CN107221519B - System-in-package module - Google Patents
System-in-package module Download PDFInfo
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- CN107221519B CN107221519B CN201710370954.5A CN201710370954A CN107221519B CN 107221519 B CN107221519 B CN 107221519B CN 201710370954 A CN201710370954 A CN 201710370954A CN 107221519 B CN107221519 B CN 107221519B
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- substrate
- semiconductor device
- lead frame
- metal frame
- magnetic device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
Abstract
The embodiment of the invention discloses a system-level packaging module, which comprises a substrate, a semiconductor device, a metal frame and a magnetic device, wherein the semiconductor device is attached to the substrate, and the substrate, the semiconductor device and the metal frame are packaged in a packaging body; in the thickness direction of the substrate, the metal frame and the semiconductor device are positioned between the substrate and the magnetic device; the metal frame is provided with a welding surface exposed outside the packaging body, and the magnetic device is positioned outside the packaging body and welded on the welding surface. The semiconductor devices and the magnetic devices are arranged along the thickness direction of the substrate, so that the overall height of the packaging module is increased, and the overall board occupation area of the packaging module is reduced; the magnetic device is stacked outside the packaging body, so that the size of the packaging body can be reduced, and the packaging cost is reduced; the metal frame can realize the electrical interconnection between the magnetic device and the internal structure of the packaging body, and is convenient for the electrical interconnection of the magnetic device; meanwhile, the welding surface of the metal frame is exposed outside the packaging body, so that heat dissipation is enhanced.
Description
Technical Field
The present invention relates to a high density power system package technology, and more particularly, to a system-level package module applied to a high density optical transceiver module.
Background
In the field of design of a PSIP module (high-density surface-mounted power system-in-package, devices such as a control IC, an MOSFET and an inductor capacitor are integrated in the same package), an inductor, namely a magnetic device, is a difficult point of miniaturization integration all the time, and the inductor is tiled on the periphery of an active device in the traditional method. There is no limitation on the height, but there is a strong demand for the reduction of the area on the board, especially for 100G capacity optical transceiver modules, and a solution for reducing the PSIP footprint is urgently needed.
In the prior art, the lead frame is adopted to extend upwards and turn over, the inductor and the lead frame are subjected to laser spot welding, the design difficulty of the frame is improved, the cost of the lead frame is too high, the requirement on an injection mold is high, the frame and the inductor can only be subjected to laser electric welding, and the long-term reliability cannot be guaranteed. In another technical scheme in the prior art, the magnetic device and the semiconductor device are arranged on the same plane, and the whole scheme occupies a large area of the board, so that the whole packaging cost is high. In another technical scheme, the semiconductor device is placed above the magnetic device, so that the semiconductor device is poor in heat dissipation, the connecting wire is too long, and the lead resistance is large.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a system-in-package module, which can reduce the overall board area, reduce the cost, and improve the heat dissipation capability.
In order to solve the above technical problem, an embodiment of the present invention provides a system in package module, which includes a substrate, a semiconductor device, a metal frame, and a magnetic device, wherein the semiconductor device is attached to the substrate, and the substrate, the semiconductor device, and the metal frame are all packaged in a package; in the thickness direction of the substrate, the metal frame and the semiconductor device are positioned between the substrate and the magnetic device; the metal frame is provided with a welding surface exposed outside the packaging body, and the magnetic device is positioned outside the packaging body and welded on the welding surface.
In a first possible implementation manner, the metal frame comprises at least two lead frames, the lead frames are in a bent boss shape, each lead frame comprises two supporting arms and a connecting arm, two ends of each connecting arm are respectively connected with the two supporting arms, and the two supporting arms, the two supporting arms and the connecting arm are integrally bent and formed; the welding surface is formed on the connecting arm; one of the two support arms is electrically connected with the substrate or the semiconductor device, and the other support arm is fixedly connected with the substrate. The metal frame is easy to machine and form.
With reference to the first possible implementation manner, in a second possible implementation manner, the lead frame is connected to the substrate in a trapezoid shape, and the length of the connecting arm is smaller than the length between the two connecting positions of the supporting arms and the substrate. The structure strength of the lead frame is improved, and the lead frame is easy to bend and form.
With reference to the first possible implementation manner, in a third possible implementation manner, the connecting arm is arranged parallel to the substrate. To facilitate soldering between the lead frame and the magnetic device.
