CN214411193U - Package antenna structure and electronic equipment - Google Patents

Package antenna structure and electronic equipment Download PDF

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Publication number
CN214411193U
CN214411193U CN202120761544.5U CN202120761544U CN214411193U CN 214411193 U CN214411193 U CN 214411193U CN 202120761544 U CN202120761544 U CN 202120761544U CN 214411193 U CN214411193 U CN 214411193U
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CN
China
Prior art keywords
substrate
antenna structure
antenna
main body
electronic component
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Active
Application number
CN202120761544.5U
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Chinese (zh)
Inventor
张凤霞
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Changsha Xinlei Semiconductor Technology Co ltd
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Changsha Xinlei Semiconductor Technology Co ltd
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Priority to CN202120761544.5U priority Critical patent/CN214411193U/en
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Publication of CN214411193U publication Critical patent/CN214411193U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

The utility model belongs to the technical field of the antenna, a encapsulation antenna structure and electronic equipment is disclosed, this encapsulation antenna structure includes base plate, electronic component and three-dimensional antenna, and wherein, electronic component is fixed to be set up in the base plate, and three-dimensional antenna includes fixed connection's weld part, connecting portion and main part in proper order, and weld part and main part interval set up, and the weld part welds in the base plate, and electronic component is located between base plate and the main part. The area of the substrate which is required to be connected with the electronic element and the three-dimensional antenna in the packaging antenna structure is small, so that the packaging area is small, the integration can be enhanced, and the cost and the volume of electronic equipment are reduced.

