CN216286492U - Shenwei 421COME mainboard - Google Patents

Shenwei 421COME mainboard Download PDF

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Publication number
CN216286492U
CN216286492U CN202122888649.XU CN202122888649U CN216286492U CN 216286492 U CN216286492 U CN 216286492U CN 202122888649 U CN202122888649 U CN 202122888649U CN 216286492 U CN216286492 U CN 216286492U
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CN
China
Prior art keywords
metal plate
cpu chip
shenwei
421come
turbofan
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Active
Application number
CN202122888649.XU
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Chinese (zh)
Inventor
胡耀文
顾益飞
蒋小铂
李强
徐江川
方伟迪
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Shanghai Junzhong Information Technology Co ltd
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Shanghai Junzhong Information Technology Co ltd
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Priority to CN202122888649.XU priority Critical patent/CN216286492U/en
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Abstract

The utility model relates to the technical field of server mainboards, in particular to a Shenwei 421COME mainboard which can effectively solve the heat dissipation problem of the mainboard and comprises a PCB board, wherein a CPU chip is arranged on the PCB board.

Description

Shenwei 421COME mainboard
Technical Field
The utility model relates to the technical field of server motherboards, in particular to a Shenwei 421COME mainboard.
Background
The Shenwei server is a domestic processor, compared with other domestic processors, the Shenwei server is arranged in the front of the processors in terms of performance, the components are arranged compactly, a CPU (central processing unit) part generates heat seriously in the using process, a cooling fan cannot be independently arranged at the corresponding position of the CPU on the server shell after the Shenwei server is installed in place, and the cooling fan carried by the server is far away from the position of the CPU, so that the cooling effect on the CPU is poor.
Disclosure of Invention
In order to solve the problem of heating of the existing mainboard, the utility model provides a Shenwei 421COME mainboard which can effectively solve the problem of heat dissipation of the mainboard.
The technical scheme is as follows: a Shenwei 421COME mainboard comprises a PCB board, wherein a CPU chip is mounted on the PCB board, and is characterized in that a heat dissipation device is fixedly bonded on the CPU chip and comprises a metal plate and a turbofan which are fixed into a whole, an air outlet of the turbofan faces towards the upper end face of the metal plate, the lower end face of the metal plate is bonded with the upper end face of the CPU chip, through grooves arranged at intervals are formed in the front end face and the rear end face of the metal plate, and a power line of the turbofan is connected with a socket on the PCB board.
The turbine fan is further characterized in that four corners of the upper end surface of the metal plate are respectively provided with a threaded hole, and the turbine fan is fixed on the metal plate through bolts;
the CPU chip is arranged in the middle of the PCB mainboard, memory banks on the PCB are arranged on two sides of the CPU chip to form a refrigeration channel, and the memory banks are sequentially arranged from front to back.
After the utility model is adopted, the heat dissipation device is directly added on the surface of the CPU chip, the heat generated by the CPU chip is absorbed by the metal plate, and then the turbofan blows air to the metal plate to make the heat smoothly dissipated from the through groove, thereby effectively solving the heat dissipation problem of the mainboard; further carry out reasonable layout to great CPU chip and the memory bank that generates heat, form the refrigeration passageway, the fan of the quick-witted case of being convenient for itself can let cold wind pass through the refrigeration passageway smoothly and form better refrigeration effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the heat dissipation device.
Detailed Description
See fig. 1 and fig. 2, a shenwei 421COME mainboard, which comprises a PCB board 1, a CPU chip 2 is mounted on the PCB board 1, a heat dissipation device 3 is fixedly adhered to the CPU chip 2, the heat dissipation device 3 comprises a metal plate 4 and a turbofan 5 which are fixed into a whole, an air outlet of the turbofan 5 faces to the upper end surface of the metal plate 4, the lower end surface of the metal plate 4 is adhered to the upper end surface of the CPU chip 2, through grooves 6 which are arranged at intervals are formed in the front end surface and the rear end surface of the metal plate 4, a power line 7 of the turbofan 5 is connected with a socket 8 on the PCB board 1, and the power line is directly supplied by board, so that the use is convenient.
Four angles departments of metal sheet 4 up end offer the screw hole respectively, and turbofan 5 is fixed in on metal sheet 4 through bolt 9, when turbofan 5 trouble, can conveniently pull down and overhaul or change.
The CPU chip is arranged in the middle of the PCB mainboard, the memory banks on the PCB are arranged on two sides of the CPU chip to form a refrigeration channel, and all the memory banks are sequentially arranged front and back.

Claims (3)

1. A Shenwei 421COME mainboard comprises a PCB board, wherein a CPU chip is mounted on the PCB board, and is characterized in that a heat dissipation device is fixedly bonded on the CPU chip and comprises a metal plate and a turbofan which are fixed into a whole, an air outlet of the turbofan faces towards the upper end face of the metal plate, the lower end face of the metal plate is bonded with the upper end face of the CPU chip, through grooves arranged at intervals are formed in the front end face and the rear end face of the metal plate, and a power line of the turbofan is connected with a socket on the PCB board.
2. The Shenwei 421COME main board as claimed in claim 1, wherein the four corners of the upper end surface of the metal plate are respectively provided with a threaded hole, and the turbofan is fixed on the metal plate through bolts.
3. The Shenwei 421COME main board as claimed in claim 1, wherein the CPU chip is disposed in the middle of the PCB, the memory banks are disposed on two sides of the CPU chip on the PCB to form a cooling channel, and the memory banks are sequentially arranged in a front-back manner.
CN202122888649.XU 2021-11-24 2021-11-24 Shenwei 421COME mainboard Active CN216286492U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122888649.XU CN216286492U (en) 2021-11-24 2021-11-24 Shenwei 421COME mainboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122888649.XU CN216286492U (en) 2021-11-24 2021-11-24 Shenwei 421COME mainboard

Publications (1)

Publication Number Publication Date
CN216286492U true CN216286492U (en) 2022-04-12

Family

ID=81037457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122888649.XU Active CN216286492U (en) 2021-11-24 2021-11-24 Shenwei 421COME mainboard

Country Status (1)

Country Link
CN (1) CN216286492U (en)

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