CN108507226A - A kind of electronic equipment radiating module - Google Patents
A kind of electronic equipment radiating module Download PDFInfo
- Publication number
- CN108507226A CN108507226A CN201810425963.4A CN201810425963A CN108507226A CN 108507226 A CN108507226 A CN 108507226A CN 201810425963 A CN201810425963 A CN 201810425963A CN 108507226 A CN108507226 A CN 108507226A
- Authority
- CN
- China
- Prior art keywords
- heat
- veneer
- piece
- euthermic chip
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 91
- 239000000463 material Substances 0.000 claims abstract description 25
- 235000012149 noodles Nutrition 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 description 17
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000005679 Peltier effect Effects 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
The invention discloses a kind of electronic equipment radiating modules, including veneer, euthermic chip, conduction cooling radiator, cooling piece and conventional interface Heat Conduction Material.Cooling piece absorbs heat to the bottom surface of veneer with the first euthermic chip bonding position by the first euthermic chip simultaneously, and in the position opposite side of the heat absorption, the heat of second euthermic chip can be conducted the relative position in the opposite side by heat-conducting piece, to which also heat can be distributed by the hot face of the heat absorption of the second euthermic chip to cooling piece and by shell by heat-conducting piece, it realizes in this way to radiating while the first euthermic chip and the second euthermic chip, solves the problem that radiates under bad working environments.Electronic equipment dissipating heat module of the present invention can cope with equipment cooling problem under worst hot case, can guarantee safe and stable, the efficient operation of electronic component.
Description
Technical field
The invention belongs to electronic equipment temperature control fields.
Background technology
With the continuous development of electronic technology, the power of electronic apparatus system is increasing, but physical size is increasingly
Small, heat flow density also sharply increases therewith, and radiate increased risk.Especially under high temperature harsh environment, good heat dissipation could be protected
Demonstrate,prove equipment dependability.Dissipating naturally for fan-free running gear is usually designed to due to reliability requirement for a kind of outdoor equipment
Hot equipment.But such equipment is usually applied to various severe worst hot cases, thus under high temperature heat-sinking capability by great challenge.
For such natural radiating equipment, usually heating device in equipment or module are dissipated by being attached on equipment inner casing
Heat under certain power density, can play preferable heat dissipation effect since shell is a radiator.Due to heat generating core
Piece is located at the positive and negative both sides of veneer, and when a face euthermic chip natural heat dissipation, euthermic chip is due to originals such as technology, layouts on another side
Cause, then can not natural heat dissipation.
As shown in Figure 1, being a kind of existing equipment with natural heat dissipation ability, which includes device housings 1 ', single
Plate 4 ', the first euthermic chip 2 ', the second euthermic chip 3 '.Wherein the first euthermic chip 2 ' is located at 4 ' bottom surface of veneer and passes through heat conduction
Material layer 8 ' (such as thermally conductive gel, chill bar) is connect with the boss 7 ' that shell 1 ' protrudes inwardly from.And the second euthermic chip 3 ' is straight
It connects and is installed on 4 ' top surface of veneer.Wherein the usual material of shell be die casting aluminium, shell can long fin with strengthen heat dissipation.
First euthermic chip 2 ' can be thermally conducted to shell by boss 7 ', so that the first euthermic chip 2 ' is transmitted to
Shell radiates.Due to product design, the second euthermic chip 3 ' can not be arranged into 2 ' bottom surface of veneer, and the heat overwhelming majority passes
It is delivered in 1 ' ambient enviroment of shell, in a part of heat transfer to veneer 2 '.Since heat is transmitted from high temperature to low temperature, the
The projecting environment temperature of two euthermic chips, 3 ' temperature, and 3 ' the preset permissive temperature of the second euthermic chip should be less than surrounding
Environment temperature, therefore second euthermic chip 3 ' can not be solved by conventional cooling measure.Such as increase radiator, the second heat generating core
3 ' heat of piece is still transmitted in ambient enviroment, therefore 3 ' temperature of the second euthermic chip can not be greatly lowered.It can in addition, also having
It can be conducted heat to by conductive structure part on side wall or opposite shell, but due to there are constructive interference etc., the party
Case can not be suitable for various operating modes.
