CN217809461U

CN217809461U - Temperature control device

Info

Publication number: CN217809461U
Application number: CN202221438687.3U
Authority: CN
Inventors: 王国伟; 张彤; 贾海舟; 邵京; 孟佳
Original assignee: Zhengzhou Sikun Biological Engineering Co ltd
Current assignee: Zhengzhou Sikun Biological Engineering Co ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-11-15
Anticipated expiration: 2032-06-09

Abstract

The utility model discloses a temperature control device, including control by temperature change bottom plate, the mechanism that generates heat, samming mechanism and heat dissipation mechanism, the face and the pond laminating of flowing of control by temperature change bottom plate one side, samming mechanism includes the heat pipe of parallel control by temperature change bottom plate, and the mechanism that generates heat is located the control by temperature change bottom plate and keeps away from one side of flowing the pond, and samming mechanism is located the control by temperature change bottom plate and generates heat between the mechanism, and heat dissipation mechanism links to each other with the face that the mechanism that generates heat kept away from flowing pond one side. The heating mechanism generates heat to improve the temperature of the flow cell, the temperature control bottom plate is positioned between the heating mechanism and the flow cell and is attached to the flow cell, and the temperature equalizing mechanism is positioned between the temperature control bottom plate and the heating mechanism. The heat pipe in the temperature equalizing mechanism can adjust the temperature distribution of the temperature control bottom plate and evenly distribute the heat of the heating mechanism on the temperature control bottom plate. When the temperature is too high, the heat dissipation mechanism can dissipate heat, and the heat pipes can uniformly distribute the heat dissipation capacity, so that the temperature uniformity of the temperature control bottom plate is ensured, and the temperature uniformity of the flow cell is further ensured.

Description

Temperature control device

Technical Field

The utility model relates to a gene sequencing equipment technical field, in particular to temperature control device.

Background

The gene sequencing technology is the most commonly used technology in modern molecular biology research, and a gene sequencer is a key device of the gene sequencing technology. The biochemical reaction field of the gene sequencer is a flow cell, a plurality of flow channels are arranged in the flow cell, and relevant reagents carry out biochemical reaction in the flow cell. Biochemical reactions are very temperature sensitive and require strict control of the flow cell temperature. However, in the prior art, the temperature gradient of the flow cell is large, and the temperature uniformity is poor.

Therefore, how to improve the uniformity of the temperature of the flow cell is a technical problem which needs to be solved urgently by the technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a temperature control device, it has set up the heat pipe and has carried out the samming to the control by temperature change bottom plate, has improved the homogeneity of control by temperature change bottom plate temperature, and then guarantees that the temperature in mobile pool is even.

In order to achieve the above object, the utility model provides a temperature control device, include the control by temperature change bottom plate, generate heat mechanism, samming mechanism and heat dissipation mechanism, the face and the mobile pool laminating of control by temperature change bottom plate one side, samming mechanism is including parallel the heat pipe of control by temperature change bottom plate, it is located to generate heat the mechanism one side of mobile pool is kept away from to the control by temperature change bottom plate, samming mechanism is located the control by temperature change bottom plate with generate heat between the mechanism, heat dissipation mechanism with it links to each other to generate heat the mechanism and keep away from mobile pool one side.

Preferably, the samming mechanism includes samming board and installation frame, the both sides of installation frame respectively with heat dissipation mechanism with the control by temperature change bottom plate links to each other, the inboard of installation frame has the installation cavity, the samming board sets up in the installation cavity, the samming board with the face laminating of flow cell one side is kept away from to the control by temperature change bottom plate, the samming board has the mounting groove, the heat pipe sets up in the mounting groove.

Preferably, the temperature controlled base plate has an installation groove, and the heat pipe is disposed in the installation groove.

Preferably, the mechanism that generates heat still includes peltier subassembly and control mechanism, the peltier subassembly is located the temperature-uniforming plate with between the heat dissipation mechanism, the peltier subassembly is platelike, its first end be with the face of temperature-uniforming plate laminating, the second end of peltier subassembly be with the face of heat dissipation mechanism laminating, the temperature-uniforming plate with still be equipped with temperature probe between the control by temperature change bottom plate, temperature probe with the peltier subassembly all with control mechanism links to each other.

Preferably, a first heat conduction layer is arranged between the temperature control bottom plate and the temperature equalizing plate.

Preferably, a second heat conduction layer is arranged between the Peltier component and the temperature equalizing plate.

Preferably, a third heat conducting layer is provided between the peltier element and the heat sink.

Preferably, a thermal insulation layer is arranged between the side wall of the mounting cavity and the Peltier component.

Preferably, the temperature control bottom plate is provided with a prepared hole, an overheating protection mechanism is arranged in the prepared hole, and the overheating protection mechanism is located in a power supply circuit of the peltier component.

