CN217426778U - Reverse-beating type broken-line arc LED packaging structure - Google Patents

Abstract

The utility model discloses a reverse beating type broken line arc LED packaging structure, which comprises a packaging body bracket; the packaging body support is hollow, and the upper end of the packaging body support is open; a metal substrate covers the bottom surface inside the packaging body bracket; the LED chip is fixed on the upper surface of the metal substrate through conductive silver adhesive; the P/N electrodes of the LED chip are respectively connected with the P/N electrodes of the metal substrate through metal wires; the metal wire is in a reverse beating type bent arc; and sealing and filling the inside of the packaging body support by using packaging glue or fluorescent glue, and curing the packaging body support, the metal substrate, the LED chip and the metal lead into a whole. According to the reverse striking type broken line arc LED packaging structure, the metal conducting wire is in a reverse striking type bent line arc, so that the condition that the LED is broken and the lamp is dead can be effectively reduced; and the packaging body bracket is sealed and filled by packaging glue or fluorescent glue, so that the harm of light emitted by the LED to human eyes can be reduced, and the generation of glare is reduced.

Description

Reverse-beating type broken-line arc LED packaging structure

Technical Field

The utility model relates to a LED encapsulates technical field, in particular to anti-formula broken line arc LED packaging structure of beating.

Background

Light Emitting Diodes (LEDs) have the advantages of small size, high light emitting efficiency, low power consumption, environmental protection, and the like, and can emit visible light or invisible light, and LED light sources are widely used in various vehicle lamps and electronic products. The luminescent device is a commonly used luminescent device, releases energy through the recombination of electrons and holes to emit light, and has wide application in the field of illumination. Like a common diode, the light emitting diode is composed of a PN junction and also has unidirectional conductivity. When a forward voltage is applied to the light emitting diode, holes injected from the P region to the N region and electrons injected from the N region to the P region are respectively recombined with the electrons in the N region and the holes in the P region within a few micrometers near a PN junction to generate spontaneous emission fluorescence. The existing LED packaging structure can only be provided with LED chips of fixed types, and the emitted light has strong stimulation to human eyes, so that the human eyes are directly watched for a long time and are greatly damaged.

The existing LED packaging structure metal lead adopts a circular arc in a forward striking mode, the abnormal phenomenon of broken wire and dead lamp is frequently caused, and once the broken wire and dead lamp condition of the LED occurs, great expense investment is required for market recall, disassembly and repair.

Therefore, on the basis of the existing LED package structure, how to reduce the stimulation of light emitted by the LED chip to human eyes and reduce the occurrence of disconnection or lamp failure of the LED chip becomes a technical problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the utility model provides a formula of beating is turned over and is rolled over line arc LED packaging structure can overcome or solve the condition that the dead lamp of broken string very easily appears in present stage LED packaging structure at least partially to and the light that sends causes the great problem of harmfulness to the human eye.

The utility model provides a reverse beating type broken line arc LED packaging structure, which comprises a packaging body bracket; the packaging body support is hollow, and the upper end of the packaging body support is open; a metal substrate covers the bottom surface inside the packaging body support;

the LED chip is fixed on the upper surface of the metal substrate through conductive silver adhesive; the P/N electrodes of the LED chip are respectively connected with the P/N electrodes of the metal substrate through metal leads;

the metal lead is in a reverse beating type bent arc;

and sealing and filling the inside of the packaging body bracket by using packaging glue or fluorescent glue, and curing the packaging body bracket, the metal substrate, the LED chip and the metal lead into a whole.

Further, the shape of the packaging body support is a cuboid, a cube or a cylinder.

Further, the metal substrate is an aluminum substrate, a copper substrate or an iron substrate.

Further, the LED chip is a blue LED chip, a red LED chip or a UV LED chip.

Furthermore, the metal wire is a gold wire, an alloy wire, a copper wire or an aluminum wire.

Further, the packaging adhesive is epoxy resin or silica gel.

Further, the fluorescent glue is: epoxy resin and fluorescent powder or a mixture of silica gel and fluorescent powder.

The embodiment of the utility model provides an above-mentioned technical scheme's beneficial effect includes at least:

the utility model provides a reverse beating type broken line arc LED packaging structure, which comprises a packaging body bracket; the packaging body support is hollow, and the upper end of the packaging body support is open; a metal substrate is covered on the bottom surface inside the packaging body support; the LED chip is fixed on the upper surface of the metal substrate through conductive silver adhesive; the P/N electrodes of the LED chip are respectively connected with the P/N electrodes of the metal substrate through metal wires; the metal wire is in a reverse beating type bent arc; and sealing and filling the inside of the packaging body support by using packaging glue or fluorescent glue, and curing the packaging body support, the metal substrate, the LED chip and the metal lead into a whole. According to the reverse striking type broken line arc LED packaging structure, the metal conducting wire is in a reverse striking type bent line arc, so that the condition that the LED is broken and the lamp is dead can be effectively reduced; and the packaging body bracket is sealed and filled by packaging glue or fluorescent glue, so that the harm of light emitted by the LED to human eyes can be reduced, and the generation of glare is reduced.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.

