CN217983328U

CN217983328U - Signal lamp lead frame

Info

Publication number: CN217983328U
Application number: CN202222481845.XU
Authority: CN
Inventors: 郑娇; 王东
Original assignee: Beijing Creutonda Technology Co ltd
Current assignee: Beijing Creutonda Technology Co ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2022-12-06
Anticipated expiration: 2032-09-20

Abstract

The utility model provides a signal lamp lead frame, including the heat absorption frame, the bilateral symmetry of heat absorption frame is provided with and is used for fixed positioning seat, the locating hole has been seted up on the positioning seat, just the locating hole runs through the positioning seat and sets up, laminating groove and the surface of control signal lamp chip are laminated mutually, the pin and the stitch groove looks joint of control signal lamp chip both sides, the surface of heat absorption frame opposite side terminal surface is provided with radiating fin, and the heat acts on the inside of heat-absorbing section of thick bamboo, and the memory metal spring that is located the heat-absorbing section of thick bamboo inside takes place deformation at its self of in-process that the temperature promoted, and then the memory metal spring becomes long, and then the removal post that is located memory metal spring upside also moves to the upside thereupon, and then the removal post drives the upstand moves to the upside, and the contact switch contact of the upper end of upstand open radiator fan through the contact switch, and then realize initiative radiating purpose.

Description

Signal lamp lead frame

Technical Field

The utility model relates to a signal lamp lead frame relates to the electronic equipment field.

Background

The lead frame is one kind and is realized the electrical connection of chip internal circuit leading-out end and outer lead wire with the help of bonding material, forms the key structure spare of electric loop, and general lead frame can give off the heat that the chip distributed out through passive radiating mode in the in-process of using, but the signal lamp is because its operational environment's particularity, generally directly exposes and insolate under the sun, so its inside temperature is higher, there is the not good problem of effect in the mode of dispelling the heat through passive heat dissipation, so need design a new structure and solve this problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a signal lamp lead frame to the not enough of prior art existence to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a signal lamp lead frame, includes the heat absorption frame, the bilateral symmetry of heat absorption frame is provided with the positioning seat that is used for fixing, set up the locating hole on the positioning seat, just the locating hole runs through the positioning seat and sets up, the locating hole passes through with the screw on the circuit board and closes in turn via the bolt, the intermediate position of heat absorption frame is provided with the laminating groove, the laminating groove is laminated with the surface of control signal lamp chip mutually, the pin and the stitch groove looks joint of control signal lamp chip both sides, the surface of heat absorption frame opposite side terminal surface is provided with radiating fin, the intermediate position that the heat absorption frame of heat dissipation set up radiating fin is provided with the initiative and opens the structure, the initiative is opened the structure and is connected with radiator fan via the connecting wire, just radiator fan installs the through-hole position on the signal lamp body.

Furthermore, the radiating fins are provided with a plurality of pieces which are arranged in parallel, and the radiating fins are members made of copper materials.

Further, a side end face of the heat absorption frame, on which the pin grooves are formed, is provided with a bonding groove, the bonding groove is arranged around the heat absorption frame for a circle, the bonding pad is clamped inside the bonding groove, and the surface of the bonding pad is bonded with the surface of the circuit board.

Further, the active opening structure comprises a heat absorbing cylinder, the heat absorbing cylinder is installed on the surface of the heat absorbing frame, a moving column is connected inside the heat absorbing cylinder in a sliding mode, the lower side of the moving column is attached to one end of a memory metal spring, the other end of the memory metal spring is fixed to the bottom end face inside the heat absorbing cylinder, the upper side of the moving column is connected and fixed to one end of a top column, a contact switch is installed on the upper side inside the heat absorbing cylinder and located right above the top column, and the contact switch is connected with a heat radiating fan through a connecting line.

Furthermore, a side tube is arranged at the edge position of the lower end face of the moving column, and the outer wall of the side tube is connected with the inner wall of the heat absorbing tube in a sliding mode.

Furthermore, heat dissipation holes are formed in the side face of the heat absorption barrel, and are arranged around the heat absorption barrel in a surrounding mode.

Furthermore, a positioning stud is arranged on the lower side of the heat absorbing cylinder, and the positioning stud arranged on the lower side of the heat absorbing cylinder is screwed with a screw hole arranged on the heat absorbing frame.

