on the second inner wall surface side. You may
  • the convex portion can be formed by punching the metal or the like that constitutes the perforated portion by press working.
  • the projections may be formed simultaneously with the holes of the perforated section, or may be formed separately from the perforations of the perforated section.
  • the shape and the like of the convex portion can be adjusted by appropriately adjusting the punch depth and the like.
  • the punching depth means, for example, how far the punch is pushed in the punching direction when punching with a punch.
  • the thickness of the convex portion may be the same as or different from the thickness of the perforated portion other than the convex portion. Moreover, the thickness of the convex portion may be the same as or different from the thickness of the support portion.
  • FIG. 9 is a cross-sectional view schematically showing a first modification of the wick structure shown in FIG.
  • the peripheral edge of the hole 32a of the perforated portion 32 is provided with a convex portion 33a that approaches the second inner wall surface 12a (see FIG. 2) of the housing 10 in the thickness direction Z.
  • the protrusion 33a has a constant distance between the outer walls of the protrusion 33a in a direction (upward in FIG. 9) toward the second inner wall surface 12a in the cross section along the thickness direction Z. have a certain shape.
  • FIG. 10 is a cross-sectional view schematically showing a second modification of the wick structure shown in FIG.
  • the periphery of the hole 32a of the perforated portion 32 is provided with a convex portion 33b that approaches the second inner wall surface 12a (see FIG. 2) of the housing 10 in the thickness direction Z.
  • the distance between the outer walls of the convex portion 33b becomes narrower toward the second inner wall surface 12a (upward in FIG. 10). It has a tapered shape.
  • the projection 33b has a reverse tapered shape in which the distance between the outer walls of the projection 33b increases in the direction (upward in FIG. 10) toward the second inner wall surface 12a. good too.
  • the convex portion 33b may have a convex shape on the second inner wall surface 12a side (upper side in FIG. 10) in a cross section along the thickness direction Z, and may be convex on the first inner wall surface 11a side (in FIG. 10 (lower side) may have a convex shape.
  • FIG. 11 is a cross-sectional view schematically showing a third modification of the wick structure shown in FIG.
  • the periphery of the hole 32a of the perforated portion 32 is provided with a convex portion 33c that approaches the second inner wall surface 12a (see FIG. 2) of the housing 10 in the thickness direction Z.
  • the convex portion 33c has a lid portion 34 that narrows the opening of the convex portion 33c at the end on the second inner wall surface 12a side (upper side in FIG. 11).
  • FIG. 12 is a cross-sectional view schematically showing a fourth modification of the wick structure shown in FIG.
  • the periphery of the hole 32a of the perforated portion 32 is provided with a convex portion 33d that approaches the first inner wall surface 11a (see FIG. 2) of the housing 10 in the thickness direction Z.
  • the convex portion 33d has a constant distance between the outer walls of the convex portion 33d toward the first inner wall surface 11a (lower side in FIG. 12) in the cross section along the thickness direction Z. has a shape that is
  • FIG. 13 is a cross-sectional view schematically showing a fifth modification of the wick structure shown in FIG.
  • the peripheral edge of the hole 32a of the perforated portion 32 is provided with a convex portion 33e that approaches the first inner wall surface 11a (see FIG. 2) of the housing 10 in the thickness direction Z.
  • the protrusion 33e has a narrower distance between the outer walls of the protrusion 33e in a direction toward the first inner wall surface 11a (downward in FIG. 13) in a cross section along the thickness direction Z. It has a tapered shape.
  • the convex portion 33e has a reverse tapered shape in which the distance between the outer walls of the convex portion 33e increases toward the first inner wall surface 11a (downward in FIG. 13) in a cross section along the thickness direction Z.
  • the convex portion 33e may have a convex shape on the second inner wall surface 12a side (upper side in FIG. 13) in a cross section along the thickness direction Z, or a convex shape on the first inner wall surface 11a side (in FIG. 13 (lower side) may have a convex shape.
  • FIG. 14 is a cross-sectional view schematically showing a sixth modification of the wick structure shown in FIG.
  • the periphery of the hole 32a of the perforated portion 32 is provided with a convex portion 33f that approaches the first inner wall surface 11a (see FIG. 2) of the housing 10 in the thickness direction Z.
  • the convex portion 33f has a lid portion 34 that narrows the opening of the convex portion 33f at the end on the first inner wall surface 11a side (lower side in FIG. 14).
  • the housing may have one evaporator or may have a plurality of evaporators. That is, one heat source may be arranged on the outer wall surface of the housing, or a plurality of heat sources may be arranged.
  • the number of evaporators and heat sources is not particularly limited.
  • the first sheet and the second sheet when the housing is composed of the first sheet and the second sheet, the first sheet and the second sheet may be overlapped so that the edges are aligned, or the edges may overlap. may be shifted and overlapped.
  • the material of the first sheet and the material of the second sheet may be different.
  • the stress applied to the housing can be dispersed.
  • one sheet can have one function and the other sheet can have another function.
  • the above functions are not particularly limited, but include, for example, a heat conduction function, an electromagnetic wave shielding function, and the like.
  • the heat diffusion device of the present invention can be mounted on electronic equipment for the purpose of heat dissipation. Therefore, an electronic device including the heat diffusion device of the present invention is also one aspect of the present invention.
  • Examples of the electronic device of the present invention include smart phones, tablet terminals, notebook computers, game machines, wearable devices, and the like.
  • the heat diffusion device of the present invention can operate independently without the need for external power, and utilize the latent heat of vaporization and latent heat of condensation of the working medium to diffuse heat two-dimensionally at high speed. Therefore, an electronic device equipped with the heat diffusion device of the present invention can effectively dissipate heat in a limited space inside the electronic device.
  • the heat diffusion device of the present invention can be used for a wide range of applications in fields such as personal digital assistants. For example, it can be used to lower the temperature of a heat source such as a CPU and extend the operating time of electronic equipment, and can be used in smartphones, tablet terminals, laptop computers, and the like.
  • vapor chamber (heat diffusion device) 10 housing 11 first sheet 11a first inner wall surface 12 second sheet 12a second inner wall surface 20 working medium 30, 30A, 30B, 30C, 30D, 30E, 30F, 30G, 30H, 30I, 30J wick structure 31 support Portion 32 Perforated portion 32a Hole of perforated portion 33a, 33b, 33c, 33d, 33e, 33f Convex portion 34 Lid portion 40 Support HS Heat source P Center-to-center distance of 31 support portion P Center-to-center distance of hole of 32 perforated portion T Height of 31 support portion T Thickness of 32 perforated portion W Width of 31 support portion X Width direction Y Length direction Z Thickness direction ⁇ Hole diameter of 32 perforated portion