The technical solution of the present invention is further described in detail by the accompanying drawings and examples.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of a reverse-beating type broken-line arc LED packaging structure provided in an embodiment of the present invention;

fig. 2 is a schematic view of another reverse-hitting type broken-line arc LED package structure provided in the embodiment of the present invention;

fig. 3 is a schematic view of a conventional direct-beating type metal wire according to an embodiment of the present invention;

fig. 4 is a schematic view of the shape of a metal wire in a reverse beating mode according to an embodiment of the present invention;

wherein: 1-a packaging body support, 2-a metal substrate, 3-conductive silver adhesive, 4-an LED chip, 5-a metal wire, 6-packaging adhesive, 7-fluorescent adhesive, 8-a red light LED chip and 9-an electrode.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

Example 1

The embodiment of the utility model provides a reverse beating type broken line arc LED packaging structure, which is shown in figure 1 and comprises a packaging body bracket 1; the package support 1 is hollow and has an open upper end. The bottom surface in the packaging body bracket 1 is covered with a metal substrate 2; the upper surface of the metal substrate 2 is fixedly provided with an LED chip 4 through a conductive silver adhesive 3. The P/N electrodes of the LED chip 4 are respectively connected with the P/N electrodes of the metal substrate 2 through metal wires 5 (the P pole of the LED chip is connected with the P pole of the metal substrate through the metal wires, and the N pole of the LED chip is connected with the N pole of the metal substrate through the metal wires), and the P/N electrodes on the LED chip 4 are represented by electrodes 9 in the figure. The metal wire 5 is a reverse beating type bending arc. Referring to fig. 1 and 2, the package holder 1 is sealed and filled with a package adhesive 6 or a fluorescent adhesive 7, and the package holder 1, the metal substrate 2, the LED chip 4, and the metal wires 5 are integrally cured. The LED chip 4 is a blue LED chip, a red LED chip or a UV ultraviolet LED chip, and the size of the LED chip 4 is generally 0.2mm × 0.6mm, which is not limited in this embodiment.

Referring to fig. 3, the shape of a conventional metal wire is shown, and the welding mode of the conventional metal wire adopts a conventional forward striking mode and is in a circular arc shape. Referring to fig. 4, the shape of the metal wire provided in this embodiment is shown, the welding mode of the metal wire 5 adopts a reverse striking mode, and the arc of the wire is bent. In the manufacturing process, when the packaging glue or the fluorescent glue is sealed and filled, the reverse-beating type bent wire arc cannot deform, and the wire arc tension of the metal wire is improved and the external force is borne. Through optimizing metal conductor's welding mode, change into the mode of beating conversely by traditional positive mode of beating, the arc is changed into the shape of buckling by traditional convex, improves the pulling force of arc to reduce the damage that external force and external environment temperature caused metal conductor. The abnormal phenomenon of the lamp is died to the broken string can not appear, effectively promotes the line arc pulling force, reduces personnel's external force operation improper to and the inside harm to the metal wire of stress that receives the influence production of the temperature height of environment of glue.

The following table shows the comparison data of the tension of the actual 7016PKG/0.9mil gold thread case:

TABLE 1 tensile force comparison data sheet

This embodiment, this turn over and beat formula broken line arc LED packaging structure, metal wire are turn over and beat formula bending type line arc, can effectively reduce the condition that the dead lamp of broken string appears in LED. And the packaging body bracket is sealed and filled by packaging glue or fluorescent glue, so that the harm of light emitted by the LED to human eyes can be reduced, the generation of glare is reduced, and the LED chip is arranged to emit soft light.

Specifically, the conductive silver paste 3 may be selected from a wide variety, and the present embodiment is not limited thereto. Isotropic Conductive silver paste (ICAs) and Anisotropic Conductive silver paste (ACAs) are classified according to a Conductive direction. ICA refers to an adhesive which is conductive in all directions and is widely used in the electronic field; ACA refers to an adhesive that is electrically conductive in one direction, such as the Z direction, and electrically non-conductive in the X and Y directions. Generally, the preparation of the ACA has higher requirements on equipment and process, is difficult to realize, and is more used for occasions such as fine printing of boards.

