CN217283838U - Semiconductor cooling assembly and radiator - Google Patents
Semiconductor cooling assembly and radiator Download PDFInfo
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- CN217283838U CN217283838U CN202220205390.6U CN202220205390U CN217283838U CN 217283838 U CN217283838 U CN 217283838U CN 202220205390 U CN202220205390 U CN 202220205390U CN 217283838 U CN217283838 U CN 217283838U
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Abstract
The utility model discloses a semiconductor cooling subassembly and radiator, wherein, this semiconductor cooling subassembly includes: the cooling device comprises a base, a heat radiation body, a semiconductor refrigeration piece, a functional piece and a cooling fan. The utility model discloses a set up a plurality of installation face on the base plate, set up a plurality of radiators on the installation face, a plurality of radiators can be according to the power free stack of the object of waiting to generate heat, it has the semiconductor refrigeration piece to correspond the laminating on leading the temperature base plate on the radiator, the heat dissipation of semiconductor refrigeration piece production heat one side accessible radiator, be provided with the function piece on producing microthermal one side, the object cooling of generating heat is treated to the microthermal function piece of accessible, thereby realize the radiating effect to the object cooling of generating heat, and simultaneously, the heat radiation fins who sets up on the radiator cools down through the radiator fan that corresponds, in order to guarantee the temperature balance of semiconductor refrigeration piece, the utility model discloses can freely add the heat radiation structure to the object that generates heat not, satisfy the different demand of adding the outfit of the object that generates heat when guaranteeing the radiating efficiency.
Description
Technical Field
The utility model relates to a radiator technical field especially relates to a semiconductor cooling subassembly and radiator.
Background
With the rapid development of science and technology, the technology of household appliances is continuously iterated and developed towards miniaturization and multifunction, and meanwhile, the heat dissipation problem of the household motor becomes a key problem to be solved by various manufacturers.
In the prior art, the radiator structure is single, and single radiator can't satisfy in limited installation space, to the radiating demand of high-power electrical apparatus, when a plurality of radiators of stack series connection, the utilization ratio in radiator wind channel reduces, causes the radiating efficiency to descend, can't solve among the prior art the high efficiency and carry out the problem of additional distribution to the heat dissipation demand of the different objects that generate heat.
Accordingly, there is a need for improvements and developments in the art.
SUMMERY OF THE UTILITY MODEL
In order to solve the single structure of radiator among the prior art, can't keep the radiating efficiency the while to the problem that the different heat dissipation demands of the object that generates heat carried on the increase, the utility model provides a semiconductor cooling subassembly and radiator.
The utility model discloses a following technical scheme realizes:
a semiconductor cooling assembly, wherein the semiconductor cooling assembly comprises:
a base including a plurality of mounting surfaces;
the heat dissipation body is at least provided with two heat dissipation bodies, the two heat dissipation bodies correspond to each other one by one and are detachably arranged on the mounting surface, each heat dissipation body comprises a plurality of heat dissipation fins and a heat conduction substrate, and the plurality of heat dissipation fins are uniformly arranged on the heat conduction substrate along a preset angle;
the semiconductor refrigeration pieces are arranged in a plurality of numbers, correspond to one another and are arranged in the middle of the heat conduction substrate in a laminating manner, and a metal layer is arranged between each semiconductor refrigeration piece and the heat conduction substrate;
the functional piece is attached to one side of the refrigerating surfaces of the plurality of semiconductor refrigerating pieces;
and the heat radiation fan corresponds to the plurality of heat radiation fins arranged on the plurality of heat radiation bodies.
In the semiconductor cooling assembly, the substrate is a plate body, and the mounting surfaces are arranged on one side of the base in an array manner and are arranged in the same horizontal plane;
the heat dissipation bodies are provided with yielding parts corresponding to the middle parts of the mounting surfaces, and the heat dissipation fans are embedded above the yielding parts;
or, the heat radiation fan is embedded in the holding part.
In the semiconductor cooling assembly, a wind guiding column is arranged on the base corresponding to the position giving part, the wind guiding column is cylindrical, and the cooling fan is fixedly arranged at one end of the wind guiding column;
the air guide column is arranged right below the center of the fan.
