CN219273901U - Semiconductor substrate cleaning device - Google Patents

Abstract

The utility model relates to the technical field of semiconductor substrates, in particular to a semiconductor substrate cleaning device, which comprises a main body, a control device, a wafer shell, a wafer and an ultrasonic structure, wherein a cleaning tank is arranged on the upper end face of the main body, an inner tank is arranged on the inner wall of the cleaning tank, an electric telescopic rod is fixedly connected to the inner wall of the inner tank, a base is fixedly connected to the inner wall of the cleaning tank, a sealing sleeve is fixedly connected to the inner wall of a guide hole of the base, the upper end of the electric telescopic rod passes through the sealing sleeve and is fixedly connected with a bearing seat, a first limiting groove is arranged on the upper end face of the bearing seat, waterproof electric telescopic rods are arranged on two sides of the inner wall of the cleaning tank, clamping strips are fixedly connected to the other end of the waterproof electric telescopic rods, and the like.

Description

Semiconductor substrate cleaning device

Technical Field

The utility model relates to the technical field of semiconductor substrates, in particular to a semiconductor substrate cleaning device.

Background

The semiconductor substrate is a wafer made of semiconductor monocrystalline materials, the substrate can directly enter a wafer manufacturing link to produce semiconductor devices, and epitaxial wafers can also be produced by epitaxial process processing, and the wafer is cleaned by a cleaning device in the processing process.

In order to improve the cleaning efficiency of the wafer, an ultrasonic cleaner is generally used for cleaning, the wafer shell and the wafer are put into the cleaner together, so that the problem of lower cleaning efficiency of one wafer is avoided, but the cleaning method has some problems, because the wafer is placed in the wafer shell for cleaning together, the structural influence of the wafer shell can cause incomplete cleaning of the wafer and possibly leave residues, and therefore, the semiconductor substrate cleaning device is proposed according to the problems.

Disclosure of Invention

The utility model aims to provide a semiconductor substrate cleaning device, which aims to solve the problems that the prior ultrasonic cleaning machine is used for cleaning a wafer, the wafer and a wafer shell are generally put into cleaning together, the structural influence of the wafer shell can cause incomplete cleaning of the wafer, and residues can be left.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a semiconductor substrate belt cleaning device, includes main part, controlling means, wafer shell, wafer and ultrasonic structure, the washing tank has been seted up to the up end of main part, the inner tank has been seted up to the inner wall of washing tank, the inner wall fixedly connected with electric telescopic handle of inner tank, the inner wall fixedly connected with base of washing tank, the guide hole inner wall fixedly connected with seal cover of base, seal cover fixedly connected with holds the seat is passed to electric telescopic handle's upper end, first spacing groove has been seted up to the up end of holding seat, waterproof electric telescopic handle is all installed to washing tank inner wall both sides, the equal fixedly connected with card strip of the other end of waterproof electric telescopic handle, the second spacing groove has all been seted up to the outer terminal surface of card strip, the runner pipe is installed to the inboard of main part, the one end intercommunication of runner pipe has the liquid feeding pipe, the feed liquor spare is installed to the inner wall both sides of washing tank, the runner pipe is linked together with the liquid feeding spare, the front side guide hole of main part is all fixedly connected with the drain pipe, the drain pipe is linked together with the washing tank.

Preferably, limiting blocks are fixedly connected to two sides of the upper end face of the base, and the width between the limiting blocks is the same as the width of the lower end of the wafer shell.

Preferably, the width of the receiving seat is smaller than the width of the inner wall of the wafer shell, and the length of the receiving seat is smaller than the length of the inner wall of the wafer shell.

Preferably, the groove widths of the first limiting groove and the second limiting groove are the same, the groove widths of the first limiting groove and the groove widths of the wafer shell are the same, and the first limiting groove and the second limiting groove are aligned with the slots of the wafer shell one by one.

