CN218499342U - Copper ceramic circuit board is covered in graphite alkene heat dissipation - Google Patents
Copper ceramic circuit board is covered in graphite alkene heat dissipation Download PDFInfo
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- CN218499342U CN218499342U CN202222416744.4U CN202222416744U CN218499342U CN 218499342 U CN218499342 U CN 218499342U CN 202222416744 U CN202222416744 U CN 202222416744U CN 218499342 U CN218499342 U CN 218499342U
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Abstract
The utility model discloses a graphene heat dissipation copper-clad ceramic circuit board, which comprises a lower ceramic layer and an upper ceramic layer; the lower surface of the lower ceramic layer is concavely provided with a plurality of first concave positions matched with the electronic device, and the inner wall of each first concave position is completely covered with a first graphene coating; the upper ceramic layer is superposed on the lower ceramic layer, a graphene heat dissipation layer and a plurality of conductive circuits are clamped between the upper ceramic layer and the lower ceramic layer, and the graphene heat dissipation layer is integrally connected with each first heat conduction column; through setting up each concave position for each electron device can realize embedded installation, and the installation is firm, is difficult for droing, and electron device installation back, the whole thickness of circuit board is less, and it is little to occupy the space, does benefit to the follow-up installation of circuit board, simultaneously, sets up graphite alkene heat dissipation layer, heat conduction post and each graphite alkene coating through the cooperation, utilizes graphite alkene can carry out quick heat conduction, realizes better radiating effect, satisfies the needs that use.
Description
Technical Field
The utility model relates to a ceramic circuit board field technique especially indicates a copper ceramic circuit board is covered in graphite alkene heat dissipation.
Background
With the gradual deepening of electronic technology in each application field, the high integration of circuit boards becomes a necessary trend, the high integration packaging module requires a good heat dissipation bearing system, and the disadvantage of the traditional circuit board in heat conductivity coefficient becomes a bottleneck restricting the development of electronic technology. In recent years, ceramic circuit boards have been widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules by virtue of their good high thermal conductivity, chemical stability and thermal stability. The DPC technology is used for carrying out vacuum coating treatment on the ceramic circuit board to complete the manufacture of the metallized circuit of the ceramic circuit board, so that the ceramic circuit board better conforms to the future development direction of high density, high precision and high reliability.
Although DPC ceramic substrates provide guarantees for increasingly integrated, intelligent, and miniaturized electronic products due to their excellent specifications and product characteristics, they also require that their power density be continuously increased, have better heat dissipation and high thermal conductivity.
DPC ceramic circuit board among the prior art has the heat dissipation copper layer on its surface, on the heat dissipation copper layer was gone up in the electronic device laminating, utilize the heat dissipation copper layer to carry out heat conduction, however, the thermal conductivity of copper is general, still remain further promotion, and the heat dissipation copper layer sets up on ceramic circuit board's surface, and the electronic device sets up the surface on heat dissipation copper layer, make the electronic device installation firm inadequately, drop easily, and also increase the whole thickness of circuit board, it is big to occupy space, the installation of the circuit board of being not convenient for. Therefore, there is a need for improvements in current ceramic wiring boards.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a graphene heat dissipation copper-clad ceramic circuit board, which can effectively solve the problem of poor heat conductivity and large thickness of the existing ceramic circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a graphene heat dissipation copper-clad ceramic circuit board comprises a lower ceramic layer and an upper ceramic layer;
the lower surface of the lower ceramic layer is concavely provided with a plurality of first concave positions matched with electronic devices, the inner wall of each first concave position is completely covered to form a first graphene coating, the bottom surface of each first concave position is provided with a first heat conduction hole, each first heat conduction hole is filled with a graphene material to form a first heat conduction column, the first heat conduction column is integrally connected with the first graphene coating, the lower surface of the lower ceramic layer is coated with copper to form a plurality of back bonding pads, the back bonding pads are positioned beside the first concave positions, the upper surface and the lower surface of the lower ceramic layer are penetrated to form a plurality of first conduction holes, the first conduction holes are filled with a conductive material to form first conduction columns, and each first conduction column is integrally connected with the corresponding back bonding pad;
the upper ceramic layer is superposed on the lower ceramic layer, a graphene heat dissipation layer and a plurality of conductive circuits are clamped between the upper ceramic layer and the lower ceramic layer, the graphene heat dissipation layer is integrally connected with each first heat conduction column, and the plurality of conductive circuits are respectively integrally connected with the corresponding first heat conduction columns;
should go up the concave second concave position that is equipped with a plurality of and electron device looks adaptation of upper surface of ceramic layer, the inner wall of the concave position of each second all covers completely and is formed with second graphite alkene coating, the second heat conduction hole has all been seted up to the bottom surface of the concave position of each second, all fill the graphite alkene material in each second heat conduction hole and be formed with the second heat conduction post, second heat conduction post body coupling is between second graphite alkene coating and graphite alkene heat dissipation layer, the upper surface of going up the ceramic layer covers copper and is formed with a plurality of front pads, these a plurality of front pads are located the side of each concave position of second, the upper and lower surface of going up the ceramic layer is run through and is formed with a plurality of second via holes, all pack in these a plurality of second via holes and have conductive material and form the second and lead the post, each second leads the post respectively a body coupling between corresponding front pad and corresponding conducting wire.
