CN106383533A - Communication equipment low-temperature starting device and application thereof - Google Patents
Communication equipment low-temperature starting device and application thereof Download PDFInfo
- Publication number
- CN106383533A CN106383533A CN201610937564.7A CN201610937564A CN106383533A CN 106383533 A CN106383533 A CN 106383533A CN 201610937564 A CN201610937564 A CN 201610937564A CN 106383533 A CN106383533 A CN 106383533A
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- Prior art keywords
- low
- temperature
- heating
- communication apparatus
- veneer
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a communication equipment low-temperature starting device comprising a veneer. A low-temperature not-starting chip and a low-temperature starting chip are arranged on the front of the veneer. The back of the veneer is pasted with a heating film in a position corresponding to the low-temperature not-starting chip. With the communication equipment low-temperature starting device, the problem on how to start equipment at low temperature and cool the equipment at high temperature is solved. The device is particularly applicable to the condition of low-temperature starting of modules and local components of equipment with a small space. The device has the characteristics of short heating time, low heating power, remarkable heating effect, low heating cost, unlimited heating space and high reliability, and has an extremely broad application space. By applying the communication equipment low-temperature starting device, safe, stable and efficient work of electronic components is ensured.
Description
Technical field
The present invention relates to a kind of communication apparatus low-temperature startup device and its application, belong to electronic equipment temperature control field.
Background technology
With the continuous development of electronic technology, the power of electronic apparatus system is increasing, but physical size is increasingly
Little, heat flow density also sharply increases therewith, and radiate increased risk.Especially under high temperature harsh and unforgiving environments, good radiating could be protected
Card equipment dependability.Above-mentioned high temperature exotherm is that direction is paid close attention in thermal design field.Another direction is then in low temperature bar
Under part, equipment cannot start, and need heating measures reasonable in design, bring up to normal start-up temperature, its worst cold case of guarantee
Under can start work.Especially in the winter of severe cold, when outdoor temperature can reach -40 DEG C, only when in equipment device temperature reach
The start-up temperature requiring to it, equipment could normally start.Thereby ensure that normal startup of equipment needs heating technique to support.
At present, conventional heating means heat air by PTC, are aided with fan simultaneously and carry out thermal current circulation form and add
In hot whole equipment the form of air come to reach equipment startup temperature.Require in program design that space is big, heating power big,
And be aided with fan and carry out circulation of air flow, high cost.It is suitable for the operating mode that requirement needs the chip distribution of cold-starting to spread.For
Local module starts, or single chip cold-starting, the equipment of small volume, and the program is poor in cost and the suitability.Especially
When being to need to start under worst cold case for certain key chip, overall heat protocol is in cost, spatially restriction contradiction is dashed forward
Go out.
Cold-starting scheme for single chip and module is mainly viscous in the shell surface of chip or module heat radiator
Patch heating film mode, but this can face the risk that cannot radiate under this chip high temperature.This is just trapped in chip or mould under low temperature
Block needs to heat, and needs to radiate, and heat in the paradox not affecting to radiate under high temperature.In the face of local radiating module or single
The cold-starting scheme of chip, is badly in need of a kind of brand-new scheme to guarantee under low temperature that heating can start, the program and not under high temperature
Impact radiating.Thus ensureing electronic equipment to stable, safety and reliable operation.
Content of the invention
Goal of the invention：For overcoming prior art not enough, a kind of low-temperature heat speed is fast, heat time heating time in providing for purport of the present invention
Short, heating power is little, heating cost is low, it is little to take up room, normally can start work under extremely harsh low temperature environment, in high temperature
Communication apparatus low-temperature startup device and its application of high temperature radiating is not affected under severe service.
Technical scheme：For solving above-mentioned technical problem, the present invention adopts the following technical scheme that：
A kind of communication apparatus low-temperature startup device, including veneer, on described veneer front be provided with low temperature cannot bootrom
With low temperature can bootrom, described low temperature cannot be adhesive with heating film by the corresponding loose side in bootrom position.