In summary it is found that when encountering this kind of heat dissipation problem, such equipment cooling can not be solved by conventional scheme.To
Lead to the pause for the project of haveing suffered.
Therefore it must use a kind of completely new technical solution that could solve such chip cooling problem, to ensure that electronics is set
For to stabilization, safety and reliable operation.
Invention content
Goal of the invention：First goal of the invention of the present invention is to provide a kind of electronic equipment radiating module, can solve interior
Heat dissipation problem when euthermic chip is arranged in portion veneer two sides simultaneously.
The present invention second goal of the invention be to provide a kind of electronic equipment radiating module, can solve heat radiation chip due to
Different location inside the shell is set and is difficult to the heat dissipation problem of direct heat conduction.
Technical solution：To reach above-mentioned first purpose, following technical solution can be used in the present invention：
A kind of electronic equipment radiating module, including shell, the first euthermic chip in shell, the second euthermic chip,
Veneer, cooling piece, heat-conducting piece are additionally provided in the shell；Cooling piece is directly or indirectly bonded with outer casing inner wall face；Described first
Euthermic chip is installed on the bottom surface of veneer, and second euthermic chip is installed on the top surface of veneer, the hot face of cooling piece and shell
Internal face is bonded, and the huyashi-chuuka (cold chinese-style noodles) of cooling piece is directly or indirectly bonded with the first euthermic chip；One end of the heat-conducting piece directly or
It connects and is bonded with the second euthermic chip, the other end of heat-conducting piece is directly or indirectly bonded with the top surface of veneer, and heat-conducting piece and veneer
The position of top surface fitting is opposite with the position that the first euthermic chip is bonded with veneer.
Advantageous effect：The heat transfer of huyashi-chuuka (cold chinese-style noodles) can be given to the effect in hot face by cooling piece by Peltier effect, and
Make the first euthermic chip being bonded with cooling piece radiate, while cooling piece by the first euthermic chip to the bottom surface and first of veneer
Euthermic chip bonding position is freezed, and in the position opposite side of the refrigeration, heat-conducting piece can be by the heat of the second euthermic chip
The relative position in the opposite side is conducted, thus can be also by the heat absorption of the second euthermic chip to cooling piece by heat-conducting piece
Hot face and heat is distributed by shell, so i.e. realize to radiating while the first euthermic chip and the second euthermic chip.
This kind of mode is limited suitable for various arrangement spaces, and the ambient temperature residing for chip is higher than the yard of chip permissive temperature
Scape.
Further, when the huyashi-chuuka (cold chinese-style noodles) of cooling piece is bonded with the first euthermic chip indirectly, the huyashi-chuuka (cold chinese-style noodles) of cooling piece and the first fever
Heat-conducting interface material layer is accompanied between chip.When heat-conducting piece is bonded with the second euthermic chip indirectly, heat-conducting piece and the second heat generating core
Piece directly accompanies heat-conducting interface material layer.It accompanies and leads when heat-conducting piece is bonded with the top surface of veneer indirectly, between heat-conducting piece and veneer
Thermal interface material layer.When cooling piece is closed with outer casing inner wall face paste indirectly, thermally-conductive interface is accompanied between cooling piece and outer casing inner wall face
Material layer.
Further, shell is metalwork, and shell is equipped with radiating fin.
Further, the electronic equipment dissipating heat module application is in natural radiating equipment or air blast cooling equipment.
Further, the heat-conducting piece is this fields typical thermal-conductive and the thermal components such as metalwork, heat pipe metalwork.
Technical solution：To reach above-mentioned second purpose, following technical scheme also can be used in the present invention.