With reference to the first possible implementation manner, in a fourth possible implementation manner, one of the support arms is inclined, and one end of the support arm, which is close to the substrate, extends in a direction away from the other support arm to form a connection piece, and the connection piece is attached to the substrate or the semiconductor device.
With reference to the fourth possible implementation manner, in a fifth possible implementation manner, another support arm is disposed along the thickness direction of the substrate, and the support arm with an opposite inclined shape is close to a side surface of the package body. The size range of the package can be determined by the supporting arm so as to reduce the occupied area of the package.
With reference to any one of the first to fifth possible implementation manners, in a sixth possible implementation manner, the at least two lead frames include a first lead frame and a second lead frame, the second lead frame is electrically connected to the substrate, and the first lead frame is electrically connected to the semiconductor device. Two lead frames are utilized so that the magnetic device can be electrically interconnected with the substrate and the semiconductor device.
With reference to the sixth possible implementation manner, in a seventh possible implementation manner, the connecting sheet of the second lead frame is attached to the substrate, and the connecting sheet of the first lead frame is attached to the upper surface of the semiconductor device. The connection strength between the semiconductor device and the first lead frame can be improved, and the heat dissipation of the semiconductor device is facilitated.
With reference to the sixth possible implementation manner, in an eighth possible implementation manner, the first lead frame and the second lead frame are respectively located on two sides of the semiconductor device. The magnetic device can be more firmly supported above the semiconductor device
With reference to the first possible implementation manner, in a ninth possible implementation manner, the system-in-package module further includes an electronic component encapsulated in the encapsulation body, and the electronic component is mounted on the substrate and located between the two support arms of the lead frame. The electronic element is packaged in the packaging body, so that the space in the packaging body can be fully utilized, and the occupied board area is reduced.
According to the system-in-package module provided by the invention, the semiconductor devices and the magnetic devices are arranged along the thickness direction of the substrate, so that the overall height of the package module is only increased, and the overall board occupation area of the package module is reduced; the magnetic device is stacked outside the packaging body, so that the size of the packaging body can be reduced, and the packaging cost is reduced; the metal frame can realize the electrical interconnection between the magnetic device and the internal structure of the packaging body, and is convenient for the electrical interconnection of the magnetic device; meanwhile, the welding surface of the metal frame is exposed outside the packaging body, so that heat dissipation is enhanced; the metal frame is easy to process, the cost of system electrical connection can be reduced, meanwhile, the lower portion of the metal frame is of a hollow structure, active and passive devices can be placed, and the occupied board area of the system is further reduced. Meanwhile, the hollow structure of the metal frame is beneficial to the tight combination of the metal frame and the packaging body, and the delamination in the plastic package of the packaging body is prevented; meanwhile, the folding structure of the metal frame is beneficial to reducing the stress applied to the semiconductor device by the magnetic device when the magnetic device is welded; meanwhile, the folding structure of the metal frame is beneficial to reducing the stress applied to the semiconductor device in the grinding process of the welding surface of the metal frame.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present invention, the drawings required to be used in the embodiments or the background art of the present invention will be described below.
Fig. 1 is a schematic structural diagram of a system-in-package module according to a preferred embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described below with reference to the drawings.
Referring to fig. 1, a system-in-package module provided in the preferred embodiment of the present invention includes a substrate 1, a semiconductor device 2, a metal frame 3 and a magnetic device 4, wherein the semiconductor device 2 is attached to the substrate 1, and the substrate 1, the semiconductor device 2 and the metal frame 3 are all packaged in a package 5. The metal frame 3 and the semiconductor device 2 are both located between the substrate 1 and the magnetic device 4 in the thickness direction of the substrate 1. The metal frame 3 has a soldering surface 30 exposed outside the package 5, and the magnetic device 4 is located outside the package 5 and soldered to the soldering surface 30.
The magnetic device 4 may be an inductor or a transformer. The semiconductor device 2 and the magnetic device 4 are arranged along the thickness direction of the substrate 1, so that the surface area of the substrate 1 is reduced, the overall height of the packaging module is only increased, and the overall board occupation area of the packaging module is reduced. The magnetic device 4 is stacked outside the package body 5, so that the size of the package body 5 can be reduced, and the packaging cost can be reduced. The metal frame 3 can realize the electrical interconnection of the magnetic device 4 and the internal structure of the packaging body 5, so that the electrical interconnection of the magnetic device 4 is facilitated; meanwhile, the welding surface 30 of the metal frame 3 is exposed outside the packaging body 5, so that heat dissipation is enhanced.