Preferably, the heat dissipation mechanism comprises a heat dissipation fin, the heat dissipation fin comprises a heat dissipation fin body and a fin, and the fin is located on one side of the heat dissipation fin body, which is far away from the temperature control bottom plate.

The utility model provides a temperature control device, including the control by temperature change bottom plate, generate heat mechanism, samming mechanism and heat dissipation mechanism, the face and the mobile pool laminating of control by temperature change bottom plate one side, samming mechanism includes the heat pipe of parallel control by temperature change bottom plate, and the mechanism that generates heat is located the control by temperature change bottom plate and keeps away from one side of mobile pool, and samming mechanism is located the control by temperature change bottom plate and generates heat between the mechanism, and heat dissipation mechanism keeps away from mobile pool one side with the mechanism that generates heat and links to each other.

The heating mechanism generates heat to improve the temperature of the flow cell, the temperature control bottom plate is positioned between the heating mechanism and the flow cell and is attached to the flow cell, and the temperature equalizing mechanism is positioned between the temperature control bottom plate and the heating mechanism. The heat pipes in the temperature equalizing mechanism can adjust the temperature distribution of the temperature control bottom plate and evenly distribute the heat of the heating mechanism on the temperature control bottom plate. When the temperature is too high, the heat dissipation mechanism can dissipate heat, and the heat pipes can uniformly distribute the heat dissipation capacity, so that the temperature uniformity of the temperature control bottom plate is improved, and the temperature uniformity of the flow cell is further ensured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a temperature control device provided by the present invention;

FIG. 2 is a cross-sectional view of the temperature control device of FIG. 1;

FIG. 3 is a schematic structural diagram of the vapor chamber shown in FIG. 2.

Wherein the reference numerals in fig. 1 to 3 are:

the device comprises a temperature equalizing plate 1, a mounting frame 2, a locking screw 3, heat insulation cotton 4, a Peltier component 5, a cooling fin 6, a heat pipe 7, a temperature control bottom plate 8, a temperature probe 9, a flow cell 10 and a self-recovery fuse 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In order to make the technical field of the present invention better understand, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a temperature control device according to the present invention; FIG. 2 is a cross-sectional view of the temperature control device of FIG. 1; fig. 3 is a schematic structural diagram of the vapor chamber in fig. 2.

The utility model provides a temperature control device, the structure is as shown in figure 1, including control by temperature change bottom plate 8, the mechanism that generates heat, samming mechanism and heat dissipation mechanism. Wherein, one side of the temperature control bottom plate 8 is tightly attached to the flow cell 10 by mechanical pressing claws or vacuum adsorption devices. The heating mechanism is located on one side of the temperature control bottom plate 8 far away from the flow cell 10, and the heating mechanism can heat the temperature control bottom plate 8 and further heat the flow cell 10. The temperature equalizing mechanism is arranged between the heating mechanism and the temperature control bottom plate 8 and comprises a heat pipe 7 parallel to the temperature control bottom plate 8. When the temperature in the temperature control bottom plate 8 is uneven, the medium in the heat pipe 7 at the position with higher temperature absorbs heat and transfers the heat to the position with lower temperature, thereby adjusting the heat distribution of the temperature control bottom plate 8 and improving the uniformity of the temperature control bottom plate 8. The heat dissipation mechanism is connected with one side of the heat generation mechanism far away from the flow cell 10. When the temperature of the flow cell 10 is too high, the heat dissipation mechanism can dissipate heat, and reduce the temperature of the temperature control bottom plate 8, thereby reducing the temperature of the flow cell 10. In addition, the temperature equalizing mechanism is located between the heat dissipation mechanism and the temperature control bottom plate 8, and in the heat dissipation process, the temperature equalizing mechanism can also adjust the heat distribution of the heat dissipation mechanism, so that the uniform heat dissipation of the temperature control bottom plate 8 is ensured, and the temperature uniformity of the temperature control bottom plate 8 is further improved.

Optionally, in a specific embodiment of the present application, a mounting groove is formed on a side of the temperature-controlled bottom plate 8 away from the flow cell 10, and the heat pipe 7 may be disposed in the mounting groove in an interference fit manner. In order to improve the temperature equalizing effect, the mounting grooves are usually multiple and distributed along the width direction of the temperature control bottom plate 8. Each installation groove is provided with one heat pipe 7, and the heat pipes 7 can improve the heat distribution efficiency. Of course, the user can set the distribution and installation of the heat pipes 7 according to the need, which is not limited herein.

