CN216052884U - Device for reducing temperature of mainboard CPU by adopting refrigeration piece - Google Patents
Device for reducing temperature of mainboard CPU by adopting refrigeration piece Download PDFInfo
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- CN216052884U CN216052884U CN202122035151.9U CN202122035151U CN216052884U CN 216052884 U CN216052884 U CN 216052884U CN 202122035151 U CN202122035151 U CN 202122035151U CN 216052884 U CN216052884 U CN 216052884U
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Abstract
The utility model discloses a device for reducing the temperature of a mainboard CPU (central processing unit) by adopting a refrigeration piece, which comprises a mainboard, a CPU, a mylar sheet, a CPU protection frame, a sealing sleeve, heat insulation cotton, a TEC refrigeration piece and a lead wire, wherein the CPU is welded in the middle of the mainboard, one side of the mylar sheet is sealed and glued on the CPU protection frame by using conformal coating, the other side of the mylar sheet is sealed and glued at the bottom side of the sealing sleeve by using conformal coating, the heat insulation cotton is placed in the sealing sleeve, the TEC refrigeration piece is placed in the heat insulation cotton, the TEC refrigeration piece cools and dissipates heat on one side, the lead is electrically connected with the super I/O chip on the mainboard, the TEC refrigeration piece and the CPU are monitored through a super I/O chip on the mainboard, when the temperature of the CPU is in contact with a preset high temperature point, the super I/O chip starts the TEC refrigerating sheet to start refrigerating, when the temperature of the CPU is lower than the preset low temperature point, the TCE refrigerating sheet stops refrigerating, and the problem of high temperature of the CPU of the main board is directly and efficiently solved.
Description
Technical Field
The utility model belongs to the technical field of computer mainboards, and particularly relates to a device for reducing the temperature of a mainboard CPU (central processing unit) by adopting a refrigerating sheet.
Background
Along with the continuous development of computer motherboard technique, each device integrates highly concentrated, the function is more and more, the performance is stronger and more, device calorific capacity is more and more, however host computer complete machine volume is more and more partial to the reduction, this has just directly led to the cooling of computer mainboard CPU key device to become a difficult problem, current computer mainboard cooling mode all adopts the compound mode heat dissipation of multi-disc heat radiation fins and fan basically, has reached comparable effect, for the effect of better realization heat dissipation cooling, the utility model discloses a further cooling heat dissipation that makes mainboard CPU key device of the refrigerated mode of refrigeration piece.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model provides a device for reducing the temperature of a CPU (central processing unit) of a mainboard by adopting a refrigerating sheet, which can further enhance the cooling effect on the basis of the cooling effect of the computer mainboard by adopting the combination of a radiating fin and a fan in the current mainstream, particularly directly cool the CPU of a core device of the computer mainboard, so that the running performance is more stable, and the problem that the cooling and the heat dissipation of the key device of the CPU of the computer mainboard in the prior art are difficult is solved.
The utility model is realized in such a way that a device for reducing the temperature of a mainboard CPU by adopting a refrigeration piece comprises a mainboard, a CPU, a mylar sheet, a CPU protection frame, a sealing sleeve, heat insulation cotton, a TEC refrigeration piece, a lead, heat dissipation fins and through holes, wherein the CPU is welded in the middle of the mainboard, one surface of the mylar sheet is adhered to the CPU protection frame by using tri-proof paint sealing glue, the other surface of the mylar sheet is adhered to the bottom side of the sealing sleeve by using tri-proof paint sealing glue, the heat insulation cotton is placed in the sealing sleeve, the TEC refrigeration piece is placed in the heat insulation cotton, and the heat dissipation fins are tightly attached to the upper side of the TEC refrigeration piece and are fastened with the four corners of the mainboard through fixing lugs at the four corners.
As a further scheme of the utility model, the TEC refrigeration piece is externally connected with a lead, the lead is electrically connected with a super I/O chip on the mainboard, one side of the TEC refrigeration piece is used for refrigerating and the other side of the TEC refrigeration piece is used for dissipating heat, the three-proofing paint has sealing, gluing and cold and hot temperature impact resistance of-60-200 ℃, and the main component of the three-proofing paint is acrylic resin.
As a further scheme of the utility model, the middle part of the Mylar film is provided with a through hole matched with the size of the CPU, the Mylar film is matched with the CPU protective frame in size, and the Mylar film is 0.05-0.1mm in thickness.
