CN102142421B - Metal-column chip connecting structure and method without solders - Google Patents
Metal-column chip connecting structure and method without solders Download PDFInfo
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- CN102142421B CN102142421B CN2010101110424A CN201010111042A CN102142421B CN 102142421 B CN102142421 B CN 102142421B CN 2010101110424 A CN2010101110424 A CN 2010101110424A CN 201010111042 A CN201010111042 A CN 201010111042A CN 102142421 B CN102142421 B CN 102142421B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
The invention discloses a metal-column chip connecting structure and a method without solders. A chip is provided with a plurality of metal columns, and each metal column is provided with a top surface and two parallel side walls. A basal plate is provided with a plurality of connecting pads on an upper surface, and each connecting pad is provided with a recess bottom surface and two recess sides. Heat, pressure and ultrasonic waves are applied to the chip, the top surface of each metal column is automatically welded to each recess bottom surface, and the parts of the two parallel side walls of each metal column are automatically welded to the two recess sides, so that the metal columns and the connecting pads form a U-shaped metallic bonding section without solders. Thus, the solder doesnot need to be used for chip connection, the metal-column chip connecting structure is particularly applied to 'metal-column welding chip connection' products, the solder jointing cost can be saved, and the bond strength and the electrical conductivity of welding spots are greatly increased.
Description
Technical field
The present invention relates to a kind of semiconductor device, particularly relate to a kind of metal column chip connecting structure and method of exempting from scolder.
Background technology
Press, chip package technology (Flip-Chip) is a kind of advanced person's chip encapsulation technology, can shorten the transmission range between chip and the substrate, has more to be better than the electrical performance that routing connects and to popularize gradually.Particularly, more develop a kind of chip package technology of innovation after the IBM Corporation, the chip upper protruding block is adopted metal column replacement soldered ball in the past, in addition with the metal column on the scolder connection chip and the connection pad on the substrate, when reflow, do not have the alteration of form of in the past soldered ball balling-up, more intensive (bump pitch can be less than 50 microns therefore the spacing tolerable of metal column dwindles, for example 30 microns), reach more high density or the projection configuration of omitting RDL (reconfiguration line layer), this technology just is referred to as " chip of metal column welding connects ", namely so-called MPS-C2 (Metal Post Solder-ChipConnection) technology.This MPS-C2 correlation technique has been found in US Patent No. 6,229,220 B1 numbers " Bump structure, bump forming method and package connectingbody ".
As shown in Figure 1, a kind of metal column chip connecting structure 100 of existing known MPS-C2 framework mainly comprises a chip 110 and a substrate 120.This chip 110 is provided with a plurality of metal columns 112, and protrudes from a surface 111 of this chip 110.One upper surface 121 of this substrate 120 has a plurality of connection pads 122, and corresponds respectively to those metal columns 112.Specifically, those metal columns 112 are welded on those connection pads 122 by a plurality of scolders 150, and other is formed with a underfill 140, in order to coat those metal columns 112, those connection pads 122 and those scolders 150.And the electrical connection of reaching this chip 110 and this substrate 120 be with those scolders 150 as weld interface, neither those metal columns 112 and those connection pads 122 that be same as on material and fusing point easily have the risk of solder joint fracture and impedance increase.
Therefore, traditional MPS-C2 technology is connected in conjunction with using those scolders 150 to do chip with this substrate 120 at this chip 110.Wherein, those scolders 150 can select tin ball (solder ball) or other to be different from the welding compound of projection composition, therefore when chip connects, need again to consider metal diffusion and wettability between unlike material, often use nickel (Ni)/gold (Au) etc. as lug surface coating, increase many welding costs.In addition, in follow-up reflow step, those scolders 150 are when being heated to reflow temperature, those scolders 150 are understood fusing and are had flowability, when those scolders 150 are squeezed or the situation of overflow can occur in vibrations, more may cause those metal columns 112 to be welded to wrong connection pad 122, then will cause being electrically connected unsuccessfully.
