CN214516427U - Ultrasonic cleaning device for monocrystalline silicon wafer - Google Patents
Ultrasonic cleaning device for monocrystalline silicon wafer Download PDFInfo
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- CN214516427U CN214516427U CN202120140588.6U CN202120140588U CN214516427U CN 214516427 U CN214516427 U CN 214516427U CN 202120140588 U CN202120140588 U CN 202120140588U CN 214516427 U CN214516427 U CN 214516427U
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- Prior art keywords
- rod
- bearing
- fixedly connected
- ultrasonic cleaning
- silicon wafer
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- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 22
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 235000012431 wafers Nutrition 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a monocrystalline silicon piece technical field just discloses a monocrystalline silicon piece's ultrasonic cleaning device, comprising a main body, the inside swing joint of main part has the carriage release lever, the bottom fixedly connected with fixed block of carriage release lever, the front side of fixed block is connected with even board, the front side fixedly connected with of even board bears the mechanism, it includes two first fixed plates, two second fixed plates, two head rods, two second connecting rods, two first carrier bars and two second carrier bars to bear the mechanism. This ultrasonic cleaning device of monocrystalline silicon piece through mutually supporting between first fixed plate, second fixed plate, head rod, second connecting rod, first carrier bar, second carrier bar, draw-in groove, dead lever, screw rod and the rotating tube, has reached and has reduced the effect that the silicon chip bears the basket to the ultrasonic wave hindrance, has solved current silicon chip and has born the basket and can cause the problem of great hindrance to the ultrasonic wave transmission when wasing the silicon chip.
Description
Technical Field
The utility model relates to a monocrystalline silicon piece technical field specifically is a monocrystalline silicon piece's ultrasonic cleaning device.
Background
In the process of silicon chip preparation, each process has all involved the washing, and abluent good or bad can directly influence next process, can influence the yield and the reliability of device even, and the silicon chip is because of there being multichannel washing step, so belt cleaning device is also diverse, wherein just contain ultrasonic cleaner, ultrasonic cleaner includes cleaning machine main part and silicon chip bears the weight of the basket, the silicon chip can be placed in bearing the weight of the basket, and will bear the weight of the basket through the arm on the cleaning machine and put into the washing tank and wash, but current silicon chip bears the weight of the basket and because of the area of covering to the silicon chip is great, can cause great hindrance to the transmission of ultrasonic wave when wasing, thereby influence the cleaning performance of the silicon chip in bearing the basket.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a monocrystalline silicon piece's ultrasonic cleaning device possesses the advantage that reduces silicon chip and bear the basket to the ultrasonic wave hindrance, has solved current silicon chip and has born the basket and can cause the problem of great hindrance to the ultrasonic wave transmission when wasing the silicon chip.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a monocrystalline silicon piece's ultrasonic cleaning device, includes the main part, the inside swing joint of main part has the carriage release lever, the bottom fixedly connected with fixed block of carriage release lever, the front side of fixed block is connected with even board, the front side fixedly connected with of even board bears the mechanism, it includes two first fixed plates, two second fixed plates, two head rods, two second connecting rods, two first carrier bars and two second carrier bars to bear the mechanism, the equal swing joint of side surface of first carrier bar and second carrier bar has the silicon chip, the right side fixedly connected with dead lever of first fixed plate, the side surface of dead lever is connected with the rotating tube, the left side fixedly connected with screw rod of second fixed plate.
Preferably, the rear side fixedly connected with stopper of even board, spacing spout has been seted up to the inside of fixed block, the inside swing joint of side surface and spacing spout of stopper.
Preferably, the side surface of the fixed rod is fixedly sleeved with a limiting ring, a limiting groove is formed in the rotating tube, and the limiting ring is movably connected with the inside of the limiting groove.
Preferably, the side surfaces of the first bearing rod and the second bearing rod are provided with clamping grooves, and the side surfaces of the silicon wafers are clamped with the inner parts of the clamping grooves.
Preferably, the inner wall of the rotating pipe is provided with a thread groove, and the thread groove is matched with the thread on the surface of the screw rod.
Preferably, the number of the bearing mechanisms is five, and the rear side of the middle bearing mechanism is fixedly connected with the front side of the connecting plate.
Compared with the prior art, the utility model provides a monocrystalline silicon piece's ultrasonic cleaning device possesses following beneficial effect:
1. this ultrasonic cleaning device of monocrystalline silicon piece through mutually supporting between first fixed plate, second fixed plate, head rod, second connecting rod, first carrier bar, second carrier bar, draw-in groove, dead lever, screw rod and the rotating tube, has reached and has reduced the effect that the silicon chip bears the basket to the ultrasonic wave hindrance, has solved current silicon chip and has born the basket and can cause the problem of great hindrance to the ultrasonic wave transmission when wasing the silicon chip.