A kind of electronic equipment radiating module, including shell, the euthermic chip in shell are additionally provided with system in the shell
Cold, heat-conducting piece；Cooling piece is closed with outer casing inner wall face paste；One end of the heat-conducting piece is bonded with euthermic chip, heat-conducting piece it is another
One end contacts with cooling piece and forms heat transfer.
Advantageous effect：The heat transfer of huyashi-chuuka (cold chinese-style noodles) can be given to the effect in hot face by cooling piece by Peltier effect, and
The heat-conducting piece for forming heat transfer with cooling piece is set to radiate, since the length or reconfigurable of heat-conducting piece are whole for suitable euthermic chip
Installation site, so as to not by design conductive structure when heat conduction chip mounting location between constructive interference influenced, still
It so can efficiently realize the heat conduction to heat radiation chip.This kind of mode is limited suitable for various arrangement spaces, the week residing for chip
Enclose the operative scenario that environment temperature is higher than chip permissive temperature.
Further, the cooling piece is bonded with heat-conducting piece by heat-conducting interface material layer.
Further, veneer is additionally provided in shell, and cooling piece, heat-conducting piece, euthermic chip are respectively positioned on the same side of veneer,
Euthermic chip is fitted on veneer.
Further, veneer is accompanied between the cooling piece and heat-conducting piece, cooling piece is bonded with the bottom surface of veneer, and heat conduction
Part is bonded with the top surface of veneer, and cooling piece and the position that veneer is bonded are opposite with the position that heat-conducting piece is bonded with veneer；Fever
Chip is located at the both sides of veneer with cooling piece, and euthermic chip is mounted on the top surface of veneer.
Further, heat-conducting interface material layer is accompanied between heat-conducting piece and veneer；Heat conduction is accompanied between cooling piece and veneer
Interface material.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of equipment with natural heat dissipation ability in the prior art.
Fig. 2 is the structural schematic diagram of the electronic equipment dissipating heat module of the embodiment of the present invention one.
Fig. 3 is the heat transfer schematic diagram of electronic equipment dissipating heat module in Fig. 2.
Fig. 4 is the structural schematic diagram of the electronic equipment dissipating heat module of the embodiment of the present invention two.
Fig. 5 is the structural schematic diagram of the electronic equipment dissipating heat module of the embodiment of the present invention three.
Specific implementation mode
Embodiment one
It is the first embodiment of electronic equipment dissipating heat module provided by the invention, in the embodiment shown in Fig. 2
The first euthermic chip 2, the second euthermic chip 3, the veneer 4 being similarly positioned in shell, refrigeration including shell 1, in shell 1
Piece 5, heat-conducting piece 6.Wherein, cooling piece 5 is directly or indirectly bonded with 1 internal face of shell, which is to make by the way of
Heat-conducting interface material layer is accompanied between cold 5 and 1 internal face of shell, and (in the present embodiment, row can be selected in heat-conducting interface material
The thermally conductive gel, chill bar etc. of the prior art in the industry, similarly hereinafter).
First euthermic chip 2 is installed on the bottom surface of veneer 4, and second euthermic chip 3 is installed on the top of veneer 4
Face.Here the one side of the bottom surface of veneer 4 being set as in face of cooling piece 5, and it is set as top surface on one side back to cooling piece 5.System
Cold 5 hot face is bonded with 1 internal face of shell, and the huyashi-chuuka (cold chinese-style noodles) of cooling piece 5 is directly or indirectly bonded with the first euthermic chip 2.Here
Cooling piece 5 be it is commonly used in the prior art by Peltier effect carry out heat conduction cooling piece 5, the hot face of the cooling piece 5 with
Huyashi-chuuka (cold chinese-style noodles) is also the generic term of prior art cooling piece in this field, i.e., after cooling piece is electrified, the heat of huyashi-chuuka (cold chinese-style noodles) is moved
To hot face, coldface temperature is caused to reduce, hot-face temperature increases.The shell 1 is inwardly projecting boss 7, cooling piece 5 and the boss
7 surface fitting.Here when the huyashi-chuuka (cold chinese-style noodles) of cooling piece 5 is bonded with the first euthermic chip 2 indirectly, the huyashi-chuuka (cold chinese-style noodles) of cooling piece 6 and first
Heat-conducting interface material layer 8 is accompanied between euthermic chip 2.