As a further scheme of the utility model, the sealing sleeve is of a middle hollow frame structure, and the bottom surface size of the sealing sleeve is the same as that of the Mylar film.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, by arranging the TEC refrigeration piece, the sealing sleeve, the heat insulation cotton and the Mylar piece, the bottom surface of the TEC refrigeration piece can directly refrigerate and absorb heat after being electrified, the CPU is directly and efficiently cooled, the heat dissipation of the top surface of the TEC refrigeration piece is dissipated after the heat dissipation of the TEC refrigeration piece is conducted by the heat dissipation fins, the heat insulation cotton can prevent the series flow of hot and cold air at the upper part and the lower part of the TEC refrigeration piece, the hot air generated at the upper part is conducted and dissipated through the heat dissipation fins to the maximum extent, the sealing glue among the sealing sleeve, the Mylar piece and the CPU protection frame is adhered by the three-proofing paint, the device can be prevented from being soaked or overflowing and damaged under the condition of a small amount of condensed water vapor, and the water is dissipated by the action of the heat dissipation fan.
2. According to the utility model, the TEC refrigeration piece is electrically connected with the super I/O chip on the mainboard through the lead wire externally connected with the TEC refrigeration piece to realize operation monitoring, the CPU is monitored in temperature through the super I/O chip, the super I/O chip controls the TEC refrigeration piece to start refrigeration when the temperature of the CPU is in contact with a preset high-temperature warning point, the TCE refrigeration piece stops operating when the temperature of the CPU is lower than the preset low-temperature warning point, the CPU is always kept to operate in a proper temperature environment, and the operation stability is improved.
Description of the drawings:
FIG. 1 is an exploded view of an embodiment of the present invention;
FIG. 2 is a schematic view of a seal ring according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an insulation batt according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a CPU protection frame according to an embodiment of the present invention;
in the figure: 1. the heat-insulation and heat-dissipation integrated circuit comprises a main board, 2 parts of Mylar films, 3 parts of sealing sleeves, 4 parts of heat-insulation cotton, 5 parts of TEC refrigerating sheets, 6 parts of conducting wires, 7 parts of heat-dissipation fins, 8 parts of through holes, 9 parts of a CPU and 10 parts of a CPU protection frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the device for reducing the temperature of the main board CPU by using the refrigeration piece comprises a main board 1, a CPU9, a mylar sheet 2, a CPU protection frame 10, a sealing sleeve 3, heat insulation cotton 4, a TEC refrigeration piece 5, a lead 6, a heat dissipation fin 7 and a through hole 8, wherein the CPU9 is welded in the middle of the main board 1, one surface of the mylar sheet 2 is adhered to the CPU protection frame 10 by using tri-proof paint sealing glue, the other surface of the mylar sheet is adhered to the bottom side of the sealing sleeve 3 by using tri-proof paint sealing glue, the heat insulation cotton 4 is placed in the sealing sleeve 3, the TEC refrigeration piece 5 is placed in the heat insulation cotton 4, and the heat dissipation fin 7 is tightly attached to the top surface of the TEC refrigeration piece 5 and fastened with four corners of the main board 1 through fixing lugs at four corners.
Referring to fig. 1, a lead 6 is externally connected to the TEC refrigeration sheet 5, the lead 6 is electrically connected to a super I/O chip on the motherboard 1, one side of the TEC refrigeration sheet 5 is used for refrigeration, and the other side is used for heat dissipation, the tri-proof paint has sealing, adhesive and cold and hot temperature impact resistance of-60 to 200 ℃, and the main component is acrylic resin.
Referring to fig. 1 and 4, the central portion of the mylar sheet 2 is provided with a through hole 8 matching the size of the CPU9, and the mylar sheet 2 matches the size of the CPU protection frame 10 and has a thickness of 0.05-0.1 mm.
Referring to fig. 1 and 2, the sealing sleeve 3 is a hollow frame structure with a middle portion and a bottom size matching with one side of the mylar sheet 2.