2. This ultrasonic cleaning device of monocrystalline silicon piece through mutually supporting between dead lever, screw rod, spacing ring and the rotating tube, can move the rotating tube through twisting and make the screw rod extend or shrink to change the size of bearing the weight of the basket, reached and be convenient for change the effect of bearing the weight of the basket size, solved when bearing the weight of the basket and enlarge the back, be difficult for carrying out the problem of transporting.
Drawings
Fig. 1 is a front view of the present invention;
FIG. 2 is a schematic view of the structure of the position limiting block of the present invention;
FIG. 3 is a schematic structural view of the carrying mechanism of the present invention;
FIG. 4 is a side view of the carrying mechanism of the present invention;
FIG. 5 is an enlarged view of the point A in FIG. 3 according to the present invention;
fig. 6 is a schematic view of the connection state structure of the screw rod and the fixing rod of the present invention.
Wherein: 1. a main body; 2. a travel bar; 3. a fixed block; 4. connecting plates; 5. a carrying mechanism; 6. a first fixing plate; 7. a second fixing plate; 8. a first connecting rod; 9. a second connecting rod; 10. a first carrier bar; 11. a second carrier bar; 12. a silicon wafer; 13. a card slot; 14. fixing the rod; 15. a screw; 16. a limiting ring; 17. rotating the tube; 18. a limiting block; 19. and a limiting sliding groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, an ultrasonic cleaning apparatus for a monocrystalline silicon wafer comprises a main body 1, the main body 1 is an ultrasonic cleaning machine, the ultrasonic cleaning machine utilizes the direct or indirect action of ultrasonic waves on liquid and dirt to disperse, emulsify and peel off the dirt layer to achieve the purpose of cleaning, a moving rod 2 is movably connected inside the main body 1, the moving rod 2 can move and lift under the control of the main body 1, a fixed block 3 is fixedly connected to the bottom end of the moving rod 2, a connecting plate 4 is connected to the front side of the fixed block 3, a limiting block 18 is fixedly connected to the rear side of the connecting plate 4, a limiting chute 19 is formed inside the fixed block 3, the side surface of the limiting block 18 is movably connected to the inside of the limiting chute 19, a bearing mechanism 5 is fixedly connected to the front side of the connecting plate 4, the number of the bearing mechanisms 5 is five, the rear side of the middle bearing mechanism 5 is fixedly connected with the front side of the connecting plate 4, the rear sides of the rear first fixing plate 6 and the rear second fixing plate 7 are fixedly connected with the front side of the connecting plate 4, and the bearing mechanism 5 comprises two first fixing plates 6, two second fixing plates 7, two first connecting rods 8, two second connecting rods 9, two first bearing rods 10 and two second bearing rods 11.
The first fixing plates 6 at the front and rear sides are connected through a first connecting rod 8 and a second connecting rod 9, the front end of the first connecting rod 8 is fixedly connected with the rear side of the front first fixing plate 6, the rear end of the first connecting rod 8 is fixedly connected with the front side of the rear first fixing plate 6, the front end of the second connecting rod 9 is fixedly connected with the rear side of the front first fixing plate 6, the rear end of the second connecting rod 9 is fixedly connected with the front side of the rear first fixing plate 6, the second fixing plates 7 at the front and rear sides are connected through the first connecting rod 8 and the second connecting rod 9, the front end of the first connecting rod 8 is fixedly connected with the rear side of the front second fixing plate 7, the rear end of the first connecting rod 8 is fixedly connected with the front side of the rear second fixing plate 7, the front end of the second connecting rod 9 is fixedly connected with the rear side of the front second fixing plate 7, the rear end of the second connecting rod 9 is fixedly connected with the front side of the rear second fixing plate 7, the first fixing plate 6 is connected with the second fixing plate 7 through a first bearing rod 10 and a second bearing rod 11, the left end of the first bearing rod 10 is fixedly connected with the right side of the second fixing plate 7, the right end of the first bearing rod 10 is fixedly connected with the left side of the first fixing plate 6, the left end of the second bearing rod 11 is fixedly connected with the right side of the second fixing plate 7, the right end of the second bearing rod 11 is fixedly connected with the left side of the first fixing plate 6, silicon wafers 12 are movably connected with the side surfaces of the first bearing rod 10 and the second bearing rod 11, clamping grooves 13 are formed in the side surfaces of the first bearing rod 10 and the second bearing rod 11, and the side surfaces of the silicon wafers 12 are clamped with the inner portions of the clamping grooves 13.