The metal frame 3 is used for electrically connecting the magnetic device 4 and the inside of the system-in-package module, such as electrical interconnection between the magnetic device 4 and the semiconductor device 2, and electrical interconnection between the magnetic device 4 and the substrate 1.
The metal frame 3 includes at least two lead frames 31, 32. In the present embodiment, the metal frame 3 includes two lead frames 31 and 32, and for convenience of description, the two lead frames 31 and 32 are a first lead frame 31 and a second lead frame 32, respectively. The first lead frame 31 is used for realizing the electrical interconnection between the magnetic device 4 and the semiconductor device 2, and the second metal frame 3 is used for realizing the electrical interconnection between the magnetic device 4 and the substrate 1.
The first lead frame 31 is in a bent boss shape, and includes two supporting arms 311 and 312 and a connecting arm 313, two ends of the connecting arm 313 are respectively connected with the two supporting arms 311 and 312, and the three are integrally bent to form the first lead frame 31. The soldering surface 30 is formed on a connection arm 313 to which the magnetic device 4 can be soldered 313. Of the two support arms 311, 312, one support arm 311 is electrically connected to the semiconductor device 2, and the other support arm 312 is fixedly connected to the substrate 1. The magnetic device 4 is soldered to the soldering surface 30 of the connecting arm 313, so that the electrical interconnection with the semiconductor device 2 is realized.
With the boss-shaped first lead frame 31, the magnetic device 4 can be supported in a certain height on the substrate 1, so that the semiconductor device 2 and the magnetic device 4 can be arranged in the thickness direction of the substrate 1. The two supporting arms 311 and 312 are used for connecting the semiconductor device 2 with the substrate 1 respectively, so that the structural strength of the connection between the metal frame 3 and the substrate 1 and the connection between the metal frame 2 and the semiconductor device 2 can be improved, heat conduction between the semiconductor device 2 and the substrate 1 can be facilitated, and the heat dissipation performance can be improved.
The first lead frame 31 is connected with the substrate 1 in a trapezoid shape, and the length of the connecting arm 313 is smaller than the length between the two connecting parts of the supporting arms 311 and 312 and the substrate 1. The top dimensions of the lead frames 31, 32 can be made smaller than the bottom dimensions thereof, and the trapezoidal structure can improve the structural strength of the first lead frame 31, and at the same time, the bending formation by a metal sheet, for example, the boss-shaped first lead frame 31 can be formed by punching, can be facilitated. The first lead frame 31 has a trapezoidal hollow structure, and active and passive devices can be placed under the hollow structure. Meanwhile, the first lead frame 31 is of a hollow structure, so that the inside of the lead frame can be fully filled with the plastic packaging material, and the bonding force between the metal frame and the plastic packaging material is ensured.
The connecting arm 313 is arranged parallel to the substrate 1 so that the upper surface of the connecting arm 313, i.e. the soldering surface 30, is parallel to the substrate 1, thereby facilitating soldering with the magnetic device 4. One surface of the connection arm 313 is exposed outside the package body 5, thereby forming a soldering face 30. The metal legs of the magnetic device 4 may be soldered to the soldering surface 30. The connecting arm 313 may be only the soldering surface 30 exposed outside the package 5, or a part or the whole of the connecting arm 313 may protrude from the upper surface of the package 5 to form a convex structure, which facilitates soldering between the first connecting arm 313 and the magnetic device 4. The soldering surface 30 is disposed parallel to the upper surface of the package body 5, thereby facilitating soldering between the first lead frame 31 and the magnetic device 4.
Of the two support arms 311, 312, one support arm 311 is inclined so that the first lead frame 31 has a trapezoidal shape. One end of the supporting arm 311 close to the substrate 1 extends towards the direction far away from the other supporting arm 312 to form a connecting sheet 314, and the connecting sheet 314 is attached and connected with the semiconductor device 2. The connecting sheet 314 can improve the connection strength between the semiconductor device 2 and the first lead frame 31, and facilitate heat dissipation of the semiconductor device 2. Meanwhile, the connecting sheet 314 and the supporting arm 311 are inclined, which is beneficial to relieving the external stress conducted from the welding surface 30 and preventing the semiconductor device 2 from cracking due to the external stress.
