CN216249098U - Novel 5G industrial computer that heat dispersion is good - Google Patents
Novel 5G industrial computer that heat dispersion is good Download PDFInfo
- Publication number
- CN216249098U CN216249098U CN202122967707.8U CN202122967707U CN216249098U CN 216249098 U CN216249098 U CN 216249098U CN 202122967707 U CN202122967707 U CN 202122967707U CN 216249098 U CN216249098 U CN 216249098U
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- heat dissipation
- bottom plate
- cavity
- chip
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- 239000006185 dispersion Substances 0.000 title claims description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 74
- 230000006698 induction Effects 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a novel 5G industrial personal computer with good heat dissipation performance, which comprises a bottom plate, wherein a panel is fixedly arranged on one side of the bottom plate, an RS232 serial port, an RS485 serial port, a network port and a USB interface are arranged on the panel at intervals, a chip holder is fixedly arranged on the bottom plate, a chip is fixedly arranged on the chip holder, a heat dissipation plate is fixedly arranged at the upper end of the chip, a plurality of heat dissipation fins which are uniformly arranged at intervals are arranged at the upper end of the heat dissipation plate, a heat conduction medium is abutted between the top end of the chip holder and the bottom plate of the heat dissipation plate, and 5GDTU is fixedly arranged on the bottom plate. The heat dissipation structure is characterized in that a heat dissipation cavity is formed in the center of each of the heat dissipation fins, a fan is arranged in the heat dissipation cavity, a plurality of through holes are uniformly formed in the inner wall of the heat dissipation cavity at intervals, air induction ports are formed in the center of each of the heat dissipation fins, a cavity cover is arranged on the top surface of the heat dissipation cavity, and connecting threads are formed in the side wall of the cavity cover. The utility model has good heat dissipation effect and strong practicability.
Description
Technical Field
The utility model relates to the technical field of industrial personal computers, in particular to a novel 5G industrial personal computer with good heat dissipation performance.
Background
The industrial control computer is a general name of a tool which adopts a bus structure and detects and controls a production process, electromechanical equipment and process equipment thereof. The industrial personal computer has important computer attributes and characteristics, such as a computer CPU, a hard disk, an internal memory, peripheral equipment and interfaces, a real-time operating system, a control network, a protocol, computing power, a friendly man-machine interface and the like.
The heat dissipation problem of industrial computer is the industrial computer problem that the industrial computer waited to solve always urgently, the tradition carries out radiating industrial computer through setting up the fan at quick-witted incasement portion, the biggest problem of cooling through the fan at quick-witted incasement is that the industrial computer functioning time is long, there is one deck thick dust etc. on fan and the mainboard, if not clear up for a long time, then easily because the dust piles up and leads to static to pile up, breakdown circuit board component class trouble, so just need an quick-witted incasement no fan and the industrial computer that the radiating effect is good.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a novel 5G industrial personal computer with good heat dissipation performance. The heat generated by the chip on the chip seat is directly conducted on the heat dissipation plate through the heat conducting medium, the heat dissipation is carried out through the plurality of heat dissipation fins on the heat dissipation plate, the air flow is infused into the grooves of the plurality of heat dissipation fins through the fan at the center of the heat dissipation plate, the redundant heat is further taken away through the air flow while the heat dissipation fins carry out heat dissipation, the heat dissipation efficiency is greatly improved, the heat dissipation device can stably run in the environment of 60 ℃, the heat of the processor is taken away through the environmental temperature difference, the normal work in the environment of 60 ℃ can be realized, and the faults caused by high temperature are reduced. The utility model adopts the low-power processor, reduces the energy consumption of the whole machine, has quick heat dissipation, supports the use of a 5G network for data transmission and has strong practicability.
The utility model is realized by the following steps:
the utility model provides a novel 5G industrial computer that heat dispersion is good, includes the bottom plate, the fixed panel that is equipped with on one side of bottom plate the interval is equipped with RS232 serial ports, RS485 serial ports, net gape and USB interface on the panel, the fixed chip seat that is equipped with on the bottom plate, the fixed chip that is equipped with on the chip seat the fixed heating panel that is equipped with in chip upper end, the polylith heat radiation fins that the interval evenly set up is served to the heating panel upper end, the top of chip seat with the butt is equipped with the heat-conducting medium between the bottom plate of heating panel, still fix on the bottom plate and be equipped with 5G DTU.
Further, the heat dissipation cavity is formed in the center of the plurality of heat dissipation fins, the fan is arranged in the heat dissipation cavity, the through holes are uniformly formed in the inner wall of the heat dissipation cavity at intervals, the air induction ports are formed in the center of the plurality of heat dissipation fins, the cavity cover is arranged on the top surface of the heat dissipation cavity, connecting threads are arranged on the side wall of the cavity cover, and thread grooves matched with the threads are formed in the inner wall of the heat dissipation cavity.
Furthermore, the number of the RS232 serial ports is 4, the number of the RS485 serial ports is 2, the number of the network ports is 3, and the number of the USB interfaces is 8.
Furthermore, the bottom plate and the heat dissipation fins are made of red copper or aluminum alloy.
Further, the heat-conducting medium is a silica gel heat-conducting fin.
Furthermore, the chip is an Intel Celeron J1900, Intel Corei5-4200U or i3-8145U type low-power consumption CPU.