One end of the heat-conducting piece 6 is directly or indirectly bonded with the second euthermic chip 3, the other end of heat-conducting piece 6 directly or
It is bonded indirectly with the top surface of veneer 4, and the position of heat-conducting piece 6 and the fitting of 4 top surface of veneer is pasted with the first euthermic chip 2 with veneer 4
The position of conjunction is opposite.
Likewise, when heat-conducting piece 6 here is bonded with the second euthermic chip 3 indirectly, heat-conducting piece 6 and the second euthermic chip 3
Directly accompany heat-conducting interface material layer；When heat-conducting piece 6 is bonded with the top surface of veneer 4 indirectly, accompanied between heat-conducting piece 6 and veneer 4
Heat-conducting interface material layer 8.
Shown in Fig. 3, it is powered on the conduction of the heat in rear integral module for cooling piece 5 and illustrates, in wherein Fig. 3
Arrow direction is the conduction orientation of heat.Wherein cooling piece 5 gives the heat transfer of huyashi-chuuka (cold chinese-style noodles) to hot face, and makes to paste with cooling piece 5
The first euthermic chip 2 heat dissipation closed, while bottom surface and first euthermic chip of the cooling piece 5 by the first euthermic chip 2 to veneer 4
2 bonding position are absorbed heat, and in the position opposite side of the heat absorption, and heat-conducting piece 6 can conduct the heat of the second euthermic chip 3
The relative position of the opposite side, thus can be also by the heat absorption of the second euthermic chip 3 to cooling piece 5 by heat-conducting piece 6
Hot face is simultaneously distributed heat by shell 1, is realized in this way to radiating while the first euthermic chip and the second euthermic chip.Its
In in order to improve the heat dissipation effect of shell 1, shell 1 is metalwork, and can further increase heat dissipation equipped with radiating fin on shell 1
Effect.
The permissive temperature that radiating mode in the present embodiment is particularly suitable for the first, second euthermic chip is less than ambient enviroment
The permissive temperature of temperature requirement or the first, second euthermic chip although projecting environment temperature, but connect with environment temperature
Closely, the case where temperature of the first, second euthermic chip can not be greatly lowered in conventional cooling measure.It is lacked compared to conventional scheme
It falls into, the technical solution of the present embodiment can quickly solve the heat dissipation problem of euthermic chip in this two classes situation.
Can be in addition the first, second heat generating core in an embodiment for such radiating module due to high reliability request
On piece installs radiator additional, and using fan to radiator heat-dissipation, it is contemplated that can accomplish close with environment temperature.But this kind of equipment by
In high reliability request, fan belongs to running element, and there are the low facts of fragile, reliability.Once fan fails bring complete machine mistake
Heat, reliability reduce.Therefore fan cooling scheme is not considered in conventional design.
Embodiment two
It please refers to shown in Fig. 4, is second of embodiment of electronic equipment dissipating heat module provided by the invention, in the embodiment
Euthermic chip 2 including shell 1, in shell 1.Cooling piece 5, heat-conducting piece 6 are additionally provided in the shell 1.Cooling piece 5 with it is outer
1 internal face of shell is bonded.One end of the heat-conducting piece 6 is bonded with euthermic chip 2, the other end of heat-conducting piece 6 contacted with cooling piece 5 and
Form heat transfer.In the present embodiment, veneer 4 is accompanied between cooling piece 5 and heat-conducting piece 6.Cooling piece 5 is bonded with the bottom surface of veneer 4,
And heat-conducting piece 6 is bonded with the top surface of veneer 4, and the position that the position that is bonded with veneer 4 of cooling piece 5 is bonded with heat-conducting piece 6 with veneer 4
It sets with respect to can also be incited somebody to action by the hot face of the heat absorption of euthermic chip 2 to cooling piece 5 and by shell 1 by heat-conducting piece 6
Heat distributes.Euthermic chip 2 is located at the both sides of veneer with cooling piece 5 in the present embodiment, suitable for requiring euthermic chip 2 to pacify
Situation on the top surface of veneer 4.