Optionally, in another specific embodiment of the present application, the temperature equalizing mechanism includes a temperature equalizing plate 1 and a mounting frame 2. As shown in fig. 2, the temperature-controlled base plate 8 is fixedly connected with the mounting frame 2 through mounting screws, and the mounting frame 2 is connected with the heat dissipation mechanism through locking screws 3. The mounting frame 2 has a mounting chamber on the inside in which the projection of the flow cell 10 onto the mounting frame 2 is located. Temperature-uniforming plate 1 sets up in the installation cavity, and 2 upper portions of installation frame have the cooperation surface of direction decurrent, and the lower part of 1 periphery of temperature-uniforming plate has spacing platform, and the cooperation surface can be laminated with spacing platform, realizes temperature-uniforming plate 1's fixed. The height of the upper side of the temperature-uniforming plate 1 is slightly higher than the upper surface of the mounting frame 2, so that the temperature-uniforming plate 1 can be attached to the temperature control bottom plate 8 and exchanges heat with the temperature control bottom plate 8. The temperature equalizing plate 1 has an installation groove, the heat pipe 7 is disposed in the installation groove, and the distribution mode of the installation groove can refer to the above specific embodiment, which is not limited herein.

Optionally, a first heat conduction layer is arranged between the temperature control bottom plate 8 and the temperature equalizing plate 1. The first heat conduction layer can be specifically heat conduction silicone grease, and the heat conduction silicone grease can be in sufficient contact with the temperature control bottom plate 8 and the temperature-uniforming plate 1, so that the heat conductivity is improved. Of course, other heat conducting materials may be adopted by the user as the first heat conducting layer, and are not limited herein.

Optionally, the heat generating mechanism comprises a peltier module 5 and a control mechanism. As shown in fig. 2, a peltier module 5 is also provided in the mounting cavity, the peltier module 5 including at least one piece of peltier. The Peltier is positioned between the temperature-uniforming plate 1 and the heat dissipation mechanism, the first end of the Peltier is a plate surface attached to the temperature-uniforming plate 1, and the second end of the Peltier is a plate surface attached to the heat dissipation mechanism. The Peltier component 5 is connected with the circuit, and the direction of the current is changed to control the first end to be a cold end or a hot end, so that the temperature of the temperature-equalizing plate 1 is increased or decreased. A temperature probe 9 is also arranged between the temperature-equalizing plate 1 and the temperature-control bottom plate 8, and the temperature probe 9 and the Peltier component 5 are both connected with a control mechanism. The temperature probe 9 measures the temperature of the temperature-equalizing plate 1, transmits a temperature signal to the control mechanism, and the control mechanism sends a control signal to the Peltier component 5 to control the Peltier component to heat or absorb heat, adjusts the temperature of the temperature-equalizing plate 1 until the temperature probe 9 reaches a target temperature, and realizes closed-loop control of the temperature. The control circuit of the peltier unit 5 may refer to the prior art, and the control mechanism may refer to an MCU microcontroller or a PLC controller or the like in the prior art. Of course, other devices in the prior art can be adopted by the user as the heating mechanism according to the needs, such as a resistance wire and the like.

Optionally, a second heat conducting layer is arranged between the peltier element 5 and the vapor chamber 1. The second heat conduction layer is used for improving the heat conductivity between the peltier element 5 and the temperature-uniforming plate 1, and the structure of the second heat conduction layer can refer to the first heat conduction layer, which is not described in detail herein.

Optionally, when the heat conductive silicone grease is filled, the silicone grease is usually excessively filled, so that the heat conductive silicone grease can completely cover the contact surface of the peltier element 5 and the temperature-uniforming plate 1 or the heat sink 6. However, excessive heat-conducting silicone grease can overflow from the contact surface and form a heat bridge between the cold end and the hot end of the peltier element 5, and the heat transfer from the peltier element 5 to the temperature equalization plate 1 is affected. The heat insulation cotton 4 is arranged on the periphery of the Peltier component 5 to serve as a heat insulation layer. Before filling the heat-conducting silicone grease, a heat-insulating layer is arranged on the periphery of the Peltier component 5, and then the heat-conducting silicone grease is excessively filled, so that the working surface of the Peltier component 5 is completely covered by the heat-conducting silicone grease. A slight excess of the thermally conductive silicone grease does not overflow the upper and lower sides of the insulating layer, thereby avoiding heat transfer between the cold and hot sides of the peltier module 5. The setting of insulating layer can also reduce the requirement to heat conduction silicone grease filling control precision, reduces temperature control device's the assembly degree of difficulty.

Optionally, a prepared hole is formed between the temperature control bottom plate 8 and the temperature equalizing plate 1, an overheat protection mechanism is arranged in the prepared hole, and the overheat protection mechanism is located in a power supply circuit of the peltier module 5. If the control mechanism or the temperature probe 9 fails to cause temperature runaway, the overheat protection mechanism can automatically cut off the power when reaching the upper threshold temperature, and can automatically electrify after the temperature is restored to the lower threshold temperature. The overheating protection mechanism may be embodied as the self-healing fuse 11, and of course, other overheating protection mechanisms in the prior art may be adopted by the user, which is not limited herein. In addition, the temperature control probe can also be arranged in the preformed hole, the preformed hole can be filled with heat-conducting silica gel, the heat transfer between the temperature-equalizing plate 1 and the temperature-measuring probe and the overheating protection mechanism is improved, and the temperature control probe is connected with the control mechanism through a lead.