This shows, above-mentioned existing chip encapsulation technology obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, finished by development but have no for a long time applicable design always, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious wish of relevant dealer solves.Therefore how to found a kind of novel metal column chip connecting structure and the method for exempting to use scolder, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing chip encapsulation technology exists, the inventor is based on being engaged in for many years abundant practical experience and professional knowledge of this type of product design manufacturing, and the utilization of cooperation scientific principle, positive research and innovation in addition, to founding a kind of novel metal column chip connecting structure and the method for exempting to use scolder, can improve general existing chip encapsulation technology, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the present invention who has practical value.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing chip encapsulation technology exists, and a kind of novel metal column chip connecting structure of exempting from scolder is provided, technical problem to be solved is to make it not need to use scolder in the past to do the chip connection, to promote the conductivity of solder joint, be applied to especially MPS-C2 (chip of metal column welding connects) product and can save the cost that uses solder bonds, be very suitable for practicality.
Another object of the present invention is to, a kind of novel metal column chip connection method of exempting to use scolder is provided, technical problem to be solved is to make it be based upon solderless U-shaped metal bonding cross section between metal column and the connection pad, significantly promotes the bond strength of solder joint, thereby more is suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of metal column chip connecting structure of exempting from scolder that the present invention proposes, it comprises: a chip, be provided with a plurality of metal columns, and protrude from a surface of this chip, each metal column has an end face and two parallel side walls; And a substrate, having a upper surface and a plurality of connection pad at this upper surface, each connection pad has a depression bottom surface and both sides depression side; Wherein, this chip join is in the upper surface of this substrate, the end face oneself of those metal columns is soldered to those depression bottom surfaces, the local oneself of two parallel side walls of those metal columns is soldered to those both sides depression sides, so that form solderless U-shaped metal bonding cross section between those metal columns and those connection pads.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid metal column chip connecting structure of exempting from scolder, wherein said U-shaped metal bonding cross section is copper-copper interface.
Aforesaid metal column chip connecting structure of exempting from scolder, this surface of wherein said chip is an active surface.
Aforesaid metal column chip connecting structure of exempting from scolder, wherein said metal column more runs through this chip.
Aforesaid metal column chip connecting structure of exempting from scolder, it comprises a underfill in addition, is formed between this chip and this substrate, to seal those metal columns.
Aforesaid metal column chip connecting structure of exempting from scolder, the pocket depth of wherein said connection pad be not more than those metal columns height 1/3rd.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of metal column chip connection method of exempting from scolder that the present invention proposes, it comprises: a chip is provided, is provided with a plurality of metal columns, protrude from a surface of this chip, each metal column has an end face and two parallel side walls; One substrate is provided, has a upper surface and a plurality of connection pad at this upper surface, each connection pad has a depression bottom surface and both sides depression side; And engage this chip in the upper surface of this substrate, utilize heat, pressure and ultrasonic waves to apply to give this chip and make the end face oneself of those metal columns be soldered to those depression bottom surfaces, the local oneself of two parallel side walls of those metal columns is soldered to those both sides depression sides, so that form solderless U-shaped metal bonding cross section between those metal columns and those connection pads.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid metal column chip connection method of exempting from scolder, wherein said U-shaped metal bonding cross section is copper-copper interface.
Aforesaid metal column chip connection method of exempting from scolder, this surface of wherein said chip is an active surface.
Aforesaid metal column chip connection method of exempting from scolder, wherein said metal column more runs through this chip.
The present invention compared with prior art has obvious advantage and beneficial effect.As known from the above, for achieving the above object, the invention provides a kind of metal column chip connecting structure of exempting from scolder, mainly comprise a chip and a substrate.This chip is provided with a plurality of metal columns, protrudes from a surface of this chip, and each metal column has an end face and two parallel side walls.This substrate has a upper surface and a plurality of connection pad at this upper surface, and each connection pad has a depression bottom surface and both sides depression side.Wherein, this chip join is in the upper surface of this substrate, the end face oneself of those metal columns is soldered to those depression bottom surfaces, the local oneself of two parallel side walls of those metal columns is soldered to those both sides depression sides, so that form solderless U-shaped metal bonding cross section between those metal columns and those connection pads.The present invention discloses above-mentioned method of attachment of exempting from the metal column chip connecting structure of scolder in addition.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
In aforesaid metal column chip connecting structure, this U-shaped metal bonding cross section can be copper-copper interface.