The other support arm 312 is disposed along the thickness direction of the substrate 1, and the relatively inclined support arm 312 is close to the side surface of the package 5. The support arms 312 may be located close to the outer side of the package 5, thereby making full use of the space within the package 5. The support arm 312 may be disposed in the thickness direction of the substrate 1, i.e., such that the support arm 312 is vertically or nearly vertically fixed to the substrate 1.
The second lead frame 32 has substantially the same structural shape as the first lead frame 31, but the support arms 321 of the second lead frame 32 are fixedly connected to the substrate 1, that is, both the support arms 321 and 322 of the second lead frame 32 are connected to the substrate 1. Any one of the two support arms 321, 322 of the second lead frame 32 may be electrically connected to the substrate 1, so as to facilitate the connection between the second lead frame 32 and the substrate 1. The connecting arm 323 of the second lead frame 32 is soldered to the magnetic device 4, so that the magnetic device 4 and the substrate 1 are electrically interconnected. One support arm 321 of the second lead frame 32 is inclined, and one end of the second lead frame close to the substrate 1 extends in a direction away from the other support arm 322 to form a connecting piece 324, and the connecting piece 324 is attached to the substrate 1. Thereby improving the connection strength between the second lead frame 32 and the substrate 1.
The first lead frame 31 and the second lead frame 32 are respectively located on both sides of the semiconductor device 2, and can more firmly support the magnetic device 4 above the semiconductor device 2. The vertically arranged support arms 312 of the first lead frame 31 and the vertically arranged support arms 322 of the second lead frame 32 are respectively provided at two opposite sides of the package 5, so that the package 5 can be roughly sized using the two vertically arranged support arms 312, 322 to minimize the size of the package 5.
The system in package module further comprises electronic components 6, the electronic components 6 being arranged in the lead frames 31, 32. The electronic components 6 may be active devices or passive devices, such as control ICs, capacitors, MOSFETs, etc., and these electronic components 6 are mounted on the substrate 1 to realize electrical connection with the substrate 1, and are disposed in the first lead frame 31 and/or the second lead frame 32 and located between the two supporting arms 311, 312 of the lead frames 31, 32, so that the surface of the substrate 1 occupied by the lead frames 31, 32 can be fully utilized to arrange other electronic components 6, thereby reducing the volume of the whole package 5 and the occupied board area.
In the above embodiment, the metal frame 3 includes the two lead frames 31, 32, the first lead frame 31 and the second lead frame 32, and the first lead frame 31 and the second lead frame 32 are electrically interconnected with the semiconductor device 2 and the substrate 1, respectively. Of course, in other embodiments, the number of lead frames 31 and 32 is not limited to this, and may be one, or three or more, and the lead frames 31 and 32 may be electrically connected to the substrate 1, the semiconductor device 2, or the other electronic component 6 depending on the electrical interconnection relationship of the magnetic device 4 above them.
According to the system-in-package module provided by the invention, the magnetic device 4 and the semiconductor device 2 are conveniently stacked in a new interconnection mode, and the occupied board area of the package module is saved. Convenient electrical interconnection of the semiconductor device 2 and the magnetic device 4 is achieved through the metal frame 3. The lead frames 31, 32 of the metal frame 3 can be preformed and formed with the soldering surface 30 on the top for soldering the magnetic device 4, i.e. the bonding pad design of the magnetic device 4 is formed by using the connecting arms 313, 323, which shortens the process flow of the packaging module. The bonding pads of the magnetic device 4, i.e. the bonding surface 30, are exposed outside the package body 5, and the metal frame 3 can be used for heat dissipation, so that the heat dissipation performance of the system-in-package module is enhanced. By stacking the magnetic device 4 on the surface of the package 5, the size of the package 5 is reduced, reducing the packaging cost. In the system-in-package module provided by the invention, the metal frame 3 is easy to process, the electrical connection cost of the system can be reduced, and meanwhile, the lower part of the metal frame 3 is of a hollow structure, so that active and passive devices can be placed, and the board occupation area of the system is further reduced. Meanwhile, the hollow structure of the metal frame 3 is beneficial to the tight combination of the metal frame 3 and the plastic packaging material of the packaging body 5, and the delamination in the plastic packaging of the packaging body 5 is prevented; meanwhile, the folding structure of the metal frame 3 is beneficial to reducing the stress applied to the semiconductor device 2 by the magnetic device 4 when the magnetic device 4 is welded; meanwhile, the folding structure of the metal frame 3 is beneficial to reducing the stress applied to the semiconductor device 2 in the grinding process of the welding surface of the metal frame 3.