Description

Package antenna structure and electronic equipment
Technical Field
The utility model relates to the field of antenna technology, especially, relate to a encapsulation antenna structure and electronic equipment.
Background
With the rapid development of the semiconductor industry, the Antenna structure is widely applied in the semiconductor industry, wherein the conventional AiP (packaged Antenna in Package) generally arranges the Antenna directly on the substrate and is located on the same plane as the chip, and then two packages are used to Package the chip and the Antenna respectively. The packaged antenna needs a large-area substrate, has a large packaging area and poor integration, and thus increases the cost and volume of the electronic equipment.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a packaging antenna structure and electronic equipment to solve current packaging antenna and need the base plate of great area, and the packaging area is big, and integration is poor, thereby increases electronic equipment's cost and the problem of volume.
To achieve the purpose, the utility model adopts the following technical proposal:
a packaged antenna structure, comprising:
a substrate;
the electronic element is fixedly arranged on the substrate;
the solid antenna comprises a welding part, a connecting part and a main body part which are fixedly connected in sequence, the welding part is arranged at intervals with the main body part, the welding part is welded on the substrate, and the electronic element is located between the substrate and the main body part.
Preferably, the electronic device further includes a plastic package layer, the plastic package layer is fixedly disposed on the substrate, and the plastic package layer covers the electronic element, the soldering portion, the connecting portion, and a part of the main body portion.
Preferably, the antenna further comprises a plastic package layer, the plastic package layer is fixedly arranged on the substrate, and the plastic package layer wraps the electronic element and part of the three-dimensional antenna.
Preferably, the main body portion has a first surface and a second surface opposite to each other, the second surface is opposite to the electronic component, and the first surface is exposed from the molding layer.
Preferably, the electronic component has a first mounting region, and the main body portion is located directly above the first mounting region.
Preferably, the main body portion is provided in parallel with the substrate.
Preferably, the main body portion has a serpentine shape.
Preferably, the welding part, the connecting part, and the body part are formed in an integral structure.
The utility model also provides an electronic equipment, including foretell encapsulation antenna structure.
The utility model has the advantages that: the utility model provides a packaging antenna structure and electronic equipment, this packaging antenna structure include base plate, electronic component and three-dimensional antenna, and wherein, electronic component is fixed to be set up in the base plate, and three-dimensional antenna sets up including fixed connection's weld part, connecting portion and main part in proper order, weld part and main part interval, and the weld part welds in the base plate, and electronic component is located between base plate and the main part. The main part of three-dimensional antenna need not with base plate direct contact, and main part and base plate interval set up, and electronic component sets up between main part and base plate, and only welding portion and the electronic component of three-dimensional antenna need with base plate direct contact, therefore the area of the base plate that needs to connect electronic component and three-dimensional antenna is less to the encapsulation area is less, can strengthen the integration, reduces electronic equipment's cost and volume.
Drawings
Fig. 1 is a first schematic structural diagram of a packaged antenna according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a solid antenna in a packaged antenna according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a packaged antenna according to an embodiment of the present invention.
In the figure:
1. a substrate;
2. an electronic component;
31. welding the part; 32. a connecting portion; 33. a main body portion;
4. and (7) plastic packaging layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The utility model provides a package antenna structure and electronic equipment, the area that needs to connect the base plate of electronic component and three-dimensional antenna among this package antenna structure is less to the encapsulated area is less, can strengthen the integration, reduces electronic equipment's cost and volume.
As shown in fig. 1-3, the package antenna structure includes a substrate 1, an electronic component 2, and a three-dimensional antenna, wherein the electronic component 2 is fixedly disposed on the substrate 1, the three-dimensional antenna includes a soldering portion 31, a connecting portion 32, and a main body portion 33, which are sequentially and fixedly connected, the soldering portion 31 and the main body portion 33 are disposed at an interval, the soldering portion 31 is soldered to the substrate 1, and the electronic component 2 is disposed between the substrate 1 and the main body portion 33. The main body part 33 of the stereo antenna does not need to be in direct contact with the substrate 1, the main body part 33 is arranged at an interval with the substrate 1, the electronic element 2 is arranged between the main body part 33 and the substrate 1, and only the welding part 31 and the electronic element 2 of the stereo antenna need to be in direct contact with the substrate 1, so that the area of the substrate 1 which needs to be connected with the electronic element 2 and the stereo antenna is smaller, the packaging area is smaller, the integration can be enhanced, and the cost and the volume of the electronic equipment are reduced.
As shown in fig. 1, optionally, the electronic device further includes a molding compound layer 4, the molding compound layer 4 is fixedly disposed on the substrate 1, and the molding compound layer 4 covers the electronic component 2, the soldering portion 31, the connecting portion 32, and a part of the main body portion 33. After the electronic element 2 and the three-dimensional antenna are fixedly arranged on the substrate 1, the electronic element 2 and the three-dimensional antenna are plastically packaged by plastic, and finally, part of the plastic is removed by grinding, so that part of the three-dimensional antenna is exposed.
Preferably, the main body 33 has a first surface and a second surface opposite to each other, the second surface is opposite to the electronic component 2, and the first surface is exposed out of the molding layer 4. After the substrate 1, the electronic element 2 and the three-dimensional antenna are molded, plastic on the side of the main body part 33 away from the substrate 1 is removed by grinding until the first surface of the main body part 33 is exposed.
As an alternative, as shown in fig. 3, the antenna further includes a plastic package layer 4, where the plastic package layer 4 is fixedly disposed on the substrate 1, and the plastic package layer 4 covers the electronic component 2 and the three-dimensional antenna. After the substrate 1, the electronic element 2 and the three-dimensional antenna are molded, when the plastic on the side of the main body part 33 away from the substrate 1 is ground, a small amount of plastic is reserved on the first surface of the main body part 33, so that the three-dimensional antenna can be protected.
Preferably, the electronic component 2 has a first mounting region, and the main body portion 33 is located directly above the first mounting region. The body 33 is provided directly above the first mounting region, and the molding area can be reduced.
Preferably, the main body portion 33 is disposed in parallel with the substrate 1. The main body 33 is parallel to the substrate 1, and can reduce the height of the plastic package, effectively reducing the area of the plastic package.
Preferably, the body portion 33 is serpentine. The main body 33 is formed in a serpentine shape, and the space can be fully utilized without increasing the plastic sealing area while increasing the antenna area. In other embodiments, the main body 33 may also have a wavy shape.
Preferably, the welding part 31, the connection part 32 and the body part 33 are of an integral structure. The three-dimensional antenna is manufactured by etching, stamping and other processes.
The utility model also provides an electronic equipment, this electronic equipment includes foretell encapsulation antenna structure. The area of the substrate 1 which is required to connect the electronic element 2 and the three-dimensional antenna in the packaged antenna in the electronic equipment is small, so that the packaging area is small, the integration can be enhanced, and the cost and the volume of the electronic equipment can be reduced.
The utility model provides a manufacturing method of encapsulation antenna structure, include:
s1: fixedly arranging the electronic element 2 and the welding part 31 of the three-dimensional antenna on the substrate 1, arranging the main body part 33 of the three-dimensional antenna in parallel with the substrate 1 at intervals, and arranging the electronic element 2 between the main body part 33 and the substrate 1;
s2: the substrate 1, the electronic element 2 and the three-dimensional antenna are plastically packaged by plastic, and the substrate 1, the electronic element 2 and the three-dimensional antenna are completely coated by the plastic;
s3: and grinding the plastic to expose the side surface of the main body part 33 of the three-dimensional antenna far away from the substrate 1 or leave the plastic with a preset thickness on the side surface.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (9)

