CN219978812U

CN219978812U - Flat plate heat radiation structure

Info

Publication number: CN219978812U
Application number: CN202320710649.7U
Authority: CN
Inventors: 黄杰; 易珊合; 楼月; 饶素康; 胡金贤; 欧阳熹; 闵小明; 敖海平
Original assignee: Beifang Lianchuang Communication Co ltd
Current assignee: Beifang Lianchuang Communication Co ltd
Priority date: 2023-04-03
Filing date: 2023-04-03
Publication date: 2023-11-07
Anticipated expiration: 2033-04-03

Abstract

The utility model discloses a flat plate heat radiation structure which comprises a shell, a main plate, a battery pack, a heat insulation part and a heat conduction assembly, wherein the heat insulation part is arranged between the battery pack and the shell, the heat conduction assembly is arranged between the main plate and the shell, a heat radiation groove is formed in the shell, the main plate is arranged between the shell and the battery pack, the heat conduction assembly comprises a heat conduction layer arranged on the shell, a first heat conduction module and a second heat conduction module which are arranged between the heat conduction layer and the main plate, the heat insulation part is arranged on one side, close to the main plate, of the battery pack and is fixed on the shell so as to enable the battery pack and the shell to be spread for a preset distance, and the first heat conduction module, the second heat conduction module and the heat conduction layer are used for conducting heat of the main plate to the shell. According to the utility model, the heat insulation piece is arranged between the main board and the battery pack, the first heat conduction module and the second heat conduction module are arranged between the main board and the shell, so that heat generated by the main board is conducted to the shell through the heat conduction assembly to dissipate heat, and meanwhile, the heat insulation piece is arranged between the battery pack and the main board, so that the battery pack is prevented from being damaged by heating.

Description

Flat plate heat radiation structure

Technical Field

The utility model relates to the field of flat plate heat dissipation, in particular to a flat plate heat dissipation structure.

Background

The military flat plate is applied to special occasions such as military exercises, military operations and the like, strict information security protection measures are required, and the requirements on autonomous controllable domestic military flat plates are higher and higher. The semiconductor has low self-supporting rate in China, the manufacturing process has a gap from the international first-class level, and the power consumption of the domestic chips such as a Central Processing Unit (CPU) and a Graphic Processing Unit (GPU) produced at present is high.

Because components such as a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU) have high power consumption, a large amount of heat is generated, and components inside a flat panel are easily burned out, a heat dissipation device is required to be arranged on the flat panel. The existing military flat plate usually uses a fan to dissipate heat, but the working noise of the fan is large, the environment of the use of the fan is complex, a plurality of severe environments such as high temperature, rain, sand dust and the like are required to face, the fan is easy to damage, and then the flat plate cannot dissipate heat, so that the normal use of the military flat plate is seriously affected.

Disclosure of Invention

Based on the above, the present utility model aims to provide a flat plate heat dissipation structure, which aims to solve the technical problem that the flat plate is easy to be damaged in a severe environment due to the fact that a fan is used for heat dissipation at present.

In order to achieve the above purpose, the present utility model is realized by the following technical scheme: the utility model provides a dull and stereotyped heat radiation structure, includes casing, mainboard and group battery, and locates the group battery with thermal-insulated piece between the casing, locate the mainboard with heat conduction subassembly between the casing, wherein:

the heat-conducting assembly comprises a shell, a heat-insulating piece, a heat-conducting layer, a first heat-conducting module, a second heat-conducting module and a heat-insulating piece, wherein the shell is provided with a heat-radiating groove, the main board is arranged between the shell and the battery pack, the heat-conducting assembly comprises a heat-conducting layer arranged on the shell, the first heat-conducting module and the second heat-conducting module are arranged between the heat-conducting layer and the main board, the heat-insulating piece is arranged on one side, close to the main board, of the battery pack and is fixed on the shell so that the battery pack and the shell are spread for a preset distance, and the first heat-conducting module, the second heat-conducting module and the heat-conducting layer are used for conducting heat of the main board to the shell.