Operation principle：Communication apparatus low-temperature startup device of the present invention, by directly heat low temperature cannot bootrom, thus
Improve its temperature to reach start-up temperature and start；This mode of heating does not interfere with the radiating of chip shell surface radiator simultaneously,
Radiate thus without having influence on high temperature.
Compared to the scheme of conventional heating air, present invention heat time heating time is short, heating power is little, and heating cost is low to be highlighted
Advantage；Compared to pasting heating film conventional scheme on a heat sink, the present invention has and radiates unaffected at high temperature, and heats
Time is short, and heating power is little, the low advantage of heating cost.
Described heating film is polyamide heating film or silica gel heating film；In short time, heat can be produced by Joule heat and carry
Height is heated the temperature of device.
When low temperature the corresponding loose side in bootrom position cannot have capacitor and inductor gadget and cannot directly paste
During heating film, low temperature cannot be provided with the heating supplementary structure connecting with loose side by the corresponding loose side in bootrom position
Part, filling interface Heat Conduction Material between veneer and heating ancillary structural member；Heating film is pasted on heating ancillary structural member；Can
The heat that heating film produces is transferred directly to veneer front by heating ancillary structural member and interface Heat Conduction Material cannot trigger
On part, reach quick heats.
Described heating ancillary structural member is panel beating metal material, can ensure that heating ancillary structural member fixing intensity, and can be really
Protect heating ancillary structural member good heat conductivity.
Preferably, described metal material is aluminum or copper.
Described heating ancillary structural member heat conductivity is more than 6W/Km；Can quickly cannot to low temperature by heating film heat transfer
Bootrom is so as to being rapidly achieved start-up temperature and starting.
Described interface Heat Conduction Material heat conductivity is more than 0.5W/Km；Can quickly cannot to low temperature by heating film heat transfer
Bootrom is so as to being rapidly achieved start-up temperature and starting.
A kind of application of communication apparatus low-temperature startup device, described communication apparatus low-temperature startup device is applied to electronic equipment
In；Can make electronic equipment cold-starting realize efficiently, low cost, be not limited by a space；Can guarantee that the safe, steady of electronic devices and components
Fixed, efficient operation.
The NM technology of the present invention is prior art.
Beneficial effect：Communication apparatus low-temperature startup device of the present invention can solve to start under equipment low temperature and radiating hardly possible under high temperature
Topic；Be particularly suited for that the device space is narrow and small, module and local device cold-starting operating mode；Have that heat time heating time is short, heating power
Little, heats are notable, and heating cost is cheap, the heating feature that space is unrestricted, reliability is high；There is extremely wide answering
Use space.The application of communication apparatus low-temperature startup device of the present invention, can guarantee that safe and stable, the efficient operation of electronic devices and components.
Brief description
Fig. 1 is communication apparatus low-temperature startup device veneer positive structure schematic of the present invention；
Fig. 2 is Fig. 1 structure schematic diagram；
Fig. 3 is Fig. 1 side structure schematic diagram；
Fig. 4 is communication apparatus low-temperature startup device principle of heating schematic diagram of the present invention；
In figure, 1 be veneer, 2 be low temperature cannot bootrom, 3 be low temperature can bootrom, 4 be heating film, 5 be interface
Heat Conduction Material, 6 be heating ancillary structural member.
Specific embodiment
For a better understanding of the present invention, it is further elucidated with present disclosure with reference to embodiment, but the present invention
Content is not limited solely to the following examples.
Embodiment 1
As Figure 1-4, a kind of communication apparatus low-temperature startup device, including veneer 1, on described veneer 1 front be provided with low
Temperature cannot bootrom 2 and low temperature can bootrom 3, described low temperature cannot paste at bootrom 2 position corresponding veneer 1 back side
There is heating film 4；Heating film 4 is polyamide heating film.
Communication apparatus low-temperature startup device of the present invention, by directly heat low temperature cannot bootrom 2, thus improve its temperature
Spend and reach start-up temperature and start；This mode of heating does not interfere with the radiating of chip shell surface radiator simultaneously, therefore not
Influence whether that high temperature radiates.
