CN216646721U - 检查装置 - Google Patents

检查装置 Download PDF

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Publication number
CN216646721U
CN216646721U CN202121306088.1U CN202121306088U CN216646721U CN 216646721 U CN216646721 U CN 216646721U CN 202121306088 U CN202121306088 U CN 202121306088U CN 216646721 U CN216646721 U CN 216646721U
Authority
CN
China
Prior art keywords
plunger
plungers
pin plate
elastic body
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202121306088.1U
Other languages
English (en)
Chinese (zh)
Inventor
星野智久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Application granted granted Critical
Publication of CN216646721U publication Critical patent/CN216646721U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
CN202121306088.1U 2020-06-22 2021-06-11 检查装置 Expired - Fee Related CN216646721U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020106767 2020-06-22
JP2020-106767 2020-06-22

Publications (1)

Publication Number Publication Date
CN216646721U true CN216646721U (zh) 2022-05-31

Family

ID=79187495

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202121306088.1U Expired - Fee Related CN216646721U (zh) 2020-06-22 2021-06-11 检查装置
CN202110651864.XA Pending CN113900005A (zh) 2020-06-22 2021-06-11 检查装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202110651864.XA Pending CN113900005A (zh) 2020-06-22 2021-06-11 检查装置

Country Status (5)

Country Link
US (1) US20230236223A1 (https=)
JP (1) JP7660570B2 (https=)
CN (2) CN216646721U (https=)
TW (1) TW202202859A (https=)
WO (1) WO2021261288A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113900005A (zh) * 2020-06-22 2022-01-07 株式会社友华 检查装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332323A (ja) * 2000-05-24 2001-11-30 Anritsu Corp シリコン電極及び高周波接点シート並びにシリコン電極製造方法
JP4921344B2 (ja) * 2007-12-26 2012-04-25 株式会社ヨコオ 検査ソケット
JP2010237133A (ja) * 2009-03-31 2010-10-21 Yokowo Co Ltd 検査ソケットおよびその製法
JP5960383B2 (ja) 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー 接触子ホルダ
JP6157047B2 (ja) 2011-02-01 2017-07-05 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
US8912810B2 (en) * 2011-09-09 2014-12-16 Texas Instruments Incorporated Contactor with multi-pin device contacts
KR101534778B1 (ko) * 2014-01-24 2015-07-09 리노공업주식회사 검사장치
JP6436711B2 (ja) * 2014-10-01 2018-12-12 日本発條株式会社 プローブユニット
KR101920822B1 (ko) * 2017-04-21 2019-02-13 리노공업주식회사 프로브 소켓
US20230236223A1 (en) * 2020-06-22 2023-07-27 Yokowo Co., Ltd. Inspection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113900005A (zh) * 2020-06-22 2022-01-07 株式会社友华 检查装置

Also Published As

Publication number Publication date
CN113900005A (zh) 2022-01-07
TW202202859A (zh) 2022-01-16
US20230236223A1 (en) 2023-07-27
JPWO2021261288A1 (https=) 2021-12-30
JP7660570B2 (ja) 2025-04-11
WO2021261288A1 (ja) 2021-12-30

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220531

CF01 Termination of patent right due to non-payment of annual fee