CN220863116U - Die tooling suitable for high-density lead welding - Google Patents

Abstract

The utility model discloses a die tooling suitable for high-density lead welding, which comprises the following steps: the welding device comprises a die body and a lead assembly, wherein a first positioning groove is formed in a welding plane, a second positioning groove is formed in the bottom surface of the first positioning groove, a bonding pad is placed in the second positioning groove, a first end of a lead is fixedly connected with a lead mounting frame, a second end of the lead is attached to the upper side surface of the bonding pad, and the second end of the lead is overlapped with a welding point on the bonding pad; the die clamping teeth are fixedly connected with the bottom surface of the first positioning groove, and are positioned between the side edges of the first positioning groove and the side edges of the second positioning groove; the utility model realizes the limitation of the position relation between the lead and the bonding pad in the lead assembly by arranging the first positioning groove and the second positioning groove; through setting up the mould latch between the lead wire, carry out spacingly through the mould latch to a plurality of leads, avoid taking place the skew between lead wire and the pad to make the welding of lead wire can 100%.

Description

Die tooling suitable for high-density lead welding

Technical Field

The utility model relates to the technical field of packaging, in particular to a die tool suitable for high-density lead welding.

Background

As integrated circuits continue to move toward miniaturization, high density, and multi-functionality, the number of components and chips that a single package housing needs to accommodate increases, such that the number of leads continues to increase and the lead pitch continues to shrink. Therefore, high density ceramic package housings will become a major trend in the future.

In the production process of the high-density ceramic package shell, a brazing method is used for connecting metal parts such as a ceramic sealing ring, an outer lead and a heat sink. To meet inspection requirements, the outer leads need to be 100% soldered inside the pads, so limiting the outer leads to be soldered inside the pads becomes a critical issue. Meanwhile, as the number of leads increases and the pitch decreases, the soldering requirements gradually increase, resulting in higher and higher requirements for positioning the leads and the bonding pads.

Therefore, how to solve the limit of the bonding pad/lead in the high-density ceramic package shell is a key problem for improving the bonding quality.

Disclosure of utility model

The utility model aims to solve the technical problems of the positioning of a high-density ceramic package shell with continuously increased lead number and continuously reduced lead pitch, and provides a die tool suitable for high-density lead welding, which solves the lead welding problem of a bonding pad.

The utility model is realized by the following technical scheme:

A die tooling suitable for high density wire bonding, comprising: a die body and a lead assembly; the upper plane of the die body is a welding plane, a first positioning groove is formed in the welding plane, and a second positioning groove is formed in the bottom surface of the first positioning groove;

The lead assembly is matched with the first positioning groove, the lead assembly is placed in the first positioning groove, the second positioning groove is matched with the bonding pad, and the bonding pad is placed in the second positioning groove;

The lead assembly comprises a lead mounting frame and a plurality of leads, wherein the leads are provided with first ends and second ends, the first ends of the leads are fixedly connected with the lead mounting frame, the second ends of the leads are attached to the upper side surface of the bonding pad, and the second ends of the leads are overlapped with the welding points on the bonding pad.

As an implementation manner, the second positioning groove is of a rectangular structure, four sides of the second positioning groove are respectively arranged in parallel with four inner side edges of the lead frame, and the lead is arranged perpendicular to the corresponding edge of the second positioning groove.

Specifically, the lead wire mounting frame is a rectangular frame, the lead wire is vertically and fixedly connected with the inner side edge of the lead wire mounting frame, and the outer side edge of the lead wire mounting frame is attached to the inner side edge of the first positioning groove;

The bonding pad is rectangular in structure, the outer side edge of the bonding pad is attached to the inner side edge of the second positioning groove, the four outer side edges of the bonding pad are respectively arranged in parallel with the four inner side edges of the lead wire mounting frame, the first end of the lead wire is vertically and fixedly connected with the inner side edge of the lead wire mounting frame, and the second end of the lead wire is perpendicularly attached to the corresponding outer side edge of the bonding pad.

