CN215299237U - Welding pad structure and packaging structure thereof - Google Patents
Welding pad structure and packaging structure thereof Download PDFInfo
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- CN215299237U CN215299237U CN202121150116.5U CN202121150116U CN215299237U CN 215299237 U CN215299237 U CN 215299237U CN 202121150116 U CN202121150116 U CN 202121150116U CN 215299237 U CN215299237 U CN 215299237U
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- weld pad
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Abstract
The utility model relates to a weld pad structure, it includes weld pad (1) and lower weld pad (2), go up weld pad (1) and weld pad (2) parallel arrangement from top to bottom down, go up weld pad (1) and connect between weld pad (2) down and be provided with about two backing sheets (3). The utility model relates to a weld pad structure and packaging structure thereof, it can realize the compression of height through pressure, and the size and the position of weld pad about not influencing can be used for the different welding point on same faying face condition of distance inconsistency from top to bottom, through once only compressing all weld pads, makes it be in same height so that carry out subsequent welding or shaping.
Description
Technical Field
The utility model relates to a weld pad structure and packaging structure thereof belongs to semiconductor packaging technology field.
Background
The SIP three-dimensional package structure generally includes a first substrate, a second substrate disposed on the upper side of the first substrate and spaced apart from the first substrate, an interposer for supporting the second substrate and electrically connecting the first substrate and the second substrate, and a device, a chip, etc. disposed on the surface of the first substrate. If the adapter plate, the thicker component, the chip and the like need to be conducted up and down, the adapter plate, the thicker component, the chip and the like need to have better upper surface coplanarity after being arranged on the first substrate, so that the subsequent welding conduction of the second substrate is facilitated. Because the coplanarity of components and parts, keysets and chip self thickness's tolerance can't guarantee the upper surface, consequently can influence the electrical conductivity of second base plate, this kind of 3D SIP packaging structure can't realize the leading reason of volume production at present too.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a weld pad structure and packaging structure thereof is provided to above-mentioned prior art, it can realize the compression of height through pressure, and the size and the position of weld pad about not influencing can be used for the inconsistent condition of distance from top to bottom at the different welding points on same faying face, makes to have elastic weld pad, and the atress makes it be in same height so that carry out subsequent welding or shaping.
The utility model provides a technical scheme that above-mentioned problem adopted does: a welding pad structure comprises an upper welding pad and a lower welding pad, wherein the upper welding pad and the lower welding pad are arranged in parallel up and down, a left supporting piece and a right supporting piece are connected and arranged between the upper welding pad and the lower welding pad, and the two supporting pieces are symmetrically distributed.
Optionally, the upper bonding pad, the lower bonding pad, and the left and right support pieces form an integral hollow bonding pad structure.
Optionally, the support piece is in an inward arc shape, an inward angled shape or an outward arc shape.
Optionally, the whole of the welding pad structure is made of a metal material.
Optionally, the material of the pad structure is copper or aluminum.
Optionally, the welding pad structure is integrally formed by stamping a strip-shaped metal sheet through a forming tool.
Optionally, the surfaces of the upper and lower pads are plated with metal or coated with solder resist.
The utility model provides a packaging structure of weld pad structure, it includes the base plate, the base plate upper surface subsides are equipped with keysets and chip, be provided with the weld pad structure between keysets and chip and last packaging structure, the upper surface of weld pad structure is at same horizontal plane, the cladding has plastic envelope material between base plate upper surface, keysets, chip, the weld pad structure.
Compared with the prior art, the utility model has the advantages of:
1. the welding pad structure of the utility model has elasticity, can realize high compression through pressure without influencing the size and the position of an upper welding pad and a lower welding pad, can be used for the condition that the upper distance and the lower distance of different welding points on the same joint surface are inconsistent, and can lead the upper surface of the welding pad structure to be at the same height through compressing all the welding pad structures at one time so as to be convenient for subsequent welding or forming;
2. the utility model discloses weld pad structure both sides symmetry and confined overall structure can guarantee effectively that unnecessary slope and deformation can not take place at the in-process weld pad of compression.
Drawings
Fig. 1 is a schematic diagram of a pad structure according to embodiment 1 of the present invention.
Fig. 2 is a schematic diagram of a pad structure according to embodiment 2 of the present invention.
Fig. 3 is a schematic diagram of a pad structure according to embodiment 3 of the present invention.