In aforesaid metal column chip connecting structure, this surface of this chip can be an active surface.
In aforesaid metal column chip connecting structure, those metal columns can more run through this chip.
In aforesaid metal column chip connecting structure, can comprise in addition a underfill, be formed between this chip and this substrate, to seal those metal columns.
In aforesaid metal column chip connecting structure, the pocket depth of those connection pads can be not more than those metal columns height 1/3rd.
By technique scheme, the present invention exempts to have at least following advantages and beneficial effect with the metal column chip connecting structure of scolder and method:
As can be seen from the above technical solutions, metal column chip connecting structure and the method for exempting from scolder of the present invention has following advantage and effect:
One, can close a wherein technological means of conduct by the particular combinations of metal column and connection pad, because each metal column has an end face and two parallel side walls, and each connection pad has a depression bottom surface and both sides depression side, and the end face oneself of metal column is soldered to the depression bottom surface, the local oneself of two parallel side walls of metal column is soldered to both sides depression side, so that form solderless U-shaped metal bonding cross section between metal column and the connection pad.Therefore, do not need to use scolder in the past to do the chip connection, to promote the conductivity of solder joint, when being applied to especially MPS-C2 (chip of metal column welding connects) product, can save the cost that uses solder bonds.
Two, can concern by the particular combinations of metal column and connection pad a wherein technological means of conduct, because each metal column has an end face and two parallel side walls, and each connection pad has a depression bottom surface and both sides depression side, and, utilize heat, pressure and ultrasonic waves to apply and give chip to be based upon the solderless U-shaped metal bonding cross section between metal column and the connection pad.Therefore, can significantly promote the bond strength of solder joint.
In sum, the invention relates to a kind of metal column chip connecting structure and method of exempting from scolder, this chip is provided with a plurality of metal columns, and each metal column has an end face and two parallel side walls.Substrate has a plurality of connection pads at upper surface, and each connection pad has a depression bottom surface and both sides depression side.Utilize heat, pressure and ultrasonic waves to apply and give chip, make the end face oneself of metal column be soldered to the depression bottom surface, the local oneself of two parallel side walls of metal column is soldered to both sides depression side, so that form solderless U-shaped metal bonding cross section between metal column and the connection pad.Therefore, do not need to use scolder to do chip and connect, apply to especially " chip of metal column welding connects " product and can save the solder bonds cost, and significantly promote bond strength and the conductivity of solder joint.The present invention has significant progress technically, and has obvious good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is for having the schematic cross-section of known metal column chip connecting structure now.
Fig. 2 is a kind of schematic cross-section of exempting from the metal column chip connecting structure of scolder of the first specific embodiment of the present invention.
Fig. 3 A to Fig. 3 C is assembly schematic cross-section in the chip bonding process of metal column chip connecting structure of the first specific embodiment of the present invention.
Fig. 4 A to Fig. 4 C is the schematic diagram that the metal column chip connecting structure of the first specific embodiment of the present invention illustrates its metal column, connection pad and combination in the chip bonding process.
Fig. 5 A to Fig. 5 C is the schematic diagram that the metal column chip connecting structure of an alternate embodiment of the present invention illustrates its metal column, connection pad and combination in the chip bonding process.
Fig. 6 is that the another kind of the second specific embodiment of the present invention is exempted from the schematic cross-section with the metal column chip connecting structure of scolder.
100: the metal column chip connecting structure
110: chip
111: surface 112: metal column
120: substrate
121: upper surface 122: connection pad
140: underfill 150: scolder
200: exempt from the metal column chip connecting structure with scolder
210: chip
211: surface 212: metal column
213: end face 213a: end face
214: parallel side wall 214a: parallel side wall
220: substrate
221: upper surface 222: connection pad
223: depression bottom surface 223a: depression bottom surface
224: depression side 224a: depression side
230:U shape metal bonding cross section
240: underfill
300: exempt from the metal column chip connecting structure with scolder
315: through hole 316: electrodeposited coating
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, metal column chip connecting structure and its embodiment of method, structure, feature and the effect thereof of exempting to use scolder to foundation the present invention proposes are described in detail as follows.
