CN214898380U - 一种芯片焊线机用固定装置 - Google Patents
一种芯片焊线机用固定装置 Download PDFInfo
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- CN214898380U CN214898380U CN202022770613.7U CN202022770613U CN214898380U CN 214898380 U CN214898380 U CN 214898380U CN 202022770613 U CN202022770613 U CN 202022770613U CN 214898380 U CN214898380 U CN 214898380U
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- 238000003466 welding Methods 0.000 claims description 14
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Effective date of registration: 20240124 Address after: Room 505, 5th Floor, Building 12, No.1 Ronghua South Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing, 100176 Patentee after: Beijing Qiancheng Technology Co.,Ltd. Country or region after: China Address before: 221400 Wenyao Town Road 22, Xinyi City, Xuzhou City, Jiangsu Province Patentee before: Xinyi Taida Electronics Co.,Ltd. Country or region before: China |
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Effective date of registration: 20240407 Address after: Room 1013, 1st Floor, Building 4, Zone 1, No. 9 Courtyard, Taihe 3rd Street, Daxing District, Beijing, 100176 Patentee after: Beijing Qianxincheng Technology Co.,Ltd. Country or region after: China Address before: Room 505, 5th Floor, Building 12, No.1 Ronghua South Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing, 100176 Patentee before: Beijing Qiancheng Technology Co.,Ltd. Country or region before: China |