Preferably, the outer end face of the electric telescopic rod is tightly attached to the inner wall of the sealing sleeve, and the base is arranged on the upper side of the inner groove.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the electric telescopic rod can push the receiving seat to move upwards through the structures such as the base, the receiving seat, the electric telescopic rod and the clamping strips, the upward movement of the receiving seat can push the wafer to move upwards through the wafer shell, and the clamping strips at two sides are matched for limiting, so that the wafer is comprehensively cleaned through the ultrasonic structure, the wafer and the wafer shell can be separated and cleaned when the ultrasonic cleaning is realized, the more comprehensive capability of the wafer cleaning is realized, the problem that the wafer and the wafer shell are commonly put into cleaning together when the traditional ultrasonic cleaning machine is used for cleaning is solved, the problem that the wafer cleaning is not thorough due to the structural influence of the wafer shell, and residues possibly remain is solved, and the practicability of the device is improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic elevational cross-sectional view of the structure of FIG. 1 of the present utility model;

FIG. 3 is a schematic view of the card strip of FIG. 2 according to the present utility model;

fig. 4 is a schematic view of the structure of the base of fig. 2 according to the present utility model.

In the figure: 1-main body, 2-controlling means, 3-washing tank, 4-feed liquor spare, 5-runner pipe, 6-filling pipe, 7-drain pipe, 8-inside groove, 9-electric telescopic handle, 10-base, 11-seal cover, 12-socket, 13-first spacing groove, 14-stopper, 15-wafer shell, 16-waterproof electric telescopic handle, 17-card strip, 18-second spacing groove, 19-wafer, 20-ultrasonic wave structure.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.

Referring to fig. 1-4, the present utility model provides a technical solution:

the utility model provides a semiconductor substrate belt cleaning device, including main part 1, controlling means 2, wafer shell 15, wafer 19 and ultrasonic structure 20, washing tank 3 has been seted up to the up end of main part 1, the inner wall of washing tank 3 is opened there is inside groove 8, the inner wall fixedly connected with electric telescopic handle 9 of inside groove 8, the inner wall fixedly connected with base 10 of washing tank 3, the guide hole inner wall fixedly connected with seal cover 11 of base 10, seal cover 11 fixedly connected with is passed to electric telescopic handle 9's upper end, first spacing groove 13 has been seted up to the up end of bearing seat 12, waterproof electric telescopic handle 16 has all been installed to washing tank 3 inner wall both sides, the equal fixedly connected with draw-in bar 17 of the other end of waterproof electric telescopic handle 16, the second spacing groove 18 has all been seted up to the outer end of draw-in bar 17, runner pipe 5 is installed to the inboard of main part 1, the one end intercommunication of runner pipe 5 has liquid feeding pipe 6, feed-in pipe 7 is installed to the inner wall both sides of washing tank 3, runner 5 is linked together with liquid feeding piece 4, the front side of main part 1 all fixedly connected with drain pipe 7, drain pipe 7 is linked together with washing tank 3.

Limiting blocks 14 are fixedly connected to two sides of the upper end face of the base 10, the width between the limiting blocks 14 is the same as the width of the lower end of the wafer shell 15, and the limiting blocks 14 are arranged to facilitate the installation of the wafer shell 19 in limiting; the width of the receiving seat 12 is smaller than the width of the inner wall of the wafer case 15, the length of the receiving seat 12 is smaller than the length of the inner wall of the wafer case 15, and the receiving seat 12 can pass upward through the wafer case 15 through the above description so that the wafer 19 is separated from the wafer case 15; the groove widths of the first limiting groove 13 and the second limiting groove 18 are the same, the groove width of the first limiting groove 13 is the same as the groove width of the wafer shell 15, the first limiting groove 13 and the second limiting groove 18 are aligned with the slots of the wafer shell 15 one by one, the clamping strips 17 are convenient for limiting the wafer 19 through the description, and the wafer 19 is also convenient for being reset and inserted into the slots of the wafer shell 15; the outer terminal surface of electric telescopic handle 9 closely laminates with the inner wall of seal cover 11, and base 10 sets up in the upside of inside groove 8, avoids the washing liquid to get into inside groove 8 through the seal cover 11 that sets up, otherwise the impurity under the washing is assembled to inside groove 8, causes the pollution to new cleaning solution easily.