The right side of the first fixing plate 6 is fixedly connected with a fixing rod 14, the rightmost first fixing plate is not connected with the fixing rod 14, the side surface of the fixing rod 14 is connected with a rotating pipe 17, a limiting ring 16 is fixedly sleeved on the side surface of the fixing rod 14, a limiting groove is formed in the rotating pipe 17, the limiting ring 16 is movably connected with the inside of the limiting groove, a thread groove is formed in the inner wall of the rotating pipe 17 and matched with threads on the surface of a screw rod 15, every two adjacent bearing mechanisms are connected together through a connecting device consisting of the fixing rod 14, the screw rod 15, the limiting ring 16 and the rotating pipe 17, a through groove is formed in the fixing rod 14, the side surface of the screw rod 15 is movably connected with the inside of the through groove, the fixing rod 14, the screw rod 15, the limiting ring 16 and the rotating pipe 17 are matched with each other, the screw rod 15 can be extended or contracted by screwing the rotating pipe 17, thereby change the size of bearing the weight of the basket, reached and be convenient for change the effect of bearing the weight of the basket size, solved and enlarged the back when bearing the weight of the basket, the difficult problem of transporting of carrying, the left side fixedly connected with screw rod 15 of second fixed plate 7, the left side of leftmost second fixed plate 7 is not connected with screw rod 15, through first fixed plate 6, second fixed plate 7, head rod 8, second connecting rod 9, first carrier bar 10, second carrier bar 11, draw-in groove 13, dead lever 14, mutually support between screw rod 15 and the rotating tube 17, reached and reduced the silicon chip and born the effect that the basket hinders to the ultrasonic wave, solved current silicon chip and born the weight of the basket and can cause the problem of great hindrance to the ultrasonic wave transmission when wasing the silicon chip.
When the ultrasonic cleaning machine is used, a silicon wafer 12 is placed into the bearing mechanism 5, the edge of the silicon wafer 12 is clamped in the clamping groove 13, the rotating pipe 17 is screwed anticlockwise, the distance between every two adjacent bearing mechanisms 5 is enlarged, so that the obstruction of the bearing mechanism 5 to ultrasonic waves around the silicon wafer 12 during ultrasonic cleaning is reduced, then the limiting block 18 is clamped with the limiting sliding groove 19, the bearing basket is installed on the moving rod 2, and finally the moving rod 2 is controlled to move downwards through the main body 1, the bearing basket is moved into the cleaning groove, and the silicon wafer 12 can be subjected to ultrasonic cleaning.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. An ultrasonic cleaning device for a monocrystalline silicon wafer, comprising a main body (1), characterized in that: a movable rod (2) is movably connected inside the main body (1), a fixed block (3) is fixedly connected at the bottom end of the movable rod (2), the front side of the fixed block (3) is connected with a connecting plate (4), the front side of the connecting plate (4) is fixedly connected with a bearing mechanism (5), the bearing mechanism (5) comprises two first fixing plates (6), two second fixing plates (7), two first connecting rods (8), two second connecting rods (9), two first bearing rods (10) and two second bearing rods (11), the side surfaces of the first bearing rod (10) and the second bearing rod (11) are movably connected with silicon wafers (12), a fixed rod (14) is fixedly connected to the right side of the first fixed plate (6), the side surface of the fixed rod (14) is connected with a rotating pipe (17), and the left side of the second fixed plate (7) is fixedly connected with a screw rod (15).
2. An ultrasonic cleaning apparatus for a single crystal silicon wafer according to claim 1, wherein: the rear side fixedly connected with stopper (18) of even board (4), spacing spout (19) have been seted up to the inside of fixed block (3), the inside swing joint of the side surface of stopper (18) and spacing spout (19).
3. An ultrasonic cleaning apparatus for a single crystal silicon wafer according to claim 1, wherein: the side surface of the fixed rod (14) is fixedly sleeved with a limiting ring (16), a limiting groove is formed in the rotating pipe (17), and the limiting ring (16) is movably connected with the inside of the limiting groove.
4. An ultrasonic cleaning apparatus for a single crystal silicon wafer according to claim 1, wherein: clamping grooves (13) are formed in the side surfaces of the first bearing rod (10) and the second bearing rod (11), and the side surface of the silicon wafer (12) is clamped with the inner portions of the clamping grooves (13).
5. An ultrasonic cleaning apparatus for a single crystal silicon wafer according to claim 1, wherein: the inner wall of the rotating pipe (17) is provided with a thread groove, and the thread groove is matched with the thread on the surface of the screw rod (15).
6. An ultrasonic cleaning apparatus for a single crystal silicon wafer according to claim 1, wherein: the number of the bearing mechanisms (5) is five, and the rear side of the middle bearing mechanism (5) is fixedly connected with the front side of the connecting plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120140588.6U CN214516427U (en) | 2021-01-19 | 2021-01-19 | Ultrasonic cleaning device for monocrystalline silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120140588.6U CN214516427U (en) | 2021-01-19 | 2021-01-19 | Ultrasonic cleaning device for monocrystalline silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214516427U true CN214516427U (en) | 2021-10-29 |
Family
ID=78345824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120140588.6U Expired - Fee Related CN214516427U (en) | 2021-01-19 | 2021-01-19 | Ultrasonic cleaning device for monocrystalline silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214516427U (en) |
-
2021
- 2021-01-19 CN CN202120140588.6U patent/CN214516427U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211029 |
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| CF01 | Termination of patent right due to non-payment of annual fee |