In summary, according to the flat plate heat dissipation structure provided by the above, the heat insulation member is arranged between the main plate and the battery pack, and the first heat conduction module and the second heat conduction module are arranged between the main plate and the casing, so that heat generated by the main plate is conducted to the casing through the heat conduction assembly to dissipate heat, and meanwhile, the heat insulation member is arranged between the battery pack and the main plate, so that the battery pack is prevented from being damaged due to being heated. Specifically, the heat radiation structure comprises a shell, a main board, a battery pack, a heat insulation piece arranged between the battery pack and the shell, and a heat conduction assembly arranged between the main board and the shell. The heat-conducting assembly comprises a heat-conducting layer arranged on the shell, a first heat-conducting module and a second heat-conducting module arranged between the heat-conducting layer and the main board, and a heat-insulating piece arranged on one side of the battery pack close to the main board and fixed on the shell so as to enable the battery pack to be separated from the shell by a preset distance, the battery pack and the main board are prevented from being contacted and heated and expanded, and the heat generated during operation of the main board is transferred onto the shell by the first heat-conducting module, the second heat-conducting module and the heat-conducting layer and dissipated by means of a heat dissipation groove arranged on the shell.

Further, the main board is provided with a first heating element and a second heating element, and the first heat conduction module is arranged between the heating element and the ground two heat conduction components.

Further, the first heat conduction module comprises a first heat conduction pad and a second heat conduction pad, the first heat conduction pad is attached to the first heating element, and the second heat conduction pad is attached to the second heating element so as to be used for transferring heat to the second heat conduction module.

Further, the second heat conduction module comprises a substrate, a heat dissipation assembly and a heat pipe assembly, the heat dissipation assembly and the heat pipe assembly are respectively arranged on two end faces of the substrate, the heat dissipation assembly is used for being connected with the first heat conduction module, and the heat pipe assembly is used for being in contact with the heat conduction layer.

Further, the heat dissipation assembly comprises a first heat dissipation boss and a second heat dissipation boss which are arranged on the same side of the substrate, one side, away from the first heating element, of the first heat conduction pad is attached to the first heat dissipation boss, and one side, away from the second heating element, of the second heat conduction pad is attached to the second heat dissipation boss.

Further, the heat pipe assembly comprises a straight first heat pipe and a U-shaped second heat pipe, and the first heat pipe and the second heat pipe are attached to the heat conducting layer.

Furthermore, the back and the periphery of the shell are provided with heat dissipation grooves.

Further, the heat conduction layer is formed by bonding and stacking a plurality of graphene sheets.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the present utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which

FIG. 1 is an exploded view of a heat dissipating structure according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of an internal layout structure of the present utility model;

FIG. 3 is a schematic diagram of a heat dissipation structure according to the present utility model;

FIG. 4 is a front view of a motherboard of the present utility model;

FIG. 5 is a schematic diagram of a front perspective view of a heat pipe module according to the present utility model;

FIG. 6 is a schematic diagram of a back perspective structure of a heat pipe module according to the present utility model;

FIG. 7 is a cross-sectional view of a graphene sheet in accordance with the present utility model;

FIG. 8 is a schematic view of a rear perspective view of a housing in the present utility model;

fig. 9 is a schematic front perspective view of a casing according to the present utility model.

Description of the drawings element symbols:

the display assembly 1, the main board 2, the first heating element 21, the second heating element 22, the interface board 3, the battery pack 4, the power supply block 5, the heat pipe assembly 66, the first heat pipe 61, the second heat pipe 62, the substrate 63, the first heat dissipation boss 631, the second heat dissipation boss 632, the solder paste 64, the heat conduction layer 7, the heat insulating element 8, the casing 9, the back heat dissipation groove 91, the left heat dissipation groove 92, the lower heat dissipation groove 93, the upper heat dissipation groove 94, the right heat dissipation groove 95, the first heat conduction pad 10, and the second heat conduction pad 11.

Detailed Description

In order to make the objects, features and advantages of the present utility model more comprehensible, embodiments accompanied with figures are described in detail below. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and the like are used herein for descriptive purposes only and not to indicate or imply that the apparatus or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-9, a schematic structural diagram of a flat heat dissipation structure according to an embodiment of the present utility model is shown, the heat dissipation structure includes a housing 9, a motherboard 2, a battery pack 4, and a heat insulation member 8 disposed between the battery pack 4 and the housing 9, a heat conduction assembly disposed between the motherboard 2 and the housing 9, wherein:

the main board 2 is disposed between the casing 9 and the battery pack 4, and since the battery pack 4 in this embodiment is formed by combining a plurality of lithium ion batteries in series and parallel, an excessively high temperature may cause instability in the lithium ion batteries and may cause internal short circuit to be damaged, so that a high temperature protection measure is adopted for the battery pack 4. A heat insulating member 8 is arranged between the main board 2 and the battery pack 4, and the heat insulating member 8 is arranged on one side of the battery pack 4, which is close to the main board 2, and is fixed on the casing 9 so as to enable a preset distance to be opened between the battery pack 4 and the casing 9 for physical isolation. The heat insulating piece 8 is of a strip-shaped structure made of Polycarbonate (PC) materials, and the polycarbonate has the advantages of good toughness, good stability, good flame retardance and good heat insulation, and can effectively protect the battery pack 4. The single-sided adhesive tape of the heat insulating piece 8 can be directly adhered, the thickness is 2mm, and the battery pack 4 and the machine shell 9 have enough distance to avoid direct contact, so that the path of heat conducted from the machine shell 9 to the battery pack 4 is thoroughly broken.

The main board 2 is provided with a first heating element 21 and a second heating element 22, and in this embodiment, the first heating element 21 and the second heating element 22 are respectively a flying cpu and a GP102 graphics processor. The Feiteng central processing unit is a domestic industrial grade central processing unit, is packaged in an FCLBGA packaging mode, has the maximum power consumption of 25W, the working temperature of-40-105 ℃, and the technology is completely and autonomously controllable. The GP102 graphic processor is independently developed by Wuhan Ling microelectronic Co., ltd, is an industrial grade 3D graphic processing chip, has the working temperature of-40-85 ℃ and the maximum power consumption of 7W, and is completely and independently controllable in technology.

In order to promote the heat conduction between mainboard 2 and the casing 9, be equipped with heat conduction subassembly between the two, heat conduction subassembly is including locating heat conduction layer 7 on the casing 9, locate first heat conduction module and the second heat conduction module between heat conduction layer 7 and the mainboard 2, first heat conduction module locates the piece that generates heat with between the second heat conduction module.

The first heat conduction module comprises a first heat conduction pad 10 and a second heat conduction pad 11, the first heat conduction pad 10 is attached to the first heating element 21, and the second heat conduction pad 11 is attached to the second heating element 22 for transferring heat to the second heat conduction module. The first thermal pad 10 and the second thermal pad 11 are made of silica gel as a base material, various auxiliary materials such as metal oxide are added, and a thermal conductive medium material synthesized by a special process can fill gaps and play roles of insulation, sealing, vibration reduction and the like. The second heat conduction module comprises a substrate 63, a heat dissipation assembly and a heat pipe assembly 6, wherein the heat dissipation assembly and the heat pipe assembly 6 are respectively arranged on two end faces of the substrate 63, the heat dissipation assembly is used for being connected with the first heat conduction module, and the heat pipe assembly 6 is used for being in contact with the heat conduction layer 7. The heat dissipation assembly includes a first heat dissipation boss 631 and a second heat dissipation boss 632 disposed on the same side of the substrate 63, one side of the first heat conduction pad 10 away from the first heat generating element 21 is attached to the first heat dissipation boss 631, and one side of the second heat conduction pad 11 away from the second heat generating element 22 is attached to the second heat dissipation boss 632. The heat pipe assembly 6 includes a first heat pipe 61 having a straight shape and a second heat pipe 62 having a U-shape, and the first heat pipe 61 and the second heat pipe 62 are attached to the heat conductive layer 7. The first heat pipe 61 and the second heat pipe 62 were each flattened to a thickness of 3mm using a heat pipe having a diameter of 8mm, each capable of transferring heat of approximately 35W. The substrate 63 is soldered at the intermediate region of the first heat pipe 61 and the second heat pipe 62 by solder paste 64.

Further, the first heat conducting pad 10 is filled in the gap between the first heat dissipating boss 631 and the first heat generating element 21 to improve the heat transfer efficiency of the first heat generating element 21 to the substrate 63; the second heat conductive pad 11 fills in the gap between the second heat dissipating boss 632 and the second heat generating member 22 to improve the heat transfer efficiency of the second heat generating member 22 to the substrate 63. The heat conduction layer 7 is formed by bonding and stacking a plurality of layers of graphene sheets, the graphene is a new material with a single-layer two-dimensional honeycomb lattice structure formed by closely stacking SP2 hybridized and connected carbon atoms, and has excellent optical, thermal, electrical and mechanical properties, a heat transfer coefficient as high as 2000W/(m < 2 >. K) and high stability.