By adopting the scheme, the TEC refrigeration piece 5, the sealing sleeve 3, the heat insulation cotton 4 and the Mylar film 2 are arranged, the bottom surface of the TEC refrigeration piece 5 can directly refrigerate and absorb heat after being electrified, the CPU9 is directly and efficiently cooled, the heat dissipation of the top surface of the TEC refrigeration piece 5 is dissipated after being conducted by the heat dissipation fins 7, the heat insulation cotton 4 can prevent the series flow of hot and cold air at the upper part and the lower part of the TEC refrigeration piece 5, the hot air generated at the upper part is conducted out through the heat dissipation fins 7 to the maximum extent, and meanwhile, the condensed water vapor is dissipated under the action of the heat dissipation fan; through the central part of the mylar piece 2 being provided with the through hole 8 matched with the CPU9 in size, the mylar piece 2 is matched with the CPU protective frame 10 in size and is 0.05-0.1mm in thickness, the sealing sleeve 3 is of a middle hollow frame structure, the bottom surface size of the mylar piece is matched with one surface of the mylar piece 2, one surface of the mylar piece 2 can be glued and sealed on the CPU protective frame 10, and the other surface of the mylar piece is glued and sealed on the bottom side of the sealing sleeve 3 to form a cavity structure.
The working mode of the utility model is as follows: the TEC refrigeration piece 5 is electrically connected with a super I/O chip on the mainboard 1 through a lead 6 externally connected with the TEC refrigeration piece 5 to realize operation monitoring, the CPU9 is monitored in temperature through the super I/O chip, when the temperature of the CPU9 is in contact with a preset high-temperature warning point, the super I/O chip controls the TEC refrigeration piece 5 to start refrigeration, at the moment, the TEC refrigeration piece 5 directly absorbs the heat of the CPU9 to cause direct and efficient cooling, when the temperature of the CPU9 is lower than the preset low-temperature warning point, the TCE refrigeration piece 5 stops operating, on the other hand, the heat emitted by the TEC refrigeration piece 5 is conducted to the heat dissipation fins 7 and then dissipated, so that the CPU9 is always kept to operate in a proper temperature environment, the operation stability is improved, and the problem of high temperature of the CPU9 is solved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the utility model.
Claims (4)
1. The utility model provides an adopt refrigeration piece to reduce device of mainboard CPU temperature, includes mainboard (1), CPU (9), wheat pulling-on piece (2), CPU guard frame (10), seal cover (3), thermal-insulated cotton (4), TEC refrigeration piece (5), wire (6), heat radiation fin (7), through-hole (8), its characterized in that: mainboard (1) middle part welding has CPU (9), wheat pulling-on piece (2) one side uses three proofings lacquer sealing adhesive to glue on CPU guard frame (10), and the another side uses three proofings lacquer sealing adhesive to glue in seal cover (3) bottom side, thermal-insulated cotton (4) have been placed in seal cover (3), thermal-insulated cotton (4) are arranged in to TEC refrigeration piece (5), heat radiation fins (7) are hugged closely in TEC refrigeration piece (5) upside and are fastened with mainboard (1) four corners through the fixed ear in four corners.
2. The device for reducing the temperature of the CPU of the mainboard by using the refrigeration sheet as claimed in claim 1, wherein: the TEC refrigeration piece (5) is externally connected with a lead (6), the lead (6) is electrically connected with a super I/O chip on the main board (1), the TEC refrigeration piece (5) is used for refrigerating and radiating simultaneously, the three-proofing paint has sealing, gluing and cold and hot temperature impact resistance of-60-200 ℃, and the main component is acrylic resin.
3. The device for reducing the temperature of the CPU of the mainboard by using the refrigeration sheet as claimed in claim 1, wherein: the central zipper pull (2) is provided with a through hole (8) matched with the CPU (9) in size in the middle, the central zipper pull (2) is matched with the CPU protection frame (10) in size, and the thickness of the central zipper pull is 0.05-0.1 mm.
4. The device for reducing the temperature of the CPU of the mainboard by using the refrigeration sheet as claimed in claim 1, wherein: the sealing sleeve (3) is of a middle hollow frame structure, and the bottom surface size of the sealing sleeve is the same as that of the Mylar film (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122035151.9U CN216052884U (en) | 2021-08-26 | 2021-08-26 | Device for reducing temperature of mainboard CPU by adopting refrigeration piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122035151.9U CN216052884U (en) | 2021-08-26 | 2021-08-26 | Device for reducing temperature of mainboard CPU by adopting refrigeration piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216052884U true CN216052884U (en) | 2022-03-15 |
Family
ID=80621912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122035151.9U Active CN216052884U (en) | 2021-08-26 | 2021-08-26 | Device for reducing temperature of mainboard CPU by adopting refrigeration piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216052884U (en) |
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2021
- 2021-08-26 CN CN202122035151.9U patent/CN216052884U/en active Active
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