1. A packaged antenna structure, comprising:
a substrate (1);
an electronic component (2), wherein the electronic component (2) is fixedly arranged on the substrate (1);
the solid antenna comprises a welding portion (31), a connecting portion (32) and a main body portion (33) which are fixedly connected in sequence, the welding portion (31) and the main body portion (33) are arranged at intervals, the welding portion (31) is welded on the substrate (1), and the electronic element (2) is located between the substrate (1) and the main body portion (33).
2. The packaged antenna structure according to claim 1, further comprising a molding layer (4), wherein the molding layer (4) is fixedly disposed on the substrate (1), and the molding layer (4) covers the electronic component (2) and the solid antenna.
3. The package antenna structure of claim 1, further comprising a molding compound layer (4), wherein the molding compound layer (4) is fixedly disposed on the substrate (1), and the molding compound layer (4) covers the electronic component (2), the soldering portion (31), the connecting portion (32) and a part of the main body portion (33).
4. The package antenna structure according to claim 3, wherein the main body portion (33) has a first surface and a second surface opposite to each other, the second surface is opposite to the electronic component (2), and the first surface is exposed from the molding layer (4).
5. Package antenna structure according to any of claims 1-4, characterized in that the electronic component (2) has a first mounting area, the body part (33) being located directly above the first mounting area.
6. Package antenna structure according to any of claims 1-4, characterized in that the body part (33) is arranged parallel to the substrate (1).
7. The packaged antenna structure of any of claims 1-4, wherein the body portion (33) is serpentine.
8. The packaged antenna structure of any of claims 1-4, wherein the solder portion (31), the connecting portion (32), and the main body portion (33) are a unitary structure.
9. An electronic device comprising a packaged antenna structure according to any of claims 1-8.
CN202120761544.5U 2021-04-14 2021-04-14 Package antenna structure and electronic equipment Active CN214411193U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120761544.5U CN214411193U (en) 2021-04-14 2021-04-14 Package antenna structure and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120761544.5U CN214411193U (en) 2021-04-14 2021-04-14 Package antenna structure and electronic equipment

Publications (1)

Publication Number Publication Date
CN214411193U true CN214411193U (en) 2021-10-15

Family

ID=78032206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120761544.5U Active CN214411193U (en) 2021-04-14 2021-04-14 Package antenna structure and electronic equipment

Country Status (1)

Country Link
CN (1) CN214411193U (en)

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