Claims (7)
1. The system-in-package module is characterized by comprising a substrate, a semiconductor device, a metal frame and a magnetic device, wherein the semiconductor device is attached to the substrate, and the substrate, the semiconductor device and the metal frame are packaged in a packaging body; in the thickness direction of the substrate, the metal frame and the semiconductor device are positioned between the substrate and the magnetic device; the metal frame is provided with a welding surface exposed outside the packaging body, and the magnetic device is positioned outside the packaging body and welded on the welding surface;
the metal frame comprises at least two lead frames, the lead frames are in a bent boss shape, each lead frame comprises two supporting arms and a connecting arm, two ends of each connecting arm are respectively connected with the two supporting arms, and the two supporting arms, the two supporting arms and the connecting arm are integrally bent and formed; the welding surface is formed on the connecting arm; one of the two supporting arms is inclined, one end of the supporting arm, which is close to the substrate, extends in the direction away from the other supporting arm to form a connecting sheet, the connecting sheet is electrically connected with the substrate or the semiconductor device, the other supporting arm is arranged in the thickness direction of the substrate, and the side surface of the opposite inclined supporting arm, which is close to the packaging body, is fixedly connected with the substrate.
2. The system-in-package module according to claim 1, wherein the leadframe is trapezoidal in shape in connection with the substrate, and the length of the connecting arm is smaller than the length between the two support arms and the substrate connection.
3. The system-in-package module according to claim 1, wherein the connecting arms are arranged parallel to the substrate.
4. The system-in-package module according to any of claims 1-3, wherein the at least two lead frames comprise a first lead frame and a second lead frame, the second lead frame being electrically connected to the substrate, the first lead frame being electrically connected to the semiconductor device.
5. The system-in-package module according to claim 4, wherein the connecting sheet of the second lead frame is attached to the substrate, and the connecting sheet of the first lead frame is attached to the upper surface of the semiconductor device.
6. The system-in-package module according to claim 4, wherein the first and second lead frames are located on either side of the semiconductor device.
7. The system-in-package module according to claim 1, further comprising an electronic component encapsulated in the encapsulation, the electronic component being mounted to the substrate and located between the two support arms of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370954.5A CN107221519B (en) | 2017-05-23 | 2017-05-23 | System-in-package module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370954.5A CN107221519B (en) | 2017-05-23 | 2017-05-23 | System-in-package module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107221519A CN107221519A (en) | 2017-09-29 |
| CN107221519B true CN107221519B (en) | 2019-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710370954.5A Active CN107221519B (en) | 2017-05-23 | 2017-05-23 | System-in-package module |
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| CN (1) | CN107221519B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112086442A (en) * | 2019-06-14 | 2020-12-15 | 华为技术有限公司 | Packaging module and metal plate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8093695B2 (en) * | 2009-09-04 | 2012-01-10 | International Rectifier Corporation | Direct contact leadless flip chip package for high current devices |
| US20120098090A1 (en) * | 2010-10-22 | 2012-04-26 | Intersil Americas Inc. | High-efficiency power converters with integrated capacitors |
| US9000576B2 (en) * | 2011-04-22 | 2015-04-07 | Cyntec Co., Ltd. | Package structure and manufacturing method thereof |
| US8916474B2 (en) * | 2013-02-18 | 2014-12-23 | Infineon Technologies Ag | Semiconductor modules and methods of formation thereof |
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Effective date of registration: 20211115 Address after: 518043 No. 01, 39th floor, building a, antuoshan headquarters building, No. 33, antuoshan Sixth Road, Xiang'an community, Xiangmihu street, Futian District, Shenzhen, Guangdong Province Patentee after: Huawei Digital Energy Technology Co., Ltd Address before: 518129 Huawei headquarters office building, Bantian, Longgang District, Shenzhen, Guangdong Patentee before: Huawei Technology Co., Ltd |