When heat is conducted to the casing 9, since the casing 9 is provided with the back heat dissipation groove 91 at the bottom, the left heat dissipation groove 92 at the left, the right heat dissipation groove 95 at the right, the lower heat dissipation groove 93 at the lower, and the upper heat dissipation groove 94 at the upper. The heat dissipation grooves increase the heat dissipation area of the casing 9 and improve the heat dissipation efficiency. The upper side of the shell 9 is provided with an interface board 3, the lower right side is provided with a power supply block 5, and the shell 9 is also provided with a display component 1. In this embodiment, the casing 9 is an integrally formed structure made of mg-al composite material, and has high strength and good rigidity, and mg-al alloy is the lightest engineering metal material known at present, and has excellent specific stiffness, specific strength, damping performance, and biocompatibility.

When the domestic military flat plate works, heat generated by the first heating element 21 and the second heating element 22 is transferred to the heat pipe assembly 6 through the first heat conduction pad 10 and the second heat conduction pad 11, then transferred to the heat conduction layer 7 through the heat pipe assembly 6, and then transferred to the machine shell 9 through the heat conduction layer 7. The heat pipe assembly 6 and the heat conducting layer 7 have ultrahigh heat transfer coefficient, and a low-thermal resistance channel is formed between the main board 2 and the shell, so that heat can be quickly transferred out.

To sum up, according to the flat plate heat radiation structure provided by the above, the heat insulation member is arranged between the main plate 2 and the battery pack, and the first heat conduction module and the second heat conduction module are arranged between the main plate 2 and the casing, so that heat generated by the main plate 2 is conducted to the casing through the heat conduction assembly to radiate, and meanwhile, the heat insulation member is arranged between the battery pack and the main plate 2, so that the battery pack is prevented from being damaged by being heated. Specifically, the heat radiation structure comprises a shell, a main board 2, a battery pack, a heat insulation piece arranged between the battery pack and the shell, and a heat conduction component arranged between the main board 2 and the shell. The mainboard 2 is located between casing and the group battery, and heat conduction subassembly is including locating the heat conduction layer on the casing, locates first heat conduction module and the second heat conduction module between heat conduction layer and the mainboard 2, and the heat-proof member is located one side that the group battery is close to the mainboard 2 to be fixed in on the casing so that prop up the default distance between group battery and the casing, prevent group battery and mainboard 2 contact thermal expansion, on first heat conduction module, second heat conduction module and the heat conduction layer produced with mainboard 2 during operation transferred to the casing, and rely on the radiating groove that is equipped with on the casing to dispel the heat.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model, and are described in detail, but are not to be construed as limiting the scope of the utility model. It should be noted that it is possible for those skilled in the art to make several variations and modifications without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The utility model provides a dull and stereotyped heat radiation structure, its characterized in that includes casing, mainboard and group battery, and locate the group battery with the heat-proof spare between the casing, locate the mainboard with heat conduction subassembly between the casing, wherein:

2. The flat panel heat dissipation structure according to claim 1, wherein the main board is provided with a first heat generating element and a second heat generating element, and the first heat conduction module is disposed between the heat generating element and the second heat conduction module.

3. The flat panel heat dissipating structure of claim 2, wherein the first heat conducting module comprises a first heat conducting pad and a second heat conducting pad, the first heat conducting pad being attached to the first heat generating element, the second heat conducting pad being attached to the second heat generating element for transferring heat to the second heat conducting module.

4. The flat panel heat dissipation structure as claimed in claim 3, wherein the second heat conduction module comprises a substrate, a heat dissipation assembly and a heat pipe assembly, the heat dissipation assembly and the heat pipe assembly are respectively disposed on two end surfaces of the substrate, the heat dissipation assembly is used for being connected with the first heat conduction module, and the heat pipe assembly is used for being in contact with the heat conduction layer.

5. The flat panel heat dissipation structure according to claim 4, wherein the heat dissipation assembly comprises a first heat dissipation boss and a second heat dissipation boss disposed on the same side of the substrate, wherein a side of the first heat conduction pad away from the first heat generating element is attached to the first heat dissipation boss, and a side of the second heat conduction pad away from the second heat generating element is attached to the second heat dissipation boss.

6. The flat panel heat dissipating structure of claim 4, wherein the heat pipe assembly comprises a first heat pipe that is straight and a second heat pipe that is U-shaped, the first heat pipe and the second heat pipe being attached to the heat conductive layer.

7. The flat panel heat dissipation structure as claimed in claim 1, wherein the back and the periphery of the case are provided with heat dissipation grooves.

8. The flat panel heat dissipating structure of claim 1, wherein the thermally conductive layer is formed by bonding and stacking a plurality of graphene sheets.