In the semiconductor cooling assembly, the base is a cylinder, and a plurality of mounting surfaces are circumferentially arranged on the side surface of the base;
the heat radiation fan is arranged on one side of the heat radiation bodies,
or the heat radiation fan is arranged in a abdicating space arranged at one side of the heat radiation bodies;
the direction of the heat dissipation fins on the plurality of heat dissipation bodies corresponds to the air outlet direction of the heat dissipation fan.
Semiconductor cooling subassembly, wherein, the base still includes leads the temperature piece, it includes connecting portion and leads temperature portion to lead the temperature piece, connecting portion and a plurality of the laminating of semiconductor refrigeration piece is connected, it is used for a plurality of to lead temperature portion the temperature of semiconductor refrigeration piece is concentrated on lead in the temperature portion.
In the semiconductor cooling assembly, the heat dissipation fins are U-shaped, and a plurality of heat dissipation fins are arranged on the heat conducting substrate at intervals of a preset distance;
or the radiating fins are square wave-shaped, and a plurality of bending parts are arranged on the radiating fins and are integrally connected.
The semiconductor cooling assembly is characterized in that the thickness of the heat conducting substrate is 0.8-3 mm.
The semiconductor cooling assembly is characterized in that the base is further provided with a controller, the controller is provided with a plurality of temperature sensing elements, and the temperature sensing elements are attached to the semiconductor cooling sheets;
the controller is also provided with a signal transmitter and a signal receiver, and the signal transmitter and the signal receiver are used for being in signal connection with terminal equipment.
The semiconductor cooling assembly, wherein, the function piece includes:
a plurality of groups of heat dissipation fins;
or a plurality of groups of water cooling assemblies, wherein each water cooling assembly comprises a water cooling pipe and a water cooling head.
A heat sink, wherein the heat sink comprises the semiconductor cooling assembly of any one of the above.
The beneficial effects of the utility model reside in that: the utility model discloses a set up a plurality of installation face on the base plate, set up a plurality of radiators on the installation face, a plurality of radiators can be according to the power free stack of the object of waiting to generate heat, it has the semiconductor refrigeration piece to correspond the laminating on leading the temperature base plate on the radiator, the heat dissipation of semiconductor refrigeration piece production heat one side accessible radiator, be provided with the function piece on producing microthermal one side, the object cooling of generating heat is treated to the microthermal function piece of accessible, thereby realize the radiating effect to the object cooling of generating heat, and simultaneously, the heat radiation fins who sets up on the radiator cools down through the radiator fan that corresponds, in order to guarantee the temperature balance of semiconductor refrigeration piece, the utility model discloses can freely add the heat radiation structure to the object that generates heat not, satisfy the different demand of adding the outfit of the object that generates heat when guaranteeing the radiating efficiency.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of a semiconductor cooling module according to the present invention;
FIG. 2 is a schematic perspective view of a second embodiment of the semiconductor cooling assembly of the present invention;
FIG. 3 is an exploded view of the first embodiment of the semiconductor cooling module of the present invention;
in fig. 1 to 3: 100. a base; 110. a bit escape part; 120. a temperature conduction member; 121. a connecting portion; 122. a temperature conduction part; 200. a heat sink; 210. a heat conducting substrate; 220. heat dissipation fins; 300. a semiconductor refrigeration sheet; 400. a heat radiation fan; 500. and a controller.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the following description of the present invention will refer to the accompanying drawings and illustrate embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In the prior art, the radiator structure is single, and single radiator can't satisfy in limited installation space, to the radiating demand of high-power electrical apparatus, when a plurality of radiators of stack series connection, the utilization ratio in radiator wind channel reduces, causes the radiating efficiency to descend, can't solve among the prior art the high efficiency and carry out the problem of additional distribution to the heat dissipation demand of the different objects that generate heat.