The utility model has the advantages that: the fitting groove in the middle of the heat absorption frame is in contact with the surface of the chip, and heat emitted by the chip can be transferred to the interior of the heat absorption frame through direct contact, so that the purpose of reducing the surface temperature of the chip is achieved, and the surface temperature of the chip is greatly reduced through the design;

the heat on the heat absorption frame is transferred to the radiating fins, and the contact area between the heat absorption frame and the air is increased through the radiating fins, so that the absorbed heat can be transferred to the air, and the temperature of the surface of the chip is greatly reduced;

the heat acts on the inside of heat-absorbing cylinder, it takes place deformation at its self of the in-process that the temperature promoted to be located the inside memory metal spring of heat-absorbing cylinder, and then the memory metal spring is elongated, and then the removal post that is located memory metal spring upside also moves to the upside thereupon, and then the removal post drives the fore-set and moves to the upside, the upper end and the contact switch contact of fore-set, open radiator fan through the contact switch, and then realize initiative radiating purpose, the physical characteristic of memory metal has been utilized in this design, and the sensor then damages easily in adverse circumstances, compare in traditional sensor control and have the advantage that the reliability is high.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of a signal lamp lead frame according to the present invention;

fig. 2 is a schematic distribution diagram of the heat dissipation fins in the lead frame of the signal lamp of the present invention;

fig. 3 is a cross-sectional view of an active opening structure in a lead frame of a signal lamp according to the present invention;

FIG. 4 is a schematic view of the distribution of side tubes in the lead frame of the signal lamp according to the present invention;

in the figure: 1-heat absorption frame, 2-positioning seat, 3-pin groove, 4-fitting groove, 5-heat dissipation fin, 6-active opening structure, 61-heat absorption cylinder, 62-moving column, 63-memory metal spring, 64-top column, 65-contact switch and 66-side cylinder.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1 and fig. 2, the present invention provides a technical solution: a signal lamp lead frame comprises a heat absorption frame 1, wherein positioning seats 2 for fixing are symmetrically arranged on two sides of the heat absorption frame 1, positioning holes are formed in the positioning seats 2 and penetrate through the positioning seats 2 to be arranged, the positioning holes penetrate through bolts to be screwed with screw holes in a circuit board, a fitting groove 4 is formed in the middle of the heat absorption frame 1, the fitting groove 4 is fitted with the surface of a control signal lamp chip, pins on two sides of the control signal lamp chip are clamped with pin grooves 3, heat dissipation fins 5 are arranged on the surface of the end face of the other side of the heat absorption frame 1, the heat dissipation fins 5 are provided with a plurality of pieces of heat dissipation fins 5 which are arranged in parallel, the heat dissipation fins 5 are components made of copper materials, an active opening structure 6 is installed in the middle of the heat dissipation frame 1, the active opening structure 6 is connected with a heat dissipation fan through a connecting wire, and the heat dissipation fan is installed in the position of a through hole in a signal lamp shell.

The side end face that heat absorption frame 1 set up stitch groove 3 is provided with laminating groove 4, and laminating groove 4 sets up around heat absorption frame 1 a week, and the inside joint in laminating groove 4 has the laminating to fill up, and the surface that just laminates the pad and the surface of circuit board laminates mutually, adopts this design can so that heat absorption frame 1 and circuit board laminating be in the same place to can prevent that the bolt from applying the too big condition that causes heat absorption frame 1 circuit board to damage of effort and taking place.

Referring to fig. 3 and 4, the active opening structure 6 includes a heat absorbing tube 61, the heat absorbing tube 61 is installed on the surface of the heat absorbing frame 1, a moving column 62 is slidably connected inside the heat absorbing tube 61, the lower side of the moving column 62 is attached to one end of a memory metal spring 63, the other end of the memory metal spring 63 is fixed to the bottom end surface inside the heat absorbing tube 61, the upper side of the moving column 62 is connected to one end of a top column 64, a contact switch 65 is installed on the upper side inside the heat absorbing tube 61, the contact switch 65 is located right above the top column 64, the contact switch 65 is connected to a heat dissipating fan through a connecting wire, heat is applied to the inside of the heat absorbing tube 61, and the memory metal spring 63 inside the heat absorbing tube 61 deforms itself during the temperature raising process, the memory metal spring 63 is lengthened, the moving column 62 located on the upper side of the memory metal spring 63 moves towards the upper side, the moving column 62 drives the top column 64 to move towards the upper side, the upper end of the top column 64 is in contact with the contact switch 65, the heat dissipation fan is started through the contact switch 65, and the purpose of active heat dissipation is achieved.

The side position of the heat absorbing cylinder 61 is provided with a plurality of heat dissipation holes which are arranged around the heat absorbing cylinder 61 for a circle, so that the heat inside the heat absorbing cylinder 61 can be conveniently discharged.

