CN217768372U

CN217768372U - High-light-efficiency high-temperature-resistant LED lamp

Info

Publication number: CN217768372U
Application number: CN202221231250.2U
Authority: CN
Inventors: 徐伟
Original assignee: Suzhou Benchmark Lighting Co ltd
Current assignee: Suzhou Benchmark Lighting Co ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-11-08
Anticipated expiration: 2032-05-23

Abstract

The utility model discloses a high light efficiency high temperature resistance LED lamp, including the base plate, be equipped with a plurality of heat conduction strips of arranging anyhow on the base plate, horizontal and vertical heat conduction strip is in enclose into a plurality of recesses on the base plate, be equipped with the LED chip in the recess, the opening upper shield of recess is equipped with the wavelength conversion layer, and the wavelength conversion layer includes the glass layer, is equipped with the phosphor layer in the glass layer. The utility model provides a high light efficiency high temperature resistance LED lamp sets up through the cooperation of heat conduction strip and wavelength conversion layer, has replaced the encapsulation glue film of traditional LED lamp, has promoted the heat dissipation and the high temperature resistance ability of LED lamp.

Description

High-light-efficiency high-temperature-resistant LED lamp

Technical Field

The utility model relates to a high light efficiency anti high temperature's LED lamp.

Background

At present, in the field of white light LED lamps with high luminous efficiency, a blue light LED chip is generally used as a main component, the LED chip is disposed on a substrate, and then a packaging adhesive layer with yellow fluorescent powder is covered, so that after the fluorescent powder absorbs part of blue light, yellow light with a longer wavelength is released, and then the unabsorbed blue light and yellow light are mixed into white light.

But in the use, the LED chip of high light efficiency can produce great heat, because the heat conductivity of encapsulation glue film self is poor, leads to encapsulation glue film printing opacity performance variation under high temperature environment, and the luminance decay also can appear in phosphor powder under high temperature environment simultaneously, influences LED lamp life-span.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an anti high temperature's of high light efficiency LED lamp, its cooperation through heat conduction strip and wavelength conversion layer sets up, has replaced the encapsulation glue film of traditional LED lamp, has promoted the heat dissipation and the high temperature resistance ability of LED lamp.

In order to achieve the above object, the technical scheme of the utility model is to design a high light efficiency high temperature resistance LED lamp, which comprises a substrate, be equipped with a plurality of heat conduction strips of range anyhow on the base plate, horizontal and vertical heat conduction strip is in enclose into a plurality of recesses on the base plate, be equipped with the LED chip in the recess, the opening upper shield of recess is equipped with the wavelength conversion layer, the wavelength conversion layer includes the glass layer, be equipped with the phosphor layer in the glass layer.

Through adopting above-mentioned technical scheme, the encapsulation glue film of traditional LED lamp has been replaced in the cooperation setting of heat conduction strip and wavelength conversion layer, the heat conduction strip has promoted the heat dispersion to the LED chip, the recess that the heat conduction strip encloses supports the wavelength conversion layer, wherein glass layer has advantages such as the transparency is high, the stationarity is good, high temperature resistant, certain distance has between phosphor layer and the LED chip, avoid the heat that the LED chip produced directly to act on phosphor layer, the heat dissipation and the high temperature resistance of LED lamp have been promoted.

Preferably, the groove and the wavelength conversion layer form a sealed cavity, and the cavity is filled with insulating and heat-conducting inert gas. By adopting the technical scheme, the oxidation resistance of the LED chip can be further improved by the filled inert gas, the heat conductivity coefficient is larger than that of air, and the heat dissipation performance of the LED chip is improved.

Preferably, the glass layer is temperature-resistant glass and has high light transmittance. Therefore, the influence of heat on the fluorescent powder layer is reduced, the light emitting quantity of the glass layer is improved due to high light transmittance, and the brightness of the LED lamp is improved.

Preferably, the heat conducting strip is connected with a heat radiating fin.

Preferably, a circuit in butt joint with the LED chip is arranged in the groove on the substrate.

The utility model has the advantages and the beneficial effects that: the utility model provides a high light efficiency high temperature resistance LED lamp, cooperation through heat conduction strip and wavelength conversion layer sets up, the encapsulation glue film of traditional LED lamp has been replaced, the heat that the heat conduction strip produced LED chip 4 is derived, reach radiating purpose through radiating fin, the recess that the heat conduction strip encloses supports the wavelength conversion layer, form the sealed cavity that holds the LED chip, the wavelength conversion layer is located the play plain noodles of LED chip, and have the certain distance between the LED chip, make the thermal stability of LED lamp good, wherein traditional encapsulation glue film of glass layer comparison has the transparency height, the stationarity is good, advantages such as high temperature resistant, fill insulating heat-conducting inert gas in the cavity, the performance of heat conduction strip with the heat derivation of LED chip has further been strengthened, promote the antioxidant capacity of LED chip simultaneously.