The conductive silver adhesive can be classified into room-temperature cured conductive silver adhesive, medium-temperature cured conductive silver adhesive, high-temperature cured conductive silver adhesive, ultraviolet-cured conductive silver adhesive, and the like according to a curing system. The room temperature cured conductive silver adhesive is unstable, the volume resistivity is easy to change when the conductive silver adhesive is stored at room temperature, and the conductive silver adhesive is not recommended to be used in a room temperature environment; when the high-temperature conductive silver adhesive is cured at high temperature, the metal particles are easy to oxidize, and the requirement on curing time needs to be shorter to meet the requirement on the conductive silver adhesive; the medium-temperature curing conductive silver adhesive (lower than 150 ℃) has moderate curing temperature, is matched with the temperature resistance and the use temperature of electronic components, and has excellent mechanical property, so the intermediate-temperature curing conductive silver adhesive is recommended to be used in the embodiment. The ultraviolet light curing conductive silver adhesive combines an ultraviolet light curing technology with the conductive silver adhesive. The conductive silver adhesive mainly comprises a resin matrix, conductive particles, a dispersing additive, an auxiliary agent and the like.

The conductive silver adhesive used in the market is mostly a resin matrix of filler type conductive silver adhesive, various types of resin matrices of the adhesive agent can be adopted, and thermosetting adhesives such as epoxy resin, organic silicon resin, polyimide resin, phenolic resin, polyurethane, acrylic resin and other adhesive systems are commonly used. The adhesives form a molecular skeleton structure of the conductive silver adhesive after curing, guarantee the mechanical property and the bonding property, and enable conductive filler particles to form channels. Because the epoxy resin can be cured at room temperature or below 150 ℃, and has rich formula and design performance, the epoxy resin-based conductive silver adhesive is dominant.

The conductive silver colloid requires that the conductive particles have good conductive performance and the particle size is in a proper range, and can be added into a conductive silver colloid matrix to form a conductive path. The conductive filler may be powders of gold, silver, copper, aluminum, zinc, iron, nickel, and graphite and some conductive compounds.

Optionally, the package support 1 is shaped like a rectangular parallelepiped, a cube, or a cylinder, which is not limited in this embodiment. The metal substrate 2 is an aluminum substrate, a copper substrate, or an iron substrate. The metal substrate 2 is a metal plate (aluminum, copper, iron, molybdenum, etc.) as a base material, and an insulating dielectric layer and a conductive layer (copper foil) are coated on the base material. The coated metal substrate is a substrate which is formed by coating a layer of glaze on six sides of a metal plate and sintering the glaze into a whole, and a conductor circuit pattern is manufactured on the substrate through leakage drawing of a silk screen and sintering. Adopt metal substrate 2 as heat dissipation base plate, can be used to absorb the heat that the LED chip produced to on conducting this heat to heat sink, realize the heat exchange with the external world, and then make the heat that LED chip or lamp pearl produced distribute out in time, improve the luminous efficacy of LED chip.

The aluminum substrate is the most used substrate in the existing metal substrates, and has good thermal conductivity, electrical insulation performance and machining performance. The aluminum substrate is divided into a flexible aluminum substrate, a mixed aluminum substrate, a multilayer aluminum substrate, a through-hole aluminum substrate and the like. The copper substrate is one of the metal substrates with higher cost, and the heat conduction effect is better than that of the aluminum substrate and the iron substrate. The copper substrate is divided into a gold immersion copper substrate, a silver plating copper substrate, a tin spraying copper substrate, an oxidation resistant copper substrate and the like. The metal substrate 2 has strong thermal expansibility, heat dissipation property, and dimensional stability. The heat dissipation problem can be effectively solved, so that the expansion with heat and contraction with cold of the LED chip of the component on the circuit board can be relieved, and the durability and the reliability of the LED chip of the electronic equipment can be improved. The metal base plate 2 is much more dimensionally stable than a sheet of insulating material.

Optionally, the LED chip 4 is a normal chip or a vertical chip, and is electrically connected to the package support 1 through a metal wire 5. The positive chip P/N electrode is positioned on the surface of the LED chip; the P electrode of the vertical chip is positioned on the surface of the LED chip, and the N electrode is positioned at the bottom of the LED chip. The normal chip or the vertical chip adopts a conventional GaN-based LED structure, sapphire, silicon carbide or silicon is used as a substrate structure, a P-type semiconductor layer, a light emitting layer, an N-type semiconductor layer, a P-type electrode and an N-type electrode are arranged on the substrate structure, the arrangement of each structure can be flexibly set according to the actual use condition, and the structure is not limited in the embodiment.