Fig. 4 is a schematic diagram of a package structure of a pad structure according to the present invention.
Fig. 5-7 are schematic diagrams illustrating a process of using the solder pad structure package of the present invention.
Wherein:
And an upper package structure 9.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments.
As shown in fig. 1 to 3, the present invention relates to a solder pad structure, which includes an upper solder pad 1 and a lower solder pad 2, wherein the upper solder pad 1 and the lower solder pad 2 are arranged in parallel, a left support sheet 3 and a right support sheet 3 are connected between the upper solder pad 1 and the lower solder pad 2, and the two support sheets 3 are symmetrically distributed;
the upper welding pad 1, the lower welding pad 2 and the left and right support pieces 3 form an integral hollow welding pad structure together, and the welding pad structure has elasticity;
the support sheet 3 can be in an inward arc shape, an inward angle shape or an outward arc shape;
the whole welding pad structure is made of metal materials, such as copper, aluminum and other easily-formed materials, the welding pad structure is integrally formed by stamping a strip-shaped metal sheet through a forming tool, and other metal electroplating or a welding-resistant coating can be carried out on the surfaces of the upper welding pad 1 and the lower welding pad 2 according to needs;
as shown in fig. 4, the utility model relates to a packaging structure of a bonding pad structure, it includes base plate 5, 5 upper surfaces of base plate are pasted and are equipped with keysets 6 and chip 7, be provided with a plurality of bonding pad structures 4 between keysets 6 and chip 7 and last packaging structure 9, the upper surface of bonding pad structure 4 is at same horizontal plane, it has plastic envelope material 8 to wrap between 5 upper surfaces of base plate, keysets 6, chip 7, bonding pad structures 4;
the upper package structure 9 includes a substrate, and a chip, a component, and the like mounted on the substrate.
The packaging process method comprises the following steps:
step one, referring to fig. 5, a substrate is taken, and a chip, a component and an adapter plate are attached to the surface of the substrate;
step two, referring to fig. 6, a plurality of welding pad structures are attached to the upper surfaces of the chip, the component and the adapter plate in the step one, the welding pad structures are slightly pressed down by equipment or a jig, the welding pad structures are stressed and compressed to enable the upper welding pads to be positioned at the same horizontal height, plastic packaging materials are filled among the chip, the component and the adapter plate on the substrate, and the upper welding pads of the welding pad structures are exposed;
and step three, referring to fig. 7, attaching a packaging structure on the exposed upper bonding pad.
In addition, the present invention also includes other embodiments, and all technical solutions formed by equivalent transformation or equivalent replacement modes should fall within the protection scope of the claims of the present invention.
Claims (5)
1. A bond pad structure, comprising: it includes weld pad (1) and lower weld pad (2), go up weld pad (1) and weld pad (2) parallel arrangement from top to bottom down, go up weld pad (1) and connect between weld pad (2) down and be provided with two backing sheets (3) about, two backing sheets (3) symmetric distribution.
2. A bond pad structure according to claim 1, wherein: the upper welding pad (1), the lower welding pad (2) and the left support piece and the right support piece (3) form an integral hollow welding pad structure together.
3. A bond pad structure according to claim 1, wherein: the support piece (3) is in an inward arc shape, an inward angle shape or an outward arc shape.
4. A bond pad structure according to claim 1, wherein: the whole welding pad structure is made of metal.
5. A packaging structure of a welding pad structure is characterized in that: it includes base plate (5), adapter plate (6) and chip (7) are equipped with in base plate (5) upper surface subsides, adapter plate (6) and chip (7) and last packaging structure (9) between be provided with a plurality of weld pad structure (4), the upper surface of weld pad structure (4) is at same horizontal plane, the cladding has plastic envelope material (8) between base plate (5) upper surface, adapter plate (6), chip (7), the weld pad structure (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121150116.5U CN215299237U (en) | 2021-05-27 | 2021-05-27 | Welding pad structure and packaging structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121150116.5U CN215299237U (en) | 2021-05-27 | 2021-05-27 | Welding pad structure and packaging structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215299237U true CN215299237U (en) | 2021-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121150116.5U Active CN215299237U (en) | 2021-05-27 | 2021-05-27 | Welding pad structure and packaging structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215299237U (en) |
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2021
- 2021-05-27 CN CN202121150116.5U patent/CN215299237U/en active Active
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