Based on the above-mentioned problem among the prior art, the utility model provides a semiconductor cooling subassembly, as shown in FIG. 1, this semiconductor cooling subassembly includes: a base 100, the base 100 including a plurality of mounting surfaces;
the number of the heat radiators 200 is at least two, the heat radiators 200 correspond to one another and are detachably arranged on the mounting surface, the heat radiator 200 comprises a plurality of heat radiating fins 220 and a temperature conducting substrate 210, and the heat radiating fins 220 are uniformly arranged on the temperature conducting substrate 210 along a preset angle;
the semiconductor refrigeration pieces 300 are arranged, the semiconductor refrigeration pieces 300 correspond to each other one by one and are arranged in the middle of the temperature conduction substrate 210 in a laminating manner, and a metal layer is arranged between each semiconductor refrigeration piece 300 and the corresponding temperature conduction substrate 210;
the functional piece is attached to one side of the refrigerating surfaces of the plurality of semiconductor refrigerating pieces 300;
the heat dissipation fan 400, the heat dissipation fan 400 corresponds to the plurality of heat dissipation fins 220 disposed on the plurality of heat dissipation bodies 200.
The utility model discloses a set up a plurality of installation face on the base plate, set up a plurality of radiators 200 on the installation face, a plurality of radiators 200 can be according to the power free stack of waiting to generate heat the object, it has semiconductor refrigeration piece 300 to correspond the laminating on leading temperature base plate 210 on radiator 200, semiconductor refrigeration piece 300 produces heat one side accessible radiator 200 heat dissipation, be provided with the function piece on the one side that produces microthermal, the object cooling of generating heat is treated to the microthermal function piece of accessible, thereby realize the radiating effect of object cooling to generating heat, and simultaneously, the cooling fin 220 that sets up on radiator 200 is cooled down through the radiator fan 400 that corresponds, in order to guarantee the temperature balance of semiconductor refrigeration piece 300, the utility model discloses can freely increase and join in marriage heat radiation structure to different objects that generate heat, satisfy the increase and join in marriage demand of different objects that generate heat when guaranteeing radiating efficiency.
In the above-mentioned embodiment, as shown in fig. 1, in the above-mentioned embodiment, the utility model discloses semiconductor cooling assembly includes base 100, radiator 200, semiconductor refrigeration piece 300, function piece and radiator fan 400, wherein, be provided with a plurality of installation face on the base 100, correspondingly, radiator 200 is provided with a plurality of, a plurality of radiator 200 corresponds with the installation face, demountable installation is on the installation face, the quantity that radiator 200 set up influences the radiating efficiency of semiconductor cooling assembly to the object that generates heat, when the heating power of the object that generates heat is higher, the accessible sets up a plurality of radiators 200 in order to guarantee radiating efficiency, in this embodiment, the quantity of radiator is provided with two at least.
Specifically, as shown in fig. 1, the heat sink 200 includes a heat sink substrate and a plurality of heat sink fins 220, the plurality of heat sink fins 220 are disposed on the heat sink substrate along a predetermined angle, and a predetermined distance is spaced between adjacent heat sink fins 220, the heat sink fins 220 and the heat sink substrate are both made of a material with a high thermal conductivity, such as copper, aluminum, and the like, heat can be uniformly conducted to the heat sink fins 220 through the heat sink substrate, and the contact area between the heat sink substrate and the air is increased through the plurality of heat sink fins 220, so that the heat dissipation efficiency of the heat sink 200 is improved.
The semiconductor refrigeration piece 300 is a heat transfer tool, which comprises an N-type semiconductor material and a P-type semiconductor material, when the N-type semiconductor material and the P-type semiconductor material are connected to form a thermocouple pair, and when current flows in the thermocouple pair, heat transfer can be generated at two ends of the N-type semiconductor material and the P-type semiconductor material, namely one end is used for refrigerating, and the other end is used for heating, namely a refrigerating surface and a radiating surface.