Optionally, the heat dissipation mechanism may employ air cooling for heat dissipation. As shown in fig. 2, the heat dissipation mechanism includes a heat sink 6 and a heat dissipation fan, and the heat sink 6 includes a heat sink body and fins. The radiating fin body is connected with the mounting frame 2 through a locking screw 3, and the Peltier component 5 is attached to the radiating fin body. The fins are positioned on one side of the radiating fin body far away from the temperature control bottom plate 8. The heat dissipation fan blows air to the fins to take away heat of the heat dissipation mechanism. Certainly, the user may also use water cooling as the heat dissipation structure as needed, and the water cooling structure may refer to the prior art and is not described herein again.

In this embodiment, the temperature control device is provided with the peltier element 5 and the heat pipe 7, and the control mechanism can control the peltier element 5 to heat or cool the temperature-equalizing plate 1 through the current direction. Meanwhile, the heat pipe 7 in the vapor chamber 1 can improve the heat transfer efficiency of the vapor chamber 1, thereby not only improving the uniformity of the temperature of the vapor chamber 1, but also improving the temperature control speed. The temperature of the flow cell 10 can be controlled quickly, accurately and uniformly, the anti-interference capability is improved, and the harsh temperature control requirement in biochemical reaction is met.

It is noted that, in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.

It is right above that the utility model provides a temperature control device has carried out the detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the scope of the appended claims.

Claims

1. The utility model provides a temperature control device, its characterized in that includes control by temperature change bottom plate (8), generates heat mechanism, samming mechanism and heat dissipation mechanism, the face and the flow pool (10) laminating of control by temperature change bottom plate (8) one side, samming mechanism is including parallel heat pipe (7) of control by temperature change bottom plate (8), the mechanism that generates heat is located flow pool (10) one side is kept away from to control by temperature change bottom plate (8), samming mechanism is located the control by temperature change bottom plate with generate heat between the mechanism, heat dissipation mechanism with it links to each other to generate heat mechanism and keeps away from flow pool (10) one side.

2. The temperature control device according to claim 1, wherein the temperature equalizing mechanism comprises a temperature equalizing plate (1) and a mounting frame (2), two sides of the mounting frame (2) are respectively connected with the heat dissipating mechanism and the temperature control bottom plate (8), a mounting cavity is arranged on the inner side of the mounting frame (2), the temperature equalizing plate (1) is arranged in the mounting cavity, the temperature equalizing plate (1) is attached to the plate surface of the side, far away from the flow pool (10), of the temperature control bottom plate (8), the temperature equalizing plate (1) is provided with a mounting groove, and the heat pipe (7) is arranged in the mounting groove.

3. Temperature control device according to claim 1, characterized in that the temperature-controlled base plate (8) has a mounting groove in which the heat pipe (7) is arranged.

4. The temperature control device according to claim 2, wherein the heating mechanism comprises a peltier component (5) and a control mechanism, the peltier component (5) is located between the temperature equalizing plate (1) and the heat dissipating mechanism, the peltier component (5) is plate-shaped, a first end of the peltier component is a plate surface attached to the temperature equalizing plate (1), a second end of the peltier component (5) is a plate surface attached to the heat dissipating mechanism, a temperature probe (9) is further arranged between the temperature equalizing plate (1) and the temperature control bottom plate (8), and the temperature probe (9) and the peltier component (5) are both connected to the control mechanism.

5. Temperature control device according to claim 2, characterized in that a first heat conducting layer is arranged between the temperature controlled base plate (8) and the temperature uniforming plate (1).

6. A temperature control device according to claim 4, characterized in that a second heat conducting layer is arranged between the Peltier element (5) and the temperature equalization plate (1).

7. A temperature control device according to claim 4, characterized in that a third heat conducting layer is arranged between the Peltier assembly (5) and the heat dissipation means.

8. A temperature control device according to claim 4, characterized in that a thermal insulation layer is provided between the side wall of the installation cavity and the Peltier element (5).

9. Temperature control device according to claim 4, characterized in that the temperature-controlled base plate (8) is provided with a prepared hole in which an overheating protection mechanism is provided, which overheating protection mechanism is located in the power supply circuit of the Peltier assembly (5).

10. The temperature control device according to any one of claims 1 to 9, characterized in that the heat dissipation mechanism comprises a heat sink (6), the heat sink (6) comprising a heat sink body and a fin located on a side of the heat sink body remote from the temperature controlled base plate (8).