Drawings

Fig. 1 is a schematic diagram of the present invention.

Fig. 2 is a partial side view of the present invention.

Detailed Description

The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

The utility model discloses the technical scheme who specifically implements is:

as shown in fig. 1 and 2, the high-luminous-efficiency high-temperature-resistant LED lamp comprises a substrate 1, wherein a plurality of heat conducting strips 2 arranged horizontally and vertically are arranged on the substrate 1, the substrate 1 is surrounded by the horizontal and vertical heat conducting strips 2 to form a plurality of grooves 3, LED chips 4 are arranged in the grooves 3, wavelength conversion layers 5 are arranged on openings of the grooves 3 in a covering manner, each wavelength conversion layer 5 comprises a glass layer 7, and fluorescent powder layers 6 are arranged in the glass layers 7.

Through adopting above-mentioned technical scheme, heat conduction strip 2 and wavelength conversion layer 5's cooperation sets up, the encapsulation glue film of traditional LED lamp has been replaced, heat conduction strip 2 has promoted the heat dispersion to LED chip 4, recess 3 that heat conduction strip 2 encloses supports wavelength conversion layer 5, set up wavelength conversion layer 5 at the play plain noodles of LED chip 4, and have the certain distance between with LED chip 4, the heat of avoiding LED chip 4 production directly acts phosphor layer 6, wherein glass layer 7 has the transparency height, the stability is good, advantages such as high temperature resistant, the heat dissipation and the high temperature resistance performance of LED lamp have been promoted.

The groove 3 and the wavelength conversion layer 5 form a sealed cavity, and the cavity is filled with insulating and heat-conducting inert gas. By adopting the technical scheme, the oxidation resistance of the LED chip 4 can be further improved by the filled inert gas, the heat conductivity coefficient is larger than that of air, and the heat dissipation performance of the LED chip 4 is improved.

The glass layer 7 is made of temperature-resistant glass and has high light transmittance. Therefore, the influence of heat on the fluorescent powder layer 6 is reduced, the light emitting amount of the glass layer is improved due to high light transmittance, and the brightness of the LED lamp is improved.

The heat conducting strip 2 is connected with a heat radiating fin 8.

And a circuit 9 butted with the LED chip 4 is arranged in the groove 3 on the substrate 1.

The embodiment of the utility model provides a panel light that high efficiency was disinfected, heat conduction strip 2 derives the heat that LED chip 4 produced, reach radiating purpose through radiating fin 8, the recess 3 that heat conduction strip 2 encloses, set up wavelength conversion layer 5 on recess 3 opening, form the sealed cavity that holds LED chip 4, replace the encapsulation glue film with wavelength conversion layer 5, the colloid of avoiding the encapsulation glue film transmittance performance variation under the influence of high temperature, wherein glass layer 7 has the transparency height, the stability is good, advantages such as high temperature resistance, and make certain distance between fluorescent powder layer 6 and the LED chip 4, make the thermal stability of LED lamp good, fill insulating heat conduction's inert gas in the cavity, further strengthened heat conduction strip 2 with the performance of deriving the heat of LED chip 4, promote the antioxidant capacity of LED chip 4 simultaneously.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a high light efficiency anti high temperature LED lamp which characterized in that: the LED packaging structure comprises a substrate, wherein a plurality of heat conducting strips which are arranged transversely and vertically are arranged on the substrate, a plurality of grooves are formed in the substrate in a surrounding mode, LED chips are arranged in the grooves, a wavelength conversion layer covers an opening of each groove, the wavelength conversion layer comprises a glass layer, and a fluorescent powder layer is arranged in the glass layer.

2. The high-luminous-efficiency high-temperature-resistant LED lamp as claimed in claim 1, wherein the groove and the wavelength conversion layer form a sealed cavity, and the cavity is filled with an insulating and heat-conducting inert gas.

3. The LED lamp of claim 2, wherein the glass layer is temperature-resistant glass and has high light transmittance.

4. The high-luminous-efficiency high-temperature-resistant LED lamp as claimed in claim 3, wherein the heat conducting strips are connected with heat dissipating fins.

5. The high-luminous-efficiency high-temperature-resistant LED lamp as claimed in claim 4, wherein the circuit abutting against the LED chip is disposed in the groove on the substrate.