Based on the working principle of the semiconductor chilling plate 300, in this embodiment, the heat dissipation surface of the semiconductor chilling plate 300 is attached to the heat dissipation substrate, so that heat generated by the heat dissipation surface of the semiconductor chilling plate 300 is dissipated by the heat dissipation body 200, thereby ensuring that the chilling surface of the semiconductor chilling plate 300 can continuously generate low temperature, and cooling a heating object, when the semiconductor chilling plate 300 is specifically arranged, the number of the semiconductor chilling plate 300 is the same as that of the heat dissipation body 200, the semiconductor chilling plate 300 and the heat dissipation body 200 correspond to each other one by one and are attached to the middle of the heat conduction substrate 210, so that the temperature generated by the heat dissipation surface of the semiconductor chilling plate 300 can be rapidly conducted to each position on the heat conduction substrate 210, in addition, in order to ensure the attachment relationship between the semiconductor chilling plate 300 and the heat dissipation substrate, the embodiment further provides a metal layer between the semiconductor chilling plate 300 and the heat conduction substrate 210, the metal layer can play a role in fixedly connecting the semiconductor chilling plate 300 and the heat conduction substrate 210, and meanwhile, the phenomenon of uneven heat conduction caused by the fact that the contact surface of the semiconductor chilling plate and the heat conduction substrate is not smooth enough is overcome.
In the above embodiment, a functional component is further disposed on one side of the cooling surface of the semiconductor cooling plate 300, and the functional component is used for cooling a heat generating object in a specific situation, and the specific arrangement of the functional component is described in detail below.
In the above embodiment, a heat dissipation fan 400 is further provided, and the heat dissipation fan 400 is used to accelerate the heat dissipation speed of the heat dissipation body 200, when actually configured, the heat dissipation fan 400 corresponds to the position of the plurality of heat dissipation fins 220 of which the plurality of heat dissipation bodies 200 are disposed, and wind power generated by the heat dissipation fan 400 can form an air channel at the position between adjacent heat dissipation fins 220, so as to improve the heat dissipation effect of the heat dissipation body 200 by increasing the air flow speed.
In an implementation manner of the present invention, as shown in fig. 1, when the heat dissipation body 200 is actually disposed, the heat conducting substrate 210 is preferably disposed on both sides of the heat dissipation fins 220, so that the heat dissipation fins 220 and the heat conducting substrate 210 form an air channel with a closed circumference, thereby ensuring that the wind generated by the heat dissipation fan 400 can be continuously transported to the other end from one end of the heat dissipation fins 220, and avoiding the problem of poor area utilization rate of the heat dissipation fins 220 in the air channel due to the fact that the air between the adjacent heat dissipation fins 220 rises to the outside of the heat dissipation fins 220 when being heated.
In the present invention, based on the above, the present invention further includes two types of semiconductor cooling assemblies, in the first embodiment of the semiconductor cooling assembly of the present invention, as shown in fig. 1:
above-mentioned base 100 specifically sets up to plate body shape, the one side on the plate body is arranged to above-mentioned installation face, and a plurality of installation face arranges with the form of array, radiator 200 is provided with a plurality of according to the user demand, and evenly arrange on the installation face on the plate body, a plurality of radiator 200's size is the same, when a plurality of radiator 200 one-to-one is installed on the installation face, the upper surface of a plurality of radiator 200 is located the coplanar, when the benefit that sets up like this lies in increasing radiator 200, can not increase installation space, thereby guarantee that above-mentioned semiconductor cooling subassembly can use in the less electrical apparatus of installation space, and freely increase or decrease the quantity of radiator 200 according to the user demand of power.
Correspondingly, a heat dissipation fan 400 is further arranged on the heat dissipation body 200 corresponding to the middle position of the mounting surface on the plate body, the heat dissipation fan 400 is embedded above the abdicating portion 110 and corresponds to the heat dissipation fins 220 on the heat dissipation body 200, the air outlet surface of the heat dissipation fan 400 faces one side of the mounting surface on the plate body, when the heat dissipation fan 400 starts to rotate, generated wind power passes through the abdicating portion 110 and passes through the adjacent heat dissipation fins 220 from the heat dissipation fins 220 arranged on the heat dissipation body 200, and therefore the effect of increasing the air flowing speed to accelerate the heat exchange rate between the heat dissipation fins 220 and the air is achieved.
In another possible implementation manner of the present invention, as shown in fig. 1, the heat dissipation fan 400 can be further embedded and disposed in the yielding portion 110, such a disposition manner makes the distance between the heat dissipation fan 400 and the mounting surface more compact, thereby reducing the space required for mounting the semiconductor cooling component, when the heat dissipation fan 400 is opened, the air flow flowing to the mounting surface is guided by the mounting surface, flows between the adjacent heat dissipation fins disposed in the heat dissipation body 200, and the effect of increasing the heat exchange rate between the heat dissipation fins 220 and the air by increasing the air flowing speed is also achieved.