Compared with the prior art, the utility model has the beneficial effects that: the heat generated by the chip on the chip seat is directly conducted on the heat dissipation plate through the heat conducting medium, the heat dissipation is carried out through the plurality of heat dissipation fins on the heat dissipation plate, the air flow is infused into the grooves of the plurality of heat dissipation fins through the fan at the center of the heat dissipation plate, the redundant heat is further taken away through the air flow while the heat dissipation fins carry out heat dissipation, and the heat dissipation efficiency is greatly improved. The utility model adopts the low-power processor, reduces the energy consumption of the whole machine, has quick heat dissipation, supports the use of a 5G network for data transmission and has strong practicability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the interior base of the present invention;
the heat dissipation structure comprises a bottom plate 1, a panel 10, an RS232 serial port 11, an RS485 serial port 13, a network port 12, a USB interface 14, a heat dissipation fin 2, a chip base 3, a chip 31, a heat dissipation cavity 4, a through hole 41, a fan 5 and a cavity cover 6.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1-2, a novel 5G industrial personal computer with good heat dissipation performance comprises a bottom plate 1, a panel 10 is fixedly arranged on one side of the bottom plate 1, an RS232 serial port 11, an RS485 serial port 13, a network port 12 and a USB interface 14 are arranged on the panel 10 at intervals, a chip holder 3 is fixedly arranged on the bottom plate 1, a chip 31 is fixedly arranged on the chip holder 3, a heat dissipation plate is fixedly arranged at the upper end of the chip 31, a plurality of heat dissipation fins 2 are uniformly arranged at intervals at the upper end of the heat dissipation plate, a heat conduction medium is arranged between the top end of the chip holder 3 and the bottom plate of the heat dissipation plate in an abutting mode, and a 5G DTU is further fixedly arranged on the bottom plate 1.
In this embodiment, the central position of the heat dissipation fins 2 is provided with a heat dissipation cavity 4, a fan 5 is arranged in the heat dissipation cavity 4, the inner wall of the heat dissipation cavity 4 is uniformly provided with a plurality of through holes 41 at intervals, the central position of the heat dissipation fins 2 is provided with air inlets, the top surface of the heat dissipation cavity 4 is provided with a cavity cover 6, the side wall of the cavity cover 6 is provided with connecting threads, and the inner wall of the heat dissipation cavity 4 is provided with thread grooves matched with the threads.
In this embodiment, the RS232 serial port 11 is 4, the RS485 serial port 13 is 2, the network port 12 is 3, and the USB interface 14 is 8.
In this embodiment, the bottom plate 1 and the heat dissipation fins 2 are made of red copper or aluminum alloy.
In this embodiment, the heat conducting medium is a silica gel heat conducting sheet.
In this embodiment, the chip 31 is an Intel Celeron J1900, Intel Corei5-4200U or i3-8145U type low power consumption CPU.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a novel 5G industrial computer that heat dispersion is good, its characterized in that: including bottom plate (1), fixed panel (10) that is equipped with on one side of bottom plate (1) the interval is equipped with RS232 serial ports (11), RS485 serial ports (13), net gape (12) and USB interface (14) on panel (10), fixed chip seat (3) that are equipped with on bottom plate (1), fixed chip (31) that are equipped with on chip seat (3) the fixed heating panel that is equipped with in chip (31) upper end, the heating panel upper end is polylith heat radiation fins (2) that the interval evenly set up, the top of chip seat (3) with the butt is equipped with the heat-conducting medium between the bottom plate of heating panel, still fixed 5G DTU that is equipped with on bottom plate (1).
2. The novel 5G industrial personal computer with good heat dissipation performance according to claim 1, characterized in that a heat dissipation cavity (4) is formed in the center of the heat dissipation fins (2), a fan (5) is arranged in the heat dissipation cavity (4), a plurality of through holes (41) are uniformly formed in the inner wall of the heat dissipation cavity (4) at intervals, a plurality of air induction ports are formed in the center of the heat dissipation fins (2), a cavity cover (6) is arranged on the top surface of the heat dissipation cavity (4), connecting threads are arranged on the side wall of the cavity cover (6), and thread grooves matched with the threads are formed in the inner wall of the heat dissipation cavity (4).
3. The novel 5G industrial personal computer with good heat dissipation performance according to claim 1, wherein the number of the RS232 serial ports (11) is 4, the number of the RS485 serial ports (13) is 2, the number of the network ports (12) is 3, and the number of the USB interfaces (14) is 8.
4. The novel 5G industrial personal computer with good heat dissipation performance according to claim 1, wherein the bottom plate (1) and the heat dissipation fins (2) are made of red copper or aluminum alloy.
5. The novel 5G industrial personal computer with good heat dissipation performance according to claim 1, wherein the heat-conducting medium is a silica gel heat-conducting fin.
6. The novel 5G industrial personal computer with good heat dissipation performance according to claim 1, characterized in that the chip is an Intel Celeron J1900, Intel Corei5-4200U or i3-8145U type low-power consumption CPU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122967707.8U CN216249098U (en) | 2021-11-30 | 2021-11-30 | Novel 5G industrial computer that heat dispersion is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122967707.8U CN216249098U (en) | 2021-11-30 | 2021-11-30 | Novel 5G industrial computer that heat dispersion is good |
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| Publication Number | Publication Date |
|---|---|
| CN216249098U true CN216249098U (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122967707.8U Expired - Fee Related CN216249098U (en) | 2021-11-30 | 2021-11-30 | Novel 5G industrial computer that heat dispersion is good |
Country Status (1)
| Country | Link |
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| CN (1) | CN216249098U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115720440A (en) * | 2022-12-14 | 2023-02-28 | 深圳市大唐计算机有限公司 | Embedded industrial computer without fan |
-
2021
- 2021-11-30 CN CN202122967707.8U patent/CN216249098U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115720440A (en) * | 2022-12-14 | 2023-02-28 | 深圳市大唐计算机有限公司 | Embedded industrial computer without fan |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220408 |