The working flow is as follows: when a cleaning device is needed to clean a wafer which is a semiconductor substrate, the cleaning tank is filled with liquid through the liquid filling pipe 6, the runner pipe 5 and the liquid inlet piece 4, the waterproof electric telescopic rod 16 is linked with the electric telescopic rod 9, the wafer shell 15 and the wafer 19 are placed between the upper side of the base 10 and the limiting block 14 through the clamp, the wafer 19 is inserted into the first limiting groove 13, at the moment, the electric telescopic rod 9 and the waterproof electric telescopic rod 16 are started through the control device 2, the carrying seat 12 is pushed to move upwards through the wafer shell 15 through the extension of the electric telescopic rod 9, meanwhile, the clamping strips 17 on two sides are also moved inwards due to the action of the waterproof electric telescopic rod 16 to limit the wafer 19 exposed out of the wafer shell 15, the wafer 19 is inserted into the second limiting groove 18, at the moment, each wafer 19 is separated from the wafer shell 15 (at the moment, the wafer 19 is virtually connected with the wafer shell 15), the wafer 19 is separated from the wafer shell 15 only, each wafer 19 is accurately inserted into a corresponding slot of the wafer shell 15 during resetting, the wafer shell 15 is cleaned completely through the ultrasonic structure 20, the wafer 19 is not left, and after the wafer shell 15 is reset, and the wafer shell 15 is completely cleaned, namely, the wafer shell 15 is completely is removed through the wafer shell cleaning device.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a semiconductor substrate belt cleaning device, includes main part (1), controlling means (2), wafer shell (15), wafer (19) and ultrasonic structure (20), its characterized in that: the utility model discloses a washing tank, including washing tank (3), washing tank (3) are seted up to the up end, washing tank (3) are opened the inner wall has inside groove (8), electric telescopic handle (9) are connected to the inner wall fixedly connected with of inside groove (8), inner wall fixedly connected with base (10) of washing tank (3), guide hole inner wall fixedly connected with seal cover (11) of base (10), seal cover (11) fixedly connected with is passed to electric telescopic handle (9)'s upper end, first spacing groove (13) have been seted up to the up end of accepting seat (12), waterproof electric telescopic handle (16) are all installed to washing tank (3) inner wall both sides, second spacing groove (18) have all been seted up to the outer end of waterproof electric telescopic handle (16), flow tube (5) are installed to the inboard of main part (1), flow tube (5) are linked together to the one end, inlet tube (6) are installed to inner wall both sides of washing tank (3), flow tube (5) are linked together with liquid outlet tube (7) are all fixed to be connected with washing tank (7).

2. A semiconductor substrate cleaning apparatus according to claim 1, wherein: limiting blocks (14) are fixedly connected to two sides of the upper end face of the base (10), and the width between the limiting blocks (14) is the same as the width of the lower end of the wafer shell (15).

3. A semiconductor substrate cleaning apparatus according to claim 1, wherein: the width of the bearing seat (12) is smaller than the width of the inner wall of the wafer shell (15), and the length of the bearing seat (12) is smaller than the length of the inner wall of the wafer shell (15).

4. A semiconductor substrate cleaning apparatus according to claim 1, wherein: the groove widths of the first limiting groove (13) and the second limiting groove (18) are the same, the groove width of the first limiting groove (13) is the same as the groove width of the wafer shell (15), and the first limiting groove (13), the second limiting groove (18) are aligned with the slots of the wafer shell (15) one by one.

5. A semiconductor substrate cleaning apparatus according to claim 1, wherein: the outer end face of the electric telescopic rod (9) is tightly attached to the inner wall of the sealing sleeve (11), and the base (10) is arranged on the upper side of the inner groove (8).

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