In the above embodiment, in order to avoid disturbance of the airflow generated by the heat dissipation fan 400 on the mounting surface and the problem of unsmooth airflow circulation, in this embodiment, an air guiding post is further disposed on the base 100 at a position corresponding to the positioning portion 110, the air guiding post is specifically configured to be cylindrical, the surface of the air guiding post is smooth, one planar end of the air guiding post is fixedly disposed at one side of the base 100 where the mounting surface is disposed, the heat dissipation fan 400 is fixedly disposed at the other planar end of the air guiding post, and meanwhile, the height of the air guiding post is set to be smaller than that of the heat dissipation fins 220, so that a part of the airflow generated by the heat dissipation fan 400 can directly enter the heat dissipation body 200, and meanwhile, the other part of the airflow is guided along the circumferential side surface of the air guiding post to move around the circumferential surface of the air guiding post and finally enter the heat dissipation body 200, the utility model has the advantages of guiding post, a portion of the airflow is prevented from bouncing out of the escape portion 110 through the side of the base 100 where the mounting surface is located.
In the first embodiment of the semiconductor cooling module of the present invention, as shown in fig. 2 and 3, the base 100 may be further provided in a cylindrical shape, the plurality of mounting surfaces are circumferentially arranged on the side surface of the base 100, the heat radiator 200 is also detachably arranged on the mounting surfaces and can be increased or decreased according to the use requirements of users, correspondingly, the heat dissipation fan 400 is disposed at one side of the plurality of heat dissipation bodies 200, and, in the present embodiment, the direction of the heat dissipation fins 220 on the heat dissipation member 200 corresponds to the direction of the air outlet of the heat dissipation fan 400, and the directions of the heat dissipation fins 220 on the plurality of heat dissipation members 200 are the same, when the heat dissipation fan 400 is turned on, the air outlet surface of the heat dissipation fan 400 corresponds to one end of the heat dissipation fins 220, the effect of rapidly conveying the air flow along the channel between the adjacent heat dissipation fins 220 can be achieved, thereby achieving the effect of taking away the heat on the heat dissipation fins 220.
In the above embodiment, the abdicating space may also be provided on the plurality of heat radiators 200, that is, the abdicating space has the same function as the abdicating portion 110, and the heat dissipation fan 400 may be embedded in the heat radiators 200, so as to further avoid loss of wind power generated by the heat dissipation fan 400.
Based on the above embodiments, as shown in fig. 3, in order to achieve the effect of cooling the heat generating object, a semiconductor chilling plate 300 is disposed on one side of the heat dissipation body 200, a heat dissipation surface of the semiconductor chilling plate 300 is attached to a heat dissipation substrate of the heat dissipation body 200, heat is dissipated through the heat dissipation body 200, and the chilling surface of the semiconductor chilling plate 300 cools the heat generating object, in this embodiment, in order to achieve the purpose of transferring the low temperature of the semiconductor chilling plates 300 attached to a plurality of heat dissipation bodies 200 to the heat generating object, in this embodiment, the substrate further includes a temperature conducting member 120, the temperature conducting member 120 is made of a material easy to conduct heat, the temperature conducting member 120 includes a connecting portion 121 and a temperature conducting portion 122, the connecting portion 121 and the temperature conducting portion 122 are integrally connected, wherein the connecting portion 121 is attached to the chilling surfaces of a plurality of semiconductor chilling plates 300, the temperature conducting portion 122 is attached to the heat generating object, so as to converge the low temperature generated by a plurality of semiconductor chilling plates 300 to the heat generating object, counteracting the heat generated by the heat generating object.
The semiconductor cooling assembly of the two types of embodiments can achieve the effect of increasing or reducing the number of the radiators 200 according to the heating power of the heating object, so that the semiconductor cooling assembly is convenient for a user to adjust and achieves the adaptive cooling effect.