Preferably, the first concave position and the second concave position are arranged in a staggered mode, so that the overall structural strength of the product is guaranteed.
As a preferred scheme, the thicknesses of the lower ceramic layer and the upper ceramic layer are the same, the depth of the first concave position is half of the thickness of the lower ceramic layer, and the depth of the second concave position is half of the thickness of the upper ceramic layer, so that the overall structural strength of the product is ensured.
As a preferred scheme, the upper surface of the lower ceramic layer penetrates through a through groove which is matched and positioned with the radiator, the graphene heat dissipation layer is exposed in the through groove, the inner peripheral side wall of the through groove is completely covered with a third graphene coating, and the third graphene coating and the graphene heat dissipation layer are integrally connected, so that the radiator can be mounted conveniently, and the heat dissipation effect is improved.
Preferably, the through groove is located at a side edge of the lower ceramic layer, so that the radiator can be conveniently assembled and disassembled.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
through setting up each concave position for each electron device can realize embedded installation, and the installation is firm, is difficult for droing, and electron device installation back, the whole thickness of circuit board is less, and it is little to occupy the space, does benefit to the follow-up installation of circuit board, simultaneously, sets up graphite alkene heat dissipation layer, heat conduction post and each graphite alkene coating through the cooperation, utilizes graphite alkene can carry out quick heat conduction, realizes better radiating effect, satisfies the needs that use.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a cross-sectional view of a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. lower ceramic layer 11, first concave position
12. First heat conduction hole 13, first via hole
14. Through groove 20 and upper ceramic layer
21. A second concave position 22 and a second heat-conducting hole
23. Second via hole 31, first graphene coating
32. First heat conduction post 33, graphite alkene heat dissipation layer
34. Second graphene coating 35 and second heat conducting column
36. Third graphene coating 41, backside pads
42. First conductive via 43, conductive line
44. A front surface bonding pad 45 and a second conductive column.
Detailed Description
Referring to fig. 1, a specific structure of a preferred embodiment of the present invention is shown, which includes a lower ceramic layer 10 and an upper ceramic layer 20.
The lower surface of the lower ceramic layer 10 is concavely provided with a plurality of first concave positions 11 matched with electronic devices, the inner wall of each first concave position 11 is completely covered to form a first graphene coating 31, the bottom surface of each first concave position 11 is provided with a first heat conduction hole 12, each first heat conduction hole 12 is filled with a graphene material to form a first heat conduction column 32, the first heat conduction column 32 is integrally connected with the first graphene coating 31, the lower surface of the lower ceramic layer 10 is coated with copper to form a plurality of back bonding pads 41, the back bonding pads 41 are positioned beside the first concave positions 11, the upper surface and the lower surface of the lower ceramic layer 10 penetrate through to form a plurality of first through holes 13, the first through holes 13 are filled with a conductive material to form first conduction columns 42, and each first conduction column 42 is integrally connected with the corresponding back bonding pad 41.
The upper ceramic layer 20 is stacked on the lower ceramic layer 10, a graphene heat dissipation layer 33 and a plurality of conductive traces 43 are interposed between the upper ceramic layer 20 and the lower ceramic layer 10, the graphene heat dissipation layer 33 is integrally connected to each first conductive stud 32, and the plurality of conductive traces 43 are integrally connected to the corresponding first conductive studs 42, respectively.
The upper surface of the upper ceramic layer 20 is concavely provided with a plurality of second concave positions 21 matched with electronic devices, the inner wall of each second concave position 21 is completely covered to form a second graphene coating 34, the bottom surface of each second concave position 21 is provided with a second heat conduction hole 22, each second heat conduction hole 22 is filled with graphene materials to form a second heat conduction column 35, the second heat conduction column 35 is integrally connected between the second graphene coating 34 and the graphene heat dissipation layer 33, the upper surface of the upper ceramic layer 20 is coated with copper to form a plurality of front bonding pads 44, the front bonding pads 44 are located beside the second concave positions 21, the upper surface and the lower surface of the upper ceramic layer 20 penetrate through the second conductive holes 23, the second conductive holes 23 are filled with conductive materials to form second conductive columns 45, and each second conductive column 45 is respectively and integrally connected between the corresponding front bonding pad 44 and the corresponding conductive line 43. In the embodiment, the first concave 11 and the second concave 21 are arranged in a staggered manner to ensure the overall structural strength of the product. The thickness of the lower ceramic layer 10 is the same as that of the upper ceramic layer 20, the depth of the first concave 11 is half of the thickness of the lower ceramic layer 10, and the depth of the second concave 21 is half of the thickness of the upper ceramic layer 20, so as to ensure the overall structural strength of the product.
The upper surface of the lower ceramic layer 10 is formed with a through groove 14 which is matched and positioned with the heat sink, the graphene heat dissipation layer 33 is exposed in the through groove 14, the inner peripheral side wall of the through groove 14 is completely covered with a third graphene coating 36, the third graphene coating 36 is integrally connected with the graphene heat dissipation layer 33, and the through groove 14 is located at the side edge of the lower ceramic layer 10, so that the heat sink can be conveniently disassembled and assembled.