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PCT/JP2022/042050 2021-11-16 2022-11-11 熱拡散デバイス Ceased WO2023090265A1 (ja)

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CN202280074978.5A CN118251580A (zh) 2021-11-16 2022-11-11 热扩散器件
US18/663,541 US20240302105A1 (en) 2021-11-16 2024-05-14 Thermal diffusion device

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WO2025079557A1 (ja) * 2023-10-10 2025-04-17 株式会社村田製作所 電子機器
JP2025537444A (ja) * 2023-10-24 2025-11-18 深▲セン▼市順▲ショウ▼科技有限公司 吸液芯とその製造方法、及びベイパーチャンバー
WO2026018633A1 (ja) * 2024-07-16 2026-01-22 株式会社村田製作所 熱拡散デバイス、電子機器及び熱拡散デバイス用のウィック

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US20090194259A1 (en) * 2008-02-04 2009-08-06 Meyer Iv George Anthony Vapor chamber and supporting structure thereof
JP2019082264A (ja) * 2017-10-27 2019-05-30 古河電気工業株式会社 ベーパーチャンバ

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WO2025079557A1 (ja) * 2023-10-10 2025-04-17 株式会社村田製作所 電子機器
JP2025537444A (ja) * 2023-10-24 2025-11-18 深▲セン▼市順▲ショウ▼科技有限公司 吸液芯とその製造方法、及びベイパーチャンバー
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CN118251580A (zh) 2024-06-25
CN218888890U (zh) 2023-04-18
TWI865963B (zh) 2024-12-11

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