The utility model discloses a but in another embodiment, above-mentioned heat radiation fins 220 is when actually setting up, for realizing more even heat conduction effect the utility model discloses in still can set up a plurality of heat radiation fins 220 into "U" font, set up at a certain distance apart between a plurality of heat radiation fins 220 to it is fixed through the radiating basal plate, heat radiation fins 220 of "U" font compare platelike heat radiation fins 220 increased with the area of contact between the air, consequently can further improve the radiating efficiency.
On the other hand, the heat dissipation fins 220 are arranged in a square wave shape in actual arrangement, that is, the heat dissipation fins 220 are integrally arranged, and the integrated heat dissipation fins 220 are provided with the bending parts in a rolling bending mode and the like, so that the heat dissipation of the heat dissipation fins 220 is uniform, the stability of the heat dissipation body 200 is improved, and the service life of the semiconductor cooling assembly is prolonged.
In the above embodiment, the speed of heat conduction is enough rapid on guaranteeing radiator 200, the utility model discloses in should inject the thickness of leading temperature base plate 210 at 0.8mm-3mm, make on the one hand lead temperature base plate 210 have sufficient intensity, on the other hand can conduct the heat to heat radiation fins 220 fast, and simultaneously, lead on the temperature base plate 210 and the metal level that sets up between semiconductor refrigeration piece 300 when the heat is being conducted, still play fixed lead temperature base plate 210 and semiconductor refrigeration piece 300, avoid leading to the not good problem of effect of heat conduction to take place because of the unevenness between semiconductor refrigeration piece 300 and the leading temperature base plate 210.
In another embodiment of the present invention, as shown in fig. 1 and fig. 3, in order to monitor the temperature of the heat sink 200, a controller 500 is further disposed on the base 100, the controller 500 is connected to the plurality of semiconductor cooling fins 300 and the fan circuit, a plurality of temperature sensing elements are disposed on the controller 500, the plurality of temperature sensing elements are attached to the plurality of semiconductor cooling fins 300, and can be disposed on the cooling surface of the semiconductor cooling fins 300, and the temperature on the cooling surface of the semiconductor cooling fins 300 is monitored, so as to automatically adjust the power consumption of the semiconductor cooling fins 300, for example, when the temperature sensing elements monitor that the temperature on the cooling surface of the semiconductor cooling fins 300 is too low, the effect of cooling the heat generating object is achieved at this time, and thus the power supply to the semiconductor cooling fins 300 can be suspended; when the temperature sensing element monitors that the temperature of the heat dissipation surface of the semiconductor chilling plate 300 is too high, it indicates that the effect of cooling the heating object is not achieved, and at this time, the power supply of the semiconductor chilling plate 300 can be increased, or an alarm can be provided for a user.
In order to achieve the above-mentioned alarm effect, in this embodiment, a signal transmitter and a signal receiver are further disposed on the controller 500, and the controller 500 can be in signal connection with a terminal device through the signal transmitter and the signal receiver, so as to perform real-time feedback on the working state of the semiconductor chilling plate 300, and on the other hand, the controller 500 can be remotely controlled through the terminal device to perform operations, such as turning on and off and adjusting the current supply to the semiconductor chilling plate 300.
The utility model discloses an in another can the implementation, above-mentioned semiconductor cooling subassembly still includes the function piece, the function piece is used for cooling to the object that generates heat of different grade type, in a specific embodiment, the function piece includes a plurality of groups heat radiation fins 220, a plurality of groups heat radiation fins 220 laminating sets up on the refrigeration face of semiconductor refrigeration piece 300 or on the above-mentioned heat conduction portion 122 of heat conduction piece 120, and still can set up the fan in one side at heat radiation fins 220, when semiconductor cooling subassembly begins work, the function piece of semiconductor refrigeration piece 300 below is cooled down to the cold face of ware, cool down a plurality of groups heat radiation fins 220 promptly, and open the fan simultaneously, the low cooling air through heat radiation fins 220 goes up the conduction, the rethread fan blows cold air to the object that generates heat on, this kind of setting is applicable to the condition that can't contact with the object that generates heat.