As another embodiment, the number of the inner sides of the lead frame is n, the second positioning groove is in an m-sided structure, and m outer sides of the second positioning groove are respectively arranged in parallel with m inner sides of the lead frame, wherein n is greater than m;

the lead is arranged perpendicular to the corresponding edge of the second positioning groove.

Optionally, the lead is fixedly connected with the inner side edge of the lead mounting frame vertically, and the outer side edge of the lead mounting frame is attached to the inner side edge of the first positioning groove;

The bonding pad is of an m-shaped structure, the outer side edge of the bonding pad is attached to the inner side edge of the second positioning groove, the m outer side edges of the bonding pad are respectively arranged in parallel with the m inner side edges of the lead wire mounting frame, the first end of the lead wire is vertically and fixedly connected with the inner side edge of the lead wire mounting frame, and the second end of the lead wire is vertically attached to the corresponding outer side edge of the bonding pad.

Further, the tool further comprises a plurality of mold clamping teeth which are fixedly connected with the bottom surface of the first positioning groove, and the mold clamping teeth are positioned between the side edges of the first positioning groove and the side edges of the second positioning groove;

And if the number of the leads welded with the first side of the bonding pad is x, the number of the die latches between the first side and the side of the first positioning groove is x-1, and one die latch is arranged between two adjacent leads.

Optionally, the die latch is in a strip structure, a horizontal axis of the die latch is parallel to the leads, and a width of the die latch is not greater than a pitch of two adjacent leads.

Specifically, the thickness of the mold latch is greater than the thickness of the lead.

Optionally, the material of the die body/the lead loading frame/the die latch is graphite or stainless steel with a graphite coating, and the die body and the die latch are integrally formed.

Optionally, a piece taking hole penetrating through the die body is formed in the bottom surface of the second positioning groove.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

According to the utility model, the first positioning groove for positioning the lead assembly and the second positioning groove for positioning the bonding pad are arranged, and the limitation of the position relation between the lead in the lead assembly and the bonding pad is realized through the cooperation of the first positioning groove and the second positioning groove, so that the welding qualification rate is improved.

The die clamping teeth are arranged between the leads, and the die clamping teeth limit the leads, so that the leads and the bonding pads are prevented from being deviated, and the leads can be welded by 100%.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the utility model and together with the description serve to explain the principles of the utility model.

Fig. 1 is a schematic structural diagram of a die tooling suitable for high-density wire bonding according to the present utility model.

Fig. 2 is a partial cross-sectional view of a die tooling adapted for high density wire bonding in accordance with the present utility model.

Reference numerals: the die comprises a die body, a first positioning groove, a second positioning groove, a 4-lead wire mounting, a 5-lead wire, a 6-die latch and a 7-piece taking hole.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and embodiments, for the purpose of making the objects, technical solutions and advantages of the present utility model more apparent. It is to be understood that the specific embodiments described herein are merely illustrative of the substances, and not restrictive of the utility model.

It should be further noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Embodiments of the present utility model and features of the embodiments may be combined with each other without conflict. The present utility model will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Example 1

As shown in fig. 1 and 2, the present embodiment provides a die tooling suitable for high-density wire bonding, which can improve bonding quality and solve the problems of limit and die design in a high-density ceramic package shell, and the die tooling includes: a die body (1) and a lead assembly; the upper plane of the die body (1) is a welding plane, a first positioning groove (2) is formed in the welding plane, and a second positioning groove (3) is formed in the bottom surface of the first positioning groove (2);

The lead assembly is matched with the first positioning groove (2), the lead assembly is placed in the first positioning groove (2), the second positioning groove (3) is matched with the bonding pad, and the bonding pad is placed in the second positioning groove (3);

The lead assembly comprises a lead mounting frame (4) and leads (5), wherein a plurality of leads (5) are respectively provided with a first end and a second end, the first ends of the leads (5) are fixedly connected with the lead mounting frame (4), the second ends of the leads (5) are attached to the upper side surface of the bonding pad, and the second ends of the leads (5) are overlapped with the bonding points on the bonding pad.