Relevant aforementioned and other technology contents of the present invention, Characteristic can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.For convenience of description, in following embodiment, identical element represents with identical numbering.
Below will cooperate appended diagram to describe embodiments of the invention in detail, so it should be noted, those diagrams are the schematic diagram of simplification, only with illustrative method basic framework of the present invention or implementation method are described, therefore only show assembly and the syntagmatic relevant with this case, shown assembly is not that number, shape, the size implemented with reality are done equal proportion and drawn among the figure, and some dimension scale and other relative dimensions ratio or exaggerated or simplify processing are to provide clearer description.Actual number, shape and the dimension scale of implementing is a kind of design of putting property of choosing, and detailed assembly layout may be more complicated.
According to the first specific embodiment of the present invention, a kind of schematic cross-section and Fig. 3 A to Fig. 3 C assembly schematic cross-section in the chip bonding process of exempting to be illustrated in the metal column chip connecting structure of scolder Fig. 2.This exempts from mainly to comprise a chip 210 and a substrate 220 with the metal column chip connecting structure 200 of scolder.
See also shown in Figure 2ly, this chip 210 is provided with a plurality of metal columns 212, protrudes from a surface 211 of this chip 210, and each metal column 212 has an end face 213 and two parallel side walls 214.Specifically, this chip 210 has been formed with integrated circuit (integrated circuit, IC) assembly, and for example internal memory, logic module and Application Specific Integrated Circuit (ASIC) can be divided into graininess by ㄧ wafer (wafer).In the present embodiment, this surface 211 of this chip 210 can be an active surface, i.e. the formation of integrated circuit surface.Specifically, (being active surface) can be formed with a plurality of weld pads (not drawing among the figure) in addition on this surface 211, for the setting of those metal columns 212, between weld pad and metal column, in addition projection lower metal layer (not drawing among the figure) can be set, to avoid the metal diffusion of composition in the metal column.The material of those metal columns 212 can comprise gold, copper, aluminium or its alloy, can utilize plating mode to form column.Preferably, can utilize and grind or the technology that has an even surface, make this end face 213 for smooth and identical height arranged.
This substrate 220 has a upper surface 221 and a plurality of connection pad 222 at this upper surface 221, and each connection pad 222 has a depression bottom surface 223 and both sides depression side 224.Specifically, this substrate 220 can be a printed circuit board (PCB) (printed circuit board, PCB), as the medium of chip bearing in the semiconductor package and electric connection.In a preferred embodiment, the distance of two depression sides 224 of each connection pad 222 can be not more than the distance of two parallel side walls 214 of each corresponding metal column 212, to guarantee that those parallel side walls 214 can those depression sides 224 of CONTACT WITH FRICTION in chip bonding.The material of those connection pads 222 can comprise copper, and this depression bottom surface 223 can utilize pattern etched or patterned electricity coating technology to reach with the formation of this both sides depression side 224.In a preferred embodiment, the pocket depth of those connection pads 222 can be not more than those metal columns 212 height 1/3rd, with avoid those metal columns 212 excessively to be embedded in those connection pads 222 and keep between this chip 210 and this substrate 220 can not CONTACT WITH FRICTION the gap.In addition, in the present embodiment, those metal columns 212 can have identical material with those connection pads 222, and for example, those metal columns 212 can be copper post (Cu post), and those connection pads 222 also can be copper groove (Cu cave).
In addition, this chip 210 is engaged in the upper surface 221 of this substrate 220, end face 213 oneselfs of those metal columns 212 are soldered to those depression bottom surfaces 223, the local oneself of two parallel side walls 214 of those metal columns 212 is soldered to those both sides depression sides 224, so that form solderless U-shaped metal bonding cross section 230 between those metal columns 212 and those connection pads 222.In other words, this U-shaped metal bonding cross section 230 comprises at least three joint interfaces and is on-plane surface, and above-mentioned " joint interface " is between this end face 213 and this depression bottom surface 223 and between two parallel side walls 214 and the corresponding two depression sides 224.And " oneself's welding " indication is the metallic atom activation diffusion that utilizes those metal column 212 surfaces, and form mutual metal bond with those connection pads 222, do not need to make use of the scolder, projection coating or other cement that add, basically can produce interrupted metal lattice interface in this U-shaped metal bonding cross section 230, therefore the impedance after oneself's welding between those metal columns 212 and those connection pads 222 can not raise, and can reach better conductivity with " solderless U-shaped metal bonding cross section " as solder joint.In the present embodiment, this U-shaped metal bonding cross section 230 can be copper-copper interface or Jin-Jin interface, and wherein the cost with copper-copper interface is lower.Therefore, this U-shaped metal bonding cross section 230 does not have other impurity, the cast structure of fragility or the existence of Jie's metallic compound, and can form comparatively smooth seamless composition surface, does not need to use scolder in the past to do the chip connection, to promote the conductivity of solder joint.