Compared to the scheme of conventional heating air, present invention heat time heating time is short, heating power is little, and heating cost is low to be highlighted
Advantage；Compared to pasting heating film conventional scheme on a heat sink, the present invention has and radiates unaffected at high temperature, and heats
Time is short, and heating power is little, the low advantage of heating cost.
The application of above-mentioned communication apparatus low-temperature startup device, makes electronic equipment cold-starting realize efficient, inexpensive, no
Limited by space；Can guarantee that safe and stable, the efficient operation of electronic devices and components.
Embodiment 2
Substantially the same manner as Example 1, except that：Heating film 4 is silica gel heating film.
Embodiment 3
Substantially the same manner as Example 1, except that：When low temperature cannot be deposited at bootrom 2 position corresponding veneer 1 back side
When capacitor and inductor gadget directly cannot paste heating film 4, low temperature cannot bootrom 2 position corresponding veneer 1 back side
It is provided with the heating ancillary structural member 6 with veneer 1 back face, filling interface heat conduction material between veneer 1 and heating ancillary structural member 6
Material 5；Heating film 4 is pasted on heating ancillary structural member 6；Heating ancillary structural member 6 is panel beating aluminium material；Heating ancillary structural member
6 heat conductivitys are more than 6W/Km；Interface Heat Conduction Material 5 heat conductivity is more than 0.5W/Km.
Embodiment 4
Substantially the same manner as Example 3, except that：Described heating film 4 is silica gel heating film.
Embodiment 5
Substantially the same manner as Example 3, except that：Described heating ancillary structural member 6 is panel beating copper material.
Embodiment 6
Substantially the same manner as Example 4, except that：Described heating ancillary structural member 6 is panel beating copper material.
Because the present invention directly heats veneer 1 or heating ancillary structural member 6 transfers heat to low temperature and cannot start core
Piece 2, compared to the scheme of heating air, present invention heat time heating time is short, heating power is little, and the low advantage of heating cost highlights；Phase
Than in increasing heating film 4 scheme on a heat sink, the present invention has and radiates unaffected at high temperature, and heat time heating time is short, plus
Thermal power is little, the low advantage of heating cost.Generally speaking, the present invention has advantage is that heat time heating time is short, and heating power is little, heating
Low cost, does not affect high temperature radiating, and reliability is guaranteed.
Communication apparatus low-temperature startup device of the present invention can solve to start under equipment low temperature and a radiating difficult problem under high temperature；Especially suitable
For the device space is narrow and small, module and device layout heating starting operating mode；Have that heat time heating time is short, heating power is little, heating effect
Fruit is notable, and heating cost is cheap, heating space is unrestricted, the high feature of reliability；There is extremely wide application space.This
The application of bright communication apparatus low-temperature startup device, can make electronic equipment cold-starting realize efficiently, low cost, do not limited by space
System；Can guarantee that safe and stable, the efficient operation of electronic devices and components.
The above is only the preferred embodiment of the present invention it should be pointed out that：Those skilled in the art are come
Say, under the premise without departing from the principles of the invention, each facility locations can also be adjusted, these adjustment also should be regarded as this
Bright protection domain.
Claims (8)
1. a kind of communication apparatus low-temperature startup device, including veneer (1), the upper front of described veneer (1) is provided with low temperature and cannot start
Chip (2) and low temperature can bootrom (3) it is characterised in that：Described low temperature cannot the corresponding veneer in bootrom (2) position
(1) back side is adhesive with heating film (4).
2. communication apparatus low-temperature startup device according to claim 1 it is characterised in that：Described heating film (4) is polyamides
Amine heating film or silica gel heating film.
3. communication apparatus low-temperature startup device according to claim 1 and 2 it is characterised in that：When low temperature cannot start core
When piece (2) position corresponding veneer (1) back side has capacitor and inductor gadget and cannot directly paste heating film (4), low temperature is no
Method bootrom (2) position corresponding veneer (1) back side is provided with the heating ancillary structural member (6) with veneer (1) back face, single
Filling interface Heat Conduction Material (5) between plate (1) and heating ancillary structural member (6)；Heating film (4) is pasted in heating ancillary structural member
(6) on.