The die body (1) is used as a basic structure of the whole tool, and an upper plane of the die body is set to be a welding plane. A first positioning groove (2) and a second positioning groove (3) are arranged on the welding plane. The first positioning groove (2) is used for placing a lead assembly, so that the position of the lead (5) in the welding process is accurate; the second positioning groove (3) is used for placing the bonding pad, so that the stability of the bonding pad in the welding process is ensured. This structural feature is beneficial to improving the accuracy and quality of the weld.

The first positioning groove (2) is positioned on the welding plane of the die body (1) and is mainly used for placing the lead assembly. Through the adaptation with the lead wire subassembly, can guarantee that lead wire (5) is in the stable position of welding in-process to realize high accuracy's welding.

The second positioning groove (3) is positioned on the bottom surface of the first positioning groove (2) and is used for placing the bonding pad. The position of the bonding pad in the welding process is stable due to the design matched with the bonding pad, and the welding quality is improved.

The lead assembly includes a lead mount (4) and a lead (5). The lead wire mounting frame (4) is used for fixing the first end of the lead wire (5), and the second end of the lead wire (5) is attached to the upper side surface of the bonding pad and coincides with the welding point on the bonding pad. The structure can ensure the accurate butt joint of the lead (5) and the bonding pad, and improve the quality and stability of welding.

The die tooling suitable for high-density lead welding realizes the accurate butt joint of the lead (5) and the bonding pad and the stability of the welding position through the design of the die body (1), the first positioning groove (2), the second positioning groove (3) and the lead assembly. These structural features help to improve the weld quality and solve the limit and die design problems in high density ceramic package housings.

The structure of the second positioning groove (3) is set by the structure of the bonding pad, namely, if the bonding pad is in a square structure, the second positioning groove (3) is also in a square structure, and if the bonding pad is in a rectangular structure, the second positioning groove (3) is also in a rectangular structure.

Taking a rectangle as an example, the second positioning groove (3) is of a rectangular structure, four sides of the second positioning groove (3) are respectively arranged in parallel with four inner side edges of the lead (5) frame, and the lead (5) is vertically arranged with the corresponding edge of the second positioning groove (3).

The lead wire mounting frame (4) is a rectangular frame, the lead wires (5) are vertically and fixedly connected with the inner side edges of the lead wire mounting frame (4), and the outer side edges of the lead wire mounting frame (4) are attached to the inner side edges of the first positioning grooves (2);

The bonding pad is rectangular structure, and the outside limit of bonding pad is laminated with the medial side of second constant head tank (3), and four lateral sides of bonding pad are respectively with four medial sides parallel arrangement of lead wire dress frame (4), and the first end and the medial side vertical fixation of lead wire dress frame (4) of lead wire (5), the perpendicular laminating of the corresponding lateral side of lead wire (5).

The first end of the lead (5) is vertically and fixedly connected with the inner side edge of the lead mounting frame (4), and the second end is vertically attached to the corresponding outer side edge of the bonding pad. The design ensures that the second end of the lead (5) coincides with the welding point on the bonding pad, thereby realizing high-precision welding.

The embodiment adopts the second positioning groove (3) with a rectangular structure, combines the design of the lead assembly and the bonding pad, and realizes the accurate butt joint of the lead (5) and the bonding pad and the stable welding position. These structural features help to improve the weld quality and solve the problems of spacing and mold design in high density ceramic package housings.

In the present embodiment, the structure of the first positioning groove (2) is not limited, because the number of the inner side edges of the lead (5) frame is limited, and the structure of the outer side edges is not limited.

In order to increase the suitability, the polygonal bonding pad can be welded, and the embodiment is expanded to the following structure.

The number of the inner sides of the lead (5) frame is n, the second positioning grooves (3) are of m-edge structures, and the m outer sides of the second positioning grooves (3) are respectively arranged in parallel with the m inner sides of the lead (5) frame, wherein n is more than m;

the lead (5) is arranged vertically to the corresponding side of the second positioning groove (3).