In addition, this exempts from can comprise in addition a underfill 240 (underfill material) with the metal column chip connecting structure 200 of scolder, is formed between this chip 210 and this substrate 220, to seal those metal columns 212.By the high fluidity of this underfill 240 before curing, in order to avoid forming the space between this chip 210 and this substrate 220.In a preferred embodiment, this underfill 240 can be selected the higher material of hardness, except protecting those metal columns 212, and structural strength that more can reinforcement integral body.
Therefore, the present invention, needn't scolder in the past does chip and connects and be applied to especially MPS-C2 (chip of metal column welding connects) product and can save the cost that uses solder bonds as a technological means wherein by the particular combinations of metal column and connection pad relation.This is because each metal column 212 has an end face 213 and two parallel side walls 214, and each connection pad 222 has a depression bottom surface 223 and both sides depression side 224, and end face 213 oneselfs of those metal columns 212 are soldered to those depression bottom surfaces 223, the local oneself of two parallel side walls 214 of those metal columns 212 is soldered to corresponding both sides depression side 224, so that form solderless U-shaped metal bonding cross section 230 between those metal columns 212 and those connection pads 222.In addition, more significantly promote bond strength and the conductivity of solder joint, the risk that easily has the fracture of weldering solder joint and impedance to increase when having exempted traditional use solder bonds.
The present invention also discloses a kind of feasible of this metal column chip connecting structure 200 of exempting from the usefulness scolder but infinite manufacture method, be illustrated in the mill assembly schematic cross-section of Fig. 3 A to Fig. 3 C, show a wherein effect of the present invention in order to clear, its step-by-step procedures is as follows.
At first, see also shown in Fig. 3 A, this chip 210 is provided, be provided with a plurality of metal columns 212, protrude from a surface 211 of this chip 210, each metal column 212 has an end face 213 and two parallel side walls 214.Those end faces 213 do not need to attach existing known employed scolder, except worrying to have the scolder pollution problem, more can save the setup cost of many scolders.
See also shown in Fig. 3 B, this substrate 220 is provided, be provided with a plurality of connection pads 222 at the upper surface 221 of this substrate 220, each connection pad 222 has a depression bottom surface 223 and both sides depression side 224.Particularly, each depression bottom surface 223 and corresponding both sides depression side 224 structure that can form just as U-lag.
See also shown in Fig. 3 C, carry out the step of a chip bonding, to engage this chip 210 in the upper surface 221 of this substrate 220.Transmit heat, pressure and ultrasonic waves and apply via an absorption type hot pressing tool (not drawing among the figure) and give this chip 210, so that end face 213 oneselfs of those metal columns 212 are soldered to those depression bottom surfaces 223, the local oneself of two parallel side walls 214 of those metal columns 212 is soldered to those both sides depression sides 224, so that form solderless U-shaped metal bonding cross section 230 between those metal columns 212 and those connection pads 222.Wherein, so-called " ultrasonic waves " refers to that vibration frequency is not less than 20,000 hertz (Hz), this chip 210 and metal column thereof 212 produced the high-frequency transverse vibration of per seconds 20,000 times to 40,000 times, so that the composition surface of those metal columns 212 and those connection pads 222 is because of the surperficial welding of dither, bring out the atom combination that atom spreads to form mutual metal, therefore do not need flux also not need galvanization and the fusing point that is heated to those metal columns 212.Utilize the fusing point that suitably heats this chip 210 but do not need to arrive those metal columns 212, be heated simultaneously and expand so that be connected to the metal column 212 of this chip 210, the distance of two parallel side walls 214 of same metal column 212 can be slightly larger than the distance of two parallel side walls 214 of corresponding connection pad 222, use the part and the CONTACT WITH FRICTION of those both sides depression sides 224 of two parallel side walls 214 that increase those metal columns 212, with reach side vertically to the oneself weld.Utilization is exerted pressure and is given this chip 210, guarantees the end face 213 of those metal columns 212 and the CONTACT WITH FRICTION of those depression bottom surfaces 223, with reach central horizontal to oneself's welding.Therefore, utilize heat, pressure and ultrasonic waves to apply and give this chip 210, can between those metal columns 212 and those connection pads 222, set up solderless U-shaped metal bonding cross section 230, can significantly promote the bond strength of solder joint.