The permissive temperature that radiating mode in the present embodiment is particularly suitable for euthermic chip is less than ambient temperature requirement,
Or the permissive temperature of euthermic chip although projecting environment temperature, but it is close with environment temperature, and conventional cooling measure without
The case where temperature of euthermic chip is greatly lowered in method.Compared to conventional scheme defect, the technical solution of the present embodiment can be quickly
Solve the heat dissipation problem of euthermic chip in this two classes situation.
Embodiment three
It please refers to shown in Fig. 5, is second of embodiment of electronic equipment dissipating heat module provided by the invention, in the embodiment
Euthermic chip 2 including shell 1, in shell 1.Cooling piece 5, heat-conducting piece 6 are additionally provided in the shell 1.Cooling piece 5 with it is outer
1 internal face of shell is bonded.One end of the heat-conducting piece 6 is bonded with euthermic chip 2, the other end of heat-conducting piece 6 contacted with cooling piece 5 and
Form heat transfer.Veneer 4 is additionally provided in the present embodiment in shell 1, and cooling piece 5, heat-conducting piece 6, euthermic chip 2 are respectively positioned on veneer
4 the same side, euthermic chip 2 are fitted on veneer 4.Heat-conducting interface material layer 8 is accompanied between heat-conducting piece 6 and veneer 4；Cooling piece
Heat-conducting interface material layer 8 is accompanied between 5 and veneer 4.The cooling piece 5 is bonded with heat-conducting piece 6 by heat-conducting interface material layer 8.
The permissive temperature that radiating mode in the present embodiment is particularly suitable for euthermic chip is less than ambient temperature requirement,
Or the permissive temperature of euthermic chip although projecting environment temperature, but it is close with environment temperature, and conventional cooling measure without
The case where temperature of euthermic chip is greatly lowered in method.Compared to conventional scheme defect, the technical solution of the present embodiment can be quickly
Solve the heat dissipation problem of euthermic chip in this two classes situation.
Background of the present invention is natural radiating equipment, but is not limited to natural radiating equipment, can also be set applied to air blast cooling
It is standby.
In conclusion cold conduction regime of the present invention can solve the insurmountable equipment cooling hardly possible of conventional cooling measure
Topic；It is particularly suitable for veneer placement constraint, design limitation, chip permissive temperature and is less than residing ambient temperature, and cooling piece
There is relatively long distance operating mode scene between euthermic chip.Compared with conventional refrigerant piece radiates, indirect for various reasons and institute
Euthermic chip is needed to contact.But refrigerating capacity is transmitted on euthermic chip indirectly by conduction cooling cooling measure.To reduce fever
Chip temperature.The program can make electronic equipment dissipating heat realize efficiently, be not limited by a space；Can guarantee electronic component safety,
Stablize, efficient operation.
It the above is only the preferred embodiment of the present invention, it should be pointed out that：Those skilled in the art are come
It says, without departing from the principle of the present invention, can also be adjusted to each facility locations, these adjustment also should be regarded as this hair
Bright protection domain.
Claims (10)
1. a kind of electronic equipment radiating module, including shell, the first euthermic chip in shell, the second euthermic chip,
It is characterized in that：Veneer, cooling piece, heat-conducting piece are additionally provided in the shell；Cooling piece is closed with outer casing inner wall face paste；First hair
Hot chip is installed on the bottom surface of veneer, and second euthermic chip is installed on the top surface of veneer, the hot face of cooling piece in shell
Wall surface is bonded, and the huyashi-chuuka (cold chinese-style noodles) of cooling piece is bonded with the first euthermic chip；One end of the heat-conducting piece is bonded with the second euthermic chip, is led
The other end of warmware is directly bonded with the top surface of veneer, and heat-conducting piece and position and the first euthermic chip of the fitting of veneer top surface with
The position of veneer fitting is opposite.