The lead (5) is vertically and fixedly connected with the inner side edge of the lead mounting frame (4), and the outer side edge of the lead mounting frame (4) is attached to the inner side edge of the first positioning groove (2);

the bonding pad is m limit shape structures, and the outside limit of bonding pad is laminated with the medial side of second constant head tank (3), and the m outside limit of bonding pad is parallel arrangement with the m medial side of lead wire dress frame (4) respectively, and the first end and the medial side vertical fixation of lead wire dress frame (4) of lead wire (5), the second end of lead wire (5) laminate perpendicularly with the corresponding lateral side of bonding pad.

That is, in this embodiment, the number of the inner sides of the lead frame (4) is set to be always larger than the number of the outer sides of the bonding pads, so that at least one of the inner sides of the lead frame (4) is ensured to be parallel to the outer sides of the bonding pads, and the lead (5) is ensured to be perpendicular to the outer sides of the bonding pads.

Through the constant head tank that adopts polygonal structure, improved the suitability of mould frock, make it can be applicable to the pad of multiple shape, help improving welding quality, adapt to the demand of different shape pads, improved welding process's stability and welding quality.

Example two

In the first embodiment, the limit between the lead wires (5) and the bonding pads is realized, and the technical problem still exists that 100% of the adjacent two lead wires (5) cannot be welded on the bonding pads, so the tooling in the embodiment further comprises mold clamping teeth (6), a plurality of mold clamping teeth (6) are fixedly connected with the bottom surfaces of the first positioning grooves (2), and the mold clamping teeth (6) are positioned between the side edges of the first positioning grooves (2) and the side edges of the second positioning grooves (3); through setting up mould latch (6), lead wire (5) place behind mould latch (6) between, with the pad one-to-one, and can not control the removal of removal ceramic to guarantee 100% welding of lead wire (5).

The number of the leads (5) welded with the first side of the bonding pad is x, the number of the die clamping teeth (6) between the first side and the side of the first positioning groove (2) is x-1, and one die clamping tooth (6) is arranged between two adjacent leads (5).

The die clamping teeth (6) are of strip-shaped structures, the horizontal axes of the die clamping teeth (6) are arranged in parallel with the leads (5), the width of each die clamping tooth (6) is not larger than the pitch of two adjacent leads (5), and the thickness of each die clamping tooth (6) is larger than the thickness of each lead (5).

Namely, through increasing the mould latch (6) with the width smaller than the pitch of the leads (5) between the leads (5), the left and right and front and back distances of the leads (5) can be positioned, and the leads (5) are prevented from shaking left and right to exceed ceramics and the front ends of the leads (5) are prevented from exceeding the bonding pads.

In addition, the material of the die body (1)/the lead wire loading frame (4)/the die clamping teeth (6) is graphite or stainless steel with a graphite coating, and the die body (1) and the die clamping teeth (6) are integrally formed.

The graphite material or graphite coated stainless steel has good abrasion resistance, corrosion resistance and heat conductivity, and is beneficial to maintaining the stability and durability of the die in the high-temperature welding process. In addition, the die body (1) and the die latch (6) are integrally formed, so that the structural compactness and the service life of the die are improved.

The bottom surface of the second positioning groove (3) is provided with a fetching hole (7) penetrating through the die body (1). The design of the part taking hole (7) is convenient for taking down the welded product from the die after the welding is finished, so that the efficiency of the welding work is improved. Meanwhile, the workpiece taking hole (7) is also beneficial to heat dissipation in the welding process, and the temperature stability of the die is kept, so that the welding quality is improved and the service life of the die is prolonged.

In the description of the present specification, reference to the terms "one embodiment/manner," "some embodiments/manner," "example," "a particular example," "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment/manner or example is included in at least one embodiment/manner or example of the application. In this specification, the schematic representations of the above terms are not necessarily for the same embodiment/manner or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/modes or examples described in this specification and the features of the various embodiments/modes or examples can be combined and combined by persons skilled in the art without contradiction.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

It will be appreciated by persons skilled in the art that the above embodiments are provided for clarity of illustration only and are not intended to limit the scope of the utility model. Other variations or modifications of the above-described utility model will be apparent to those of skill in the art, and are still within the scope of the utility model.