Fig. 4 A to Fig. 4 C illustrates the schematic diagram of its metal column, connection pad and combination in the chip bonding process for this metal column chip connecting structure 200.Shown in Fig. 4 A, this end face 213 of each metal column 212 can be rectangle, and each metal column 212 can have the wall of pair of parallel in addition except having two above-mentioned parallel side walls 214, therefore so that those metal columns 212 form cuboid.In addition, shown in Fig. 4 B and Fig. 4 C, the area of this depression bottom surface 223 of each connection pad 222 can be not more than the area of corresponding end face 213.More specifically, when those metal columns 212 are engaged to those connection pads 222, utilize heat, pressure and ultrasonic waves to apply and give this chip 210, rapidly vibration friction between those end faces 213 and corresponding depression bottom surface 223 and those parallel side walls 214 and the corresponding depression side 224, so that end face 213 oneselfs of those metal columns 212 are soldered to those depression bottom surfaces 223, and the local oneself of two parallel side walls 214 of those metal columns 212 is soldered to those both sides depression sides 224.The arrow direction is and utilizes supersonic direction of vibration among Fig. 4 C, and it is parallel to those parallel side walls 214 and those depression sides 224.
Fig. 5 A to Fig. 5 C illustrates the schematic diagram of its metal column, connection pad and combination in the chip bonding process for this metal column chip connecting structure 200 in an alternate embodiment, in order to the shape of depression bottom surface that the end face that do not limit metal column and connection pad are described.Shown in Fig. 5 A, this end face 213a of each metal column 212 can be square, and can have two couples of parallel side wall 214a that are parallel to each other and equate.And shown in Fig. 5 B, each connection pad 222 depressions and form shape just as a storage tank except having both sides depression side 224a, more are formed with another to parallel sidewall.Further, the shape of the depression bottom surface 223a of those connection pads 222 can be rectangle, and the area of the depression bottom surface 223a of those connection pads 222 can greater than the area of the end face 213a of those metal columns 212, weld the end face 213a of those metal columns 212 to those depression bottom surfaces 223a in order to the oneself.In addition, those depression bottom surfaces 223a is not more than the corresponding length of side (being the distance of two parallel side wall 214a of metal column 212) of the end face 213a of corresponding metal column 212 than minor face (being the distance of two depression side 224a of connection pad 222), therefore when this chip 210 engages with this substrate 220, ultrasonic wave vibration direction according to Fig. 5 C arrow indication, the two parallel side wall 214a energy high frequency vibration friction of those metal columns 212 welds two parallel side wall 214a of those metal columns 212 to those both sides depression side 224a to two depression side 224a of those corresponding connection pads 222 in order to the oneself.
According to the second specific embodiment of the present invention, another kind exempts to be illustrated in the metal column chip connecting structure 300 of scolder the schematic cross-section of Fig. 6.Wherein the primary clustering identical with the first embodiment will indicate with same-sign, give no longer in detail and give unnecessary details.
