CN217821249U - 防护薄膜框架、防护薄膜及包括其的光掩模及系统 - Google Patents

防护薄膜框架、防护薄膜及包括其的光掩模及系统 Download PDF

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Publication number
CN217821249U
CN217821249U CN202220717487.5U CN202220717487U CN217821249U CN 217821249 U CN217821249 U CN 217821249U CN 202220717487 U CN202220717487 U CN 202220717487U CN 217821249 U CN217821249 U CN 217821249U
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China
Prior art keywords
adhesive layer
pellicle
protective film
photomask
frame
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CN202220717487.5U
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English (en)
Chinese (zh)
Inventor
西村晃范
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
CN202220717487.5U 2021-04-05 2022-03-30 防护薄膜框架、防护薄膜及包括其的光掩模及系统 Active CN217821249U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021064107 2021-04-05
JP2021-064107 2021-04-05

Publications (1)

Publication Number Publication Date
CN217821249U true CN217821249U (zh) 2022-11-15

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CN202220717487.5U Active CN217821249U (zh) 2021-04-05 2022-03-30 防护薄膜框架、防护薄膜及包括其的光掩模及系统
CN202280024213.0A Pending CN117063119A (zh) 2021-04-05 2022-03-30 防护薄膜框架、防护薄膜、带防护薄膜的光掩模、曝光方法、半导体元件的制造方法及液晶显示器的制造方法

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CN202280024213.0A Pending CN117063119A (zh) 2021-04-05 2022-03-30 防护薄膜框架、防护薄膜、带防护薄膜的光掩模、曝光方法、半导体元件的制造方法及液晶显示器的制造方法

Country Status (7)

Country Link
US (1) US20240184205A1 (https=)
EP (1) EP4321931A4 (https=)
JP (1) JPWO2022215609A1 (https=)
KR (1) KR20230164123A (https=)
CN (2) CN217821249U (https=)
TW (2) TWM634756U (https=)
WO (1) WO2022215609A1 (https=)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3026637B2 (ja) * 1991-06-13 2000-03-27 旭化成電子株式会社 ペリクル枠体の剥離法
JP3427241B2 (ja) * 1995-08-14 2003-07-14 信越化学工業株式会社 ペリクルのフォトマスクへの貼着構造
JPH1020479A (ja) * 1996-07-08 1998-01-23 Shin Etsu Chem Co Ltd フォトマスクへのペリクル貼着方法
JP4100816B2 (ja) * 1999-04-14 2008-06-11 信越化学工業株式会社 ペリクル枠およびこれを用いたペリクル
JP3597166B2 (ja) * 2000-12-27 2004-12-02 三井化学株式会社 ペリクル
JP6105188B2 (ja) * 2009-11-18 2017-03-29 旭化成株式会社 ペリクル
JP2011113033A (ja) * 2009-11-30 2011-06-09 Shin-Etsu Chemical Co Ltd ペリクル膜の製造方法および装置
JP5478463B2 (ja) 2010-11-17 2014-04-23 信越化学工業株式会社 リソグラフィー用ペリクル
KR101514591B1 (ko) * 2011-05-18 2015-04-22 아사히 가세이 이-매터리얼즈 가부시키가이샤 펠리클, 펠리클용 점착제, 펠리클 부착 포토마스크 및 반도체 소자의 제조 방법
JP6316686B2 (ja) * 2014-07-04 2018-04-25 旭化成株式会社 ペリクル、ペリクル付フォトマスク、及び半導体素子の製造方法
JP6543044B2 (ja) * 2015-02-23 2019-07-10 旭化成株式会社 ペリクル
JP2017090719A (ja) * 2015-11-11 2017-05-25 旭化成株式会社 ペリクル
JP2017090718A (ja) * 2015-11-11 2017-05-25 旭化成株式会社 ペリクル
JP7082546B2 (ja) * 2018-08-01 2022-06-08 旭化成株式会社 ペリクル及びその製造方法
JP7103252B2 (ja) * 2019-02-01 2022-07-20 信越化学工業株式会社 ペリクルフレーム、ペリクル、マスク粘着剤付ペリクルフレーム、ペリクル付露光原版、露光方法及び半導体の製造方法
CN115485618A (zh) * 2020-05-14 2022-12-16 信越化学工业株式会社 防护薄膜框架、防护薄膜、带防护薄膜的曝光原版、半导体的制造方法、液晶显示板的制造方法及曝光方法
EP4163719A4 (en) * 2020-06-04 2024-08-07 Shin-Etsu Chemical Co., Ltd. PELLICLE FRAME, PELLICLE-EQUIPPED EXPOSURE ORIGINAL PLATE, EXPOSURE METHOD, METHOD FOR MANUFACTURING A SEMICONDUCTOR AND METHOD FOR MANUFACTURING A LIQUID CRYSTAL DISPLAY PANEL

Also Published As

Publication number Publication date
EP4321931A4 (en) 2025-07-30
TW202307560A (zh) 2023-02-16
EP4321931A1 (en) 2024-02-14
TWM634756U (zh) 2022-12-01
JPWO2022215609A1 (https=) 2022-10-13
WO2022215609A1 (ja) 2022-10-13
US20240184205A1 (en) 2024-06-06
KR20230164123A (ko) 2023-12-01
CN117063119A (zh) 2023-11-14

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