The utility model discloses an in another can the implementation way, above-mentioned function piece still can set up to water-cooling assembly, this water-cooling assembly includes water-cooling head and water-cooled tube, when actually setting up, the water-cooled tube cover is established on the water-cooling head, and the water-cooling head fix on above-mentioned report provide the refrigeration piece or with fix on lead the temperature portion 122 of temperature piece 120, when semiconductor cooling assembly begins to work, the refrigeration of semiconductor refrigeration piece 300 is cooled down to the water-cooled tube in the face of the water-cooling head, the cooling of rethread water-cooling head to the water-cooled tube, on the semiconductor refrigeration piece 300 that a plurality of radiator 200 corresponds, a plurality of water-cooling assembly that sets up passes through water-cooled tube intercombination, can form water cooling system, through this kind of mode of setting, can cool down to the cooling water in the water-cooling structure fast effectively, this kind of setting is applicable to the water cooling plant of apparatus such as quick-witted case.
Based on the above-mentioned embodiment, the utility model provides a radiator, this radiator includes arbitrary one in the above-mentioned embodiment semiconductor cooling subassembly, this semiconductor cooling subassembly specifically includes: a base including a plurality of mounting surfaces; the heat dissipation body is at least provided with two heat dissipation bodies, the two heat dissipation bodies correspond to each other one by one and are detachably arranged on the mounting surface, each heat dissipation body comprises a plurality of heat dissipation fins and a heat conduction substrate, and the plurality of heat dissipation fins are uniformly arranged on the heat conduction substrate along a preset angle; the semiconductor refrigeration pieces are arranged in a plurality of numbers, correspond to one another and are arranged in the middle of the heat conduction substrate in a laminating manner, and a metal layer is arranged between each semiconductor refrigeration piece and the heat conduction substrate; the functional piece is attached to one side of the refrigerating surfaces of the plurality of semiconductor refrigerating pieces; and the heat radiation fan corresponds to the plurality of heat radiation fins arranged on the plurality of heat radiation bodies. The utility model discloses a set up a plurality of installation face on the base plate, set up a plurality of radiators on the installation face, a plurality of radiators can be according to the power free stack of the object of waiting to generate heat, it has the semiconductor refrigeration piece to correspond the laminating on leading the temperature base plate on the radiator, the heat dissipation of semiconductor refrigeration piece production heat one side accessible radiator, be provided with the function piece on producing microthermal one side, the object cooling of generating heat is treated to the microthermal function piece of accessible, thereby realize the radiating effect to the object cooling of generating heat, and simultaneously, the heat radiation fins who sets up on the radiator cools down through the radiator fan that corresponds, in order to guarantee the temperature balance of semiconductor refrigeration piece, the utility model discloses can freely add the heat radiation structure to the object that generates heat not, satisfy the different demand of adding the outfit of the object that generates heat when guaranteeing the radiating efficiency.
To sum up, the utility model provides a semiconductor cooling subassembly and radiator, wherein, this semiconductor cooling subassembly includes: a base including a plurality of mounting surfaces; the heat dissipation body is at least provided with two heat dissipation bodies, the two heat dissipation bodies correspond to each other one by one and are detachably arranged on the mounting surface, each heat dissipation body comprises a plurality of heat dissipation fins and a heat conduction substrate, and the plurality of heat dissipation fins are uniformly arranged on the heat conduction substrate along a preset angle; the semiconductor refrigeration pieces are arranged in a plurality of numbers, correspond to one another and are arranged in the middle of the heat conduction substrate in a laminating manner, and a metal layer is arranged between each semiconductor refrigeration piece and the heat conduction substrate; the functional piece is attached to one side of the refrigerating surfaces of the plurality of semiconductor refrigerating pieces; and the heat radiation fan corresponds to the plurality of heat radiation fins arranged on the plurality of heat radiation bodies. The utility model discloses a set up a plurality of installation face on the base plate, set up a plurality of radiators on the installation face, a plurality of radiators can be according to the free stack of power of the object of waiting to generate heat, it has the semiconductor refrigeration piece to correspond the laminating on the temperature base plate of leading on the radiator, the heat dissipation of semiconductor refrigeration piece production of heat one side accessible radiator, be provided with the function piece on the one side of production microthermal, the object cooling that generates heat is treated to the microthermal function piece of accessible, thereby realize the radiating effect of the object cooling of generating heat, and simultaneously, the cooling fin who sets up on the radiator cools down through the radiator fan that corresponds, in order to guarantee the temperature balance of semiconductor refrigeration piece, the utility model discloses can be to the free additional allocation heat radiation structure of the object that generates heat not, satisfy the additional allocation demand of the different objects that generate heat when guaranteeing the radiating efficiency.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. The semiconductor cooling assembly is characterized by comprising:
a base including a plurality of mounting surfaces;
the heat dissipation body is at least provided with two heat dissipation bodies, the two heat dissipation bodies correspond to each other one by one and are detachably arranged on the mounting surface, each heat dissipation body comprises a plurality of heat dissipation fins and a heat conduction substrate, and the plurality of heat dissipation fins are uniformly arranged on the heat conduction substrate along a preset angle;
the semiconductor refrigeration pieces are arranged in a plurality of numbers, correspond to one another and are arranged in the middle of the heat conduction substrate in a laminating manner, and a metal layer is arranged between each semiconductor refrigeration piece and the heat conduction substrate;
the functional piece is attached to one side of the refrigerating surfaces of the plurality of semiconductor refrigerating pieces;
and the heat radiation fan corresponds to the plurality of heat radiation fins arranged on the plurality of heat radiation bodies.