Claims (10)

1. Die tooling suitable for high density wire bonding, characterized in that includes: a die body (1) and a lead assembly; the upper plane of the die body (1) is a welding plane, a first positioning groove (2) is formed in the welding plane, and a second positioning groove (3) is formed in the bottom surface of the first positioning groove (2);

The lead assembly is matched with the first positioning groove (2), the lead assembly is placed in the first positioning groove (2), the second positioning groove (3) is matched with a bonding pad, and the bonding pad is placed in the second positioning groove (3);

the lead assembly comprises a lead mounting frame (4) and leads (5), wherein a plurality of leads (5) are respectively provided with a first end and a second end, the first ends of the leads (5) are fixedly connected with the lead mounting frame (4), the second ends of the leads (5) are attached to the upper side face of the bonding pad, and the second ends of the leads (5) are overlapped with the bonding points on the bonding pad.

2. The die tooling for high-density wire bonding according to claim 1, wherein the second positioning groove (3) has a rectangular structure, four sides of the second positioning groove (3) are respectively arranged in parallel with four inner sides of the wire (5) frame, and the wire (5) is vertically arranged with corresponding sides of the second positioning groove (3).

3. The die tooling for high-density wire bonding according to claim 2, wherein the wire mounting frame (4) is a rectangular frame, the wire (5) is vertically and fixedly connected with the inner side edge of the wire mounting frame (4), and the outer side edge of the wire mounting frame (4) is attached to the inner side edge of the first positioning groove (2);

The bonding pad is of a rectangular structure, the outer side edge of the bonding pad is attached to the inner side edge of the second positioning groove (3), the four outer side edges of the bonding pad are respectively arranged in parallel with the four inner side edges of the lead wire mounting frame (4), the first end of the lead wire (5) is vertically and fixedly connected with the inner side edge of the lead wire mounting frame (4), and the second end of the lead wire (5) is perpendicularly attached to the corresponding outer side edge of the bonding pad.

4. The die tooling for high-density wire bonding according to claim 1, wherein the number of inner sides of the wire (5) frame is n, the second positioning groove (3) has an m-sided structure, and m outer sides of the second positioning groove (3) are respectively arranged in parallel with m inner sides of the wire (5) frame, wherein n is greater than m;

The lead (5) is perpendicular to the corresponding side of the second positioning groove (3).

5. The die tooling for high-density wire bonding according to claim 4, wherein the wire (5) is fixedly connected vertically with the inner side of the wire mounting frame (4), and the outer side of the wire mounting frame (4) is attached to the inner side of the first positioning groove (2);

The bonding pad is of an m-shaped structure, the outer side of the bonding pad is attached to the inner side of the second positioning groove (3), the m outer sides of the bonding pad are respectively parallel to the m inner sides of the lead wire mounting frame (4), the first end of the lead wire (5) is vertically and fixedly connected with the inner side of the lead wire mounting frame (4), and the second end of the lead wire (5) is vertically attached to the corresponding outer side of the bonding pad.

6. A die tooling for high-density wire bonding according to any one of claims 1-5, further comprising die latches (6), a plurality of said die latches (6) being fixedly connected to the bottom surface of said first positioning groove (2), and said die latches (6) being located between the sides of said first positioning groove (2) and the sides of said second positioning groove (3);

The number of the leads (5) welded with the first side of the bonding pad is x, the number of the die latches (6) between the first side and the side of the first positioning groove (2) is x-1, and one die latch (6) is arranged between two adjacent leads (5).

7. A die tooling for high-density wire bonding according to claim 6, wherein the die latch (6) is of a bar-shaped structure, the horizontal axis of the die latch (6) is arranged in parallel with the wires (5), and the width of the die latch (6) is not greater than the pitch of two adjacent wires (5).

8. A die tooling for high density wire bonding as in claim 7 wherein the die latch (6) has a thickness greater than the thickness of the wire (5).

9. The die tooling for high-density wire bonding according to claim 6, wherein the material of the die body (1)/the wire mounting frame (4)/the die latch (6) is graphite or stainless steel with a graphite coating, and the die body (1) and the die latch (6) are integrally formed.

10. A die tooling for high-density wire bonding according to claim 6, wherein the bottom surface of the second positioning groove (3) is provided with a pick-up hole (7) penetrating the die body (1).