The positioning stud is arranged on the lower side of the heat absorbing cylinder 61, the positioning stud arranged on the lower side of the heat absorbing cylinder 61 is screwed with the screw hole arranged on the heat absorbing frame 1, and the position of the heat absorbing cylinder 61 can be fixed through the positioning screw.

The specific implementation mode is as follows: after the positioning seats 2 on the two sides of the heat absorption frame 1 penetrate through the positioning holes through bolts, the heat absorption frame 1 is fixed on the surface of a chip, pins on the edge of the chip are clamped with pin grooves 3, then the surface of the chip is attached to the groove bottom of an attachment groove 4, heat emitted by the chip can be transferred to the inside of the heat absorption frame 1 through direct contact, the purpose of reducing the surface temperature of the chip is achieved, the temperature on the surface of the chip is greatly reduced through the design, the heat on the heat absorption frame 1 is transferred to heat dissipation fins 5, the contact area between the heat dissipation fins 5 and the air is increased, the absorbed heat can be transferred to the air, the temperature on the surface of the chip is greatly reduced, the heat acts on the inside of the heat absorption barrel 61, the memory metal spring 63 inside the heat absorption barrel 61 deforms in the temperature increasing process, the memory metal spring 63 is lengthened, the moving column 62 on the upper side of the memory metal spring 63 also moves towards the upper side, the moving column 62 drives the top column 64 to move upwards, the upper end of the contact switch 65, the heat dissipation fan is turned on, the heat dissipation fan, the heat dissipation effect of the traditional heat sensor is achieved, and the advantage of the traditional physical sensor is easily utilized in the active control of the heat dissipation environment.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.

Claims

1. A signal lamp lead frame comprises a heat absorption frame (1), and is characterized in that: the heat absorption lamp is characterized in that positioning seats (2) used for fixing are symmetrically arranged on two sides of a heat absorption frame (1), positioning holes are formed in the positioning seats (2), the positioning holes penetrate through the positioning seats (2) to be arranged, the positioning holes penetrate through screw holes in a circuit board to be screwed together through bolts, an attaching groove (4) is formed in the middle of the heat absorption frame (1), the attaching groove (4) is attached to the surface of a control signal lamp chip, pins on two sides of the control signal lamp chip are clamped with pin grooves (3), heat dissipation fins (5) are arranged on the surface of the end face of the other side of the heat absorption frame (1), an active opening structure (6) is arranged at the middle of the heat dissipation heat absorption frame (1) provided with the heat dissipation fins (5), the active opening structure (6) is connected with a heat dissipation fan through a connecting wire, and the heat dissipation fan is arranged at the position of a through hole in a signal lamp shell.

2. The signal lamp lead frame according to claim 1, wherein: the radiating fins (5) are provided with a plurality of pieces, the radiating fins (5) are arranged in parallel, and the radiating fins (5) are members made of copper materials.

3. The signal lamp lead frame of claim 2, wherein: the heat absorption frame (1) sets up a side end face in stitch groove (3) and is provided with laminating groove (4), laminating groove (4) encircle heat absorption frame (1) a week and set up, the inside joint in laminating groove (4) has the laminating pad, and the laminating pad the surface and the surface of circuit board laminate mutually.

4. The signal lamp lead frame according to claim 3, wherein: the active opening structure (6) comprises a heat absorbing barrel (61), the heat absorbing barrel (61) is installed on the surface of a heat absorbing frame (1), a moving column (62) is connected to the inside of the heat absorbing barrel (61) in a sliding mode, the lower side of the moving column (62) is attached to one end of a memory metal spring (63), the other end of the memory metal spring (63) is fixed to the bottom end face of the inside of the heat absorbing barrel (61), the upper side of the moving column (62) is connected and fixed with one end of a top column (64), a contact switch (65) is installed on the upper side of the inside of the heat absorbing barrel (61), the contact switch (65) is located right above the top column (64), and the contact switch (65) is connected with a heat radiating fan through a connecting line.

5. The signal lamp lead frame according to claim 4, wherein: the edge position of the lower end face of the moving column (62) is provided with a side cylinder (66), and the outer wall of the side cylinder (66) is in sliding connection with the inner wall of the heat absorbing cylinder (61).

6. The signal lamp lead frame according to claim 5, wherein: the side surface of the heat absorbing cylinder (61) is provided with a plurality of heat dissipation holes which are arranged around the heat absorbing cylinder (61) in a circle.

7. The signal lamp lead frame of claim 6, wherein: and a positioning stud is arranged on the lower side of the heat absorbing cylinder (61), and the positioning stud arranged on the lower side of the heat absorbing cylinder (61) is screwed with a screw hole arranged on the heat absorbing frame (1).