2. The semiconductor cooling assembly according to claim 1, wherein the substrate is a plate body, and a plurality of the mounting surfaces are arranged on one side of the base in an array manner and are arranged in the same horizontal plane;
the heat dissipation bodies are provided with yielding parts corresponding to the middle parts of the mounting surfaces, and the heat dissipation fans are embedded above the yielding parts;
or, the heat radiation fan is embedded in the holding part.
3. The semiconductor cooling assembly according to claim 2, wherein a cylindrical air guiding column is disposed on the base at a position corresponding to the positioning portion, and the heat dissipation fan is fixedly disposed at one end of the air guiding column;
the air guide column is arranged right below the center of the fan.
4. The semiconductor cooling assembly of claim 1, wherein the base is a cylinder, and the plurality of mounting surfaces are circumferentially disposed on a side surface of the base;
the heat radiation fan is arranged on one side of the heat radiation bodies,
or the heat radiation fan is arranged in an abdicating space arranged at one side of the heat radiation bodies;
the direction of the heat dissipation fins on the plurality of heat dissipation bodies corresponds to the air outlet direction of the heat dissipation fan.
5. The semiconductor cooling assembly of claim 4, wherein the base further comprises a temperature conduction member, the temperature conduction member comprises a connection portion and a temperature conduction portion, the connection portion is in fit connection with the plurality of semiconductor chilling plates, and the temperature conduction portion is used for concentrating the temperature of the plurality of semiconductor chilling plates on the temperature conduction portion.
6. The semiconductor cooling assembly according to claim 1, wherein the heat dissipating fins are U-shaped, and a plurality of the heat dissipating fins are disposed on the temperature conducting substrate at predetermined intervals;
or, the radiating fins are square wave-shaped, a plurality of bending parts are arranged on the radiating fins, and the bending parts are integrally connected.
7. The semiconductor cooling assembly according to claim 1, wherein the thickness of the thermally conductive substrate is 0.8mm to 3 mm.
8. The semiconductor cooling assembly according to claim 1, wherein a controller is further arranged on the base, a plurality of temperature sensing elements are arranged on the controller, and the temperature sensing elements are attached to the semiconductor cooling sheets;
the controller is also provided with a signal transmitter and a signal receiver, and the signal transmitter and the signal receiver are used for being in signal connection with terminal equipment.
9. The semiconductor cooling assembly of claim 1, wherein the functional element comprises:
a plurality of groups of heat dissipation fins;
or a plurality of groups of water cooling assemblies, wherein each water cooling assembly comprises a water cooling pipe and a water cooling head.
10. A heat sink, comprising the semiconductor cooling assembly of any one of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220205390.6U CN217283838U (en) | 2022-01-25 | 2022-01-25 | Semiconductor cooling assembly and radiator |
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| CN202220205390.6U CN217283838U (en) | 2022-01-25 | 2022-01-25 | Semiconductor cooling assembly and radiator |
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| CN202220205390.6U Active CN217283838U (en) | 2022-01-25 | 2022-01-25 | Semiconductor cooling assembly and radiator |
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