When the device is used, the electronic device is embedded in the first concave position 11 and is fixedly attached to the first graphene coating 31, and the electronic device is welded and conducted with the corresponding back bonding pad 41, or the electronic device is embedded in the second concave position 21 and is fixedly attached to the second graphene coating 34, and the electronic device is welded and conducted with the corresponding front bonding pad 44; and embedding the heat radiator in the through groove 14, and adhering and fixing the heat radiator to the graphene heat dissipation layer 33 and the third graphene coating 36.
When each conductive circuit 43 is connected with an external circuit, each electronic device works, and heat generated by each electronic device is transferred to the graphene heat dissipation layer 33 through the corresponding graphene coating and the corresponding heat conduction column in sequence and then is transferred to the radiator through the graphene heat dissipation layer 33 to realize quick heat dissipation.
The utility model discloses a design focus lies in: through setting up each concave position for each electron device can realize embedded installation, and the installation is firm, is difficult for droing, and electron device installation back, the whole thickness of circuit board is less, and it is little to occupy the space, does benefit to the follow-up installation of circuit board, simultaneously, sets up graphite alkene heat dissipation layer, heat conduction post and each graphite alkene coating through the cooperation, utilizes graphite alkene can carry out quick heat conduction, realizes better radiating effect, satisfies the needs that use.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (5)
1. The utility model provides a graphite alkene heat dissipation copper-clad ceramic circuit board which characterized in that: comprises a lower ceramic layer and an upper ceramic layer;
the lower surface of the lower ceramic layer is concavely provided with a plurality of first concave positions matched with electronic devices, the inner wall of each first concave position is completely covered to form a first graphene coating, the bottom surface of each first concave position is provided with a first heat conduction hole, each first heat conduction hole is filled with a graphene material to form a first heat conduction column, the first heat conduction column is integrally connected with the first graphene coating, the lower surface of the lower ceramic layer is coated with copper to form a plurality of back bonding pads, the back bonding pads are positioned beside the first concave positions, the upper surface and the lower surface of the lower ceramic layer are penetrated to form a plurality of first conduction holes, the first conduction holes are filled with a conductive material to form first conduction columns, and each first conduction column is integrally connected with the corresponding back bonding pad;
the upper ceramic layer is superposed on the lower ceramic layer, a graphene heat dissipation layer and a plurality of conductive circuits are clamped between the upper ceramic layer and the lower ceramic layer, the graphene heat dissipation layer is integrally connected with each first heat conduction column, and the plurality of conductive circuits are respectively integrally connected with the corresponding first heat conduction columns;
the upper surface of this go up ceramic layer is concave to be equipped with a plurality of with the concave position of second of electron device looks adaptation, the inner wall of the concave position of each second all covers completely and is formed with second graphite alkene coating, the second heat conduction hole has all been seted up to the bottom surface of the concave position of each second, all pack graphite alkene material in each second heat conduction hole and be formed with the second heat conduction post, second heat conduction post body coupling is between second graphite alkene coating and graphite alkene heat dissipation layer, the upper surface of going up ceramic layer covers copper and is formed with a plurality of front pads, this a plurality of front pads are located the side of each concave position of second, the upper and lower surface of going up ceramic layer runs through and is formed with a plurality of second via holes, all pack in this a plurality of second via holes and have conductive material and form the second via post, each second via post respectively body coupling in corresponding front pad and between the conductive circuit that corresponds.
2. The graphene heat dissipation copper-clad ceramic circuit board of claim 1, wherein: the first concave position and the second concave position are arranged in a staggered mode.
3. The graphene heat dissipation copper-clad ceramic circuit board of claim 1, wherein: the thickness of the lower ceramic layer is the same as that of the upper ceramic layer, the depth of the first concave position is half of that of the lower ceramic layer, and the depth of the second concave position is half of that of the upper ceramic layer.
4. The graphene heat dissipation copper-clad ceramic circuit board of claim 1, wherein: the upper surface of the lower ceramic layer penetrates through a through groove which is matched and positioned with the radiator, the graphene heat dissipation layer is exposed in the through groove, the inner peripheral side wall of the through groove is completely covered with a third graphene coating, and the third graphene coating and the graphene heat dissipation layer are integrally connected.
5. The graphene heat dissipation copper-clad ceramic circuit board of claim 4, wherein: the through groove is positioned on the lateral edge of the lower ceramic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222416744.4U CN218499342U (en) | 2022-09-13 | 2022-09-13 | Copper ceramic circuit board is covered in graphite alkene heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222416744.4U CN218499342U (en) | 2022-09-13 | 2022-09-13 | Copper ceramic circuit board is covered in graphite alkene heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218499342U true CN218499342U (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222416744.4U Active CN218499342U (en) | 2022-09-13 | 2022-09-13 | Copper ceramic circuit board is covered in graphite alkene heat dissipation |
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| CN (1) | CN218499342U (en) |
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- 2022-09-13 CN CN202222416744.4U patent/CN218499342U/en active Active
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