2. electronic equipment dissipating heat module according to claim 1, it is characterised in that：The huyashi-chuuka (cold chinese-style noodles) of cooling piece and the first heat generating core
Heat-conducting interface material layer is accompanied between piece；Heat-conducting piece and the second euthermic chip directly accompany heat-conducting interface material layer；Between heat-conducting piece
It connects when being bonded with the top surface of veneer, heat-conducting interface material layer is accompanied between heat-conducting piece and veneer；Cooling piece and outer casing inner wall face it
Between accompany heat-conducting interface material layer.
3. electronic equipment dissipating heat module according to claim 1, it is characterised in that：The shell is inwardly projecting boss,
Cooling piece is bonded with the surface of the boss.
4. electronic equipment dissipating heat module according to claim 3, it is characterised in that：The shell is metalwork, and shell
It is equipped with radiating fin.
5. electronic equipment dissipating heat module according to any one of claim 1 to 4, it is characterised in that：The electronic equipment dissipates
Thermal modules are applied to natural radiating equipment or air blast cooling equipment.
6. a kind of electronic equipment radiating module, including shell, the euthermic chip in shell, it is characterised in that：The shell
Inside it is additionally provided with cooling piece, heat-conducting piece；Cooling piece is closed with outer casing inner wall face paste；One end of the heat-conducting piece is bonded with euthermic chip,
The other end of heat-conducting piece contacts with cooling piece and forms heat transfer.
7. electronic equipment dissipating heat module as claimed in claim 6, it is characterised in that：The cooling piece passes through heat conduction with heat-conducting piece
Interface material is bonded.
8. electronic equipment dissipating heat module as claimed in claim 7, it is characterised in that：It is additionally provided with veneer in shell, and cooling piece,
Heat-conducting piece, euthermic chip are respectively positioned on the same side of veneer, and euthermic chip is fitted on veneer.
9. electronic equipment dissipating heat module as claimed in claim 6, it is characterised in that：It is accompanied between the cooling piece and heat-conducting piece
Veneer, cooling piece is bonded with the bottom surface of veneer, and heat-conducting piece is bonded with the top surface of veneer, and the position that cooling piece is bonded with veneer
It is opposite with the position that heat-conducting piece is bonded with veneer；Euthermic chip is located at the both sides of veneer, euthermic chip installation with cooling piece
On the top surface of veneer.
10. electronic equipment dissipating heat module as claimed in claim 9, it is characterised in that：Heat conduction is accompanied between heat-conducting piece and veneer
Interface material；Heat-conducting interface material layer is accompanied between cooling piece and veneer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810425963.4A CN108507226A (en) | 2018-05-07 | 2018-05-07 | A kind of electronic equipment radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810425963.4A CN108507226A (en) | 2018-05-07 | 2018-05-07 | A kind of electronic equipment radiating module |
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| Publication Number | Publication Date |
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| CN108507226A true CN108507226A (en) | 2018-09-07 |
Family
ID=63400137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810425963.4A Pending CN108507226A (en) | 2018-05-07 | 2018-05-07 | A kind of electronic equipment radiating module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747774A (en) * | 2021-10-11 | 2021-12-03 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling system and use method thereof |
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- 2018-05-07 CN CN201810425963.4A patent/CN108507226A/en active Pending
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|---|---|---|---|---|
| CN101102656A (en) * | 2007-07-04 | 2008-01-09 | 杨伍民 | Closed loop automatic compensation heat dispersion method and device |
| CN202887087U (en) * | 2012-09-29 | 2013-04-17 | 四川奥格科技有限公司 | Semiconductor central processing unit (CPU) radiator having heat insulation protection |
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| CN113747774A (en) * | 2021-10-11 | 2021-12-03 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling system and use method thereof |
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Application publication date: 20180907 |
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