See also shown in Figure 6ly, this exempts from mainly to comprise a chip 210 and a substrate 220 with the metal column chip connecting structure 300 of scolder.This chip 210 is provided with a plurality of metal columns 212, protrudes from a surface 211 of this chip 210, and each metal column 212 has an end face 213 and two parallel side walls 214.This substrate 220 has a upper surface 221 and a plurality of connection pad 222 at this upper surface 221, and each connection pad 222 has a depression bottom surface 223 and both sides depression side 224.Wherein, this chip 210 is engaged in the upper surface 221 of this substrate 220, end face 213 oneselfs of those metal columns 212 are soldered to those depression bottom surfaces 223, the local oneself of two parallel side walls 214 of those metal columns 212 is soldered to those both sides depression sides 224, so that form solderless U-shaped metal bonding cross section 230 between those metal columns 212 and those connection pads 222.Preferably, those metal columns 212 can more run through this chip 210.Further, this chip 210 can be formed with a plurality of through holes 315 by those metal column 212 through parts, and the hole wall of each through hole 315 is provided with an electrodeposited coating 316.Those electrodeposited coatings 316 can be selected electric conducting material, for example: copper (Cu).Specifically, namely so-called silicon perforation (Though Silicon Via, TSV) of those through holes 315.The structure that runs through this chip 210 by those metal columns 212 can provide the effect of vertical electrical conducting with firm those metal columns 212, help this chip 210 to the ultrasonic wave vibration conduction of those metal columns 212, to promote the formation in this U-shaped metal bonding cross section 230.In the present embodiment, the protuberate 211 of those metal columns 212 can be the back side of this chip 210, therefore the active surface of this chip 210 is then away from this substrate 220, to reach better radiating effect.In addition, but those metal columns 212 expose another chip of end face stereo-stacking.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (4)
1. metal column chip connecting structure of exempting from scolder is characterized in that it comprises:
One chip is provided with a plurality of metal columns, protrudes from a surface of this chip, and each metal column has an end face and two parallel side walls;
One substrate has a upper surface and a plurality of connection pad that is arranged on this upper surface, and each connection pad has a depression bottom surface and both sides depression side; And
One underfill is formed between this chip and this substrate, to seal those metal columns;
Wherein, this chip join is in the upper surface of this substrate, the end face oneself of those metal columns is soldered to those depression bottom surfaces, the local oneself of two parallel side walls of those metal columns is soldered to those both sides depression sides, so that form solderless U-shaped metal bonding cross section between those metal columns and those connection pads, and the pocket depth of those connection pads be not more than those metal columns height 1/3rd.
2. metal column chip connecting structure of exempting from scolder according to claim 1 is characterized in that wherein said U-shaped metal bonding cross section is copper-copper interface.
3. metal column chip connecting structure of exempting from scolder according to claim 1, this surface that it is characterized in that wherein said chip is an active surface.
4. metal column chip connecting structure of exempting from scolder according to claim 1 is characterized in that wherein said metal column more runs through this chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101110424A CN102142421B (en) | 2010-02-01 | 2010-02-01 | Metal-column chip connecting structure and method without solders |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101110424A CN102142421B (en) | 2010-02-01 | 2010-02-01 | Metal-column chip connecting structure and method without solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102142421A CN102142421A (en) | 2011-08-03 |
| CN102142421B true CN102142421B (en) | 2013-01-02 |
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| CN2010101110424A Expired - Fee Related CN102142421B (en) | 2010-02-01 | 2010-02-01 | Metal-column chip connecting structure and method without solders |
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| CN105097777B (en) * | 2014-04-21 | 2019-01-18 | 中芯国际集成电路制造(上海)有限公司 | A kind of semiconductor devices and preparation method thereof |
| CN104465598A (en) * | 2014-12-19 | 2015-03-25 | 江苏长电科技股份有限公司 | Metal lead frame high thermal conductivity flip chip packaging structure and technological method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101197342A (en) * | 2006-12-08 | 2008-06-11 | 日月光半导体制造股份有限公司 | Packaging structure and its manufacturing method |
| CN101527271A (en) * | 2009-04-17 | 2009-09-09 | 中南大学 | Chip packaging method using conical bonding pad for thermosonic flip-chip bonding |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101197342A (en) * | 2006-12-08 | 2008-06-11 | 日月光半导体制造股份有限公司 | Packaging structure and its manufacturing method |
| CN101527271A (en) * | 2009-04-17 | 2009-09-09 | 中南大学 | Chip packaging method using conical bonding pad for thermosonic flip-chip bonding |
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| CN102142421A (en) | 2011-08-03 |
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