The metal wire 5 is a gold wire, an alloy wire, a copper wire or an aluminum wire, which is not limited in this embodiment. Has better ductility and machinability, strong conductivity and corrosion resistance. The packaging adhesive 6 is transparent epoxy resin or silica gel. The fluorescent glue 7 is a mixture of transparent epoxy resin and fluorescent powder, or a mixture of silica gel and fluorescent powder. Silica gel is stable in chemical property and not easy to burn, has strong adsorption capacity and high electrical insulation, and has high use safety by taking the silica gel as a main substance of the packaging adhesive 6 or the fluorescent adhesive 7. And the interior of the packaging body support 1 is sealed and filled with epoxy resin or silica gel, so that glare emitted by the LED chip 4 is filtered, and the glare is friendly and soft to human eyes. Reduce the harm to human eyes in the using process.

The epoxy resin has the following advantages: excellent mechanical properties: the epoxy resin has strong cohesive force and self mechanical strength superior to that of common resin. The strength is good: after the epoxy resin reacts with amines, hydroxyl groups are generated in the structure, and the epoxy resin has good adhesion to a plurality of materials. The hardening shrinkage rate is low: the curing shrinkage of the epoxy resin is only 1-2%, which is one of the smallest types of thermosetting plastics. The processing performance is good: the epoxy resin does not generate volatile substances when being hardened, and can be suitable for various processing conditions. The electrical performance is good: the volume resistance of the epoxy resin is more than 1015ohm-cm, and the epoxy resin is a resin material with good insulation property. The chemical stability is high: epoxy resins can withstand corrosion by various acids, alkalis, and salts without damage. The heat resistance is good: the cured epoxy resin can be heat-resistant to about 100 ℃ in general, and the resin with a special heat-resistant grade can be heat-resistant to more than 200 ℃.

Optionally, the reverse-beating type broken-line-arc LED package structure provided by this embodiment may be manufactured as follows:

referring to fig. 2, the LED chip 4 is a red LED chip 8, which is a front-mounted chip, and has an electrode above the chip and a vertical structure. Bonding the red LED chip 8 on the metal substrate 2 in the packaging body bracket 1 by using conductive silver adhesive 3 through die bonding equipment; then setting equipment parameters through welding equipment, setting an arc shape of a metal wire 5 into a bent arc by using a reverse beating welding mode, and enabling a P electrode of the red light LED chip 8 to be in circuit connection with a P electrode structure of a metal substrate 2 of the packaging body support 1 through the metal wire 5 to play a role in conduction; and then, filling the packaging adhesive 6 into the packaging body support 1 by using adhesive dispensing equipment, and finally baking and curing by using an oven.

The reverse-beating type broken-line-arc LED packaging structure provided by the embodiment can effectively improve the tensile force of a line arc, reduce improper external force operation of personnel, and reduce the stress generated by the influence of the high and low temperature of the environment inside glue, so that the metal wire is damaged, and the LED quality and the luminous efficiency are improved.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (6)

1. A reverse beating type broken line arc LED packaging structure is characterized by comprising a packaging body support (1); the packaging body support (1) is hollow, and the upper end of the packaging body support is open; the bottom surface in the packaging body support (1) is covered with a metal substrate (2);

an LED chip (4) is fixed on the upper surface of the metal substrate (2) through conductive silver adhesive (3); the P/N electrodes of the LED chip (4) are respectively connected with the P/N electrodes of the metal substrate (2) through metal wires (5);

the metal lead (5) is in a reverse beating type bent arc;

the packaging body support (1) is internally sealed and filled with packaging glue (6) or fluorescent glue (7), and the packaging body support (1), the metal substrate (2), the LED chip (4) and the metal lead (5) are solidified into a whole.

2. The inverted polygonal line arc LED packaging structure according to claim 1, wherein the package support (1) is rectangular, square or cylindrical in shape.

3. The inverted open type broken line arc LED packaging structure according to claim 1, wherein the metal substrate (2) is an aluminum substrate, a copper substrate or an iron substrate.

4. The reverse-hitting type broken-line arc LED packaging structure according to claim 1, wherein the LED chip (4) is a blue LED chip, a red LED chip or a UV ultraviolet LED chip.

5. The flip-chip type broken-line arc LED package structure according to claim 1, wherein the metal wire (5) is a gold wire, an alloy wire, a copper wire or an aluminum wire.

6. The reverse-hitting type broken-line arc LED packaging structure according to claim 1, wherein the packaging adhesive (6) is epoxy resin or silica gel.

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