4. communication apparatus low-temperature startup device according to claim 3 it is characterised in that：Described heating ancillary structural member
(6) it is panel beating metal material.
5. communication apparatus low-temperature startup device according to claim 4 it is characterised in that：Described metal material be aluminum or
Copper.
6. communication apparatus low-temperature startup device according to claim 4 it is characterised in that：Described heating ancillary structural member
(6) heat conductivity is more than 6W/Km.
7. communication apparatus low-temperature startup device according to claim 3 it is characterised in that：Described interface Heat Conduction Material (5)
Heat conductivity is more than 0.5W/Km.
8. the communication apparatus low-temperature startup device described in claim 1-7 any one application it is characterised in that：Described communication
Equipment low-temperature startup device is applied in electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610937564.7A CN106383533B (en) | 2016-10-25 | 2016-10-25 | A kind of communication apparatus low-temperature startup device and its application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610937564.7A CN106383533B (en) | 2016-10-25 | 2016-10-25 | A kind of communication apparatus low-temperature startup device and its application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106383533A true CN106383533A (en) | 2017-02-08 |
| CN106383533B CN106383533B (en) | 2018-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610937564.7A Active CN106383533B (en) | 2016-10-25 | 2016-10-25 | A kind of communication apparatus low-temperature startup device and its application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108507226A (en) * | 2018-05-07 | 2018-09-07 | 南京中新赛克科技有限责任公司 | A kind of electronic equipment radiating module |
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| CN201064028Y (en) * | 2007-06-19 | 2008-05-21 | 上海岱诺信息技术有限公司 | Heating device necessary for starting-up under low temperature for hand-hold and hand-carried electronic equipments |
| CN101217857A (en) * | 2007-12-26 | 2008-07-09 | 中兴通讯股份有限公司 | A heating device and method for outdoor base station |
| JP2008300792A (en) * | 2007-06-04 | 2008-12-11 | Fuji Electric Device Technology Co Ltd | Semiconductor device, and manufacturing method thereof |
| CN101754648A (en) * | 2008-12-02 | 2010-06-23 | 苏州岱诺信息技术有限公司 | Device for heating portable electronic equipment |
| CN105549248A (en) * | 2016-02-02 | 2016-05-04 | 西安中科微精光子制造科技有限公司 | Microdisplay dynamic target simulation module |
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2016
- 2016-10-25 CN CN201610937564.7A patent/CN106383533B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300792A (en) * | 2007-06-04 | 2008-12-11 | Fuji Electric Device Technology Co Ltd | Semiconductor device, and manufacturing method thereof |
| CN201064028Y (en) * | 2007-06-19 | 2008-05-21 | 上海岱诺信息技术有限公司 | Heating device necessary for starting-up under low temperature for hand-hold and hand-carried electronic equipments |
| CN101217857A (en) * | 2007-12-26 | 2008-07-09 | 中兴通讯股份有限公司 | A heating device and method for outdoor base station |
| CN101754648A (en) * | 2008-12-02 | 2010-06-23 | 苏州岱诺信息技术有限公司 | Device for heating portable electronic equipment |
| CN105549248A (en) * | 2016-02-02 | 2016-05-04 | 西安中科微精光子制造科技有限公司 | Microdisplay dynamic target simulation module |
Cited By (1)
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| CN108507226A (en) * | 2018-05-07 | 2018-09-07 | 南京中新赛克科技有限责任公司 | A kind of electronic equipment radiating module |
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| CN106383533B (en) | 2018-06-08 |
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Address after: Room 1501, building 2, No.19, ningshuang Road, Yuhuatai District, Nanjing City, Jiangsu Province Patentee after: Nanjing Sinovatio Technology LLC Address before: 210000 Yuhuatai, Jiangsu province tulip Road, No. 17, No. Patentee before: Nanjing Sinovatio Technology LLC |